JPS6344300B2 - - Google Patents
Info
- Publication number
- JPS6344300B2 JPS6344300B2 JP56114042A JP11404281A JPS6344300B2 JP S6344300 B2 JPS6344300 B2 JP S6344300B2 JP 56114042 A JP56114042 A JP 56114042A JP 11404281 A JP11404281 A JP 11404281A JP S6344300 B2 JPS6344300 B2 JP S6344300B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- plating liquid
- plating
- mask
- mask plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56114042A JPS5815244A (ja) | 1981-07-21 | 1981-07-21 | Ｉｃフレ−ムの部分メツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56114042A JPS5815244A (ja) | 1981-07-21 | 1981-07-21 | Ｉｃフレ−ムの部分メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5815244A JPS5815244A (ja) | 1983-01-28 |
| JPS6344300B2 true JPS6344300B2 (enrdf_load_stackoverflow) | 1988-09-05 |
Family
ID=14627568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56114042A Granted JPS5815244A (ja) | 1981-07-21 | 1981-07-21 | Ｉｃフレ−ムの部分メツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5815244A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6433799A (en) * | 1987-07-30 | 1989-02-03 | Sony Corp | Sample holding circuit |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6353957A (ja) * | 1986-08-22 | 1988-03-08 | Hitachi Cable Ltd | リ−ドフレ−ムのスポツトめつき方法 |
| JPH02133949A (ja) * | 1988-11-14 | 1990-05-23 | Hitachi Cable Ltd | リードフレームのスポットめっき方法 |
| KR930006493B1 (ko) * | 1991-09-27 | 1993-07-16 | 장관순 | 탭핑머시인겸 드릴링머시인의 자동이송장치 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57210987A (en) * | 1981-06-18 | 1982-12-24 | Sumitomo Electric Ind Ltd | Partial plating device |
-
1981
- 1981-07-21 JP JP56114042A patent/JPS5815244A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6433799A (en) * | 1987-07-30 | 1989-02-03 | Sony Corp | Sample holding circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5815244A (ja) | 1983-01-28 |
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