JPS57149756A - Partial plating method for lead frame - Google Patents

Partial plating method for lead frame

Info

Publication number
JPS57149756A
JPS57149756A JP3485481A JP3485481A JPS57149756A JP S57149756 A JPS57149756 A JP S57149756A JP 3485481 A JP3485481 A JP 3485481A JP 3485481 A JP3485481 A JP 3485481A JP S57149756 A JPS57149756 A JP S57149756A
Authority
JP
Japan
Prior art keywords
tank
section
plating
supporting base
plating liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3485481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6351388B2 (enrdf_load_stackoverflow
Inventor
Kuniaki Tsurushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3485481A priority Critical patent/JPS57149756A/ja
Publication of JPS57149756A publication Critical patent/JPS57149756A/ja
Publication of JPS6351388B2 publication Critical patent/JPS6351388B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP3485481A 1981-03-11 1981-03-11 Partial plating method for lead frame Granted JPS57149756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3485481A JPS57149756A (en) 1981-03-11 1981-03-11 Partial plating method for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3485481A JPS57149756A (en) 1981-03-11 1981-03-11 Partial plating method for lead frame

Publications (2)

Publication Number Publication Date
JPS57149756A true JPS57149756A (en) 1982-09-16
JPS6351388B2 JPS6351388B2 (enrdf_load_stackoverflow) 1988-10-13

Family

ID=12425758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3485481A Granted JPS57149756A (en) 1981-03-11 1981-03-11 Partial plating method for lead frame

Country Status (1)

Country Link
JP (1) JPS57149756A (enrdf_load_stackoverflow)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924775A (enrdf_load_stackoverflow) * 1972-06-26 1974-03-05
JPS49133230A (enrdf_load_stackoverflow) * 1973-04-26 1974-12-20
JPS5091533A (enrdf_load_stackoverflow) * 1973-12-15 1975-07-22
JPS5199635A (ja) * 1975-02-28 1976-09-02 Nippon Electric Co Bubunmetsukyomasukingujigu
JPS51137629A (en) * 1975-05-23 1976-11-27 Nippon Electro Plating Highhspeed continuous plating method
JPS5748265U (enrdf_load_stackoverflow) * 1980-08-29 1982-03-18

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924775A (enrdf_load_stackoverflow) * 1972-06-26 1974-03-05
JPS49133230A (enrdf_load_stackoverflow) * 1973-04-26 1974-12-20
JPS5091533A (enrdf_load_stackoverflow) * 1973-12-15 1975-07-22
JPS5199635A (ja) * 1975-02-28 1976-09-02 Nippon Electric Co Bubunmetsukyomasukingujigu
JPS51137629A (en) * 1975-05-23 1976-11-27 Nippon Electro Plating Highhspeed continuous plating method
JPS5748265U (enrdf_load_stackoverflow) * 1980-08-29 1982-03-18

Also Published As

Publication number Publication date
JPS6351388B2 (enrdf_load_stackoverflow) 1988-10-13

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