JPH086235Y2 - 電子部品用熱処理装置 - Google Patents
電子部品用熱処理装置Info
- Publication number
- JPH086235Y2 JPH086235Y2 JP1990065436U JP6543690U JPH086235Y2 JP H086235 Y2 JPH086235 Y2 JP H086235Y2 JP 1990065436 U JP1990065436 U JP 1990065436U JP 6543690 U JP6543690 U JP 6543690U JP H086235 Y2 JPH086235 Y2 JP H086235Y2
- Authority
- JP
- Japan
- Prior art keywords
- heater
- cartridge heater
- heat treatment
- temperature
- cartridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 title claims description 30
- 239000011810 insulating material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000007667 floating Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Resistance Heating (AREA)
- Furnace Details (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990065436U JPH086235Y2 (ja) | 1990-06-22 | 1990-06-22 | 電子部品用熱処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990065436U JPH086235Y2 (ja) | 1990-06-22 | 1990-06-22 | 電子部品用熱処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0423998U JPH0423998U (enrdf_load_stackoverflow) | 1992-02-26 |
| JPH086235Y2 true JPH086235Y2 (ja) | 1996-02-21 |
Family
ID=31597263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990065436U Expired - Lifetime JPH086235Y2 (ja) | 1990-06-22 | 1990-06-22 | 電子部品用熱処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH086235Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102506292B1 (ko) * | 2022-10-17 | 2023-03-06 | 천복기계(주) | 교체식 수냉식 고주파 용접기 |
-
1990
- 1990-06-22 JP JP1990065436U patent/JPH086235Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102506292B1 (ko) * | 2022-10-17 | 2023-03-06 | 천복기계(주) | 교체식 수냉식 고주파 용접기 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423998U (enrdf_load_stackoverflow) | 1992-02-26 |
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