JPH087632Y2 - 半導体装置用樹脂封止金型 - Google Patents

半導体装置用樹脂封止金型

Info

Publication number
JPH087632Y2
JPH087632Y2 JP1987176774U JP17677487U JPH087632Y2 JP H087632 Y2 JPH087632 Y2 JP H087632Y2 JP 1987176774 U JP1987176774 U JP 1987176774U JP 17677487 U JP17677487 U JP 17677487U JP H087632 Y2 JPH087632 Y2 JP H087632Y2
Authority
JP
Japan
Prior art keywords
resin
mold
recess
cavity
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987176774U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0180930U (en:Method
Inventor
勉 青野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1987176774U priority Critical patent/JPH087632Y2/ja
Publication of JPH0180930U publication Critical patent/JPH0180930U/ja
Application granted granted Critical
Publication of JPH087632Y2 publication Critical patent/JPH087632Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1987176774U 1987-11-19 1987-11-19 半導体装置用樹脂封止金型 Expired - Lifetime JPH087632Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987176774U JPH087632Y2 (ja) 1987-11-19 1987-11-19 半導体装置用樹脂封止金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987176774U JPH087632Y2 (ja) 1987-11-19 1987-11-19 半導体装置用樹脂封止金型

Publications (2)

Publication Number Publication Date
JPH0180930U JPH0180930U (en:Method) 1989-05-30
JPH087632Y2 true JPH087632Y2 (ja) 1996-03-04

Family

ID=31468477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987176774U Expired - Lifetime JPH087632Y2 (ja) 1987-11-19 1987-11-19 半導体装置用樹脂封止金型

Country Status (1)

Country Link
JP (1) JPH087632Y2 (en:Method)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831538A (ja) * 1981-08-19 1983-02-24 Toshiba Corp 樹脂封止用金型装置

Also Published As

Publication number Publication date
JPH0180930U (en:Method) 1989-05-30

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