JPH10275967A - Electronic-component assembly and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniform the distance between a board and a flexible board mounted on the board. SOLUTION: This assembly comprises a mounting board 1, an organic film 2 which is formed on the mounting board 1, a silver epoxy resin 5 which connects the surface of the mounting board to the organic film 2 and a thermosetting-resin layer 4 which is filled between the mounting board 1 and the organic film 2. Through holes 231 are formed in the organic film 2, mounting electrodes 11 are formed on the mounting board 1, and the through holes 231 and the mounting electrodes 11 are connected by the silver epoxy resin 5. The thermosetting-resin layer 4 seals the silver epoxy resin 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component assembly and a method of manufacturing the same, and more particularly, to an electronic component assembly including a substrate provided with an integrated circuit device and a mounting substrate on which the substrate is mounted, and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art An example of this type of electronic component assembly is disclosed in U.S. Pat. No. 5,203,075.

In the electronic component assembly described in FIG. 10 of the above publication, a flexible substrate 31 is mounted on a substrate 13. The flexible substrate 31 and the substrate 13 are connected by solder. A frame 47 is provided between the flexible substrate 31 and the substrate 13 to make the flexible substrate 31 and the substrate 13 parallel. An integrated circuit device 43 is provided on the flexible substrate 31. Nothing is provided between the flexible substrate 31 and the substrate 13 other than the solder or the frame 47.

[0004]

In the above-mentioned prior art,
There is a problem that the connection between the flexible substrate and the substrate by solder may be defective. When the flexible substrate is mounted on the substrate and after the flexible substrate is mounted on the substrate, the flatness of the flexible substrate cannot be maintained, and the distance between the flexible substrate and the substrate is kept constant. This is because they cannot.

[0005] Further, the above-mentioned prior art is susceptible to mechanical stress and heat-resistant stress, and has a problem that the solder is peeled off or broken. This is because the flexible substrate and the substrate are connected only by solder.

Further, the above-mentioned prior art has a problem that it is vulnerable to moisture resistance stress, that is, the solder connecting the flexible substrate and the substrate tends to become brittle due to exposure to moisture. This is because the solder connecting the flexible substrate and the substrate is in direct contact with the outside air. There is also a problem that migration is likely to occur due to this moisture.

An object of the present invention is to provide an electronic component assembly having higher reliability of connection between a flexible substrate and a substrate.

Another object of the present invention is to provide an electronic component assembly capable of keeping the distance between flexible substrates constant.

Still another object of the present invention is to provide an electronic component assembly that can achieve connection between a flexible substrate and a substrate by using not only solder but also other connecting members.

Another object of the present invention is to provide an electronic component assembly in which a connecting member for connecting a flexible substrate and a substrate is hardly exposed to outside air.

[0011]

In order to solve the above problems, an electronic component assembly according to the present invention comprises a first substrate and a first substrate.
A second substrate provided such that a lower surface thereof is opposed to an upper surface of the first substrate; a conductive resin connecting the upper surface of the first substrate to the lower surface of the second substrate; The second
And an insulating resin layer for sealing the conductive resin.

According to another electronic component assembly of the present invention, there is provided a first substrate having a pad provided on an upper surface thereof, and a first through hole provided at a position of the first substrate facing the pad. And an insulating resin layer provided on an upper surface of the first substrate, and a second through hole provided at a position of the first substrate facing the pad, wherein the insulating resin A second substrate provided on the insulating resin layer and the first substrate of the insulating resin layer;
And a conductive resin penetrating through the through hole of the first substrate and connecting the pad of the first substrate to the second through hole of the second substrate.

Further, another electronic component assembly according to the present invention includes:
A first substrate having a pad provided on an upper surface thereof, a second through hole provided at a position of the first substrate facing the pad, and a lower surface facing the upper surface of the first substrate A conductive resin for connecting pads of the first substrate with the second through holes of the second substrate; and a second substrate provided with the first substrate and the second substrate. And an insulating resin embedded between the substrates.

Further, another electronic component assembly according to the present invention is characterized in that the conductive resin is a silver epoxy resin.

Further, another electronic component assembly according to the present invention includes:
The insulating resin layer is a thermosetting resin.

Further, another electronic component assembly according to the present invention is characterized in that the insulating resin layer is made of a thermoplastic resin.

Further, another electronic component assembly of the present invention includes:
The second substrate has flexibility.

Further, another electronic component assembly according to the present invention is characterized in that an integrated circuit device is provided on the second substrate.

According to the method of manufacturing an electronic component assembly of the present invention, a method of manufacturing an electronic component assembly including a first substrate provided with a plurality of pads and a second substrate provided with a plurality of through holes is provided. Providing a conductive resin on each of the plurality of pads provided on the first substrate; and providing the plurality of through holes of the second substrate and the plurality of pads of the first substrate. Mounting the second substrate on the first substrate with the conductive resin provided on a plurality of pads facing each other; and melting the conductive resin to form the plurality of pads and the plurality of pads. Connecting a through-hole to the first substrate and the second substrate;
Filling the gap with the substrate with an insulating resin.

According to another aspect of the present invention, there is provided a method of manufacturing an electronic component assembly including a first substrate provided with a plurality of pads and a second substrate provided with a plurality of first through holes. A method of manufacturing an electronic component assembly, comprising: providing a conductive resin on each of the plurality of pads provided on the first substrate; Providing an insulating resin in a region where the insulating resin is not provided;
Mounting the second substrate on the first substrate with the plurality of through holes of the substrate facing the conductive resin provided on the plurality of pads of the first substrate. Curing the conductive resin and the insulating resin to form the plurality of pads and the plurality of through holes by the conductive resin,
Connecting the first substrate and the second substrate with the insulating resin.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of an electronic component assembly according to the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, a first embodiment of an electronic component assembly according to the present invention comprises a mounting substrate 1 and an organic film 2 provided so that the upper and lower surfaces of the mounting substrate 1 face each other.
And a thermosetting resin layer 4 provided between the upper surface of the mounting substrate 1 and the lower surface of the organic film 2.

An LSI chip 3 is provided on the upper surface of the organic film 2.
Is provided. In this embodiment, the LSI chip 3
17.5 mm square, about 80
Zero input / output terminals are arranged at intervals of 80 micrometers. The LSI chip 3 is not limited to this, and various semiconductor devices can be applied. The LSI chip 3 is mounted on the organic film 2 by inner lead bonding (ILB).

The organic film 2 includes a plurality of internal leads 2.
1, circuit wiring pattern 22 and a plurality of external leads 23
Is provided. LSI chip 3 for organic film 2
A device hole for mounting the device is provided. In a more preferred form, the device hole is the organic film 2
It is provided in the center of. It is preferable that the organic film 2 has heat resistance, good dimensional stability, and sufficient adhesion to a conductor. Such an organic film 2
As a material of the above, polyimide, fluorine-based film or epoxy resin can be applied.

Each of the plurality of internal leads 21 extends from the device hole of the organic film 2, and connects each of the plurality of input / output terminals of the LSI chip 3 to the circuit wiring pattern 22 of the organic film 2. The connection between each internal lead 21 and the input / output terminal of the LSI chip 3 and each internal lead 21 itself are sealed with a sealing resin 24.

The circuit wiring pattern 22 is formed by applying gold plating to a copper surface. The thickness of the circuit wiring pattern 22 is about 10 to 25 micrometers. A part of the plurality of ends of the circuit wiring pattern 22 is connected to each of the plurality of internal leads 21, and the other part is connected to each of the plurality of external leads 23.

The plurality of external leads 23 are connected to input / output terminals of the LSI chip 3 via the circuit wiring pattern 22 and the internal leads 21. Each of the plurality of external leads 23 includes a through hole 231 and an electrode 232. The through hole 231 penetrates the organic film 2. The electrodes 232 are provided on the inner surface of the through hole 231 and on both main surfaces of the organic film 2 around the through hole 231. The material of the electrode 232 is copper, and its surface is plated with gold. The plurality of external leads 23 are arranged in a lattice.

A power supply lead 25 is provided around the device hole of the organic film 2. Power lead 2
Reference numeral 5 denotes a power supply lead to the LSI chip 3, which is connected to a power supply pin and a ground pin of the LSI chip 3 via a circuit wiring pattern and internal leads. The power supply lead 25 has no through hole.

The mounting board 1 is a printed board made of a composite material of glass and epoxy. A plurality of wiring electrodes 11 are provided on the upper surface of the mounting substrate 1.

Each of the plurality of wiring electrodes 11 is provided at a position facing each of the plurality of external leads 23 of the organic film 2. The material of the wiring electrode 11 is copper or gold.

A silver epoxy resin 5 is provided on each of the plurality of wiring electrodes 11 on the wiring board 1. The silver epoxy resin 5 connects each of the plurality of external leads 23 of the organic film 2 and each of the plurality of wiring electrodes 11 of the mounting board 1 to each other. The curing temperature of silver epoxy resin 5 is about 150 ° C
It is. The thermal expansion coefficient of the silver epoxy resin 5 is substantially the same as that of the mounting substrate 1 or the organic film 2.

The thermosetting resin layer 4 provided between the organic film 2 and the mounting substrate 1 integrates the organic film 2 with the mounting substrate 1. It is preferable that the material of the thermosetting resin layer 4 has a heat conductivity coefficient similar to that of the mounting substrate 1 and the organic film 2. Specifically, an epoxy resin can be used.

Next, a method of manufacturing an electronic component assembly according to the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2A, in a first step, silver epoxy resin 5 is provided on each of a plurality of wiring electrodes 11 provided on mounting substrate 1. The silver epoxy resin 5 is provided on the wiring electrodes 11 by printing.

Referring to FIG. 2B, in a second step, the organic film 2 on which the LSI chip 3 is mounted is mounted on the mounting substrate 1. After positioning is performed such that each electrode 232 of the plurality of external leads 23 of the organic film 2 and each of the silver epoxy resins 5 provided on the plurality of wiring electrodes 11 on the mounting substrate 1 are opposed to each other, Will be installed. Each electrode 2 of the plurality of external leads 23 of the organic film 2
32 is brought into contact with each silver epoxy resin 5.

Referring to FIG. 2C, in a third step, the silver epoxy resin 5 is cured to connect the plurality of mounting electrodes 11 on the mounting substrate 1 and the plurality of through holes 231 of the organic film 2. More specifically, the silver epoxy resin 5 is cured by heat treatment such as reflow.

Referring to FIG. 2D, in a fourth step, a gap between the organic film 2 and the mounting substrate 1 is filled with a resin and cured.

As described above, in this embodiment, the silver epoxy resin 5 that connects each of the plurality of mounting boards 11 on the mounting board 1 and the plurality of through holes 231 of the organic film 2 is used.
Is provided, the reliability of the electronic component assembly can be further improved. This is because the silver epoxy resin 5 has substantially the same coefficient of thermal expansion as the organic film 2 and the thermosetting resin sheet 40.

In this embodiment, the heat applied to the electronic component assembly can be further reduced. This is because the curing temperature of the silver epoxy resin 5 is lower than when using solder or the like.

Further, the space between the mounting substrate 1 and the organic film 2 is filled with a thermosetting resin layer 4 and the silver epoxy resin 5 for connecting the electrode 232 of the organic film 2 and the mounting electrode 11 of the mounting substrate 1 is sealed. As a result, the silver epoxy resin 5 does not come into contact with the outside air. As a result, the reliability of the electronic component assembly against the moisture resistance stress can be improved, and the occurrence of migration can be prevented.

Next, a second embodiment of the present invention will be described in detail with reference to the drawings. The feature of the second embodiment is that a thermosetting resin sheet 40 is provided between the mounting substrate 1 and the organic film 2.

Referring to FIG. 3A, in a first step, silver epoxy resin 5 is provided on each of a plurality of wiring electrodes 11 provided on mounting substrate 1. The silver epoxy resin 5 is provided on the wiring electrode 11 by printing.

Referring to FIG. 3B, in a second step, a thermosetting resin layer 4 is provided on the upper surface of the mounting substrate 1. Specifically, the thermosetting resin sheet 40 is mounted on the mounting substrate 1.
Mounted on the top of The thermosetting resin sheet 40 is provided with a plurality of through holes 41 at positions facing the plurality of mounting electrodes 11 of the mounting substrate 1. After positioning is performed such that each of the plurality of through holes 41 of the thermosetting resin sheet 40 and each of the silver epoxy resins 5 provided on the plurality of wiring electrodes 11 on the mounting substrate 1 are opposed to each other, Each through hole 41 is mounted so as to penetrate each silver epoxy resin 5.

Referring to FIG. 3C, in a third step, the organic film 2 on which the LSI chip 3 is mounted is mounted on the thermosetting resin sheet 40. After positioning is performed such that each electrode 232 of the plurality of external leads 23 of the organic film 2 and each of the silver epoxy resins 5 provided on the plurality of wiring electrodes 11 on the mounting substrate 1 are opposed to each other, Will be installed. Multiple external leads 2 of organic film 2
Each of the three electrodes 232 is brought into contact with each silver epoxy resin 5.

Referring to FIG. 3D, in the fourth step, the silver epoxy resin 5 and the thermosetting resin sheet 40 are formed.
Are simultaneously cured, and the plurality of mounting electrodes 11 on the mounting substrate 1 and the plurality of through holes 231 of the organic film 2 are connected to each other by the thermosetting resin sheet 40 with the silver epoxy resin 5. More specifically, the silver epoxy resin 5 and the thermosetting resin sheet 40 are cured by heat treatment such as reflow.

As described above, in this embodiment, the thermosetting resin sheet 40 is provided on the upper surface of the mounting substrate 1 on which the silver epoxy resin 5 is provided, and the thermosetting resin sheet 40 is provided on the silver epoxy resin 5 and the thermosetting resin sheet 40. Since the organic film 2 is mounted, heat can be applied to the silver epoxy resin 5 and the thermosetting resin sheet 40 to cure them at the same time.

In this embodiment, the organic film 2 can be more easily flattened. This is because the thermosetting resin sheet 40 is provided on the upper surface of the mounting substrate 1, so that it is only necessary to mount the organic film 2 on the upper surface of the thermosetting resin sheet 40.

Next, a third embodiment of the present invention will be described in detail with reference to the drawings. The feature of the third embodiment lies in that after the fourth step of the third embodiment, a fifth step of filling a silver epoxy resin from above the through hole 231 of the organic film 2 is performed. The first to fourth steps are the same as in the above-described second embodiment.

Referring to FIG. 4, in the fifth step,
The silver epoxy resin 51 is filled from above the through hole 231 of the organic film 2. The silver epoxy resin 51 is filled using a dispenser. The through holes 231 of the organic film 2 are filled with the silver epoxy resin 51.

As described above, in the present embodiment, since the silver epoxy resin 51 is filled from above the through hole 231, the shortage of the silver epoxy resin 5 provided by printing can be compensated.

In the above embodiment, the thermosetting resin is provided on the upper surface of the mounting substrate 1. However, the present invention is not limited to this, and another resin may be used. For example, a thermoplastic resin may be provided.

In the above embodiment, the mounting substrate 1
Silver epoxy resin 5 was provided on the mounting electrode 11 of
The invention is not limited to this, and any resin may be used as long as it has conductivity.

[0053]

As is apparent from the above description, according to the present invention, since the silver epoxy resin for connecting each of the plurality of mounting boards on the mounting board and the plurality of through holes of the organic film is provided, the electronic component assembly is provided. The three-dimensional reliability can be further improved. This is because the silver epoxy resin has almost the same coefficient of thermal expansion as the organic film and the thermosetting resin sheet.

Further, according to the present invention, the heat applied to the electronic component assembly can be further reduced. This is because the curing temperature of the silver epoxy resin is lower than when using solder or the like.

Further, according to the present invention, the space between the mounting substrate and the organic film is filled with a thermosetting resin, and the silver epoxy resin for connecting the electrode of the organic film to the mounting electrode of the mounting substrate is sealed. Is not exposed to the outside air. As a result, it is possible to improve the reliability of the electronic component assembly against the moisture resistance stress and to prevent the occurrence of migration.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a first embodiment of the present invention.

FIG. 2 is a diagram showing a manufacturing method according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating a manufacturing method according to a second embodiment of the present invention.

FIG. 4 is a diagram illustrating a manufacturing method according to a third embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 mounting substrate 11 mounting electrode 2 organic film 21 internal lead 22 circuit wiring pattern 23 external lead 24 sealing resin 3 LSI chip 4 thermosetting resin 40 thermosetting resin sheet 5 silver epoxy resin

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H05K 3/46 H05K 3/46 NL

Claims (10)

[Claims] A first substrate; a second substrate provided with a lower surface facing the upper surface of the first substrate; an upper surface of the first substrate and a lower surface of the second substrate; An electronic component assembly comprising: a conductive resin connecting the first and second substrates; and an insulating resin layer provided between the first substrate and the second substrate to seal the conductive resin. 2. A first substrate having a pad provided on an upper surface thereof, and a first through hole provided at a position of the first substrate facing the pad, wherein the upper surface of the first substrate is provided. A second substrate provided on the insulating resin layer, having an insulating resin layer provided on the first substrate, and a second through hole provided at a position of the first substrate facing the pad. Through the first through hole of the insulating resin layer,
An electronic component assembly, comprising: a conductive resin for connecting a pad of the first substrate to the second through hole of the second substrate. 3. A first substrate having a pad provided on an upper surface thereof, a second through hole provided in a position of the first substrate facing the pad, and a lower surface of the first substrate provided on the first substrate. A second substrate provided to face the upper surface of the first substrate; a conductive resin connecting pads of the first substrate to the second through-holes of the second substrate; An electronic component assembly comprising: an insulating resin embedded between a substrate and the second substrate. 4. The electronic component assembly according to claim 1, wherein the conductive resin is a silver epoxy resin. 5. The electronic component assembly according to claim 1, wherein the insulating resin layer is a thermosetting resin. 6. The electronic component assembly according to claim 1, wherein the insulating resin layer is a thermoplastic resin. 7. The electronic component assembly according to claim 1, wherein the second substrate has flexibility. 8. The electronic component assembly according to claim 1, wherein an integrated circuit device is provided on the second substrate. 9. A method of manufacturing an electronic component assembly including a first substrate provided with a plurality of pads and a second substrate provided with a plurality of through holes, wherein the electronic component assembly is provided on the first substrate. Providing a conductive resin on each of the plurality of pads provided, and the conductive resin provided on the plurality of through holes of the second substrate and the plurality of pads of the first substrate. Mounting the second substrate on the first substrate with the first and second substrates facing each other; melting the conductive resin to connect the plurality of pads to the plurality of through-holes; Filling a gap between the substrate and the second substrate with an insulating resin. 10. A method of manufacturing an electronic component assembly including a first substrate provided with a plurality of pads and a second substrate provided with a plurality of first through holes, wherein the first substrate is provided. Providing a conductive resin on each of the plurality of pads provided thereon; providing an insulating resin in a region where the conductive resin is not provided on the first substrate; Mounting the second substrate on the first substrate with the plurality of through holes of the second substrate facing the conductive resin provided on the plurality of pads of the first substrate. And curing the conductive resin and the insulating resin to form the plurality of pads and the plurality of through holes with the conductive resin, and the first substrate and the second substrate with the insulating resin.
Connecting the substrates to each other.