JPH087636Y2 - 電子部品付きフィルムコネクタ - Google Patents
電子部品付きフィルムコネクタInfo
- Publication number
- JPH087636Y2 JPH087636Y2 JP1990032517U JP3251790U JPH087636Y2 JP H087636 Y2 JPH087636 Y2 JP H087636Y2 JP 1990032517 U JP1990032517 U JP 1990032517U JP 3251790 U JP3251790 U JP 3251790U JP H087636 Y2 JPH087636 Y2 JP H087636Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- outer lead
- lead portion
- liquid crystal
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims description 65
- 238000007747 plating Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 11
- 239000004973 liquid crystal related substance Substances 0.000 description 25
- 239000000758 substrate Substances 0.000 description 23
- 239000011521 glass Substances 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000005336 cracking Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990032517U JPH087636Y2 (ja) | 1990-03-28 | 1990-03-28 | 電子部品付きフィルムコネクタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990032517U JPH087636Y2 (ja) | 1990-03-28 | 1990-03-28 | 電子部品付きフィルムコネクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03124642U JPH03124642U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-12-17 |
| JPH087636Y2 true JPH087636Y2 (ja) | 1996-03-04 |
Family
ID=31535526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990032517U Expired - Fee Related JPH087636Y2 (ja) | 1990-03-28 | 1990-03-28 | 電子部品付きフィルムコネクタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087636Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3384528B2 (ja) * | 1996-02-05 | 2003-03-10 | 矢崎総業株式会社 | フラットケーブルとジョイント端子との接合体 |
| JP4643423B2 (ja) * | 2005-12-01 | 2011-03-02 | 富士通コンポーネント株式会社 | ケーブルコネクタ型トランシーバモジュール |
-
1990
- 1990-03-28 JP JP1990032517U patent/JPH087636Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03124642U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-12-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |