JPS5815244A - Ｉｃフレ−ムの部分メツキ装置 - Google Patents

Ｉｃフレ−ムの部分メツキ装置

Info

Publication number
JPS5815244A
JPS5815244A JP56114042A JP11404281A JPS5815244A JP S5815244 A JPS5815244 A JP S5815244A JP 56114042 A JP56114042 A JP 56114042A JP 11404281 A JP11404281 A JP 11404281A JP S5815244 A JPS5815244 A JP S5815244A
Authority
JP
Japan
Prior art keywords
frame
plating
plating solution
mask plate
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56114042A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344300B2 (enrdf_load_stackoverflow
Inventor
Kenji Yamamoto
健治 山本
Junichi Tezuka
純一 手塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP56114042A priority Critical patent/JPS5815244A/ja
Publication of JPS5815244A publication Critical patent/JPS5815244A/ja
Publication of JPS6344300B2 publication Critical patent/JPS6344300B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56114042A 1981-07-21 1981-07-21 Ｉｃフレ−ムの部分メツキ装置 Granted JPS5815244A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56114042A JPS5815244A (ja) 1981-07-21 1981-07-21 Ｉｃフレ−ムの部分メツキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56114042A JPS5815244A (ja) 1981-07-21 1981-07-21 Ｉｃフレ−ムの部分メツキ装置

Publications (2)

Publication Number Publication Date
JPS5815244A true JPS5815244A (ja) 1983-01-28
JPS6344300B2 JPS6344300B2 (enrdf_load_stackoverflow) 1988-09-05

Family

ID=14627568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56114042A Granted JPS5815244A (ja) 1981-07-21 1981-07-21 Ｉｃフレ−ムの部分メツキ装置

Country Status (1)

Country Link
JP (1) JPS5815244A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6353957A (ja) * 1986-08-22 1988-03-08 Hitachi Cable Ltd リ−ドフレ−ムのスポツトめつき方法
JPH02133949A (ja) * 1988-11-14 1990-05-23 Hitachi Cable Ltd リードフレームのスポットめっき方法
JPH05277818A (ja) * 1991-09-27 1993-10-26 Kwan Soon Jang ねじ立て盤兼ボール盤の自動送り装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433799A (en) * 1987-07-30 1989-02-03 Sony Corp Sample holding circuit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210987A (en) * 1981-06-18 1982-12-24 Sumitomo Electric Ind Ltd Partial plating device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210987A (en) * 1981-06-18 1982-12-24 Sumitomo Electric Ind Ltd Partial plating device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6353957A (ja) * 1986-08-22 1988-03-08 Hitachi Cable Ltd リ−ドフレ−ムのスポツトめつき方法
JPH02133949A (ja) * 1988-11-14 1990-05-23 Hitachi Cable Ltd リードフレームのスポットめっき方法
JPH05277818A (ja) * 1991-09-27 1993-10-26 Kwan Soon Jang ねじ立て盤兼ボール盤の自動送り装置

Also Published As

Publication number Publication date
JPS6344300B2 (enrdf_load_stackoverflow) 1988-09-05

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