JPH0878921A - Laminated resonance circuit board - Google Patents

Abstract

PURPOSE: To provide a laminated resonance circuit board capable of miniaturizing the board by minimizing the area to be occupied by a short stub. CONSTITUTION: The laminated resonance circuit board uses a laminated body constituted by laminating dielectric layers 1a-1d as a board 1. A strip line 2 is formed on that laminated board 1, a short stub 3 for characteristic control to be connected with the strip line 2 is divided, and one part or all the divided short stubs 31, 32 and 33 are internally mounted inside the laminated body board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated resonant circuit board used for a high frequency voltage controlled oscillator (VCO) and having a strip line.

[0002]

2. Description of the Related Art Conventionally, a high-frequency oscillator, for example, a voltage controlled oscillator (VCO), is shown in FIG.
X is a resonance circuit section including strip lines MSL ₁ , MSL ₂ varicap diodes Cv, and capacitors C _{1 to} C ₄ , Y is a negative resistance circuit section including oscillation transistors, resistors, capacitors, and Z. Is an amplifying circuit unit including an amplifying transistor, a strip line, a resistor, a capacitor, and the like.

In such a high frequency oscillating device, when a predetermined voltage is applied from the control terminal Vt, the capacitance of the varicap diode Cv in particular changes, whereby a predetermined resonance frequency is obtained. When this and the negative resistance circuit section Y satisfy the oscillation condition and oscillate, the signal is amplified by the amplification circuit section Z and is derived from the output terminal OUT.

In the manufacturing process of such a high-frequency oscillator, the frequency adjustment according to the specifications is performed by adjusting the strip line MSL ₁ of the resonance circuit section X.

In such a high frequency oscillating device, the method of adjusting the oscillating frequency adjusts the line length of the strip line MSL ₁ constituting the resonance circuit section.

The above-described strip line MSL ₁ has a resonant circuit substrate 6 made of a single plate dielectric material as shown in FIG.
Formed to zero. In FIG. 6, a conductor film 61 (hereinafter referred to as a strip line) formed in a linear shape, a U shape, a J shape, etc. on one main surface of a dielectric substrate 62 and a ground formed on the other main surface. A conductor film 63 and a through-hole conductor 64 connected to the ground conductor film 63 at one end of the strip line 61
It consists of and. Here, in order to enable the above-mentioned frequency adjustment, one end of the strip line 61 has a characteristic-adjusting short stub composed of a plurality of conductor films 65a, 65b ... Which are cut by laser irradiation, sandblasting, drilling or the like. 65 are connected, and in consideration of the oscillation frequency of the high-frequency oscillation device (resonance frequency at the resonance circuit board level), a predetermined number of the conductor films 65a, 65b of the short subdub 65 are arranged in the direction of the arrow in the figure. Were cut off in sequence.

The substantial length component of the strip line 61 changes depending on the disconnection state of the short stubs 65a, 65b, ... Connected to the strip line 61, the inductance component increases, and the oscillation frequency decreases. You can do it. Conductor film 6 that constitutes this short stub 65
The relationship between the number of cuts for sequentially cutting 5a, 65b, ... And the change in the oscillation frequency is as follows.
For example, the oscillation frequency can be linearly reduced with respect to the number of cuts a, 65b, ....

[0008]

However, in FIG. 6 described above, the short subdub 65 connected to one end of the strip line 61 is formed on the surface of the substrate 60.

Further, when it is desired to widen the characteristic adjustment range, for example, the variable adjustment width of the oscillation frequency or to make the variable width by the adjustment small so that fine adjustment is possible, the conductor films 65a, 65b, ... It is necessary to form a large number of conductors.

As a result, the area occupied by the short stubs 65 on the surface of the resonant circuit board 60 becomes large, the size of the entire board becomes large, and when another wiring pattern is formed on the surface of the board 60, This imposes a large restriction on the degree of freedom in routing the wiring pattern.

The present invention has been devised in view of the above problems, and an object thereof is to widen the characteristic adjustment range,
An object of the present invention is to provide a laminated resonant circuit board that can minimize the area occupied by the short stub even if the variable width is reduced, and the board can be downsized.

[0012]

A laminated resonant circuit board of the present invention is a laminated resonant circuit board in which a strip line having a short stub for adjusting characteristics is formed on a laminated body formed by laminating a plurality of dielectric layers. The short stub is divided, and all or part of the divided short stub is formed between dielectric layers.

[0013]

According to the present invention, since the short stub made of a plurality of conductor films connected to the strip line can reduce or eliminate the area exposed on the surface of the laminated substrate, the planar stub of the laminated substrate can be eliminated. The area occupied by the short stubs can be reduced, and a small laminated resonant circuit board can be obtained.

Further, when another wiring pattern is formed on the surface of the laminated resonant circuit board, the degree of freedom in routing the wiring pattern is greatly improved.

In order to form the predetermined conductor film of the short stub formed between the laminate layers, for example, the intensity of the laser beam, which is a cutting means, is controlled so that the conductor film to be cut is cut together with the dielectric layer. The target conductor film may be cut.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A laminated resonant circuit board of the present invention will be described below with reference to the drawings.

FIG. 1 is a partial plan view of a laminated resonant circuit board of the present invention, and FIG. 2 is a sectional view taken along line AA in FIG.
The resonant circuit board is used as the resonant circuit section X of the typical high frequency generator shown in FIG.
In FIG. 1 and FIG. 2, only the strip line MSL ₁ is shown, and other strip lines MSL ₂ constituting the resonance circuit section X, various electronic components such as a varicap diode Cv, capacitors C _{1 to} C _4, etc. Was omitted.

1 and 2, 10 is a laminated resonant circuit substrate, 1 is a laminated substrate, and 2 is a strip line MS.
L ₁ conductor film (hereinafter simply referred to as strip line), 3
Is a short stub, and 4 is a ground conductor film.

The laminated substrate 1 is composed of, for example, four dielectric layers 1.
a to 1d. The dielectric layers 1a to 1d are made of a material having a predetermined dielectric constant according to the characteristics of the strip line 2, for example, a ceramic containing alumina as a main component, a ceramic containing barium titanate as a main component, such a ceramic and a glass component. And a glass-ceramic material, a glass epoxy material, or the like. For example, a strip line 2 is formed on the surface of the substrate 1, and one end side of the strip line 2 is a short stub composed of a plurality of conductor films 31a, 31b, ... Connected to the strip line 2. 31 is formed.

Further, a short stub 32 composed of a plurality of conductor films 32a, 32b ... Is internally provided between the dielectric layers 1a and 1b, and further, the dielectric layer 1b and the dielectric layer 1b. A plurality of conductor films 33 are provided between the layer 1c and the layer.
The short stub 33 composed of a, 33b ...

That is, the short stub 3 is divided into three short stubs 31, 32, 33, and the short stubs 32, 33 are mounted in the laminated substrate 1.

A ground conductor film 4 is provided between the dielectric layers 1c and 1d so as to face at least the strip line 2.

The strip line 2 is made of Cu (Cu alone,
Cu alloy), Ag-based (Ag simple substance, Ag alloy), etc. are formed by printing / baking a thick-film conductive paste, and Cu is also used in the glass-epoxy substrate lamination process.
It is formed by adhering foil, etc., and has a desired width and desired length depending on the characteristics.

A conductive through hole 5 connected to the ground conductor film 4 is formed at one end of the strip line 2. The conductive through holes 5 are formed in the dielectric layers 1a, 1
The conductive material is applied to the inner wall of the hole penetrating b, 1c, or the conductive material is filled in the penetrating hole.

As described above, the short stub 3 is divided into the short stub 31 on the front surface and the internal short stubs 32 and 33 installed inside the laminated substrate 1. The short stubs 31 on the surface are formed of the same material as the strip line 2 at the same time, and the interior short stubs 32, 33 are formed.
Is an Ag-based, Cu-based, high-melting-point metal (W-based, Mo-based) on the surface of the green sheet to be the dielectric layers 1b and 1c before firing
It is formed by printing and drying a thick-film conductive paste containing a material as a main component and integrally firing after stacking green sheets, or by adhering Cu foil during a glass-epoxy substrate stacking process.

Each of the short stubs 31, 32, 33 includes, for example, a plurality of conductor films 31a, 31b ..., Conductor film 32.
a, 32b ..., Conductive films 33a, 33b ..
Two conductor films 31a, 31b, 32 for 2, 33
It is composed of a, 32b, 33a and 33b.

One end of each of the conductor films 31a and 31b forming the short stub 31 on the surface is directly connected to the strip line 2.
Is connected to one end side and the other ends are connected to each other.

Both ends of the conductor films 32a, 32b, 33a, 33b constituting the interior short stubs 32, 33 are connected to each other. Then, the conductor films 32a, 32b,
One of 33 a and 33 b is connected to at least one end side of the strip line 2 via the conductive through hole 6.
In addition, the conductive through holes 6 are at least the dielectric layers 1a, 1
Conductor material is applied to the inner wall of the hole passing through b,
Also, the through hole is filled with a conductive material.

As a result, on one end side of the strip line 2, the short stub 3 composed of two conductor films per layer is formed.
1, 32, 33, that is, a total of 6 conductor films 31a, 31
b, 32a, 32b, 33a, 33b are connected.

The ground conductor film 4 is provided between the dielectric layer 1c and the dielectric layer 1d, and at least the strip line 2 is provided.
Are formed so as to face each other. This forming method is different in shape from the interior short stubs 32 and 33, but is formed by the same method.

As described above, in the laminated resonant circuit substrate 10 of the present invention, the short stub for adjusting the characteristics of the strip line 2 is formed on the surface of the laminated substrate 1 by the short stub 31 (conductor film 31a, 31b), the internal short stubs 32, 33 (conductor films 32a, 32b, formed between the dielectric layers 1a, 1b, 1b of the multilayer substrate 1).
33a, 33b).

As a result, the occupied area of the short stub for obtaining the short stub for performing the same adjustment as in the conventional case can be substantially reduced to 1/3, and the overall size of the substrate 1 can be reduced. be able to.

Thus, for example, when forming a wiring pattern for mounting another electronic component used as the resonance circuit section X of the high frequency oscillation circuit on the surface of the laminated resonance circuit board, the wiring pattern has a degree of freedom in routing. Further, the internal wiring pattern can be formed by utilizing the interlayers with the dielectric layers 1a, 1b, 1c on which the internal short stubs 32, 33 are formed. It will be possible.

Next, the conductor films 31a, 31b forming the short stubs 31, 32, 33 formed in this way,
A method for adjusting the cutting of 32a, 32b, 33a, 33b will be described.

In the prior art, since the conductor films 65a, 65b, ... Constituting the short stub 65 are formed on the surface of the substrate 60, a plurality of conductor films exposed on the surface are monitored while monitoring the characteristics of the strip line 61. 65a,
To cut the desired number of conductor films out of 65b ...
It suffices to irradiate a laser beam or the like necessary for cutting only the conductor film and scan for a predetermined length (corresponding to the number of conductor films to be cut). However, in the present invention, the short stub 31 on the surface is formed. When the conductor films 31a and 31b to be cut are cut, the conductor films 32a, 32b and 33 forming the internal short stubs 32 and 33 are the same as in the conventional case.
When cutting a and 33b, the dielectric layers 1a and
It is necessary to irradiate a laser beam having the intensity required to cut 1b to cut.

Specifically, by the first laser irradiation and scanning, the conductor film 31a of the surface short stub 31,
31b is cut, and the conductor films 32a and 32b of the internal short stub 32 are cut by the same scanning as the locus of the second laser irradiation and the first scanning, and the third laser irradiation and the first irradiation. The conductor films 33a and 33b of the internal short stub 33 are cut by the same scanning as the loci of the second and second scanning. At this time, laser irradiation was performed using a YAG laser (wavelength 1.06 μm, Q
Switch 1 kHz), output 3 W, irradiation distance of 20 cm, the first irradiation, conductor film 31a, 3
1b and a part of the surface side of the dielectric layer 1a can be cut / removed, and by the second irradiation, the remaining part of the dielectric layer 1a and the conductor film 3 are removed.
2a, 32b and a part of the surface side of the dielectric layer 1b are cut.
It is possible to remove, the third irradiation, the rest of the dielectric layer 1b,
It becomes possible to cut and remove a part of the conductor films 33a and 33b and the dielectric layer 1c on the surface side, and the laser irradiation conditions are made common, and the short stub 31 on the surface and the dielectric layers 1a and 1a.
b, the short stub 32 between the layers and the dielectric layers 1b and 1c
It is possible to selectively cut the short stub 33 between the layers.

For example, when it is necessary to cut three conductor films as a result of monitoring the strip line 2, 1
Short stub 31 on the surface by the second laser irradiation
The conductor films 31a and 31b forming the above are cut, and then only one of the conductor films 32a and 32b forming the internal short stub 32 is cut by the second irradiation of the same scanning as the first scanning locus. At this time, if the scanning distance for the second time is controlled, it becomes easy to cut only one of the conductor films 32a and 32b. In the scanning direction, the front surface short stubs 31 and the interior short stubs 32 and 33 may always be scanned from the same direction, and only the interior short stubs 32 may be scanned relative to the front surface short stubs 31 and the interior short stubs 33. Alternatively, amplitude scanning in which scanning is performed in the reverse direction may be performed.

With this, a total of three short stubs 3
Conductor films 31a, 31b, 32 constituting 1, 32, 33
Three conductor films 31 among a, 32b, 33a and 33b
It is possible to cut a, 31b and 32a. Note that the number of conductor films to be cut may be determined in advance and the conductor films may be cut, and the conductor films 31a, 31b, 32a, 3a, 3a, 3a, and 3a may be cut while the strip line 2 is constantly monitored.
You may make it cut | disconnect 2b, 33a, 33b, and drive it into a predetermined characteristic.

According to the above cutting method, the conductor films 31a and 31b are cut by one laser irradiation and scanning, the conductor films 32a and 32b are cut by the second laser irradiation and scanning, and the third laser irradiation is performed. And the conductor films 33a, 3 by scanning
Although 3b is cut, for example, the scanning width of the laser irradiation is shortened, and the conductor film 31a of the short stub 31 is cut by the first laser irradiation / scanning by the amplitude operation, and then by the amplitude scanning. Interior short stub 32
The conductor film 32a of the internal short stub 33 is further cut by amplitude scanning,
Next, the conductor film 31b of the short stub 31 is cut by the second laser irradiation / scanning, and then the conductor film 32b of the internal short stub 32 is cut by the amplitude scanning,
Then, by amplitude scanning, the interior short stub 33 is
The conductor film 33b may be cut.

Regarding the connecting positions of the short stubs 31, 32, 33 and the strip line 2, the short stubs 31, 32, 33 are formed at positions slightly apart from one end of the strip line 2 as shown in FIG. It doesn't matter.

Further, in the above-described embodiment, the strip line 2 and the short stub 31 are formed on the surface of the substrate, and the strip line 2 is a microstrip line having a structure facing the ground conductor film. For example, the strip line 2 is internally provided between the dielectric layer 1a and the dielectric layer 1b and directly connected to the short stub 32, and the short stub 31 on the surface and the internal short stub 33 are connected by the conductive through hole 6. It doesn't matter. Furthermore, the short stubs 31 to 31 can be formed by using markings that determine the cutting position and the reference side of the board.
All 33 may be provided inside the laminated substrate 1.

Although the ground conductor film 4 is formed between the dielectric layer 1b and the dielectric layer 1c, the ground conductor film 4 does not necessarily have to be incorporated in the laminated resonant circuit board.
For example, the main surface on the back surface side of the laminated substrate may be formed by printing / baking a conductive paste.

Further, the number of laminated dielectric layers, the number of internal short stubs, the number of conductor films forming the short stubs, etc. can be arbitrarily changed according to the adjustment variable width and variable amount of the strip line.

Furthermore, although the laminated resonant circuit board of the present invention has been described as being used as a resonant circuit portion of a high frequency oscillation circuit, in addition, a plurality of resonant circuit boards of the present invention may be connected or a single resonant circuit board may be used. It can also be used as a filter device in which a plurality of strip lines are formed.

[0045]

As described above, according to the present invention, the short stubs connected to one end side of the strip line for adjusting the characteristics are divided, and all or a part of the divided short stubs is formed on the laminated substrate. Since it is internally provided, the area occupied by the short stub on the substrate can be reduced in plan view.

As a result, the size of the substrate can be reduced, and in forming another wiring pattern on the surface of the substrate, the degree of freedom of the wiring pattern is improved.

[Brief description of drawings]

FIG. 1 is a plan view of a laminated resonant circuit board of the present invention.

FIG. 2 is a cross-sectional view taken along the line AA of FIG.

FIG. 3 is an exploded perspective view of FIG.

FIG. 4 is an exploded perspective view showing another laminated resonant circuit board of the present invention.

FIG. 5 is a circuit diagram of a typical high frequency oscillator.

FIG. 6 is an external perspective view of a conventional resonant circuit board.

[Explanation of supplements]

 10 ... Laminated resonant circuit substrate 1 ... Laminated substrate 1a to 1d ... Dielectric layer 2 ... Strip line 3 ... Short stub 31 ... Surface short stub 32 ... Internal short stub 33 ..Interior short stubs 4 ... Ground conductor film 5, 6 ... Conduction through holes

Claims (1)

[Claims] 1. A laminated resonant circuit board in which a strip line having a short stub for adjusting a characteristic is formed on a laminated body formed by laminating a plurality of dielectric layers, wherein a part of the short stub is at least a dielectric interlayer. A laminated resonant circuit board, characterized by being formed in.