JPH08506455A - 基板温度制御されたプラズマ堆積方法 - Google Patents
基板温度制御されたプラズマ堆積方法Info
- Publication number
- JPH08506455A JPH08506455A JP7515189A JP51518995A JPH08506455A JP H08506455 A JPH08506455 A JP H08506455A JP 7515189 A JP7515189 A JP 7515189A JP 51518995 A JP51518995 A JP 51518995A JP H08506455 A JPH08506455 A JP H08506455A
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- 238000000151 deposition Methods 0.000 title claims abstract description 125
- 239000000758 substrate Substances 0.000 title claims abstract description 102
- 230000008021 deposition Effects 0.000 claims abstract description 108
- 239000004065 semiconductor Substances 0.000 claims abstract description 51
- 239000000956 alloy Substances 0.000 claims abstract description 25
- 239000001257 hydrogen Substances 0.000 claims abstract description 22
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 22
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 230000002596 correlated effect Effects 0.000 claims abstract description 4
- 230000006866 deterioration Effects 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 62
- 239000007789 gas Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 33
- 230000015556 catabolic process Effects 0.000 claims description 4
- 230000000875 corresponding effect Effects 0.000 claims description 4
- 238000006731 degradation reaction Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910021478 group 5 element Inorganic materials 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 2
- 229910021480 group 4 element Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract description 16
- 238000005137 deposition process Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 230000005284 excitation Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 108091008695 photoreceptors Proteins 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BDEDPKFUFGCVCJ-UHFFFAOYSA-N 3,6-dihydroxy-8,8-dimethyl-1-oxo-3,4,7,9-tetrahydrocyclopenta[h]isochromene-5-carbaldehyde Chemical compound O=C1OC(O)CC(C(C=O)=C2O)=C1C1=C2CC(C)(C)C1 BDEDPKFUFGCVCJ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013367 dietary fats Nutrition 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010520 ghee Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/206—Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System
- H01L31/204—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System including AIVBIV alloys, e.g. SiGe, SiC
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
- Manufacturing Of Electric Cables (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.水素化第IV族半導体合金材料の高品質層のグロー放電堆積方法において、 堆積装置中に限界されたプラズマ域を有し、予め選定されたプロセス・ガスを 当該堆積装置中に導入するための導管、および前記プラズマ域で前記プロセス・ ガスを活性化して当該プロセス・ガスからプラズマを形成するための電磁気エネ ルギー源を含む堆積装置を用意する工程と、 前記堆積装置の中に基板を保持する工程と、 水素および第IV族半導体元素を有するプロセス・ガスを前記堆積装置中に導入 する工程と、 前記プロセス・ガスの圧力を大気圧より低いプロセス圧に維持する工程と、 予め選定されたパワー・レベルの電磁気エネルギーを入力して、前記プロセス ・ガスからプラズマを形成し、および前記パワー・レベルに対応した堆積速度で 前記基板上に水素化第IV族半導体合金材料の層を堆積させる堆積種に前記プロセ ス・ガスを分解する工程と、 堆積速度と積極的に相関づけられ、かつ不所望の形態の除去の促進のために前 記層に十分な運動エネルギーを与えるのには十分に高いが、水素を失うことによ る前記層の品質低下を防ぐのには十分に低い、予め選定された温度に基板を維持 する工程と、 を含むことを特徴とするグロー放電堆積方法。 2.前記予め選定された温度に基板を維持する工程において、 堆積速度が1秒当たり10〜20オングストロームの範囲のときに前記基板の温度 を300〜350℃の範囲に維持し、 堆積速度が1秒当たり20より上であるが50オングストロームより下のときに前 記基板の温度を325〜400℃の範囲に維持し、および、 堆積速度が1秒当たり50オングストロームあるいはそれ以上のきに前記基板の 温度を350〜500℃の範囲に維持することを特徴とする請求の範囲第1項記載の堆 積方法。 3.前記予め選定された温度に基板を維持する工程において、 堆積速度が1秒当たり10オングストロームのときに前記基板の温度を300〜350 ℃の範囲に維持し、 堆積速度が1秒当たり20オングストロームのときに前記基板の温度を300〜400 ℃の範囲に維持し、 堆積速度が1秒当たり30オングストロームのときに前記基板の温度を300〜440 ℃の範囲に維持し、 堆積速度が1秒当たり40オングストロームのときに前記基板の温度を315〜475 ℃の範囲に維持し、 堆積速度が1秒当たり50オングストロームのときに前記基板の温度を325〜500 ℃の範囲に維持し、および、 堆積速度が1秒当たり60オングストロームのときに前記基板の温度を350〜515 ℃の範囲に維持することを特徴とする請求の範囲第1項記載の堆積方法。 4.前記第IV族元素を有するプロセス・ガスを導入する工程において、 シリコン、ゲルマニウムおよびそれらの組合せからからなるグループから選択 された元素を含むプロセス・ガスを導入することを特徴とする請求の範囲第1項 記載の堆積方法。 5.前記プロセス・ガスを導入する工程において、 ハロゲン、第III族元素、第V族元素およびそれらの組み合せからからなるグ ループから選択された1つをさらに含むプロセス・ガスを導入することを特徴と する請求の範囲第1項記載の堆積方法。 6.前記プロセス・ガスを導入する工程において、 SiH4、Si2H6、GeH4、SiF4、GeF4およびそれらの組合せからからなるグループ から選択された1つを含むプロセス・ガスを導入することを特徴とする請求の範 囲第1項記載の堆積方法。 7.前記予め選定されたパワー・レベルの電磁気エネルギーを入力する工程にお いて、 マイクロ波エネルギーを入力することを特徴とする請求の範囲第1項記載の堆 積方法。 8.前記予め選定されたパワー・レベルの電磁気エネルギーを入力する工程にお いて、 無線周波エネルギーを入力することを特徴とする請求の範囲第1項記載の堆積 方法。 9.半導体材料の互いに逆の導電型にドープされた層の間に配置された水素化第 IV族半導体材料の真性層を含む種類の光起電力デバイスの製造方法であって、前 記真性層がグロー放電堆積方法によって堆積され、該堆積方法は、 堆積装置中に限界されたプラズマ域を有し、予め選定されたプロセス・ガスを 導入するための手段、および前記プラズマ域で前記プロセス・ガスを活性化して 当該プロセス・ガスからプラズマを形成するための電磁気エネルギー源を含む堆 積装置を用意し、 前記堆積装置の中に基板を保持し、 水素および第IV族半導体元素を含むプロセス・ガスを前記堆積装置中に導入し 、 大気圧より低いプロセス圧にプロセス・ガスを維持し、 予め選定されたパワー・レベルの電磁気的エネルギーを入力して、前記プロセ ス・ガスからプラズマを形成しおよび前記パワー・レベルに対応した堆積速度で 前記基板上に水素化第IV族半導体合金材料の層を堆積させる堆積種に前記プロセ ス・ガスを分解する光起電力デバイスの製造方法において、 堆積速度と積極的に相関づけられ、不所望の形態の除去の促進のために前記層 に十分な運動エネルギーを与えるには十分に高いが、水素を失うことによる層の 品質低下を防ぐのには十分に低い、予め選定された温度に基板を維持することを 特徴とする光起電力デバイスの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/157,322 US5476798A (en) | 1992-06-29 | 1993-11-26 | Plasma deposition process with substrate temperature control |
US08/157,322 | 1993-11-26 | ||
PCT/US1994/013478 WO1995015012A1 (en) | 1993-11-26 | 1994-11-21 | Plasma deposition process with substrate temperature control |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08506455A true JPH08506455A (ja) | 1996-07-09 |
JP3936391B2 JP3936391B2 (ja) | 2007-06-27 |
Family
ID=22563238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51518995A Expired - Fee Related JP3936391B2 (ja) | 1993-11-26 | 1994-11-21 | 基板温度制御されたプラズマ堆積方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5476798A (ja) |
EP (1) | EP0681743B1 (ja) |
JP (1) | JP3936391B2 (ja) |
ES (1) | ES2194897T3 (ja) |
WO (1) | WO1995015012A1 (ja) |
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US6391690B2 (en) * | 1995-12-14 | 2002-05-21 | Seiko Epson Corporation | Thin film semiconductor device and method for producing the same |
US6274461B1 (en) * | 1998-08-20 | 2001-08-14 | United Solar Systems Corporation | Method for depositing layers of high quality semiconductor material |
EP0994515B1 (en) * | 1998-10-12 | 2007-08-22 | Kaneka Corporation | Method of manufacturing silicon-based thin-film photoelectric conversion device |
US6468829B2 (en) | 2000-05-16 | 2002-10-22 | United Solar Systems Corporation | Method for manufacturing high efficiency photovoltaic devices at enhanced depositions rates |
JP4240933B2 (ja) * | 2002-07-18 | 2009-03-18 | キヤノン株式会社 | 積層体形成方法 |
US7902049B2 (en) * | 2004-01-27 | 2011-03-08 | United Solar Ovonic Llc | Method for depositing high-quality microcrystalline semiconductor materials |
US20100116334A1 (en) * | 2008-11-07 | 2010-05-13 | United Solar Ovonic Llc | Vhf energized plasma deposition process for the preparation of thin film materials |
US20100117172A1 (en) * | 2008-11-07 | 2010-05-13 | United Solar Ovonic Llc | Thin film semiconductor alloy material prepared by a vhf energized plasma deposition process |
US20100116338A1 (en) * | 2008-11-07 | 2010-05-13 | United Solar Ovinic Llc | High quality semiconductor material |
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JPS5857757A (ja) * | 1981-10-01 | 1983-04-06 | Seiko Epson Corp | 非晶質シリコン太陽電池の製造方法 |
US4701343A (en) * | 1982-09-24 | 1987-10-20 | Energy Conversion Devices, Inc. | Method of depositing thin films using microwave energy |
US4517223A (en) * | 1982-09-24 | 1985-05-14 | Sovonics Solar Systems | Method of making amorphous semiconductor alloys and devices using microwave energy |
US4504518A (en) * | 1982-09-24 | 1985-03-12 | Energy Conversion Devices, Inc. | Method of making amorphous semiconductor alloys and devices using microwave energy |
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US4713309A (en) * | 1985-08-26 | 1987-12-15 | Energy Conversion Devices, Inc. | Enhancement layer for positively charged electrophotographic devices and method for decreasing charge fatigue through the use of said layer |
US4729341A (en) * | 1985-09-18 | 1988-03-08 | Energy Conversion Devices, Inc. | Method and apparatus for making electrophotographic devices |
JPS62271418A (ja) * | 1986-05-20 | 1987-11-25 | Matsushita Electric Ind Co Ltd | 非晶質シリコン半導体素子の製造方法 |
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DE3742110C2 (de) * | 1986-12-12 | 1996-02-22 | Canon Kk | Verfahren zur Bildung funktioneller aufgedampfter Filme durch ein chemisches Mikrowellen-Plasma-Aufdampfverfahren |
JPH01152765A (ja) * | 1987-12-10 | 1989-06-15 | Matsushita Electric Ind Co Ltd | 非晶質シリコン太陽電池の製造方法 |
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US5194398A (en) * | 1989-06-28 | 1993-03-16 | Mitsui Toatsu Chemicals, Inc. | Semiconductor film and process for its production |
US5114770A (en) * | 1989-06-28 | 1992-05-19 | Canon Kabushiki Kaisha | Method for continuously forming functional deposited films with a large area by a microwave plasma cvd method |
AU632241B2 (en) * | 1990-09-06 | 1992-12-17 | Mitsui Toatsu Chemicals Inc. | Amorphous silicon solar cell and method for manufacturing the same |
JPH04329881A (ja) * | 1991-05-01 | 1992-11-18 | Canon Inc | マイクロ波プラズマcvd法による堆積膜形成装置 |
US5204272A (en) * | 1991-12-13 | 1993-04-20 | United Solar Systems Corporation | Semiconductor device and microwave process for its manufacture |
US5256576A (en) * | 1992-02-14 | 1993-10-26 | United Solar Systems Corporation | Method of making pin junction semiconductor device with RF deposited intrinsic buffer layer |
-
1993
- 1993-11-26 US US08/157,322 patent/US5476798A/en not_active Expired - Lifetime
-
1994
- 1994-11-21 ES ES95902666T patent/ES2194897T3/es not_active Expired - Lifetime
- 1994-11-21 WO PCT/US1994/013478 patent/WO1995015012A1/en active IP Right Grant
- 1994-11-21 JP JP51518995A patent/JP3936391B2/ja not_active Expired - Fee Related
- 1994-11-21 EP EP95902666A patent/EP0681743B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5476798A (en) | 1995-12-19 |
EP0681743B1 (en) | 2003-03-26 |
JP3936391B2 (ja) | 2007-06-27 |
WO1995015012A1 (en) | 1995-06-01 |
ES2194897T3 (es) | 2003-12-01 |
EP0681743A4 (en) | 1997-08-13 |
EP0681743A1 (en) | 1995-11-15 |
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