JPH08507412A - 放熱装置及びヒートシンクの組立体を備える高性能の放熱実装体 - Google Patents

放熱装置及びヒートシンクの組立体を備える高性能の放熱実装体

Info

Publication number
JPH08507412A
JPH08507412A JP6519147A JP51914794A JPH08507412A JP H08507412 A JPH08507412 A JP H08507412A JP 6519147 A JP6519147 A JP 6519147A JP 51914794 A JP51914794 A JP 51914794A JP H08507412 A JPH08507412 A JP H08507412A
Authority
JP
Japan
Prior art keywords
heat sink
heat
sink assembly
dissipation device
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6519147A
Other languages
English (en)
Japanese (ja)
Inventor
チア，チョク・ジェイ
アラガラトナム，マニアン
ロウ，クワイ・フーン
リム，セン・ソーイ
Original Assignee
エルエスアイ・ロジック・コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エルエスアイ・ロジック・コーポレーション filed Critical エルエスアイ・ロジック・コーポレーション
Publication of JPH08507412A publication Critical patent/JPH08507412A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02F—CYLINDERS, PISTONS OR CASINGS, FOR COMBUSTION ENGINES; ARRANGEMENTS OF SEALINGS IN COMBUSTION ENGINES
    • F02F7/00—Casings, e.g. crankcases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP6519147A 1993-02-26 1994-02-16 放熱装置及びヒートシンクの組立体を備える高性能の放熱実装体 Pending JPH08507412A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US023,981 1993-02-26
US08/023,981 US5353193A (en) 1993-02-26 1993-02-26 High power dissipating packages with matched heatspreader heatsink assemblies
PCT/US1994/001736 WO1994019594A1 (en) 1993-02-26 1994-02-16 High power dissipating packages with matched heatspreader heatsink assemblies

Publications (1)

Publication Number Publication Date
JPH08507412A true JPH08507412A (ja) 1996-08-06

Family

ID=21818224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6519147A Pending JPH08507412A (ja) 1993-02-26 1994-02-16 放熱装置及びヒートシンクの組立体を備える高性能の放熱実装体

Country Status (4)

Country Link
US (3) US5353193A (enExample)
EP (1) EP0690955A1 (enExample)
JP (1) JPH08507412A (enExample)
WO (1) WO1994019594A1 (enExample)

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US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
GB2293051B (en) * 1994-09-07 1998-05-06 Hewlett Packard Co Mass storage device mounting scheme
GB2293487B (en) * 1994-09-21 1998-08-12 Hewlett Packard Co Method and apparatus for attaching a heat sink and a fan to an intergrated circuit package
GB2295927A (en) * 1994-12-08 1996-06-12 Gareth Rhys Baron Mounting of an integrated circuit on a printed circuit board
US5596485A (en) * 1995-03-16 1997-01-21 Amkor Electronics, Inc. Plastic packaged integrated circuit with heat spreader
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US5777847A (en) * 1995-09-27 1998-07-07 Nec Corporation Multichip module having a cover wtih support pillar
US5696405A (en) * 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US5653280A (en) * 1995-11-06 1997-08-05 Ncr Corporation Heat sink assembly and method of affixing the same to electronic devices
US5579827A (en) * 1995-11-13 1996-12-03 Us Micro Lab, Inc. Heat sink arrangement for central processing unit
DE19612259A1 (de) * 1996-03-28 1997-10-02 Sel Alcatel Ag IC-Bauelement mit Kühlanordnung
CA2201218C (en) * 1996-04-23 2004-09-28 Rudolf Fuchs Process for the preparation of optically active piperazine-2-carboxylic acid derivatives
US5708564A (en) * 1996-05-07 1998-01-13 Lin; Andy Heat sink mounting structure
US6786888B1 (en) 1996-05-20 2004-09-07 Medtronic Ave, Inc. Low profile catheter for emboli protection
EP0889524A3 (en) 1997-06-30 1999-03-03 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system
US6052892A (en) * 1997-11-07 2000-04-25 Micron Electronics, Inc. Adaptor tool for mounting components on printed circuit boards
US5903972A (en) * 1997-11-07 1999-05-18 Micron Electronics, Inc. Method of mounting components on printed circuit boards
US6201301B1 (en) 1998-01-21 2001-03-13 Lsi Logic Corporation Low cost thermally enhanced flip chip BGA
US6016250A (en) * 1998-01-30 2000-01-18 Credence Systems Corporation Self-balancing thermal control device for integrated circuits
US6026895A (en) 1998-02-06 2000-02-22 Fujitsu Limited Flexible foil finned heatsink structure and method of making same
US5966288A (en) * 1998-05-22 1999-10-12 Northern Telecom Limited Assemblies of electronic devices and flexible containers thereof
US6061889A (en) * 1998-06-19 2000-05-16 Lsi Logic Corporation Device and method for removing heatspreader from an integrated circuit package
DE19832710A1 (de) * 1998-07-14 2000-01-27 Siemens Ag Elektrooptische Baugruppe
US6219238B1 (en) 1999-05-10 2001-04-17 International Business Machines Corporation Structure for removably attaching a heat sink to surface mount packages
JP2001044310A (ja) * 1999-07-28 2001-02-16 Mitsubishi Electric Corp 半導体装置およびその搭載方法
TW547699U (en) * 2000-06-14 2003-08-11 Foxconn Prec Components Co Ltd Heat sink device
US6293331B1 (en) * 2000-08-11 2001-09-25 Tyco Electronics Logistics Ag Vibration and shock resistant heat sink assembly
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
US7061102B2 (en) 2001-06-11 2006-06-13 Xilinx, Inc. High performance flipchip package that incorporates heat removal with minimal thermal mismatch
US6386274B1 (en) * 2001-06-28 2002-05-14 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6626507B2 (en) * 2001-07-09 2003-09-30 Hewlett-Packard Development Company, L.P. Fire shield for air ventilation holes of a computer chassis
US6683787B1 (en) 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US6690575B1 (en) 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6661657B1 (en) 2002-02-14 2003-12-09 Mercury Computer Systems, Inc. Circuit board assembly for use in a central inlet chassis configuration
US6697255B1 (en) 2002-02-14 2004-02-24 Mercury Computer Systems, Inc. Circuit board assembly with integrated shaping and control of flow resistance curve
US6944023B2 (en) * 2002-11-15 2005-09-13 Celestica International Inc. System and method for mounting a heat sink
US6781837B2 (en) * 2002-12-06 2004-08-24 Dell Products L.P. System and method for information handling system heat sink retention
EP1575089B1 (en) * 2004-03-09 2007-11-14 Infineon Technologies AG Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
DE102005015244A1 (de) * 2005-04-02 2006-10-05 Elringklinger Ag Abschirmteil, insbesondere Hitzeschild
DE102005015246A1 (de) * 2005-04-02 2006-10-12 Elringklinger Ag Abschirmteil, insbesondere Hitzeschild
US7277291B2 (en) * 2005-08-08 2007-10-02 Verifone Holdings, Inc. Thermal transfer device
US8198725B2 (en) * 2009-12-31 2012-06-12 Star Technologies Inc. Heat sink and integrated circuit assembly using the same
CN102938997A (zh) * 2011-08-16 2013-02-20 鸿富锦精密工业（深圳）有限公司 散热装置
US10114183B2 (en) * 2015-07-31 2018-10-30 Finisar Corporation Screwless heat sink attachment
US9736966B1 (en) 2016-02-10 2017-08-15 International Business Machines Corporation Heat sink with integrated threaded lid
US11439043B2 (en) 2019-05-20 2022-09-06 International Business Machines Corporation Multi-device cooling structure having assembly alignment features
KR102868109B1 (ko) * 2019-09-10 2025-10-10 엘지전자 주식회사 방열기능을 갖는 전자장치

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US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
DE3335365A1 (de) * 1983-09-29 1985-04-18 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum loesbaren befestigen eines kuehlkoerpers auf einem integrierten baustein
DE3335332A1 (de) * 1983-09-29 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum festhalten eines kuehlkoerpers auf der kuehlflaeche eines integrierten bausteins
JPS60115247A (ja) * 1983-11-28 1985-06-21 Fujitsu Ltd 半導体装置
US4879632A (en) * 1985-10-04 1989-11-07 Fujitsu Limited Cooling system for an electronic circuit device
US4729426A (en) * 1986-03-06 1988-03-08 Thermalloy Incorporated Bonded clip heat sink
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US4716494A (en) * 1986-11-07 1987-12-29 Amp Incorporated Retention system for removable heat sink
US5019940A (en) * 1987-02-24 1991-05-28 Thermalloy Incorporated Mounting apparatus for electronic device packages
US4897764A (en) * 1988-10-31 1990-01-30 Control Data Corporation Conductive cooling cup module
US5227663A (en) * 1989-12-19 1993-07-13 Lsi Logic Corporation Integral dam and heat sink for semiconductor device assembly
US4978638A (en) * 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
JPH04107985A (ja) * 1990-08-28 1992-04-09 Fujitsu Ltd 冷却構造
US5132875A (en) * 1990-10-29 1992-07-21 Compaq Computer Corporation Removable protective heat sink for electronic components
JPH04256342A (ja) * 1991-02-08 1992-09-11 Toshiba Corp 半導体パッケージ
US5257162A (en) * 1992-11-20 1993-10-26 Intel Corporation Bellows lid for c4 flip-chip package

Also Published As

Publication number Publication date
EP0690955A1 (en) 1996-01-10
US5568683A (en) 1996-10-29
EP0690955A4 (enExample) 1996-01-24
WO1994019594A1 (en) 1994-09-01
US5353193A (en) 1994-10-04
US5463529A (en) 1995-10-31

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