JP2947213B2 - Electronic component assembly and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component assembly and a method of manufacturing the same, and more particularly, to an electronic component assembly including a substrate provided with an integrated circuit device and a mounting substrate on which the substrate is mounted, and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art An example of this type of electronic component assembly is disclosed in U.S. Pat. No. 5,203,075.

In the electronic component assembly described in FIG. 10 of the above publication, a flexible substrate 31 is mounted on a substrate 13. The flexible substrate 31 and the substrate 13 are connected by solder. A frame 47 is provided between the flexible substrate 31 and the substrate 13 to make the flexible substrate 31 and the substrate 13 parallel. An integrated circuit device 43 is provided on the flexible substrate 31. Nothing is provided between the flexible substrate 31 and the substrate 13 other than the solder or the frame 47.

[0004]

In the above-mentioned prior art,
There is a problem that the connection between the flexible substrate and the substrate by solder may be defective. When the flexible substrate is mounted on the substrate and after the flexible substrate is mounted on the substrate, the flatness of the flexible substrate cannot be maintained, and the distance between the flexible substrate and the substrate is kept constant. This is because they cannot.

[0005] Further, the above-mentioned prior art is susceptible to mechanical stress and heat-resistant stress, and has a problem that the solder is peeled off or broken. This is because the flexible substrate and the substrate are connected only by solder.

Further, the above-mentioned prior art has a problem that it is vulnerable to moisture resistance stress, that is, the solder connecting the flexible substrate and the substrate tends to become brittle due to exposure to moisture. This is because the solder connecting the flexible substrate and the substrate is in direct contact with the outside air. There is also a problem that migration is likely to occur due to this moisture.

An object of the present invention is to provide an electronic component assembly having higher reliability of connection between a flexible substrate and a substrate.

Another object of the present invention is to provide an electronic component assembly capable of keeping the distance between flexible substrates constant.

Still another object of the present invention is to provide an electronic component assembly that can achieve connection between a flexible substrate and a substrate by using not only solder but also other connecting members.

Another object of the present invention is to provide an electronic component assembly in which solder for connecting a flexible substrate and a substrate is hardly exposed to the outside air.

[0011]

In order to solve the above problems, an electronic component assembly according to the present invention comprises a first substrate and a first substrate.
A second substrate provided on the first substrate, a connection member for connecting an upper surface of the first substrate and a lower surface of the second substrate, and a support member provided on the upper surface of the second substrate And a resin filled between the first substrate and the second substrate.

In another electronic component assembly according to the present invention, the resin seals the connection member.

Further, another electronic component assembly according to the present invention includes:
A pin is provided on a lower surface of the support member to keep a constant distance between the first substrate and the second substrate.

Further, another electronic component assembly according to the present invention includes a through-hole provided in the second substrate, wherein the pin passes through the through-hole.

Further, another electronic component assembly according to the present invention includes:
It further includes an electrode provided on a side surface inside the through hole, wherein the pin and the electrode are electrically connected by the connection member.

Further, another electronic component assembly of the present invention includes a pad provided on the first substrate, wherein the pin and the pad are electrically connected by the connection member. I do.

Further, another electronic component assembly of the present invention includes:
The support member has a flat plate portion, and the plate portion is in close contact with the substrate.

In another electronic component assembly according to the present invention, the second substrate has flexibility.

Further, another electronic component assembly of the present invention includes:
An integrated circuit device is provided on the second substrate.

According to another electronic component assembly of the present invention, there is provided a substrate having an upper surface, a lower surface, and a plurality of through holes.
A lower surface facing the upper surface of the substrate, a support member provided on the lower surface and having a plurality of pins penetrating each of the plurality of through holes, an upper surface facing the lower surface of the substrate, and a plurality of the support members; A mounting substrate having a plurality of pads connected to each of the pins.

According to a method of manufacturing an electronic component assembly of the present invention, a method of manufacturing an electronic component assembly including a substrate provided with a plurality of pads, a flexible substrate provided with a plurality of electrodes, and a support member is provided. A step of providing solder on each of the plurality of pads provided on the substrate, and wherein the plurality of electrodes of the flexible substrate and the plurality of pads of the substrate are opposed to each other. Mounting the flexible substrate on a substrate, mounting the support member on the flexible substrate, and connecting the plurality of pads and the plurality of electrodes by melting the solder. And filling a gap between the substrate and the flexible substrate with a resin.

According to another method of manufacturing an electronic component assembly of the present invention, a substrate provided with a plurality of pads, a flexible substrate provided with a plurality of through holes, and a plurality of pins are provided. A method of manufacturing an electronic component assembly including a support member, wherein solder is provided on each of the plurality of pads provided on the substrate, and the plurality of through holes of the flexible substrate are provided. Mounting the flexible substrate on the substrate with the plurality of pads of the substrate facing each other, causing the plurality of through holes of the flexible substrate to face the plurality of pins of the support member; Mounting the support member on the flexible substrate, melting the solder to connect the plurality of pads, the plurality of pins, and the plurality of through-holes, Filling resin into gaps between flexible substrates Including the.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of an electronic component assembly according to the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, a first embodiment of an electronic component assembly according to the present invention comprises a mounting substrate 1, an organic film 2 provided on the upper surface of the mounting substrate 1, and an upper surface of the organic film 2. It includes the provided LSI chip 3 and the stiffener 4 provided on the upper surface of the organic film 2.

In this embodiment, the LSI chip 3 is provided with 17.
It has a shape of 5 mm square, and about 800 input / output terminals are arranged around it at intervals of 80 micrometers. The LSI chip 3 is not limited to this, and various semiconductor devices can be applied. LSI chip 3 is organic film 2
Mounted on top.

The organic film 2 has a plurality of internal leads 2
1, circuit wiring pattern 22 and a plurality of external leads 23
Is provided. LSI chip 3 for organic film 2
A device hole for mounting the device is provided. In a more preferred form, the device hole is the organic film 2
It is provided in the center of. It is preferable that the organic film 2 has heat resistance, good dimensional stability, and sufficient adhesion to a conductor. Such an organic film 2
As a material of the above, polyimide, fluorine-based film or epoxy resin can be applied.

Each of the plurality of internal leads 21 extends from the device hole of the organic film 2, and connects each of the plurality of input / output terminals of the LSI chip 3 to the circuit wiring pattern 22 of the organic film 2. The connection between each internal lead 21 and the input / output terminal of the LSI chip 3 and each internal lead 21 itself are sealed with a sealing resin 24.

The circuit wiring pattern 22 is formed by applying gold plating to a copper surface. The thickness of the circuit wiring pattern 22 is about 10 to 25 micrometers. A part of the plurality of ends of the circuit wiring pattern 22 is connected to each of the plurality of internal leads 21, and the other part is connected to each of the plurality of external leads 23.

The plurality of external leads 23 are connected to input / output terminals of the LSI chip 3 via the circuit wiring pattern 22 and the internal leads 21. Each of the plurality of external leads 23 includes a through hole 231 and an electrode 232. The through hole 231 penetrates the organic film 2. The electrodes 232 are provided on the inner surface of the through hole 231 and on both main surfaces of the organic film 2 around the through hole 231. The material of the electrode 232 is copper, and its surface is plated with gold. The plurality of external leads 23 are arranged in a lattice.

A power supply lead 25 is provided around the device hole of the organic film 2. Power lead 2
Reference numeral 5 denotes a power supply lead to the LSI chip 3, which is connected to a power supply pin and a ground pin of the LSI chip 3 via a circuit wiring pattern and internal leads. The power supply lead 25 has no through hole.

The mounting board 1 is a printed board made of a composite material of glass and epoxy. A plurality of mounting electrodes 11 are provided on the upper surface of the mounting substrate 1.

Each of the plurality of mounting electrodes 11 is provided at a position facing each of the plurality of external leads 23 of the organic film 2. The material of the mounting electrode 11 is copper or gold.

The stiffener 4 includes a plate portion 41 and a plurality of pins 42. The stiffener 4 presses the organic film 2 toward the mounting substrate 1 to flatten the organic film 2. The stiffener 4 is provided with a through hole 43 at a position facing the LSI chip 3. The LSI chip 3 is included in the through hole 43 or penetrates the through hole 43.

The material of the plate portion 41 is ceramic or plastic. The thickness of the plate portion 41 is, for example, 1 millimeter. The plate portion 41 has a lower surface having smoothness.

The plurality of pins 42 are provided on the lower surface of the plate portion 41. Each of the plurality of pins 42 is provided at a position facing each of the plurality of external leads 23 of the organic film 2. Each of the plurality of pins 42 has conductivity, and each of the external leads 23 of the organic film 2 and each of the mounting electrodes 11 of
And are electrically connected. The material of the pins 42 is gold or copper. The plurality of pins 42 all have the same length,
The diameter is between 0.3 and 0.6 millimeter. The plurality of pins 42 are arranged in a grid.

The pin 42 of the stiffener 4 is
Is not provided at a position facing the power supply lead 25. The position where the power supply lead 25 is provided on the organic film 2 is high because of the high density of the wiring provided in the inner layer and near the connection point with the LSI chip 3. This is because the distance between the two is easily kept uniform.

The solder 5 is provided on each of the plurality of mounting electrodes 11 on the wiring board 1. The solder 5 includes each of the plurality of external leads 23 of the organic film 2, each of the plurality of pins 42 of the stiffener 4, and the plurality of mounting electrodes 1 of the mounting substrate 1.
1 are connected to each other.

A resin 6 is filled between the organic film 2 and the mounting substrate 1. The resin 6 integrates the organic film 2 and the mounting substrate 1. It is preferable that the material of the resin 6 has a similar thermal conductivity coefficient to that of the mounting substrate 1 and the organic film 2. Specifically, an epoxy resin can be used.

Next, a method for manufacturing an electronic component assembly according to the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2A, in a first step, solder 5 is provided on each of a plurality of mounting electrodes 11 provided on mounting substrate 1. The solder 5 is applied to the mounting electrode 11 by screen printing or the like.

Referring to FIG. 2B, in a second step, the organic film 2 on which the LSI chip 3 is mounted is mounted on the mounting substrate 1. The alignment is performed so that the electrodes 232 of the plurality of external leads 23 of the organic film 2 and the plurality of mounting electrodes 11 on the mounting substrate 1 face each other, and then the mounting is performed. Each electrode 232 of the plurality of external leads 23 of the organic film 2 is brought into contact with the solder 5 provided on each of the plurality of mounting electrodes 11 on the wiring board 1.

Referring to FIG. 2C, a stiffener 4 is mounted on the organic film 2 in a third step.
Positioning of the stiffener 4 is performed so that each of the plurality of pins 42 of the stiffener 4 and each of the plurality of external leads 23 of the corresponding organic film 2 face each other. It is inserted inside the through hole 231. Each pin 42 passes through each through hole 231, and the tip of the pin 42 contacts the solder 5 on the mounting electrode 11. The solder 5 is melted by the reflow method, and each pin 42 of the stiffener 4, each external lead of the organic film 2, and the mounting electrode 11 of the wiring board 1 are mechanically and electrically connected.

Referring to FIG. 2D, in a fourth step, the gap between the organic film 2 and the mounting substrate 1 is filled with a resin and cured. At this time, the organic film 2
Is pressed in the direction of the mounting substrate 1 by the stiffener 4, a part of the organic film 2 rises due to the pressure of the encapsulated resin, and the mounting substrate 1 and the organic film 2
Can be prevented from becoming uneven.

As described above, in this embodiment, since the stiffener 4 is mounted on the organic film 2, the weight of the stiffener 4 pushes the organic film 2 toward the wiring board 1. Can be made flatter. In addition, since the external force applied to the organic film 2 can be reduced by the strength of the stiffener 4, it is possible to prevent the reliability of the connection between the wiring board 1 and the organic film 2 from being reduced due to the mechanical stress.

Further, since the pins 42 are provided on the stiffener 4, the pins 42 are passed through the through holes 231 of the organic film 2, and the pins 42, the electrodes 232, and the mounting electrodes 11 are connected and fixed by the solder 5. The distance between the substrate and the organic film 2 can be uniform over the entire area of the organic film 2.

Further, the space between the mounting substrate 1 and the organic film 2 is filled with the resin 6, and the pins 42 of the stiffener 4, the electrodes 232 of the organic film 2, and the mounting electrodes 11 of the mounting substrate 1 are mounted.
Is sealed, so that the solder 5 does not come into contact with the outside air. As a result, it is possible to improve the reliability of the electronic component assembly against the moisture resistance stress and prevent the occurrence of migration.

In this embodiment, the pin 42 of the stiffener 4
Is not provided at a position facing the power supply lead 25 of the organic film 2. However, a through hole is also provided at the power supply lead 25, and a pin 42 is provided at a position facing the through hole of the stiffener 4. You may.

[0048]

As is apparent from the above description, in the present invention, since the stiffener is mounted on the organic film, the weight of the stiffener pushes the organic film in the direction of the wiring board. It can be flatter. Further, since the external force applied to the organic film can be reduced by the strength of the stiffener, it is possible to prevent the reliability of the connection between the wiring board and the organic film from being reduced due to the mechanical stress.

Also, pins are provided on the stiffener, the pins are passed through the through holes of the organic film, and the pins, the electrodes and the mounting electrodes are connected and fixed by soldering. The present invention also has an effect that the temperature can be made uniform over the entire surface.

Further, the space between the mounting substrate and the organic film is filled with resin, and the solder for connecting the pins of the stiffener, the electrode of the organic film, and the mounting electrode of the mounting substrate is sealed. As a result, the present invention has the effect of improving the reliability of the electronic component assembly against the moisture resistance stress and preventing the occurrence of migration.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a first embodiment of the present invention.

FIG. 2 is a diagram showing a manufacturing method according to the first embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mounting substrate 11 mounting electrode 2 organic film 21 internal lead 22 circuit wiring pattern 23 external lead 24 sealing resin 3 LSI chip 4 stiffener 41 plate portion 42 pin 5 solder 6 resin

Claims (7)

(57) [Claims] A first substrate; a second substrate provided on the first substrate; a connection member for connecting an upper surface of the first substrate to a lower surface of the second substrate; a support member provided on an upper surface of said second substrate, said saw including a filled resin between the first substrate and the second substrate, the first on the lower surface of the support member An electronic component assembly comprising a pin for keeping a distance between a substrate and the second substrate constant. Wherein said second comprises a through hole formed in the substrate, an electronic component assembly of claim 1 wherein said pin, characterized in that through said through hole. 3. An electrode provided on a side surface inside the through hole, wherein the pin and the electrode are electrically connected by the connection member.
3. The electronic component assembly according to 2 . Wherein said first includes a pad provided on the substrate, an electronic component assembly according to claim 1, wherein said pin and said pad, characterized in that it is electrically connected by the connecting member. 5. A substrate having an upper surface, a lower surface, and a plurality of through holes, a lower surface facing the upper surface of the substrate, and a plurality of pins provided on the lower surface and penetrating each of the plurality of through holes. An electronic component assembly, comprising: a mounting member having a supporting member, an upper surface opposed to a lower surface of the substrate, and a plurality of pads connected to each of a plurality of pins of the supporting member. 6. A method of manufacturing an electronic component assembly including a substrate provided with a plurality of pads, a flexible substrate provided with a plurality of electrodes, and a support member, wherein: Providing solder on each of the plurality of pads; and mounting the flexible substrate on the substrate with the plurality of electrodes of the flexible substrate facing the plurality of pads of the substrate. Mounting the supporting member on the flexible substrate; connecting the plurality of pads to the plurality of electrodes by melting the solder; and a gap between the substrate and the flexible substrate. And a step of filling the resin with a resin. 7. A method of manufacturing an electronic component assembly including a substrate provided with a plurality of pads, a flexible substrate provided with a plurality of through holes, and a support member provided with a plurality of pins. Providing solder on each of the plurality of pads provided on the substrate, and placing the plurality of through holes of the flexible substrate and the plurality of pads of the substrate facing each other on the substrate. Mounting the flexible substrate; and mounting the support member on the flexible substrate with the plurality of through holes of the flexible substrate facing the plurality of pins of the support member. Melting the solder to connect the plurality of pads, the plurality of pins, and the plurality of through-holes, and filling a gap between the substrate and the flexible substrate with a resin. Of electronic component assembly Method.