JPH0476051U - - Google Patents

Info

Publication number
JPH0476051U
JPH0476051U JP11944890U JP11944890U JPH0476051U JP H0476051 U JPH0476051 U JP H0476051U JP 11944890 U JP11944890 U JP 11944890U JP 11944890 U JP11944890 U JP 11944890U JP H0476051 U JPH0476051 U JP H0476051U
Authority
JP
Japan
Prior art keywords
solder plating
leads
cathode
solder
plating liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11944890U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087642Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990119448U priority Critical patent/JPH087642Y2/ja
Publication of JPH0476051U publication Critical patent/JPH0476051U/ja
Application granted granted Critical
Publication of JPH087642Y2 publication Critical patent/JPH087642Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990119448U 1990-11-16 1990-11-16 リードの半田メッキ装置 Expired - Fee Related JPH087642Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119448U JPH087642Y2 (ja) 1990-11-16 1990-11-16 リードの半田メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119448U JPH087642Y2 (ja) 1990-11-16 1990-11-16 リードの半田メッキ装置

Publications (2)

Publication Number Publication Date
JPH0476051U true JPH0476051U (enrdf_load_stackoverflow) 1992-07-02
JPH087642Y2 JPH087642Y2 (ja) 1996-03-04

Family

ID=31867405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119448U Expired - Fee Related JPH087642Y2 (ja) 1990-11-16 1990-11-16 リードの半田メッキ装置

Country Status (1)

Country Link
JP (1) JPH087642Y2 (enrdf_load_stackoverflow)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS572899A (en) * 1980-05-07 1982-01-08 Perkin Elmer Corp Method and device for electroplating electroconductive substrate
JPS6067689A (ja) * 1983-09-22 1985-04-18 Nec Corp めつき方法及びめつき装置
JPS6092497A (ja) * 1983-10-27 1985-05-24 Nec Corp メツキ装置
JPS61253399A (ja) * 1985-05-07 1986-11-11 Sumitomo Metal Ind Ltd メツキ液浄化装置
JPS6240391A (ja) * 1985-08-13 1987-02-21 Matsushita Electric Ind Co Ltd 情報記録体の電鋳装置
JPS62210688A (ja) * 1986-03-11 1987-09-16 日本碍子株式会社 セラミツクパツケ−ジの部分めつき方法及びその装置
JPS63243297A (ja) * 1987-03-31 1988-10-11 Mitsubishi Metal Corp 伝熱管の製造方法
JPH02111898A (ja) * 1988-10-20 1990-04-24 Mitsubishi Electric Corp 半導体素子の製造装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS572899A (en) * 1980-05-07 1982-01-08 Perkin Elmer Corp Method and device for electroplating electroconductive substrate
JPS6067689A (ja) * 1983-09-22 1985-04-18 Nec Corp めつき方法及びめつき装置
JPS6092497A (ja) * 1983-10-27 1985-05-24 Nec Corp メツキ装置
JPS61253399A (ja) * 1985-05-07 1986-11-11 Sumitomo Metal Ind Ltd メツキ液浄化装置
JPS6240391A (ja) * 1985-08-13 1987-02-21 Matsushita Electric Ind Co Ltd 情報記録体の電鋳装置
JPS62210688A (ja) * 1986-03-11 1987-09-16 日本碍子株式会社 セラミツクパツケ−ジの部分めつき方法及びその装置
JPS63243297A (ja) * 1987-03-31 1988-10-11 Mitsubishi Metal Corp 伝熱管の製造方法
JPH02111898A (ja) * 1988-10-20 1990-04-24 Mitsubishi Electric Corp 半導体素子の製造装置

Also Published As

Publication number Publication date
JPH087642Y2 (ja) 1996-03-04

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Legal Events

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LAPS Cancellation because of no payment of annual fees