JPH087642Y2 - リードの半田メッキ装置 - Google Patents
リードの半田メッキ装置Info
- Publication number
- JPH087642Y2 JPH087642Y2 JP1990119448U JP11944890U JPH087642Y2 JP H087642 Y2 JPH087642 Y2 JP H087642Y2 JP 1990119448 U JP1990119448 U JP 1990119448U JP 11944890 U JP11944890 U JP 11944890U JP H087642 Y2 JPH087642 Y2 JP H087642Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder plating
- solder
- leads
- cathode
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 91
- 238000007747 plating Methods 0.000 title claims description 70
- 239000007788 liquid Substances 0.000 claims description 24
- 238000001914 filtration Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 2
- 230000003134 recirculating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 239000012535 impurity Substances 0.000 description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010802 sludge Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119448U JPH087642Y2 (ja) | 1990-11-16 | 1990-11-16 | リードの半田メッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119448U JPH087642Y2 (ja) | 1990-11-16 | 1990-11-16 | リードの半田メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476051U JPH0476051U (enrdf_load_stackoverflow) | 1992-07-02 |
| JPH087642Y2 true JPH087642Y2 (ja) | 1996-03-04 |
Family
ID=31867405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119448U Expired - Fee Related JPH087642Y2 (ja) | 1990-11-16 | 1990-11-16 | リードの半田メッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087642Y2 (enrdf_load_stackoverflow) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4302316A (en) * | 1980-05-07 | 1981-11-24 | The Perkin-Elmer Corporation | Non-contacting technique for electroplating X-ray lithography |
| JPS6067689A (ja) * | 1983-09-22 | 1985-04-18 | Nec Corp | めつき方法及びめつき装置 |
| JPS6092497A (ja) * | 1983-10-27 | 1985-05-24 | Nec Corp | メツキ装置 |
| JPS61253399A (ja) * | 1985-05-07 | 1986-11-11 | Sumitomo Metal Ind Ltd | メツキ液浄化装置 |
| JPH0696789B2 (ja) * | 1985-08-13 | 1994-11-30 | 松下電器産業株式会社 | 情報記録体の電鋳装置 |
| JPS62210688A (ja) * | 1986-03-11 | 1987-09-16 | 日本碍子株式会社 | セラミツクパツケ−ジの部分めつき方法及びその装置 |
| JPS63243297A (ja) * | 1987-03-31 | 1988-10-11 | Mitsubishi Metal Corp | 伝熱管の製造方法 |
| JPH02111898A (ja) * | 1988-10-20 | 1990-04-24 | Mitsubishi Electric Corp | 半導体素子の製造装置 |
-
1990
- 1990-11-16 JP JP1990119448U patent/JPH087642Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0476051U (enrdf_load_stackoverflow) | 1992-07-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3352352B2 (ja) | めっき装置、めっき方法およびバンプの形成方法 | |
| US7507319B2 (en) | Anode holder | |
| JP4368543B2 (ja) | メッキ方法およびメッキ装置 | |
| US20020088845A1 (en) | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for elecronic parts having the film | |
| US20040235219A1 (en) | Plating apparatus, plating method, and method for manufacturing semiconductor device | |
| JPH087642Y2 (ja) | リードの半田メッキ装置 | |
| US7772043B2 (en) | Plating apparatus, plating method and manufacturing method for semiconductor device | |
| US4932585A (en) | Method and apparatus for solder plating an object | |
| US7159758B1 (en) | Circuit board processing techniques using solder fusing | |
| JP4029936B2 (ja) | 半導体装置の製造方法 | |
| KR102744025B1 (ko) | 도금 장치 | |
| JP2513357B2 (ja) | リ―ドの半田メッキ装置 | |
| JP3400278B2 (ja) | 半導体製造装置及び半導体装置の製造方法 | |
| JP3884150B2 (ja) | 高速メッキ装置及び高速メッキ方法 | |
| JPH0770659B2 (ja) | リードの半田メッキ装置 | |
| JP2522111B2 (ja) | リ―ドの半田メッキ装置 | |
| JP3167782B2 (ja) | 電子部品の高速半田めっき装置 | |
| JP3995564B2 (ja) | 半導体装置およびその製造方法 | |
| JPH0744025Y2 (ja) | リードの半田メッキ装置 | |
| JP2530881Y2 (ja) | 半導体装置のリードフレーム | |
| JP3568486B2 (ja) | 半導体装置の製造方法 | |
| JPH0821664B2 (ja) | リードの半田メッキ装置 | |
| JP2506613Y2 (ja) | リ―ドの半田メッキ装置 | |
| JP2811112B2 (ja) | 半田供給板 | |
| KR20040058113A (ko) | 도금 장치, 도금 방법 및 반도체 장치의 제조 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |