JPH07321437A - Mounting structure - Google Patents
Mounting structureInfo
- Publication number
- JPH07321437A JPH07321437A JP11074694A JP11074694A JPH07321437A JP H07321437 A JPH07321437 A JP H07321437A JP 11074694 A JP11074694 A JP 11074694A JP 11074694 A JP11074694 A JP 11074694A JP H07321437 A JPH07321437 A JP H07321437A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- hole
- printed wiring
- printed
- bga
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、実装技術に関し、特
に、表面に電子部品を実装するプリント配線板等に、Ｂ
ＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ、ボール・グリ
ッド・アレイ）タイプの電子部品やプリント配線板等を
搭載する実装技術に適用して有効な技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting technique, and more particularly, to a printed wiring board having electronic parts mounted on the surface thereof.
The present invention relates to a technique effectively applied to a mounting technique for mounting a GA (Ball Grid Array) type electronic component, a printed wiring board, or the like.
【０００２】[0002]
【従来の技術】たとえば、電子部品等の実装工程では、
当該電子部品における入出力端子数の増加等に伴って、
従来の挿入実装型の実装方法に代えてＢＧＡによる実装
が行われるようになってきている。2. Description of the Related Art For example, in the mounting process of electronic parts,
With the increase in the number of input / output terminals in the electronic parts,
In place of the conventional insertion mounting type mounting method, BGA mounting has been performed.
【０００３】従来、このようなＢＧＡによる実装技術と
しては、たとえば、パッドのハンダ付け領域内に設けら
れたスルーホールをプリント板の反部品搭載側に印刷さ
れた被膜によって閉塞することにより、ハンダ付け領域
内に設けたスルーホールからの溶融ハンダの流出を防止
するようにした方法（特開平２−２８３０９１号公報参
照）、反部品搭載側の開口するスルーホールの開口部を
閉塞する部材を具備することにより、ハンダの流出を防
止するようにした方法（特開平３−５３５８６号公報参
照）等がある。Conventionally, as a mounting technique by such BGA, for example, soldering is performed by closing a through hole provided in a soldering region of a pad with a film printed on the non-component mounting side of a printed board. A method for preventing the outflow of molten solder from a through hole provided in the area (see Japanese Patent Laid-Open No. 283091/1990), and a member for closing the opening of the through hole on the side opposite to the component mounting side. Accordingly, there is a method (see Japanese Patent Laid-Open No. 3-53586) for preventing the solder from flowing out.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来のプリン
ト配線板は、ハンダの流出のみを考慮したもので、反部
品搭載側のパッドは被膜または部具により絶縁されるた
め、ＢＧＡタイプ電子部品の実装後の電気的接触・部品
の交換時の加熱方法等が考慮されていない。However, in the conventional printed wiring board, only the outflow of solder is taken into consideration, and the pad on the side opposite to the component mounting side is insulated by the film or the component, so that the BGA type electronic component It does not take into consideration electrical contact after mounting and heating method when replacing parts.
【０００５】部品の小形化、多ピン化によりプリント配
線板への実装部品としてＢＧＡ型の電子部品（ＬＳＩパ
ッケージ等）が用いられている。このＢＧＡは、その裏
面にボール状のハンダをアレイ状に並べたものである
が、その接続部がＢＧＡの真下にあるため、実装後の電
気的接触・部品交換時の加熱等が容易に出来ない。BGA type electronic parts (LSI packages, etc.) are used as parts to be mounted on a printed wiring board due to miniaturization and increase in the number of pins of parts. This BGA has ball-shaped solder arranged in an array on its back surface. Since the connection part is directly under the BGA, it is easy to make electrical contact after mounting and heat when replacing parts. Absent.
【０００６】図５は、従来のＢＧＡによる実装構造の一
例を示す断面図である。図５において、１０１はＢＧＡ
型の電子部品（以下、ＢＧＡ）を構成するプリント配線
板、１０２は、ハンダボール、１０４は、印刷される被
膜、１０５は、プリント配線板、１０８は、スルーホー
ル、１０９は、スルーホール、１１０は、接続パッド、
１１１は、接続パッドである。従来のＢＧＡでは、プリ
ント配線板１０１およびプリント配線板１０５の接続パ
ッド１１１，１１０から引き出しライン１１１ａ，引き
出しライン１１０ａを設け、スルーホール１０８および
スルーホール１０９を経由して配線するため、スルーホ
ール１０８およびスルーホール１０９の開口部からハン
ダボール１０２の位置が逸れた状態となり、実装後の電
気的接触・部品交換時の加熱が容易にできない等の問題
があった。FIG. 5 is a sectional view showing an example of a conventional BGA mounting structure. In FIG. 5, 101 is a BGA
Printed wiring board constituting a mold electronic component (hereinafter, BGA), 102 solder balls, 104 coating film to be printed, 105 printed wiring board, 108 through hole, 109 through hole, 110 Is the connection pad,
111 is a connection pad. In the conventional BGA, the lead-out line 111a and the lead-out line 110a are provided from the connection pads 111 and 110 of the printed wiring board 101 and the printed wiring board 105, and wiring is performed via the through hole 108 and the through hole 109. The position of the solder ball 102 deviates from the opening of the through hole 109, and there is a problem in that electrical contact after mounting and heating during component replacement cannot be performed easily.
【０００７】本発明の目的は、ハンダボールによる実装
後の電気的接触・部品交換時の加熱が容易にできる実装
技術を提供することにある。An object of the present invention is to provide a mounting technique capable of facilitating electrical contact after mounting with a solder ball and heating at the time of component replacement.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するため
に、本発明の実装構造では、ハンダボールによるＢＧＡ
を構成するプリント配線板（第１の部材）およびＢＧＡ
を実装するプリント配線板（第２の部材）において、該
ＢＧＡを構成するプリント配線板（第１の部材）の接続
パッド（第１の接続領域）、および該ＢＧＡを実装する
プリント配線板（第２の部材）の接続パッド（第２の接
続領域）の少なくとも一方にスルーホールを設け、実装
後に、必要に応じて、このスルーホールを介して、電気
的接触・部品交換時の加熱を行うことを可能にしたもの
である。In order to achieve the above object, in the mounting structure of the present invention, a BGA using solder balls is used.
Printed wiring board (first member) and BGA constituting the
In a printed wiring board (second member) for mounting the BGA, a connection pad (first connection region) of the printed wiring board (first member) forming the BGA, and a printed wiring board (first member) for mounting the BGA. A through hole is provided in at least one of the connection pads (second connection region) of the second member), and after mounting, heating is performed at the time of electrical contact / part replacement, if necessary, through this through hole. Is made possible.
【０００９】[0009]
【作用】ハンダボールによるＢＧＡを構成するプリント
配線板（第１の部材）およびＢＧＡを実装するプリント
配線板（第２の部材）の双方の接続パッド（第１および
第２の接続領域）の少なくとも一方にスルーホールを有
するため、当該スルーホールの開口部上にハンダボール
が位置することとなり、ＢＧＡ実装後に該スルーホール
を経由してハンダボールに対する電気的接触や部品交換
時の加熱等の操作が容易にできる。At least the connection pads (first and second connection regions) of both the printed wiring board (first member) that constitutes the BGA using solder balls and the printed wiring board (second member) that mounts the BGA. Since the through-hole is provided on one side, the solder ball is positioned on the opening of the through-hole, and after the BGA mounting, the solder ball is electrically contacted via the through-hole and the operation such as heating at the time of component replacement can be performed. You can easily.
【００１０】[0010]
【実施例】以下、本発明の実施例を図面に基づいて詳細
に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【００１１】（実施例１）図１は、本発明の一実施例で
ある実装構造の一例を示す断面図である。本実施例で
は、一例として、ＢＧＡを用いて複数のプリント配線板
を相互に接続する場合について説明する。(Embodiment 1) FIG. 1 is a sectional view showing an example of a mounting structure which is an embodiment of the present invention. In this embodiment, as an example, a case where a plurality of printed wiring boards are connected to each other by using BGA will be described.
【００１２】たとえば、樹脂やセラミックス等の絶縁物
からなるプリント配線板１の表面には、複数の接続パッ
ド１１が形成され、この接続パッド１１の各々は、当該
接続パッド１１の中央部に穿設されたスルーホール７の
内周面に施された導体被覆３ａを介して、裏面側の接続
パッド１１ａに電気的に接続されている。また、接続パ
ッド１１が形成された表面側は、当該接続パッド１１の
領域を除いて、樹脂等からなる絶縁性の被膜４ｃに覆わ
れているとともに、この被膜４ｃの一部は、接続パッド
１１の中央におけるスルーホール７の開口部に選択的に
充填されてダム４ｄを形成している。For example, a plurality of connection pads 11 are formed on the surface of the printed wiring board 1 made of an insulating material such as resin or ceramics, and each of the connection pads 11 is provided at the center of the connection pad 11. It is electrically connected to the connection pad 11a on the back surface side through the conductor coating 3a provided on the inner peripheral surface of the formed through hole 7. Further, the surface side where the connection pad 11 is formed is covered with an insulating coating 4c made of resin or the like except for the region of the connection pad 11, and a part of the coating 4c is connected to the connection pad 11. The opening portion of the through hole 7 in the center of is filled selectively to form a dam 4d.
【００１３】そして、このような接続パッド１１におけ
るダム４ｄによって閉塞されたスルーホール７の開口部
の直上部に、蒸着等によってハンダを選択的に被着させ
た後、リフロすることによってハンダボール２を突設形
成する。このリフロ時においてもダム４ｄにより、溶融
したハンダがスルーホール７の内部に入り込んで流出す
る懸念はない。Then, solder is selectively applied by vapor deposition or the like directly above the opening of the through hole 7 closed by the dam 4d in the connection pad 11, and then reflowed to reflow the solder ball 2 To form a protrusion. Even during this reflow, there is no concern that the molten solder will enter the inside of the through hole 7 and flow out due to the dam 4d.
【００１４】一方、プリント配線板１が搭載されるプリ
ント配線板５は、表面に複数の接続パッド１０が形成さ
れ、この接続パッド１０は、当該接続パッド１０の中央
部に穿設されたスルーホール６の内周面に施された導体
被覆３ｂを介して裏面側に設けられた接続パッド１０ａ
に電気的に接続されている。プリント配線板５における
接続パッド１０の配置位置およびピッチは、プリント配
線板１側の接続パッド１１の配置位置およびピッチに一
致するように形成されている。接続パッド１０が形成さ
れた表面側は、当該接続パッド１０の領域を除いて絶縁
性の被膜４ａに覆われているとともに、この被膜４ａの
一部は、接続パッド１０の中央におけるスルーホール６
の開口部に充填されてダム４ｂを形成している。On the other hand, the printed wiring board 5 on which the printed wiring board 1 is mounted has a plurality of connection pads 10 formed on the surface thereof, and the connection pads 10 are through holes formed in the central portion of the connection pads 10. Connection pad 10a provided on the back surface side through the conductor coating 3b provided on the inner peripheral surface of
Electrically connected to. The arrangement positions and pitches of the connection pads 10 on the printed wiring board 5 are formed to match the arrangement positions and pitches of the connection pads 11 on the printed wiring board 1 side. The surface side where the connection pad 10 is formed is covered with an insulating film 4a except for the region of the connection pad 10, and a part of this film 4a is formed in the through hole 6 in the center of the connection pad 10.
The opening 4 is filled to form a dam 4b.
【００１５】なお、被膜４ａや被膜４ｃによって形成す
るダム４ｂ、ダム４ｄは、必ずしも高い絶縁性を必要と
せず、ハンダ流出防止ができればよいので、材質は必ず
しも被膜４ａや被膜４ｃと同一である必要なく、種々変
更可能である。Since the dams 4b and 4d formed by the coating 4a and coating 4c do not necessarily need high insulation and can prevent the solder from flowing out, the material is not necessarily the same as the coating 4a and coating 4c. However, various changes can be made.
【００１６】そして、プリント配線板１の表面をプリン
ト配線板５の表面に対向させ、プリント配線板１の側の
ハンダボール２をプリント配線板５の接続パッド１０に
重ね合わせた状態でリフロすることにより、図１に例示
される状態に、プリント配線板１とプリント配線板５と
を、複数のハンダボール２からなるＢＧＡを介して接合
し実装する。この時、プリント配線板５（プリント配線
板１）の側の接続パッド１０（接続パッド１１）に設け
られたダム４ｂ（ダム４ｄ）により、ハンダボール２が
溶融して生じた溶融ハンダがスルーホール６（スルーホ
ール７）に入り込んで流出する懸念はない。Then, the surface of the printed wiring board 1 is opposed to the surface of the printed wiring board 5, and the solder balls 2 on the side of the printed wiring board 1 are reflowed in a state of being superposed on the connection pads 10 of the printed wiring board 5. Thus, the printed wiring board 1 and the printed wiring board 5 are joined and mounted in the state illustrated in FIG. 1 via the BGA including the plurality of solder balls 2. At this time, the molten solder generated by melting the solder balls 2 through the dam 4b (dam 4d) provided on the connection pad 10 (connection pad 11) on the printed wiring board 5 (printed wiring board 1) side is a through hole. 6 (through hole 7), there is no risk of outflow.
【００１７】こうして、実装されたプリント配線板１と
プリント配線板５においては、プリント配線板５および
プリント配線板１に設けられたスルーホール６またはス
ルーホール７を経由して、当該スルーホール６またはス
ルーホール７の開口部上に位置するハンダボール２に対
して容易に電気的接触や部品交換時の加熱等が可能とな
り、ＢＧＡの実装後の電気的検査および、ＢＧＡの交換
が容易にできる。In the printed wiring board 1 and the printed wiring board 5 thus mounted, the through hole 6 or the through hole 6 or the through hole 7 provided in the printed wiring board 1 is passed through the through hole 6 or The solder balls 2 located on the openings of the through holes 7 can be easily electrically contacted with each other and heated at the time of component replacement, so that electrical inspection after mounting the BGA and replacement of the BGA can be facilitated.
【００１８】（実施例２）図２は、本発明の他の実施例
である実装構造の一例を示す断面図である。本実施例の
場合には、ＢＧＡを構成するプリント配線板１における
接続パッド１１の中央部、すなわちハンダボール２の形
成位置にスルーホール７を形成し、一方、ハンダボール
２を介して、このプリント配線板１に対向するプリント
配線板５の接続パッド１０ｂには、当該接続パッド１０
ｂの中央部、すなわちハンダボール２の接続部位から逸
れた位置に開口するようにスルーホール９を形成したも
のである。(Embodiment 2) FIG. 2 is a sectional view showing an example of a mounting structure which is another embodiment of the present invention. In the case of the present embodiment, the through hole 7 is formed at the central portion of the connection pad 11 in the printed wiring board 1 constituting the BGA, that is, at the position where the solder ball 2 is formed, while the print is made via the solder ball 2. The connection pad 10b of the printed wiring board 5 facing the wiring board 1 is attached to the connection pad 10b.
The through hole 9 is formed so as to open at the central portion of b, that is, at a position deviated from the connection portion of the solder ball 2.
【００１９】この実施例２の場合には、プリント配線板
１の側のスルーホール７を介して、当該スルーホール７
の開口部上に位置するハンダボール２に対して容易に電
気的接触や部品交換時の加熱操作等が可能となり、ＢＧ
Ａの実装後の電気的検査および、ＢＧＡの交換が容易に
できる。In the case of the second embodiment, the through hole 7 is provided via the through hole 7 on the printed wiring board 1 side.
It becomes possible to easily make electrical contact with the solder ball 2 located on the opening of the, and perform a heating operation at the time of component replacement.
The electrical inspection after mounting A and the BGA can be easily replaced.
【００２０】（実施例３）図３は、本発明のさらに他の
実施例である実装構造の一例を示す断面図である。この
実施例３では、前記実施例２とは逆に、プリント配線板
１の側の接続パッド１１ｂには、当該接続パッド１１ｂ
の中央部、すなわちハンダボール２の形成位置から逸れ
た位置にスルーホール８を形成し、対向するプリント配
線板５の接続パッド１０の中央部、すなわちハンダボー
ル２の接続部位にスルーホール６を形成したものであ
る。(Embodiment 3) FIG. 3 is a sectional view showing an example of a mounting structure which is still another embodiment of the present invention. In the third embodiment, contrary to the second embodiment, the connection pad 11b on the printed wiring board 1 side is connected to the connection pad 11b.
Through holes 8 are formed in the central portion of the printed circuit board 5, that is, in the central portion of the connecting pads 10 of the printed wiring board 5 facing each other, that is, in the connecting portion of the solder balls 2. It was done.
【００２１】この実施例３の場合には、プリント配線板
５の側のスルーホール６を介して、当該スルーホール６
の開口部上に位置するハンダボール２に対して容易に電
気的接触や部品交換時の加熱操作等が可能となり、ＢＧ
Ａの実装後の電気的検査および、ＢＧＡの交換が容易に
できる。In the case of the third embodiment, the through hole 6 is provided through the through hole 6 on the printed wiring board 5 side.
It becomes possible to easily make electrical contact with the solder ball 2 located on the opening of the, and perform a heating operation at the time of component replacement.
The electrical inspection after mounting A and the BGA can be easily replaced.
【００２２】（実施例４）図４は、本発明のさらに他の
実施例である実装構造の一例を示す断面図である。この
実施例４の場合には、プリント配線板１（プリント配線
板５）に、中央部にスルーホール７（スルーホール６）
が形成された接続パッド１１（接続パッド１０）、およ
び中央部から逸れた位置にスルーホール８（スルーホー
ル９）が形成された接続パッド１１ｂ（接続パッド１０
ｂ）を混在させて形成したものである。(Embodiment 4) FIG. 4 is a sectional view showing an example of a mounting structure which is still another embodiment of the present invention. In the case of the fourth embodiment, the printed wiring board 1 (printed wiring board 5) is provided with the through hole 7 (through hole 6) at the center.
Connection pad 11 (connection pad 10) in which a hole is formed, and connection pad 11b (connection pad 10) in which a through hole 8 (through hole 9) is formed at a position deviated from the central portion.
It is formed by mixing b).
【００２３】この実施例４の場合には、プリント配線板
１の側のスルーホール７、およびプリント配線板５の側
のスルーホール６を用いることによって、当該スルーホ
ール７およびスルーホール６の開口部上に位置するハン
ダボール２に対して容易に電気的接触や部品交換時の加
熱操作等が可能となり、ＢＧＡの実装後の電気的検査お
よび、ＢＧＡの交換が容易にできる。In the case of the fourth embodiment, by using the through hole 7 on the printed wiring board 1 side and the through hole 6 on the printed wiring board 5 side, the through holes 7 and the openings of the through holes 6 are formed. It is possible to easily make an electrical contact with the solder ball 2 located above, a heating operation at the time of component replacement, etc., and it is possible to easily perform an electrical inspection after the mounting of the BGA and a replacement of the BGA.
【００２４】なお、上記の各実施例の説明では、プリン
ト配線板同士を接続する場合について説明したが、一方
がＢＧＡ型の封止形態を有するＬＳＩやＩＣ等の電子部
品であってもよいことは言うまでもない。In the above description of each embodiment, the case where the printed wiring boards are connected to each other has been described, but one of them may be an electronic component such as an LSI or IC having a BGA type sealing form. Needless to say.
【００２５】[0025]
【発明の効果】本発明の実装構造によれば、ハンダボー
ルの接続領域に開口したスルーホールを経由して、該ス
ルーホールの開口部上に位置するハンダボールに対する
電気的接触や部品交換時の加熱操作等が可能となり、複
数のハンダボールからなるＢＧＡによる実装後の電気的
検査および、ＢＧＡの交換が容易にできる、という効果
が得られる。According to the mounting structure of the present invention, through the through hole opened in the solder ball connection region, electrical contact is made to the solder ball located above the opening of the through hole, or when parts are replaced. It is possible to perform a heating operation and the like, and it is possible to obtain an effect that the electrical inspection after mounting by the BGA including a plurality of solder balls and the replacement of the BGA can be easily performed.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の一実施例である実装構造の一例を示す
断面図である。FIG. 1 is a sectional view showing an example of a mounting structure which is an embodiment of the present invention.
【図２】本発明の他の実施例である実装構造の一例を示
す断面図である。FIG. 2 is a sectional view showing an example of a mounting structure which is another embodiment of the present invention.
【図３】本発明のさらに他の実施例である実装構造の一
例を示す断面図である。FIG. 3 is a sectional view showing an example of a mounting structure which is still another embodiment of the present invention.
【図４】本発明のさらに他の実施例である実装構造の一
例を示す断面図である。FIG. 4 is a sectional view showing an example of a mounting structure which is still another embodiment of the present invention.
【図５】従来の実装構造の一例を示す断面図である。FIG. 5 is a sectional view showing an example of a conventional mounting structure.
１・・・プリント配線板（第１の部材）、２・・・ハン
ダボール、３ａ・・・導体被覆、３ｂ・・・導体被覆、
４ａ・・・被膜、４ｂ・・・ダム、４ｃ・・・被膜、４
ｄ・・・ダム、５・・・プリント配線板（第２の部
材）、６・・・スルーホール、７・・・スルーホール、
８・・・スルーホール、９・・・スルーホール、１０・
・・接続パッド（第２の接続領域）、１０ａ・・・接続
パッド、１０ｂ・・・接続パッド（第２の接続領域）、
１１・・・接続パッド（第１の接続領域）、１１ａ・・
・接続パッド、１１ｂ・・・接続パッド（第１の接続領
域）1 ... Printed wiring board (first member), 2 ... Solder ball, 3a ... Conductor coating, 3b ... Conductor coating,
4a ... film, 4b ... dam, 4c ... film, 4
d ... Dam, 5 ... Printed wiring board (second member), 6 ... Through hole, 7 ... Through hole,
8 ... through hole, 9 ... through hole, 10 ...
..Connection pads (second connection area), 10a ... Connection pads, 10b ... Connection pads (second connection area),
11 ... Connection pad (first connection region), 11a ...
Connection pad, 11b ... Connection pad (first connection area)
Claims (1)
介して接続してなる実装構造であって、前記第１および
第２の部材において前記ハンダボールが接続される第１
および第２の接続領域の少なくとも一方にスルーホール
を形成してなることを特徴とする実装構造。1. A mounting structure in which first and second members are connected via solder balls, wherein the solder balls are connected in the first and second members.
And a mounting structure having a through hole formed in at least one of the second connection region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11074694A JPH07321437A (en) | 1994-05-25 | 1994-05-25 | Mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11074694A JPH07321437A (en) | 1994-05-25 | 1994-05-25 | Mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07321437A true JPH07321437A (en) | 1995-12-08 |
Family
ID=14543499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11074694A Pending JPH07321437A (en) | 1994-05-25 | 1994-05-25 | Mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07321437A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10275967A (en) * | 1997-03-28 | 1998-10-13 | Nec Corp | Electronic-component assembly and its manufacture |
| EP0942636A3 (en) * | 1998-03-12 | 2001-03-14 | Lucent Technologies Inc. | Solder bonding printed circuit board |
| US6208022B1 (en) | 1997-03-27 | 2001-03-27 | Nec Corporation | Electronic-circuit assembly |
| WO2004004434A1 (en) * | 2002-06-27 | 2004-01-08 | Raytheon Company | Multilayer stripline radio frequency circuits and interconnection methods |
| EP1599077A1 (en) * | 2004-05-19 | 2005-11-23 | Aries Electronics, Inc | Method of creating gold contacts directly on printed circuit boards and product thereof |
| JP2014232760A (en) * | 2013-05-28 | 2014-12-11 | 株式会社日立製作所 | Inter-layer connection substrate and manufacturing method thereof |
-
1994
- 1994-05-25 JP JP11074694A patent/JPH07321437A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6208022B1 (en) | 1997-03-27 | 2001-03-27 | Nec Corporation | Electronic-circuit assembly |
| JPH10275967A (en) * | 1997-03-28 | 1998-10-13 | Nec Corp | Electronic-component assembly and its manufacture |
| EP0942636A3 (en) * | 1998-03-12 | 2001-03-14 | Lucent Technologies Inc. | Solder bonding printed circuit board |
| WO2004004434A1 (en) * | 2002-06-27 | 2004-01-08 | Raytheon Company | Multilayer stripline radio frequency circuits and interconnection methods |
| AU2003233683B2 (en) * | 2002-06-27 | 2006-02-23 | Raytheon Company | Multilayer stripline radio frequency circuits and interconnection methods |
| EP1599077A1 (en) * | 2004-05-19 | 2005-11-23 | Aries Electronics, Inc | Method of creating gold contacts directly on printed circuit boards and product thereof |
| JP2014232760A (en) * | 2013-05-28 | 2014-12-11 | 株式会社日立製作所 | Inter-layer connection substrate and manufacturing method thereof |
| CN104219901A (en) * | 2013-05-28 | 2014-12-17 | 株式会社日立制作所 | Interlayer connection substrate and its manufacturing method |
| US9320154B2 (en) | 2013-05-28 | 2016-04-19 | Hitachi, Ltd. | Method of manufacturing an interlayer connection substrate |
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