JPH0512940U - Digitizer sensor plate - Google Patents

Digitizer sensor plate

Info

Publication number
JPH0512940U
JPH0512940U JP6512791U JP6512791U JPH0512940U JP H0512940 U JPH0512940 U JP H0512940U JP 6512791 U JP6512791 U JP 6512791U JP 6512791 U JP6512791 U JP 6512791U JP H0512940 U JPH0512940 U JP H0512940U
Authority
JP
Japan
Prior art keywords
flat plate
insulating flat
sensor wire
sensor
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6512791U
Other languages
Japanese (ja)
Other versions
JPH089787Y2 (en
Inventor
正博 佐藤
成明 片瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Totoku Electric Co Ltd
Original Assignee
Totoku Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Totoku Electric Co Ltd filed Critical Totoku Electric Co Ltd
Priority to JP1991065127U priority Critical patent/JPH089787Y2/en
Publication of JPH0512940U publication Critical patent/JPH0512940U/en
Application granted granted Critical
Publication of JPH089787Y2 publication Critical patent/JPH089787Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 センサ線を絶縁平板上のX軸及びY軸方向に
夫々所定パターンで、前記絶縁平板の外側にセンサ線折
り返し部を設けて布線する工程、前記絶縁平板周縁内の
センサ線を絶縁平板上に接着固定する工程等により構成
されて、後工程においてセンサ線折り返し部が断線の危
険から保護されるとともに、軽量で取扱い易い電磁誘導
方式のデジタイザセンサ板を提供するものである。 【構成】 センサ線を絶縁平板上のX軸及びY軸方向に
夫々所定パターンで、前記絶縁平板の外側にセンサ線折
り返し部を設けて布線し、前記布線されたセンサ線の端
末を絶縁平板から導出し、前記絶縁平板の周縁部を除く
絶縁平板上のセンサ線を接着剤で前記平板上に固着し、
前記センサ線折り返し部を前記絶縁平板の周縁内に折り
曲げ配置し、このセンサ線の折り返し部を覆う保護カバ
ーを絶縁平板上に固定するものである。
(57) [Abstract] [Purpose] Wiring a sensor wire on the insulating flat plate in a predetermined pattern in the X-axis and Y-axis directions by arranging a sensor wire turnback portion on the outside of the insulating flat plate, the insulating flat plate periphery Provided is a digitizer sensor plate of electromagnetic induction type which is configured by a step of adhesively fixing the sensor wire in the inside to an insulating flat plate, etc., and protects the folded portion of the sensor wire from the risk of disconnection in a later step and is lightweight and easy to handle. It is a thing. [Structure] A sensor wire is laid in a predetermined pattern in the X-axis and Y-axis directions on an insulating flat plate, and a sensor wire turnback portion is provided on the outside of the insulating flat plate for wiring to insulate the end of the wired sensor wire. Derived from the flat plate, the sensor wire on the insulating flat plate excluding the peripheral portion of the insulating flat plate is fixed on the flat plate with an adhesive,
The folded-back portion of the sensor wire is bent and arranged within the peripheral edge of the insulating flat plate, and a protective cover for covering the folded-back portion of the sensor wire is fixed on the insulating flat plate.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案はCAD用の図形入力機等に用いられる電磁誘導方式のデジタイザセン サ板に関するものである。 The present invention relates to an electromagnetic induction type digitizer sensor plate used in a figure input device for CAD.

【0002】[0002]

【従来の技術】[Prior Art]

従来より、CAD等の情報入力機器には図4に示す如く構成された電磁誘導方 式のデジタイザセンサ板が用いられている。センサ線2は図3に示すようにして 布線される。まず、絶縁平板3の外側周辺に複数本のセンサ線布線用ピン4を所 定の間隔で配設し、該布線用ピン4に絶縁被覆を施したセンサ線2をX軸方向及 びY軸方向毎に夫々順次引っ掛け折り返しながら所定パターンに布線し、X軸方 向及びY軸方向のそれぞれのセンサ線端末8,8を絶縁平板3から導出させる。 次に前記絶縁平板3上の周縁部を除くセンサ線2上に接着剤5を塗布して、セン サ線2を前記平板3上に埋設固着する。その後、センサ線折り返し部7を前記布 線用ピン4から取り外して前記平板3上の接着剤の充填されていない板周縁部11 に折り曲げ配置し、前記センサ線折り返し部7上に更に接着剤5Aを塗布して、 前記センサ線折り返し部7を絶縁平板3上の周縁部11に固着させて製造していた 。 Conventionally, an electromagnetic induction type digitizer sensor plate configured as shown in FIG. 4 has been used for an information input device such as CAD. The sensor wire 2 is wired as shown in FIG. First, a plurality of sensor wire arranging pins 4 are arranged at predetermined intervals around the outer side of the insulating flat plate 3, and the sensor wire 2 having an insulating coating on the wire arranging pins 4 extends in the X-axis direction. Wiring is performed in a predetermined pattern while being hooked and folded back in each Y-axis direction, and the sensor wire terminals 8, 8 in the X-axis direction and the Y-axis direction are led out from the insulating flat plate 3. Next, an adhesive 5 is applied on the sensor wire 2 excluding the peripheral portion on the insulating flat plate 3, and the sensor wire 2 is embedded and fixed on the flat plate 3. After that, the sensor wire folded-back portion 7 is removed from the wiring pin 4 and is bent and arranged on the plate peripheral portion 11 on the flat plate 3 which is not filled with the adhesive. Was applied to fix the sensor wire folded-back portion 7 to the peripheral edge portion 11 on the insulating flat plate 3 for manufacturing.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

上記従来のデジタイザセンサ板は絶縁平板外側のセンサ線折り返し部の処理に 当たり、接着剤で充填固着するものであった。このため、センサ線折り返し部の 接着剤塗布固着の作業において、前記センサ線折り返し部が接着剤層からはみ出 したまま絶縁平板に固着され、製造工程中にこのはみ出したセンサ線折り返し部 で断線を生じる危険性があった。また、センサ線折り返し部を絶縁平板に接着剤 で接着固定する作業は接着剤の固化に時間を要し、作業性に劣る上、接着剤の重 量分センサ板が重くなる難点があった。 The above-mentioned conventional digitizer sensor plate is filled and fixed with an adhesive when processing the sensor wire turnaround portion on the outside of the insulating flat plate. Therefore, in the work of applying and fixing the adhesive on the folded portion of the sensor line, the folded portion of the sensor line is fixed to the insulating flat plate while protruding from the adhesive layer, and a break occurs at the protruding portion of the sensor line during the manufacturing process. There was a risk. Further, the work of adhering and fixing the folded portion of the sensor wire to the insulating flat plate with an adhesive takes time to solidify the adhesive, which is inferior in workability, and the sensor plate is heavy due to the weight of the adhesive.

【0004】 本考案は、前記諸欠点が解消し、簡便な手段でセンサ線折り返し部を断線の危 険から保護し、製造工程中の取扱い易いデジタイザセンサ板を提供するものであ る。The present invention solves the above-mentioned drawbacks and provides a digitizer sensor plate which protects the folded portion of the sensor wire from the risk of disconnection by a simple means and is easy to handle during the manufacturing process.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

絶縁被覆を施したセンサ線を絶縁平板上のX軸及びY軸方向に夫々所定の間隔 で前記絶縁平板の外側に折り返し部を設けて蛇行状に布線し、前記X軸方向及び Y軸方向に布線したセンサ線端末を前記絶縁平板から導出し、前記絶縁平板の周 縁部を除く前記センサ線を前記絶縁平板上に接着剤にて充填固着したデジタイザ センサ板において、前記絶縁平板外側のセンサ線折り返し部を前記接着剤の充填 されていない絶縁平板周縁部内に折り曲げ収納し、該センサ線折り返し部を覆う 保護カバーを配設するものである。 The sensor wires coated with insulation are provided in the X-axis and Y-axis directions on the insulating flat plate at predetermined intervals outside the insulating flat plate, and are folded back to form a meandering shape. In the digitizer sensor plate in which the sensor wire end wired to the insulating flat plate is led out, and the sensor wire excluding the peripheral portion of the insulating flat plate is fixed and fixed on the insulating flat plate with an adhesive, The sensor wire folded-back portion is folded and housed in the peripheral edge portion of the insulating flat plate not filled with the adhesive, and a protective cover for covering the sensor wire folded-back portion is provided.

【0006】[0006]

【作用】[Action]

センサ線の折り返し部を絶縁平板の周縁部に折り曲げ配置した後、このセンサ 線折り返し部を保護カバーで覆うことにより、作業工程中でのセンサ線折り返し 部の断線事故が防止される。また、従来の接着剤に代えて保護カバーを用いたこ とにより、センサ板の軽量化が図られ、製造工程中の取扱いも容易となる。なお 、保護カバーは絶縁平板にネジ止め等で着脱自在に固定すれば、センサ板の補修 等の作業の際に好都合である。 After the folded portion of the sensor wire is bent around the periphery of the insulating flat plate, the folded portion of the sensor wire is covered with a protective cover to prevent the sensor wire folded portion from being broken during the working process. Further, by using a protective cover in place of the conventional adhesive, the sensor plate can be made lighter and can be easily handled during the manufacturing process. It should be noted that if the protective cover is detachably fixed to the insulating flat plate with screws or the like, it is convenient for work such as repair of the sensor plate.

【0007】[0007]

【実施例】【Example】

以下、本考案を図1,図2,図3に沿って説明する。図1は本考案の一実施例 を示すセンサ板の断面図で、図2は保護カバーの一実施例を示す部分斜視図、図 3はセンサ線の布線を説明するための図である。図1において、2は極細マグネ ットワイヤなど絶縁被膜を施したセンサ線であり、3は透明ガラス或はエポキシ ガラス板等からなる絶縁平板、5は充填層となる接着剤、6はプラスチック材の 保護カバーである。 Hereinafter, the present invention will be described with reference to FIGS. 1, 2 and 3. FIG. 1 is a sectional view of a sensor plate showing an embodiment of the present invention, FIG. 2 is a partial perspective view showing an embodiment of a protective cover, and FIG. 3 is a view for explaining wiring of sensor wires. In FIG. 1, 2 is a sensor wire coated with an insulating film such as an ultra-fine magnet wire, 3 is an insulating flat plate made of transparent glass or epoxy glass plate, 5 is an adhesive to be a filling layer, and 6 is protection of a plastic material. It is a cover.

【0008】 本考案のデジタイザセンサ板は次のようにして製造される。センサ線2の布線 は従来技術の欄に説明したと同様に図3に示すように、絶縁平板3の外側周縁に 所定間隔で配設された複数本のセンサ線布線用ピン4にセンサ線2を順次引っ掛 け折り返しながらX軸方向及びY軸方向にそれぞれ所定のパターンで布線し、X 軸方向及びY軸方向のそれぞれのセンサ線2,2の端末リード8,8を絶縁平板 3から導出させる。そして、センサ線2が所定パターンに布線された前記絶縁平 板3上の周縁部11を除いたセンサ線2上から接着剤5を塗布してセンサ線2を絶 縁平板3上に固着させる。次に、前記センサ線2の折り返し部7をセンサ線布線 用ピン4から取り外して、接着剤5の塗布されていない絶縁平板3上の周縁部11 に折り曲げ配置する。The digitizer sensor plate of the present invention is manufactured as follows. The wiring of the sensor wires 2 is similar to that described in the section of the prior art, as shown in FIG. 3, a plurality of sensor wire wiring pins 4 arranged at predetermined intervals on the outer peripheral edge of the insulating flat plate 3 are connected to the sensors. Wires 2 are hooked and folded back in sequence and laid in a predetermined pattern in the X-axis direction and the Y-axis direction respectively, and the terminal leads 8, 8 of the sensor lines 2, 2 in the X-axis direction and the Y-axis direction are insulated flat plates. It derives from 3. Then, the sensor wire 2 is fixed on the insulating flat plate 3 by applying an adhesive 5 on the sensor wire 2 excluding the peripheral portion 11 on the insulating flat plate 3 on which the sensor wire 2 is arranged in a predetermined pattern. .. Next, the folded-back portion 7 of the sensor wire 2 is removed from the sensor-wiring pin 4 and is bent and arranged at the peripheral portion 11 on the insulating flat plate 3 to which the adhesive 5 is not applied.

【0009】 次に、図1に示す如く絶縁平板3上に折り曲げられたセンサ線2の折り返し部 7を覆うように保護カバー6(図2に示す)を絶縁平板3上に配設し、保護カバ ー6を絶縁平板3にネジ10等で固定する。この時、センサ線2,2の端末リード 部8,8は保護カバー6に設けたセンサ線導出口9から導出されて、センサ板1 が構成される。なお、保護カバー6の形状は実施例のものに限定されることなく 種々変更可能なことはいうまでもない。さらに、保護カバー6を絶縁平板3へ取 付け固定させるに際し、接着剤を用いて固定してもよく、保護カバー6に溝を設 けて保護カバー6を絶縁平板3に嵌着させてもよい。Next, a protective cover 6 (shown in FIG. 2) is arranged on the insulating flat plate 3 so as to cover the folded portion 7 of the sensor wire 2 bent on the insulating flat plate 3 as shown in FIG. Fix the cover 6 to the insulating flat plate 3 with screws 10 or the like. At this time, the terminal lead portions 8 of the sensor wires 2 and 2 are led out from the sensor wire lead-out port 9 provided in the protective cover 6 to form the sensor plate 1. Needless to say, the shape of the protective cover 6 is not limited to that of the embodiment and can be variously changed. Further, when the protective cover 6 is attached and fixed to the insulating flat plate 3, it may be fixed by using an adhesive, or a groove may be provided in the protective cover 6 and the protective cover 6 may be fitted to the insulating flat plate 3. .

【0010】[0010]

【考案の効果】[Effect of the device]

本考案のデジタイザセンサ板は、センサ線の折り返し部が絶縁平板の外側にあ るセンサ板において、このセンサ線折り返し部を絶縁平板の周縁内に折り曲げ配 置し、このセンサ線の折り返し部を覆う保護カバーを配設し絶縁平板に固定した ものであるので、製造工程中の外力等による断線事故の防止が図られ信頼性の高 いセンサ板が得られる。また、従来の接着剤に代え保護カバーを用いたことによ りセンサ板の軽量化が図られ、製造工程中の取扱い性も改善される。 According to the digitizer sensor plate of the present invention, in the sensor plate in which the folded portion of the sensor wire is outside the insulating flat plate, the folded folded portion of the sensor wire is arranged inside the peripheral edge of the insulating flat plate to cover the folded portion of the sensor wire. Since a protective cover is installed and fixed to an insulating flat plate, it is possible to prevent disconnection accidents due to external forces during the manufacturing process and obtain a highly reliable sensor plate. In addition, the use of a protective cover instead of the conventional adhesive reduces the weight of the sensor plate and improves the handling during the manufacturing process.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例を示すデジタイザセンサ板の
要部断面図である。
FIG. 1 is a sectional view of a main part of a digitizer sensor plate showing an embodiment of the present invention.

【図2】本考案に用いられる保護カバーの部分斜視図で
ある。
FIG. 2 is a partial perspective view of a protective cover used in the present invention.

【図3】デジタイザセンサ板のセンサ線の布線工程を説
明する図である。
FIG. 3 is a diagram illustrating a wiring process of sensor wires on a digitizer sensor plate.

【図4】従来例のデジタイザセンサ板の断面図である。FIG. 4 is a sectional view of a conventional digitizer sensor plate.

【符号の説明】[Explanation of symbols]

1 デジタイザセンサ板 2 センサ線 3 絶縁平板 4 センサ線布線用ピン 5,5A 接着剤 6 保護カバー 7 センサ線折り返し部 8 センサ線のリード線端末部 9 端末リード線導出口 10 ネジ 11 デジタイザセンサ板の周縁部 1 Digitizer sensor plate 2 Sensor wire 3 Insulating flat plate 4 Sensor wire wiring pin 5,5A Adhesive 6 Protective cover 7 Sensor wire folded portion 8 Sensor wire lead wire terminal 9 Terminal lead wire outlet 10 Screw 11 Digitizer sensor plate Edge of

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 絶縁被覆を施したセンサ線を絶縁平板上
のX軸及びY軸方向に夫々所定の間隔で前記絶縁平板の
外側に折り返し部を設けて蛇行状に布線し、前記X軸方
向及びY軸方向に布線したセンサ線端末を前記絶縁平板
から導出し、前記絶縁平板の周縁部を除く前記センサ線
を前記絶縁平板上に接着剤にて充填固着したデジタイザ
センサ板において、前記絶縁平板外側のセンサ線折り返
し部を前記接着剤の充填されていない絶縁平板周縁部内
に折り曲げ収納し、該センサ線折り返し部を覆う保護カ
バーを配設したことを特徴とするデジタイザセンサ板。
1. A sensor wire coated with an insulating coating is provided in the X-axis and the Y-axis direction on the insulating flat plate at predetermined intervals outside the insulating flat plate to fold the windings in a meandering manner, and the X-axis is arranged. In the digitizer sensor plate, the sensor wire terminals wired in the Y-axis direction and the Y-axis direction are led out from the insulating flat plate, and the sensor wires except for the peripheral edge of the insulating flat plate are filled and fixed on the insulating flat plate with an adhesive. A digitizer sensor plate, characterized in that a folded portion of the sensor wire outside the insulating flat plate is folded and housed in a peripheral portion of the insulating flat plate not filled with the adhesive, and a protective cover is provided to cover the folded portion of the sensor wire.
JP1991065127U 1991-07-23 1991-07-23 Digitizer sensor plate Expired - Lifetime JPH089787Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991065127U JPH089787Y2 (en) 1991-07-23 1991-07-23 Digitizer sensor plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991065127U JPH089787Y2 (en) 1991-07-23 1991-07-23 Digitizer sensor plate

Publications (2)

Publication Number Publication Date
JPH0512940U true JPH0512940U (en) 1993-02-19
JPH089787Y2 JPH089787Y2 (en) 1996-03-21

Family

ID=13277901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991065127U Expired - Lifetime JPH089787Y2 (en) 1991-07-23 1991-07-23 Digitizer sensor plate

Country Status (1)

Country Link
JP (1) JPH089787Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129094U (en) * 1976-03-27 1977-10-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118327U (en) * 1985-12-26 1986-07-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118327U (en) * 1985-12-26 1986-07-25

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129094U (en) * 1976-03-27 1977-10-01

Also Published As

Publication number Publication date
JPH089787Y2 (en) 1996-03-21

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