JPH08340060A - Package for semiconductor and semiconductor module - Google Patents

Abstract

PURPOSE: To provide a ceramic package for semiconductor which have connecting bumps as input output terminals and can improve the reliability of connecting sections against heat history, etc., and the electrical connection of the bumps without using any solder alloy containing Pb. CONSTITUTION: Electrode pads 3 are formed on one main surface of the main body of a ceramic package 1 containing an internal wiring layer 2 so that the pads 3 can be electrically connected to the layer 2. Conductive resin bumps 6 which are composed of a resin material having conductivity in at least its surface section are connected to the pads 3 through an anisotropic conductive resin layer 5. The resin layer 5 contains conductive sections only at the parts which are held between the pads 3 and bumps 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package having a bump connection body (bump) as an input / output terminal and a semiconductor mounting module using the same.

[0002]

2. Description of the Related Art Various packages made of ceramics, resin, metal, etc., on which semiconductor chips such as LSI are mounted, are highly densified by high integration, high speed, large power consumption, and large chips of LSI. There is a trend toward higher speeds and higher heat dissipation. In addition, these semiconductors are also used for workstations, personal computers, minicomputers,
From industrial applications such as large-scale computers to electronic devices such as portable devices, printers, copiers, cameras, televisions, and video devices, semiconductor performance has improved.

A high-performance, highly-integrated LSI package can be connected to the LSI at multiple terminals with a narrow pitch, has a high wiring density, has good heat dissipation, and can handle high-speed signals. It is required that the terminals of the package itself be multi-terminal and have a narrow pitch. In addition, a high-performance package that satisfies these conditions
There is a need for a technique that can be easily manufactured at low cost with high reliability.

In order to satisfy the multi-terminal / narrow pitch of the package as described above, the package structure is changed from the conventional pin insertion type to QFP (Quad Flat Package) or BGA (Ba).
llGrid Array) and other surface-mount types. Among the surface mount types, the BGA package using the bump connection body (bump) made of solder as the input / output terminal of the package can shorten the connection distance and can suppress reflection and delay of high-speed signals due to the inductance of the connection portion. Since it has advantages such as the above, it is expected as a high performance and highly integrated LSI package. BGA was initially used for applications such as supercomputers and large-scale computers, and has recently been used for consumer products such as personal computers and portable devices.

In addition to shortening the connection distance by solder bumps, BGA also facilitates narrow pitch and multiple terminals by forming bumps.
The use of multiple terminals will reduce the package size itself, and it is expected to improve the mounting density on the printed circuit board, improve electrical characteristics by reducing wiring parasitic capacitance, inductance, resistance, etc., and improve high-frequency characteristics by reducing the package size. it can. Generally, Pb-Sn is used as the material for forming the solder bumps.
This type of eutectic solder is used.For such solder bumps, Sn-Pb eutectic solder paste is printed on the pad, and a Sn-Pb eutectic solder ball is printed on the solder paste using a jig. After mounting, they are joined by melting the solder paste.

Further, as the speed of the LSI increases, the power consumption increases and the amount of heat generated tends to increase year by year.
From the heat dissipation surface of the package, a structure and material with excellent heat dissipation are required. As the high heat dissipation package, a ceramic package, a package with a metal body, a package made of a printed circuit board, a resin, etc. with a heat sink for heat dissipation are used. Many. Among the ceramic packages, aluminum nitride (Al
Those using high thermal conductivity materials such as N) are especially used as packages having low thermal resistance.

As described above, B using ceramics
The GA package is a high-density package satisfying high heat dissipation and excellent electrical characteristics, capable of multiple terminals and narrow pitches, and is expected as a package for high-speed and highly integrated semiconductor elements. . However, when the ceramic BGA package is mounted on a printed circuit board or the like, the difference in the coefficient of thermal expansion between the ceramic package body and the printed circuit board is large, and therefore the reliability of the solder bump portion, which is the connection portion, is high. It has a problem that it tends to decrease.

That is, since the coefficient of thermal expansion of a ceramic material is generally on the order of 10 ^-6 / K and that of a resin material is on the order of 10 ^-5 / K, a reflow soldering process when mounting a BGA package on a printed circuit board. Due to the heat history received in the above, and the heat history due to the change in the ambient temperature during normal use, cracks and the like are generated in the solder bump portion, resulting in poor connection strength and connection failure due to an increase in connection resistance. For this reason, there is a demand for a bump structure that is highly reliable with respect to thermal history.

On the other hand, in addition to the decrease in reliability due to the thermal fatigue of the solder bumps, etc., there has been a demand for reducing the use of solder alloys containing Pb due to the recent growing interest in environmental damage. That is, waste electronic components that use a large amount of Pb-containing solder alloys, like ordinary industrial waste and general waste, have generally been mainly landfilled, but solder alloys containing Pb If you continue to dispose of the waste electronic components that used a large amount of by directly landfilling etc., due to the elution of the Pb component existing in the waste electronic components,
It is feared that the environment and living things will be adversely affected. Therefore, it is required to realize bump formation and bonding without using Pb-Sn solder alloy or the like.

[0010]

As described above, in the conventional ceramic BGA package, when it is subjected to a reflow soldering process for mounting it on a printed circuit board or the like or a thermal history due to a change in environmental temperature during use. In addition, due to the difference in thermal expansion between the ceramic package and the printed circuit board or the like, stress or strain is generated in the solder bump portion, which is the connection portion, and the solder bump undergoes thermal fatigue fracture or the ceramic package undergoes stress fracture. Therefore, there is a problem that the reliability of the connection portion is low. In addition, solder alloys containing Pb have been required to reduce their use due to the recent growing concern over environmental damage. From this reason as well, a bump structure that can replace solder bumps and solder paste bonding can be used. And a joining method is required.

The present invention has been made to solve such a problem, and improves the reliability of the connecting portion against the thermal history of a ceramic package having a bump connecting body (bump) as an input / output terminal, and Pb An object of the present invention is to provide a semiconductor package in which the electrical connection of the projection connection body portion is realized with high reliability without using a solder alloy containing the above, and a semiconductor mounting module using the same.

[0012]

SUMMARY OF THE INVENTION A semiconductor package according to the present invention is a ceramic package body having an internal wiring layer, and a ceramic package on one main surface thereof so as to be electrically connected to the internal wiring layer. An electrode pad formed on the electrode pad, and a projection connector formed of a resin material having conductivity at least on the surface thereof and joined to the electrode pad via an anisotropic conductive resin layer. It has a feature.

Further, the semiconductor mounting module of the present invention is
A semiconductor package component having the above-described semiconductor package of the present invention, a semiconductor element mounted on the semiconductor package, and a printed circuit board connected to the semiconductor package component via a conductive means. I am trying.

[0014]

In the semiconductor package of the present invention, since the protrusion connecting body is formed mainly of the resin material, the stress applied to the protrusion connecting body can be greatly reduced if the displacement amounts are equal. Further, even if the displacement amount is slightly increased, the stress applied to the projection connection body can be reduced. Therefore, since the internal stress generated in the protrusion connection body is reduced, the crack propagation of the protrusion connection body and its connection portion caused by the warpage of the printed circuit board is suppressed, and the mechanical strength such as creep is also suppressed. Is suppressed. Therefore, it is possible to suppress deterioration in reliability of the connection portion due to application of heat history.

Further, in the semiconductor package of the present invention, the projection connection body is formed of a resin material having conductivity at least on the surface portion, and such a projection connection body is different from the electrode pad. Bonding is performed through the anisotropic conductive resin layer. The anisotropic conductive resin layer improves the reliability of the thermal history of the connection part between the projection connection body and the electrode pad, and then functions as an electrical connection part between the projection connection body and the electrode pad. You can secure enough. Further, according to the semiconductor package of the present invention, the formation and the connection of the protrusion connection body can be realized with high reliability without using a solder alloy containing Pb which is feared as a cause of environmental damage. Is possible.

Since the semiconductor mounting module of the present invention uses the semiconductor package of the present invention as described above, good reliability of the connecting portion can be obtained.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view schematically showing the structure of a ceramic BGA package according to an embodiment of the present invention and a mounting module configured by mounting the same on a printed circuit board. In the figure, reference numeral 1 denotes a ceramics package body composed of a multilayer ceramics circuit board, which has an outer shape of, for example, 32 × 32 × 1.5 mm. As the constituent material of the ceramic package body 1, various ceramic materials such as aluminum nitride, silicon nitride, alumina, mullite, and glass ceramics can be used, and they are composed of one kind or a combination of two or more kinds. . Further, the semiconductor package of the present invention is not limited to the package body made of the ceramics alone as described above, and it is also possible to apply the package body in which the formation portion of the projection connector described later is made of at least a ceramic material. is there.

The ceramic package body 1 has an internal wiring layer 2 formed by filling a through hole with metallization, and is electrically connected to the internal wiring layer 2 in a predetermined region on the lower main surface. Circular pads (electrode pads) 3 are formed. A surface wiring layer 4 electrically connected to the internal wiring layer 2 is provided on the upper main surface which is the chip mounting surface.

The circular pad 3 described above is composed of a W metallized layer by the above-mentioned simultaneous firing method, a metal layer by metallization after sintering, and the like. If necessary, the surface of the circular pad 3 is subjected to Ni / Au plating treatment or the like to enhance the bondability. A conductive resin bump 6 made of a resin material having conductivity at least on the surface is connected as a projection connector to each of the circular pads 3 via an anisotropic conductive resin layer 5, respectively. These make up the ceramic BGA package 7. here,
The conductive resin bump 6 may be made of a resin material having conductivity at least on the surface portion, and for example, as shown in FIG. 2, a resin bump body 8 made of a resin having a Young's modulus of 10000 MPa or less, An example is one composed of a metal coating layer 9 formed on the surface thereof.
As the resin constituting the resin bump body 8, various resin materials can be used as long as the Young's modulus is 10,000 MPa or less, and examples thereof include epoxy resin, polyimide resin, acrylic resin and the like. Of the above resins,
In particular, it is desirable to use a resin material having a Young's modulus of 5000 MPa or less. In addition, in the resin bump body 8, alumina, silica, silicon nitride, boron nitride, aluminum nitride, etc.
You may mix 1 type (s) or 2 or more types as a filler.

The metal coating layer 9 formed on the surface of the resin bump body 8 is made of Ni, Cu, Au, which has good conductivity.
It is preferably formed of Sn or the like, and its thickness is 1
It is preferably about 10 μm. If the thickness of the metal coating layer 9 is less than 1 μm, sufficient conductivity may not be obtained, while if it exceeds 10 μm, peeling may occur due to strain. Such a metal coating layer 9 can be formed on the surface of the resin bump body 8 by a plating method, a vapor deposition method, or the like. By using such a metal coating layer 9, the substantial resistance value of the conductive resin bump 6 can be made equal to that of the conventional solder ball.

The shape of the above-mentioned conductive resin bump 6 is not limited to the spherical shape similar to that of a normal solder bump, and the columnar body shown in FIG. 2, the drum body, the prismatic body or the like can be applied. Particularly in the present invention, since pressure is applied when the conductive resin bumps 6 are bonded by the anisotropic conductive resin layer 5, the conductive surface having a flat surface facing the electrode such as a columnar body, a drum body, or a prismatic body is used. It is preferable to use the resin bumps 6.

Further, the conductive resin bump 6 is not limited to the one having the metal coating layer 9 provided on the surface of the resin bump body 8 as described above, and the conductivity of the conductive resin bump 6 is, for example, 1.5 as a wiring electric resistance. Various conductive resin materials can be applied as long as they satisfy Ω or less. For example,
Using a conductive resin material in which a conductive filler is mixed in the resin matrix, or an anisotropic conductive resin material or the like filled by orienting a fibrous conductive filler in a certain direction,
It is also possible to manufacture the conductive resin bumps 6.

The conductive resin bumps 6 as described above are mechanically bonded and electrically connected to the circular pad 3 via the anisotropic conductive resin layer 5. Here, the anisotropic conductive resin layer 5 is composed of a coated layer of an anisotropic conductive resin paste or an anisotropic conductive resin film, and the circular pad 3
Conductivity is provided only between the conductive resin bump 6 and the conductive resin bump 6. The anisotropic conductive resin uses, for example, an insulating resin having adhesiveness such as epoxy resin as a matrix, and a conductive filler such as metal particles or metal coating particles having a diameter of about 5 to 10 μm is mixed in the insulating resin matrix. It is a thing. At this time, the blending amount of the conductive filler is adjusted so as to be present separately from each other in the insulating resin matrix, and has an insulating property in a normal state. However,
By applying pressure, the anisotropic conductive resin matrix is deformed to reduce the distance between the conductive fillers, and as shown in FIG.
When the 1's come into contact with each other, only this pressed part becomes conductive.

That is, pressure is applied to the conductive resin bumps 6 arranged on the circular pad 3 via the anisotropic conductive resin paste coating layer and the anisotropic conductive resin layer 5 made of an anisotropic conductive resin film. When added, as shown in FIG. 2, pressure is applied only to the portion of the anisotropic conductive resin layer 5 where the conductive resin bumps 6 are present (the bump corresponding area A), and conductivity is imparted only to that portion. It On the other hand, since the portion where the conductive resin bumps 6 do not exist (inter-bump area B) is not pressed,
The original insulation is maintained.

At the same time when the pressure is applied, the insulating resin matrix 10 made of epoxy resin or the like is heated to cure, so that only the bump corresponding region A between the circular pad 3 and the conductive resin bump 6 is conductive. The part 5a is formed. On the other hand, the inter-bump region B becomes the insulating portion 5b, and the conductive resin bumps 6 adjacent to each other are insulated from each other, so that a short circuit or the like does not occur. In this way, good electrical connection between the circular pad 3 and the conductive resin bump 6 is ensured, and the conductive resin bump 6 is reliably insulated. The insulating portion 5b of the anisotropic conductive resin layer 5 existing in the inter-bump region B also functions as a protective film for the conductive resin bump 6.

The anisotropic conductive resin layer 5 is not limited to the one prepared by adjusting the amount of the conductive filler mixed in the insulating resin matrix as described above, and the fibrous conductive filler is unidirectional. It is possible to use an oriented and filled one, that is, an anisotropic conductive resin or the like in which conductivity is imparted only in the orientation direction of the fibrous conductive filler.

A ceramic BG having the above-mentioned structure
The A package 7 includes the ceramic package body 1
The semiconductor element 13 is bonded and mounted on the main surface above the substrate via a bonding material 12 such as solder, a brazing material, or a glass-based adhesive.
Then, the semiconductor element 13 and the surface wiring layer 4 are electrically connected via the bonding wire 14, and the semiconductor element 13 is hermetically sealed with the ceramic lid 15 or the like, whereby the semiconductor package component 16 is obtained.

The semiconductor package component 16 as described above is
As shown in FIG. 1, it is used as a mounting module 18 by mounting it on a printed circuit board 17 made of glass epoxy or the like. The mounting on the printed board 17 is performed by, for example, the resin balls 6 of the ceramic BGA package 7.
And the terminal 19 of the printed circuit board 17 between the ceramic B
Similar to the connection on the GA package 7 side, the connection is made through the anisotropic conductive resin layer 20.

The ceramic BGA package 7 and the mounting module 18 described above are manufactured, for example, as follows. The manufacturing process will be described with reference to FIG.

First, for example, a through hole is formed in a ceramic green sheet, surface printing with a tungsten metallizing paste and metallization filling into the through hole are performed, and then lamination, pressure bonding and sintering in a reducing atmosphere are performed. The ceramic package body 1 is manufactured.
At this time, the circular pad 3 as an electrode pad is simultaneously formed. Further, the conductive resin bumps 6 are mounted by mounting the semiconductor chip 13 and joining the ceramic lid 15 and the like.
The semiconductor package component 16 is completed except for the connecting step.

Next, a paste of anisotropic conductive resin in which a conductive filler such as metal particles or metal coating particles having a diameter of about 5 to 10 μm is dispersed in an insulating resin matrix such as epoxy resin is used as a ceramic material. It is applied to the side of the package body 1 on which the circular pad 3 is formed to form an anisotropic conductive resin coating layer 5 '(FIG. 4-a). Alternatively, the anisotropic conductive resin film is arranged on the surface on which the circular pad 3 is formed.

Next, the conductive resin bumps 6 are arranged on the anisotropic conductive resin coating layer 5'according to the positions of the circular pads 3, and are temporarily connected by, for example, a conductive adhesive or the like (FIG. 4-).
b). Thereafter, similarly, an anisotropic conductive resin coating layer 20 'is formed, or the semiconductor package component 16 is placed on the printed board 17 on which the anisotropic conductive resin film is arranged, with the pads aligned. And 50-20 per pad
While applying a load of about 0 g, the semiconductor package component 16 and the printed circuit board 17 are mechanically joined and electrically connected by heating at a temperature according to the insulating resin matrix of the anisotropic conductive resin.

Here, a BGA using a conventional solder bump is used.
In the package, first, the solder bump is connected to the ceramic package body through the solder reflow process, and the solder reflow process is performed again to mount the package on the printed circuit board 17.
Was implemented in. On the other hand, by using the anisotropic conductive resin, the connection of the conductive resin bump 6 to the ceramic package body 1 and the connection of the semiconductor package component 16 and the printed board 17 are realized by one heat treatment. Therefore, the cost of the mounting process can be significantly reduced.

The ceramic BGA package 1
Depending on the intended use of 6, the conductive resin bumps 6 are connected to the ceramic package body 1 in advance to complete the ceramic BGA package 16, and the mounting of the semiconductor element 13 and the printed circuit board 17 are performed in the same manner as the conventional BGA package. It is also possible to implement.

The mounting module 18 having the above-mentioned configuration
In the case of (1), even though the ceramics BGA package 16 and the printed circuit board 17 on which the BGA package 16 is mounted have different coefficients of thermal expansion, even if displacement due to temperature change occurs, the projection connector has a small Young's modulus of conductivity. Since the bumps are made of the resin bumps 6, the internal stress of the protrusion connection body can be reduced.

Here, in a semiconductor package using a bump connection body such as a solder bump as an input / output terminal, the fatigue of the connection part formed by the projection connection body and the package when the thermal history due to the temperature change is received. Low cycle fatigue due to repeated plastic deformation that occurs due to the difference in thermal expansion between the printed circuit board and the like to be mounted. Here, it is known that the Coffin-Manson empirical formula represented by the following formula (1) is established between the low cycle fatigue life N _f of the projection connection body and the plastic strain amplitude δ.

N _f = C (δ) ^-2 (1) (where C is a constant) Further, the plastic strain amplitude δ of the projection connection body is δ = d · Δα · ΔT. (2) (where d is the distance from the center of the package to the connection part, △
α is a relative thermal expansion coefficient of the package with respect to the printed circuit board, and ΔT is a temperature change width). Originally, the maximum shear strain γ (= δ
/ H), the plastic strain amplitude δ is considered here for simplification.

When the package and the constituent material such as a printed circuit board on which the package is mounted have different coefficients of thermal expansion, the respective elongations when the temperature changes are different. As a result, an internal stress σ (= ε · δ), which is determined by the plastic strain amplitude δ and the Young's modulus ε of the constituent material of the projection connection body, is generated at the connection portion. This internal stress causes a warp on the printed circuit board side, for example. Then, due to the internal stress σ and the warp on the printed circuit board side,
Cracks etc. occur in the projection connection body and the connection strength decreases,
Also, due to the increase in connection resistance, a connection failure determined by Eq. (1) will occur.

As described above, the fatigue N of the projection connection body due to the temperature change is determined by the internal stress σ and the plastic strain amplitude δ. That is, it is determined by the area of the stress-strain curve and expressed as follows.

N = σ · δ = (ε · δ) · δ = ε · δ ² (3) If the constituent material of the package is ceramics and the substrate material on which it is mounted is resin, the temperature is Although it is unavoidable to generate the plastic strain amplitude δ due to the change, since the Young's modulus ε of the protrusion connection can be set to a small value, internal stress of the protrusion connection and its connection, and eventually fatigue due to thermal history, etc. can be reduced. can do.

Therefore, the crack propagation of the conductive resin bump 6 as the projection connecting body and the anisotropic conductive resin layer 5 which is the connecting portion due to the warp or the like generated on the printed circuit board 17 is suppressed, and the creep is similarly generated. It is possible to suppress a decrease in mechanical strength. As a result, it becomes possible to prevent the reliability of the connection portion from being lowered due to the application of heat history.

Further, the conductive resin bumps 6 as the projection connecting bodies are provided on the surface of the resin bump main body 8 with the metal coating layer 9
Are formed of a conductive resin material or the like, and the circular pads 3 and the conductive resin bumps 6, and further the conductive resin bumps 6 and the terminals 19 on the printed circuit board 17 side are formed by anisotropic conductive resin layers 5 and 20. Conductive resin bump 6 because it is connected
The function as the electrical connection portion of can be ensured as well as the conventional solder bump. Since such an electrical connection portion is realized without using a solder alloy containing Pb, it greatly contributes to the suppression of environmental damage.

Next, a specific example of the ceramic BGA package 16 and the mounting module 18 formed by mounting the same on the printed circuit board 17 and the evaluation results thereof will be described.

Example 1 First, a package body made of aluminum nitride was prepared, and a conductive resin bump having a Ni coating layer with a thickness of 5 μm formed on the surface of a resin bump body made of acrylic resin was prepared. On the circular pad forming surface of the aluminum nitride package body, an anisotropic conductive resin paste in which silver particles having a diameter of about 5 to 10 μm were dispersed in an epoxy resin in an amount of 5% by volume was applied to a thickness of 100 μm.

Next, the above-mentioned conductive resin bumps are arranged on the coated layer of the anisotropic conductive resin paste in accordance with the positions of the circular pads and temporarily connected, and then this is similarly subjected to the anisotropic conductive resin paste. The pads were placed together on the printed circuit board on which the coating layer was formed. Then, the package and the printed circuit board were joined by heating at 443 K for 1 minute while applying a load of 100 g per pad.

As a comparison with the present invention, 10% Sn-90%
Using a solder bump having a Pb composition and a solder paste having a composition of 60% Sn-40% Pb, a BGA package made of aluminum nitride similar to that of Example 1 was prepared and mounted on a glass epoxy printed board. When the electric characteristics (connection resistance) of the mounting modules according to the examples and comparative examples thus obtained were examined, it was confirmed that the mounting modules according to the example had substantially the same electric characteristics as those according to the comparative example. . Further, the reliability tests of the mounted modules according to the examples and the comparative examples were conducted as follows. That is, hold at 208K for 30 minutes, then hold at room temperature for 5
Hold at 8K for 30 minutes. A thermal cycle test was conducted with this as one cycle, and the quality was judged after a certain cycle had elapsed. The electrical resistance was examined to determine pass / fail, and when the electrical resistance reached twice the initial value, it was determined to be defective. As a result, the BGA package using the solder balls of the comparative example had a defect after 100 cycles, whereas the BGA package of the example had an initial resistance value even after the 500-cycle thermal cycle test. A good result of about 1.1 times was obtained.

Example 2 As in Example 1, a package body made of aluminum nitride was prepared, and a conductive resin bump having a Ni coating layer with a thickness of 5 μm formed on the surface of the resin bump body made of polyimide resin was prepared. did. An anisotropic conductive resin film (manufactured by 3M; ZAF) was arranged on the circular pad forming surface of the aluminum nitride package body. Next, after the conductive resin bumps described above are arranged on the anisotropic conductive resin film according to the positions of the circular pads and temporarily connected, this is similarly placed on the printed circuit board on which the anisotropic conductive resin film is arranged. The pads were placed together. And while applying load 45
The package and the printed board were joined by heating at 3K for 20 seconds.

When the electrical characteristics (connection resistance) of the mounted module according to the second embodiment were examined, it was found that, as in the first embodiment,
It was confirmed that it had good electrical characteristics. Further, when the reliability test of the mounted module according to the second embodiment was performed in the same manner as the first embodiment, the resistance value was about 1.1 times the initial value even after the thermal cycle test of 500 cycles, which was a good result. . Further, in Example 2, it is also possible to peel off with a heating general-purpose solvent, and it is possible to repair and repair relatively easily.

[0050]

As described above, according to the semiconductor package of the present invention, the internal stress of the bump connection body (bump) due to the temperature change can be reduced. A decrease in mechanical strength such as creep can be suppressed. Further, such a highly reliable protrusion connecting body and connecting portion can be realized without using a solder alloy containing Pb. Therefore, it is possible to provide a Pb-less semiconductor package in which the reliability of the connection portion formed by the protrusion connection body is improved. Further, according to the semiconductor mounting module of the present invention, good reproducibility and good connection portion reliability can be obtained.

[Brief description of drawings]

FIG. 1 is a ceramic BG according to an embodiment of the present invention.
It is sectional drawing which shows the structure of an A package and a mounting module using the same.

FIG. 2 is an enlarged cross-sectional view showing a protrusion connecting body portion of the ceramic BGA package shown in FIG.

FIG. 3 is a diagram for explaining a connection structure of a protrusion connector in the ceramic BGA package shown in FIG.

FIG. 4 is a cross-sectional view showing a main part manufacturing process of the ceramic BGA package shown in FIG. 1.

[Explanation of symbols]

 1 ... Ceramic package body 2 ... Internal wiring layer 3 ... Circular pad 5 ... Anisotropic conductive resin layer 5a ... Conductive part 5b ... Insulating part 6 ... Conductive resin bump 7 ... Ceramic BGA package

Claims (4)

[Claims] 1. A ceramic package body having an internal wiring layer, an electrode pad formed on one main surface of the ceramic package so as to be electrically connected to the internal wiring layer, and at least a surface portion. A semiconductor package, comprising: a protrusion connecting body formed of a resin material having conductivity and joined to the electrode pad via an anisotropic conductive resin layer. 2. The semiconductor package according to claim 1, wherein the anisotropic conductive resin layer is an anisotropic conductive resin paste coating layer or an anisotropic layer in which a conductive filler is filled in an insulating resin matrix. A semiconductor package, comprising a conductive resin film, wherein conductivity is imparted only between the electrode pad and the protrusion connection body. 3. The semiconductor package according to claim 1, wherein the protrusion connection body is made of a resin material or a conductive resin material having a metal coating layer formed on a surface thereof. 4. A semiconductor package according to claim 1,
A semiconductor mounting module comprising: a semiconductor package component having a semiconductor element mounted on the semiconductor package; and a printed circuit board connected to the semiconductor package component via a conductive means.