JPH0845779A - Plating base electrode forming method of electronic component - Google Patents

Abstract

PURPOSE:To improve adhesion of plating by interposing, densely arranging, and baking the same metal powder as the metal for plating, on a plating substratum electrode. CONSTITUTION:Many multilayered ceramic capacitors 7 wherein plating substratum electrode coating is finished are put in a box. The same nickel powder as plating metal is introduced and sufficiently mixed. The mixture is taken out from the box, and nickel which is left without adhering to the multilayered ceramic capacitor 7 is separated from the multilayer capacitor. The multilayered capacitors 7 to which nickel powder adhere are densly arranged on a jig 6 and baked. After baking, the multilayered ceramic capacitors 7 are separated from the jig 6. Thereby continuity of nickel plating is maintained, and soldering quality can be ensured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a plating base electrode for electronic parts such as a laminated ceramic capacitor.

[0002]

2. Description of the Related Art A conventional technique will be described by taking a multilayer ceramic capacitor as an example. The laminated ceramic capacitor is formed into a sheet by a reverse roll method or the like after kneading the ceramic powder and the organic binder. This sheet is cut into a predetermined area, and internal electrode paste such as palladium is screen-printed on one side of the sheet and dried. Then put another sheet on it. This printing-sheeting operation is repeated until the desired number of layers is obtained, a predetermined pressure is applied, the green chip is cut into a predetermined size, and the green chip is baked to obtain the baked chip 1 shown in FIG. Thereafter, a conductive paint containing a small amount of glass frit (hereinafter abbreviated as GF) containing silver as a main component for the purpose of adhering to the ceramic is applied to both ends of the both ends and baked at a predetermined temperature to perform plating base electrode 2 shown in FIG. To form. Thereafter, as shown in FIG. 1, nickel plating 3 and solder plating 4 are plated in this order to obtain a finished monolithic ceramic capacitor 5.

[0003]

When the plating undercoat electrode 2 shown in FIG. 1 is baked (at 600 ° C. or higher), GF contained in the conductive paint comes out on the surface of the plating undercoat electrode 2, so that the plating undercoat electrode 2 is formed. When baking is performed in the state of contacting with each other, there is a drawback that the GF exposed on the surface causes the monolithic ceramic capacitors 5 before plating 3 and 4 to stick to each other as shown in FIG. Therefore, there is a problem in productivity because it is necessary to prevent the monolithic ceramic capacitors from contacting each other when baking is performed.

Further, in order to prevent sticking at the time of baking, ceramic powder such as alumina or zirconia is sprinkled on the laminated ceramic capacitor 5 before baking, and the plating base electrode 2
It has been known that by interposing this ceramic powder in the portions where they come into contact with each other, sticking of the plating base electrode 2 during baking can be prevented. However, GF on the surface of the plating base electrode 2 reacts with the ceramic powder, which adheres to the surface of the plating base electrode 2, and when the plating treatment is performed, the portion to which the ceramic powder adheres is not plated and solderability is improved. There was a problem of deterioration.

Therefore, the present invention aims to enhance the adhesion of plating.

[0006]

To achieve this object, according to the present invention, when a conductive coating material is baked, it is densely arranged on the plating base electrode with the same metal powder as the metal to be plated interposed. Characterized by baking.

[0007]

[Function] The metal powder prevents contact between the plating undercoat electrodes during baking of the plating undercoat electrodes, and prevents sticking of the plating undercoat electrodes after baking. Also, since this metal powder is the same metal as the metal that is plated on the plating base electrode, even if the metal powder reacts with GF on the surface of the plating base electrode and adheres to the surface of the plating base electrode, the subsequent plating treatment , Continuity with metal plating can be maintained and soldering performance can be guaranteed.

[0008]

EXAMPLE A multilayer ceramic capacitor will be described below as an example.

FIG. 3 is a plan view of a box-shaped jig 6 used for baking and a monolithic ceramic capacitor 7 on which a conductive paint for a plating undercoat electrode densely arranged is applied, in which an enlarged view is shown in a circle. Is. The method of baking the plating base electrode of the monolithic ceramic capacitor 7 according to the present invention is as follows.

First, a box is prepared in which 100,000 to 200,000 of the monolithic ceramic capacitors coated with the plating base electrode 2 can be sufficiently stored, and 100,000 of the coated monolithic ceramic capacitors 7 are placed in the box. Then, 200,000 pieces of nickel powder (average particle diameter of 3 to 4 μm) same as the plated metal are put into 10,000 pieces of monolithic ceramic capacitors. It should be noted that the effect of sticking the plating base electrodes 2 to each other is reduced when the amount is 1 g or less. Thereafter, the box is shaken vertically and horizontally so that the nickel powder and the applied laminated ceramic capacitor 7 are sufficiently mixed. After that, the mixture is taken out of this box on a sieve in which the laminated ceramic capacitor 7 does not fall and only the nickel powder falls, and the nickel not remaining on the laminated ceramic capacitor 7 and the laminated ceramic capacitor are separated.
Thereafter, as shown in FIG. 3, the monolithic ceramic capacitors 7 having nickel powder adhered on the jig 6 are densely arranged and baked at a temperature of 600 ° C. to 800 ° C. for about 1 hour.

After the baking is completed, the jig 6 and the monolithic ceramic capacitor 7 are separated. At this time, no sticking between the plating base electrodes 2 of the monolithic ceramic capacitor 7 was observed.

After that, a plating treatment was performed, but as a result of confirmation, the continuity of nickel plating was maintained, and it was possible to guarantee that in the soldering performance as well.

[0013]

As described above, according to the present invention, the same metal powder as that of the plating base electrode is adhered to the electronic component body which has been coated with the conductive coating material for the plating base electrode, and baking is performed.
Since it is possible to arrange them densely on the baking jig, the productivity can be improved. Also, because the plating continuity can be maintained, the soldering performance is not compromised.

[Brief description of drawings]

FIG. 1 is a sectional view of a monolithic ceramic capacitor.

FIG. 2 is a plan view showing sticking of the plating undercoat electrodes to each other after baking of the plating undercoat electrodes of the multilayer ceramic capacitor.

FIG. 3A is an embodiment of the present invention, and is a plan view of a multilayer ceramic capacitor densely arranged on a jig. FIG. 3B is an enlarged plan view of a portion B of FIG. 3A.

[Explanation of symbols]

 2 Plating base electrode 3 Nickel plating 4 Solder plating 6 Jig 7 Multilayer ceramic capacitor

Claims (1)

[Claims] 1. When forming a plating base electrode by baking a conductive paint on the body of an electronic component, a large number of electronic components coated with the conductive paint are plated with the same metal powder as the metal on which the plating base electrode is plated. A method of forming a plating base electrode for an electronic component, which comprises densely arranging and baking.