JPH0864708A - Marking apparatus and marking method for semiconductor package - Google Patents

Abstract

PURPOSE: To provide an apparatus by which both semiconductor packages in a sheet form and discrete semiconductor packages can be marked. CONSTITUTION: A conveying rail for semiconductor packages which are mounted on a lead frame which is not cut yet so as to have a continuous sheet form and a conveyer for discrete semiconductor package 3 whose leads are formed and which are bonded to the surface of an adhesive tape 4 in a belt shape are provided so as to cross each other with a common marking head at the center of the crossing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package marking device and method. 2. Description of the Related Art In recent years, various types of packages have been used due to diversification of semiconductor devices, a semiconductor package transporting method differs depending on a marking device, and a variety of marking devices for packages are also used accordingly.

Therefore, it is always necessary to use various types of marking devices, and as the cost is reduced, there is also a demand for a multi-purpose marking device in which various types are integrated.

[0003]

2. Description of the Related Art FIGS. 2 and 3 are explanatory views of a conventional example. In the figure, 1 is a marking head, 2 is a sheet semiconductor package, 3 is a single semiconductor package, 7 is an inspection unit, 8 is a transport rail, 9 is a lead, 10 is a magazine, and 11 is a magazine.
Is a loader section, 12 is an unloader section, 13 is a loader transfer, 14 is a transfer transfer, 15 is a conveyor, 16 is a UV curing furnace, 17 is an unloader transfer, and 18 is a slide-down transfer rail.

Conventionally, in the step of marking (marking) the type and type of the semiconductor package surface, in order to simplify the transportation system of the semiconductor package, a sheet (for example, plastic type package) or a single (for example, ceramic type) is used. Any of the transport systems (package) is used, and a dedicated marking device suitable for each is used.

First, regarding the sheet marking device, FIG. 2 is a perspective view showing an outline of the route of the device, and FIG. 3 is a plan view of a sheet semiconductor package to be marked.
FIG. 3B is a sectional view showing the main part of the marking device, and FIG.

That is, as shown by the arrow in FIG. 2 to indicate the package transfer route, the IC is mounted in the magazine 10 of the loader unit 11.
About 20 sheet-shaped semiconductor packages 2 each of which has a chip-loaded lead frame sealed with a mold resin are housed. Then, the loader transfer 13 loads the six consecutive sheet-shaped semiconductor packages 2 on the transport rail 8 one by one, the marking head 1 imprints the surface of each package, and then the inspection unit 7 inspects.

After that, the transfer transfer 14 is performed by the conveyor 15
And is sent to the UV cure furnace 16. After UV curing is performed and the marking is printed, it is stored in the magazine 10 of the unloader unit 12 by the unloader transfer 17.

The single semiconductor package is shown in FIG.
As shown in (1), slide on the slide-type transport rail 18 and mark each package with the marking head. in this way,
Since the conveying method is limited by the marking device, it is difficult to mark a sheet-shaped and single semiconductor package at the same time with one device because it requires a large space and a wide space. Always required multiple equipment, double capital investment and factory floor space.

[0009]

However, even for plastic semiconductors of the same type, there is a demand for marking by mixing a sheet-shaped semiconductor package before lead cutting and molding and a single semiconductor package after lead cutting and molding. The number of these types of packages is increasing, and there is a demand for an apparatus that efficiently processes both types of packages with a single apparatus.

However, the conventional sheet-shaped and single-piece dedicated marking devices cannot share the transport system, and the efficiency is lowered due to the proper use of the devices. for that reason,
The present invention is provided for the purpose of developing a versatile device by sharing a transport system, reducing investment, and reducing marking cost by improving operating rate.

[0011]

FIG. 1 is a diagram illustrating the principle of the present invention. In the figure, 1 is a marking head, 2 is a sheet-like semiconductor package, 3 is a single semiconductor package,
4 is an adhesive tape, 5 is a tray, and 6 is a tape winding mechanism.

In order to solve the above-mentioned problems, the conventional sheet-type package conveying system is used as it is, and a newly developed single-piece package conveying system is added to provide a dual-purpose device for both.

Therefore, a taping mechanism for conveying a single package is developed, and the single package is continuously mounted on a tape from a container or a tray for storing the single package and is conveyed to a marking head. That is, the transport system for taping a single package is attached so as to intersect with the conventional sheet transport system at a right angle (90 °).

The taping transfer path does not require such a space length and does not require a complicated transfer system.
The marked single body is wound up again on the taping device.

That is, an object of the present invention is to provide a single semiconductor package in which leads are formed centering on the marking head of the semiconductor package and at right angles to the carrier rails of the semiconductor packages connected in a sheet shape before cutting the lead frame. By arranging the semiconductor package tape transport device that is adhered to the surface of the adhesive tape,
And a semiconductor package marking device that can also be used as a single semiconductor package. Also, the semiconductor packages connected in a sheet shape before cutting the lead frame are conveyed to the position of the marking head by a conveyance rail, The step of marking and the semiconductor package in which a single semiconductor package with leads molded is adhered to the surface of the adhesive tape is transported to the position of the marking head by the tape transport device installed at a right angle with the transport rail and the marking head as the center. Then, the step of marking the semiconductor package is achieved by sequentially performing the marking.

[0016]

According to the present invention, a sheet-shaped semiconductor package conveying system and a single-piece semiconductor package taping type conveying system are attached to a general-purpose device so as to intersect at right angles with the marking head as a center. You can easily switch the marking from the package marking to the single semiconductor package with the same device.

Further, the single semiconductor package can be shipped while being taped.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram for explaining the principle of the present invention and an explanatory diagram for one embodiment. In the figure, 1 is a marking head, 2 is a sheet-like semiconductor package, 3 is a single semiconductor package,
4 is an adhesive tape, 5 is a tray, and 6 is a tape winding mechanism.

Marking of a 16-pin mold resin-sealed J-lead type semiconductor package will be described. FIG.
As shown in the plan view of FIG. 3A, a conventional sheet-shaped semiconductor package is mounted on a lead frame with six semiconductor packages.
The individual pieces are sealed with a mold resin, and the outer lead terminals are connected in an uncut state. This sheet-shaped semiconductor package is stacked and stored in a magazine, tray, container or the like in a conventional marking device. Then, a series of sheet-shaped semiconductor packages are sent one by one to the position of the marking head by the transfer rail of the transfer mechanism as indicated by the dotted arrow, and the type, model, etc. are printed on the surface of the semiconductor package.

Next, in the case of marking a single semiconductor package, as shown in the plan view of FIG. 1A and the sectional view of FIG. A semiconductor package taping mechanism is provided in a direction perpendicular to the marking head, and individual semiconductor packages stored in trays or container containers are transported one by one onto an adhesive tape that is gradually wound up by a rotating drum. The marks are sent one by one to the position of the marking head as indicated by the dotted arrow, and the type, model, etc. are printed on the surface of the semiconductor package.

In this way, the marking of a sheet-shaped or single semiconductor package can be easily performed by switching the transport mechanism with one combined marking device. Also,
The single pattern package can be conveyed not only by the taping method but also by a mechanical chuck or a vacuum holding method.

[0022]

As described above, according to the present invention,
Sheet-shaped or single marking can be done with the same device regardless of the marking device, which greatly contributes to reduction of capital investment and improvement of operating rate.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention.

FIG. 2 is an explanatory diagram of a conventional example (No. 1)

FIG. 3 is an explanatory diagram of a conventional example (No. 2)

[Explanation of symbols]

 In the figure 1 marking head 2 sheet semiconductor package 3 single semiconductor package 4 adhesive tape 5 tray etc. 6 tape winding mechanism

Claims (2)

[Claims] 1. A marking head comprising: a carrier rail for a semiconductor package, which is continuously connected in a sheet shape before cutting a lead frame; and a carrier device for a single semiconductor package, in which leads are shaped and adhered in a strip shape on the surface of an adhesive tape. A semiconductor package marking device, wherein the marking devices are arranged so as to intersect with each other. 2. A step of carrying a semiconductor package, which is continuously connected in a sheet shape before cutting the lead frame, to a position of a marking head by a carrying rail to mark the semiconductor package, and a lead is shaped, and a band-like shape is formed on the surface of the adhesive tape. The step of carrying the single semiconductor package adhered to the above-mentioned semiconductor package to the position of the marking head by the tape carrying device installed so as to intersect the carrying rail and the marking head as a center, and marking the semiconductor package, as appropriate. A method for marking a semiconductor package, wherein the marking is performed by switching.