JPS63275135A - Semiconductor wafer packing equipment - Google Patents

Abstract

PURPOSE:To enable the remarkable reduction of manhour, and improve yield, by printing automatically characters on a previously formed continuous containing bag, in which semiconductor wafers are accommodated. CONSTITUTION:From a supplying part, a containing bag belt 21 of constant length is carried in order with a specific timing, and a printing part 5 prints prescribed characters on each containing bag 22. By a suction apparatus 6, the one side sheet of the containing bag 22 is sucked with a specific timing, and an insertion port is opened. By a carriage-insertion part 7, a semiconductor wafer 20 is taken out from a wafer containing carrier 1 with a specific timing, and carried and inserted into the containing bag 22 through an insertion port. Thus the semiconductor wafer 20 is carried together with the containing bag 22 by a conveying part 4, and orderly accommodated in a containing box 8. Thereby, the improvement of yield and the reduction of manhour are realized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor wafer bagging machine, and more particularly to a semiconductor wafer bagging machine used when packaging semiconductor wafers for shipping.

[Conventional technology]

A conventional semiconductor wafer bagging machine uses tweezers, a printing machine, etc., and when the semiconductor wafer is shipped, an operator manually stamps the wafer number 1 on the storage bag of semiconductor wafer 1, and the semiconductor wafer is Each sheet was stored in a printed storage bag, then stored in a storage box and packed.

[Problem that the invention seeks to solve]

The conventional semiconductor wafer/bagging machine described above is constructed manually using tweezers, a printing machine, etc., so it requires a huge amount of man-hours for the operator, and the tweezers etc. cause damage to the semiconductor wafer/bagging machine. There is a drawback that the yield decreases due to the increase in s.

An object of the present invention is to provide a bag tying machine for semiconductor wafers that can improve yield and reduce man-hours.

[Means for solving problems]

The semiconductor wafer bagging machine of the first invention includes a wafer storage carrier for holding and storing a plurality of semiconductor wafers, a carrier holding portion having a wafer storage carrier holding portion, and a tape-shaped sheet fil-2 having a predetermined width. A storage bag supply unit that stores in advance a storage bag belt formed by stacking sheets and sequentially bonding these sheets in the width direction at regular intervals in the longitudinal direction and sequentially feeds out the storage bag belt; a conveyance unit that sequentially conveys the entire storage bag band by a certain length at a predetermined timing, a printing unit that prints predetermined characters on each of the storage bags, and one sheet 'i-' of the storage bag that has been conveyed.
a suction device that picks up the semiconductor wafer at a predetermined timing and opens an insertion port; and a wafer transport/insertion unit that takes out the semiconductor wafer from the wafer storage carrier at a predetermined timing, transports the semiconductor wafer, and inserts the semiconductor wafer from the insertion port into the storage bag. have.

The semiconductor wafer bagging machine of the second invention includes a storage carrier for holding and storing a plurality of semiconductor wafers, a storage carrier for holding the wafers, and a storage carrier for holding the semiconductor wafers, and sequentially loading the semiconductor wafers one by one at a predetermined timing. A wafer supply unit that feeds out a wafer, and an upper sheet roller and a lower sheet roller that house tape-shaped upper sheets and lower sheet rollers of a predetermined width, respectively, and feed out the upper sheet and the lower sheet by a certain length at a predetermined timing. A sheet supply section, a semiconductor wafer 71 fed out from the wafer supply section, a conveyance section that sequentially conveys the semiconductor wafer 71 by sandwiching it between an upper sheet and a lower sheet fed out from the sheet supply section, and the upper sheet that has been conveyed. and an adhesive device that adheres the lower sheet in the width direction at regular intervals in the longitudinal direction to form a storage bag containing the semiconductor wafer;
and a printing section that prints predetermined characters on each of the storage bags.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the first invention.

The wafer storage carrier 1 holds and stores a plurality of semiconductor wafers 20, and is held by a carrier holding section.

The storage bag supply roller 3 stacks two tape-shaped sheets that are slightly wider than the diameter of the semiconductor wafer 20, and stacks these two sheets in the width direction at regular intervals that are slightly longer than the diameter of the semiconductor wafer 20 in the longitudinal direction. Glued storage bag 22
A storage bag belt 21 in which the storage bag strips 21 are continuously formed is stored in advance and fed out one after another.

The conveyance unit 4 carries the storage bag band 21 from the storage bag supply roller 3.
are sequentially conveyed by a length corresponding to one storage bag 22 at a predetermined timing 2.

The printing unit 5 prints a predetermined character (23) such as a wafer number on the mark housing 22 into which the semiconductor wafers 20 are packed.

The suction device 6 suctions the upper sheet 6- of the transported storage bag 22 at a predetermined timing, and opens the insertion opening of the storage bag 22.

The wafer transfer insertion section 7 inserts the arm 7 at a predetermined timing.
Transfer the semiconductor wafer 2 from the wafer storage carrier l to A.
The semiconductor wafer 20 is taken out and transported, and the semiconductor wafer 20 is inserted into the storage bag 22 through the insertion opening opened by the suction device 6.

The semiconductor wafers 20 are further transported along with the storage bag 22 to the transport section 4, and are sequentially stored in the storage box 8.

FIG. 2 is a side view showing an embodiment of the second invention.

A plurality of semiconductor wafers 2 are stored in the wafer storage carrier la.
The wafer supply section 9 holds the wafer storage carrier la1 and sequentially feeds out the semiconductor chips 20 one by one from the wafer storage carrier la at a predetermined timing.

The sheet supply unit 10 supplies tape-shaped upper sheets 24 and lower sheets 2 having a width slightly wider than the diameter of the semiconductor wafer 20.
The device is provided with an upper sheet roller 11 and a lower sheet roller 12, each of which is wound and housed with a semiconductor wafer 2o, and feeds out an upper sheet 24 and a lower sheet 25 at a predetermined timing, each having a length slightly longer than the diameter of the semiconductor wafer 2o.

The conveyance section 4a sequentially conveys the semiconductor wafer 20 fed out from the wafer supply section 9 by sandwiching it between an upper sheet 24 and a lower sheet 25 fed out from the sheet supply section 1o.

The bonding device 13 bonds an upper sheet 24 and a lower sheet 25 sandwiching the transported semiconductor wafer 20 in the width direction at an interval slightly longer than the diameter of the semiconductor wafer 2o in the longitudinal direction using an adhesive portion 14 to form a semiconductor wafer. A storage bag 22a containing 20 is formed.

The printing unit 5 prints predetermined characters indicating the wafer number on each storage bag 22a.

The semiconductor wafer I20 is further transported by the transport section 4a together with the storage bag 22a and sequentially stored in the storage box 8a.

Therefore, the semiconductor wafers 2o can be automatically packed into bags, and the number of man-hours can be significantly reduced. Further, by appropriately designing and manufacturing the arm 7A and the wafer supply section 9, it is possible to prevent damage to the semiconductor wafers 2o, and it is possible to improve the yield.

In the embodiment shown in FIG. 2, printing is performed after bagging, but it is also possible to print at a predetermined position before bagging.

〔Effect of the invention〕

As explained above, the present invention automatically prints on a pre-formed continuous storage bag and inserts and stores the semiconductor wafer, or automatically sandwiches the semiconductor wafer between two sheets and holds the semiconductor wafer on both sides. Adhesive, storage, and printing eliminates the need for workers to manually bag and stamp semiconductor wafers, significantly reducing man-hours and preventing scratches on semiconductor wafers. There is an effect that the yield rate 9 can be improved.

[Brief explanation of drawings]

FIG. 1 and FIG. 2 are a perspective view and a side view showing an embodiment of the first and second inventions, respectively. 1, la...wafer storage carrier, 2...
...Carrier holding part, 3...Storage bag supply roller, 4゜4a...Transportation part, 5...
Printing section, 6...Adsorption device, 7...Wafer transport insertion section, 7A...Arm, 8゜8a...
...Storage box, 9...Wafer supply section, 10
... Sheet supply section, 11 ... Upper sheet roller, 12 ... Lower sheet roller, 1
3...Adhesive device, 14...Adhesive part, 2
0... Semiconductor wafer, 21... Storage bag belt, 22... Storage bag, 23... Printing or lO-

Claims (2)

[Claims] (1) A wafer storage carrier that holds and stores a plurality of semiconductor wafers, a carrier holding part that holds this wafer storage carrier, and two tape-shaped sheets of a predetermined width that are stacked at regular intervals in the longitudinal direction. There is a storage bag supply section that stores in advance a storage bag band formed of storage bags made of sheets glued together in the width direction and sequentially delivers the storage bag band. a conveyance unit that sequentially conveys the length of each storage bag, a printing unit that prints predetermined characters on each of the storage bags, and a suction machine that sucks one sheet of the conveyed storage bag at a predetermined timing and opens an insertion opening. A semiconductor wafer bagging machine comprising: a wafer transport/insertion section that takes out the semiconductor wafer from the wafer storage carrier at a predetermined timing, transports the semiconductor wafer, and inserts the semiconductor wafer into the storage bag from the insertion opening. (2) A wafer storage carrier that holds and stores a plurality of semiconductor wafers, a wafer supply unit that holds the wafer storage carrier and sequentially feeds out the semiconductor wafers one by one at a predetermined timing, and a tape-shaped wafer of a predetermined width. a sheet supply section that is equipped with an upper sheet roller and a lower sheet roller that respectively house an upper sheet and a lower sheet of the wafer, and that feeds out the upper sheet and the lower sheet by a certain length at a predetermined timing; a conveyance section that sequentially conveys the semiconductor wafers fed from the sheet supply section by sandwiching them between an upper sheet and a lower sheet; 1. A semiconductor wafer bagging machine comprising: an adhesive device that adheres to form storage bags containing the semiconductor wafers; and a printing section that prints predetermined characters on each of the storage bags.