JPS6351388B2 - - Google Patents
Info
- Publication number
- JPS6351388B2 JPS6351388B2 JP56034854A JP3485481A JPS6351388B2 JP S6351388 B2 JPS6351388 B2 JP S6351388B2 JP 56034854 A JP56034854 A JP 56034854A JP 3485481 A JP3485481 A JP 3485481A JP S6351388 B2 JPS6351388 B2 JP S6351388B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead
- lead frame
- frame
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3485481A JPS57149756A (en) | 1981-03-11 | 1981-03-11 | Partial plating method for lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3485481A JPS57149756A (en) | 1981-03-11 | 1981-03-11 | Partial plating method for lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57149756A JPS57149756A (en) | 1982-09-16 |
JPS6351388B2 true JPS6351388B2 (enrdf_load_stackoverflow) | 1988-10-13 |
Family
ID=12425758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3485481A Granted JPS57149756A (en) | 1981-03-11 | 1981-03-11 | Partial plating method for lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57149756A (enrdf_load_stackoverflow) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS516055B2 (enrdf_load_stackoverflow) * | 1972-06-26 | 1976-02-25 | ||
JPS49133230A (enrdf_load_stackoverflow) * | 1973-04-26 | 1974-12-20 | ||
JPS5719193B2 (enrdf_load_stackoverflow) * | 1973-12-15 | 1982-04-21 | ||
JPS5858439B2 (ja) * | 1975-02-28 | 1983-12-24 | 日本電気株式会社 | リ−ドフレ−ムの製造方法 |
JPS51137629A (en) * | 1975-05-23 | 1976-11-27 | Nippon Electro Plating | Highhspeed continuous plating method |
JPS5743897Y2 (enrdf_load_stackoverflow) * | 1980-08-29 | 1982-09-28 |
-
1981
- 1981-03-11 JP JP3485481A patent/JPS57149756A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57149756A (en) | 1982-09-16 |
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