JPH03103260U - - Google Patents

Info

Publication number
JPH03103260U
JPH03103260U JP1038790U JP1038790U JPH03103260U JP H03103260 U JPH03103260 U JP H03103260U JP 1038790 U JP1038790 U JP 1038790U JP 1038790 U JP1038790 U JP 1038790U JP H03103260 U JPH03103260 U JP H03103260U
Authority
JP
Japan
Prior art keywords
jig
main body
wafer
plating
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1038790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1038790U priority Critical patent/JPH03103260U/ja
Publication of JPH03103260U publication Critical patent/JPH03103260U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP1038790U 1990-02-05 1990-02-05 Pending JPH03103260U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1038790U JPH03103260U (enrdf_load_stackoverflow) 1990-02-05 1990-02-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1038790U JPH03103260U (enrdf_load_stackoverflow) 1990-02-05 1990-02-05

Publications (1)

Publication Number Publication Date
JPH03103260U true JPH03103260U (enrdf_load_stackoverflow) 1991-10-28

Family

ID=31513957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1038790U Pending JPH03103260U (enrdf_load_stackoverflow) 1990-02-05 1990-02-05

Country Status (1)

Country Link
JP (1) JPH03103260U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316887A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理装置
US6391168B1 (en) 1999-04-06 2002-05-21 Nec Corporation Plating apparatus utilizing an auxiliary electrode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6391168B1 (en) 1999-04-06 2002-05-21 Nec Corporation Plating apparatus utilizing an auxiliary electrode
JP2001316887A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理装置

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