JPH039330Y2 - - Google Patents

Info

Publication number
JPH039330Y2
JPH039330Y2 JP1986168764U JP16876486U JPH039330Y2 JP H039330 Y2 JPH039330 Y2 JP H039330Y2 JP 1986168764 U JP1986168764 U JP 1986168764U JP 16876486 U JP16876486 U JP 16876486U JP H039330 Y2 JPH039330 Y2 JP H039330Y2
Authority
JP
Japan
Prior art keywords
plating
semiconductor wafer
wafer
plated
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986168764U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6373939U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986168764U priority Critical patent/JPH039330Y2/ja
Publication of JPS6373939U publication Critical patent/JPS6373939U/ja
Application granted granted Critical
Publication of JPH039330Y2 publication Critical patent/JPH039330Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP1986168764U 1986-10-31 1986-10-31 Expired JPH039330Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986168764U JPH039330Y2 (enrdf_load_stackoverflow) 1986-10-31 1986-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986168764U JPH039330Y2 (enrdf_load_stackoverflow) 1986-10-31 1986-10-31

Publications (2)

Publication Number Publication Date
JPS6373939U JPS6373939U (enrdf_load_stackoverflow) 1988-05-17
JPH039330Y2 true JPH039330Y2 (enrdf_load_stackoverflow) 1991-03-08

Family

ID=31101945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986168764U Expired JPH039330Y2 (enrdf_load_stackoverflow) 1986-10-31 1986-10-31

Country Status (1)

Country Link
JP (1) JPH039330Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2739743B2 (ja) * 1989-12-25 1998-04-15 カシオ計算機株式会社 メッキによる電極の形成方法

Also Published As

Publication number Publication date
JPS6373939U (enrdf_load_stackoverflow) 1988-05-17

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