JPH08320332A - Mounting structure of acceleration sensor - Google Patents

Abstract

PURPOSE: To obtain the mounting structure, of an acceleration sensor, by which the cost of a mounting operation onto an electronic circuit board is low and whose reliability is high. CONSTITUTION: Chip capacitors 14 are used as the raising components of an acceleration sensor 10. The sensor 10 is mounted on the chip capacitors 14 mounted on circuit patterns 15 as constituent components for a board 19. Aluminum posts 17 are formed to be disk-shaped, they are mounted on, and soldered to, the circuit patterns 15 on the board 19, and they are used as terminals for bonding of wires 18 which connect terminal parts 13 for the sensor 10 to the circuit patterns 15. The board 19 is formed in such a way that the circuit patterns 15 composed of a conductor, a resistor and the like are printed as thick films on a ceramic board and that electronic components and the like are mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for an acceleration sensor mounted on an electronic circuit board of a safety device such as an automobile.

[0002]

2. Description of the Related Art A mounting structure of an acceleration sensor mounted on an electronic circuit board (hereinafter abbreviated as a board) of automobile safety equipment or the like will be described with reference to FIG. 7A and 7B are views showing a mounting structure of a conventional acceleration sensor, in which FIG. 7A is a plan view and FIG. 7B is a sectional view taken along line GG.

Reference numeral 50 is an acceleration sensor, which is a rectangular cube and has a hook-shaped slit 52 from the outer periphery toward the center.
Is penetrated in the thickness direction, and the inertial portion 51 is elastically supported.
Are formed. When acceleration is applied to the acceleration sensor 50, the inertial portion 51 moves in the direction opposite to the direction in which the acceleration is applied.
When the inertial portion 51 moves, the resistance value of the acceleration sensor 50 changes according to the amount of movement (magnitude of strain due to movement), so that the changing resistance value is converted from the terminal portion 53 into acceleration.

The acceleration sensor 50 is used so that the inertial portion 51 acts in the direction in which acceleration is detected. Since the upper and lower surfaces of the inertial portion 51 and the upper and lower surfaces of the acceleration sensor 50 are flush with each other in a normal state, when the acceleration sensor 50 is directly mounted on the substrate 59, the lower surface of the inertial portion 51 becomes the substrate 59.
Since the inertial portion 51 cannot move toward the substrate 59, the outer peripheral lower surface of the acceleration sensor 50 except the inertial portion 51 needs to be raised.

Reference numeral 70 is a raised component of the acceleration sensor 50.
The inertial portion 51 of the acceleration sensor 50 has a rectangular cube shape.
Is formed with a concave portion 71. Glass or the like is used as the material. The raised component 70 is bonded to the lower portion 54 of the acceleration sensor 50, and the acceleration sensor 50 is bonded to the substrate 59 via the raised component 70. Reference numeral 57 is an aluminum post, which has a disk shape and is a circuit pattern 5 on the substrate 59.
5 is a terminal for bonding a wire 57 which is mounted and soldered on the wiring 5, and connects the terminal portion 53 of the acceleration sensor 50 and the circuit pattern 55.

Reference numeral 59 denotes a substrate on which a circuit pattern 55 of a conductor, resistors and the like are formed on a ceramic plate by thick film printing, and electronic parts and the like are mounted. Next, the operation will be described. When acceleration is applied to the acceleration sensor 50 mounted on the substrate 59 in the direction of the arrow N due to impact or the like, the inertial portion 51 moves in the direction opposite to the arrow N. Since the resistance value of the acceleration sensor 50 changes according to the movement amount of the inertial portion 51, the change amount of the resistance value is extracted and converted into acceleration.

[0007]

However, in the above-described acceleration sensor mounting structure 00, the inertial portion 5 of the acceleration sensor 50 is used.
When 1 moves in the vertical direction, the lower part of the inertia part 51 is the substrate 59.
Since the glass raising component 70 having the concave portion formed therein so as not to come into contact with the surface thereof is used, there is a problem that the price becomes expensive.

Therefore, the present invention solves the above-mentioned problems, and an object of the present invention is to provide a mounting structure for an acceleration sensor which is inexpensive and highly reliable.

[0009]

SUMMARY OF THE INVENTION The present invention achieves the above-mentioned object. An acceleration sensor for detecting an acceleration by the movement of an elastically supported inertial portion is used in which the direction of movement of the inertial portion is the surface of an electronic circuit board. In a mounting structure of an acceleration sensor in which the acceleration sensor is mounted on a surface of the electronic circuit board in a vertical direction, the acceleration sensor is mounted on an electronic component mounted on the electronic circuit board. And

Further, an acceleration sensor for detecting acceleration by the movement of the inertial portion elastically supported is provided on the surface of the electronic circuit board so that the movement direction of the inertial portion is perpendicular to the surface of the electronic circuit board. The mounting structure of the acceleration sensor to be mounted is characterized in that a raised portion of the acceleration sensor is formed on the surface of the electronic circuit board by thick film printing, and the acceleration sensor is mounted on the raised portion.

Further, an acceleration sensor for detecting acceleration by the movement of the inertial portion elastically supported is provided on the surface of the electronic circuit board so that the moving direction of the inertial portion is perpendicular to the surface of the electronic circuit board. The mounting structure of the acceleration sensor to be mounted is characterized in that an aluminum post serving as a terminal portion for wire bonding is mounted on the electronic circuit board, and the acceleration sensor is mounted on the aluminum post.

The aluminum post is also used as a terminal portion for wire bonding with the connection terminal of the acceleration sensor. Further, in a mounting structure of an acceleration sensor in which an acceleration sensor that detects acceleration by the movement of an elastically supported inertial portion is mounted on a surface of an electronic circuit board, a movement direction of the surface of the electronic circuit board and the inertial portion is the electronic circuit. The electronic circuit board is mounted so that it is parallel to the surface of the board.

Further, in a mounting structure of an acceleration sensor in which an acceleration sensor for detecting acceleration by moving an elastically supported inertial portion is mounted on a surface of an electronic circuit board, in a moving direction of the inertial portion of the acceleration sensor of the electronic circuit board. Is characterized in that a concave portion is provided in a portion corresponding to.

[0014]

According to the present invention, since the acceleration sensor is mounted on the electronic component mounted on the surface of the substrate and the acceleration sensor is raised from the surface of the substrate, acceleration is applied to the acceleration sensor. Even if the inertial portion of the sensor moves toward the substrate, the inertial portion can be prevented from coming into contact with the surface of the substrate.

According to the second invention, since the acceleration sensor is mounted on the thick film printed on the surface of the substrate and the acceleration sensor is raised from the surface of the substrate, acceleration is applied to the acceleration sensor. Even if the inertial portion of the acceleration sensor moves toward the substrate, the inertial portion can be prevented from coming into contact with the surface of the substrate. According to the third invention, since the acceleration sensor is mounted on the aluminum post mounted on the surface of the substrate and the acceleration sensor is raised from the surface of the substrate, acceleration is applied to the acceleration sensor and the acceleration sensor. Even if the inertial part moves toward the substrate, the inertial part can be prevented from coming into contact with the surface of the substrate.

According to the fourth invention, the acceleration sensor is mounted on the aluminum post mounted on the circuit of the board, and the acceleration sensor is raised from the surface of the board.
Even if acceleration is applied to the acceleration sensor and the inertial portion of the acceleration sensor moves toward the substrate, the inertial portion can be prevented from coming into contact with the surface of the substrate. Further, the aluminum post can also be used as a terminal portion for wire bonding with the connection terminal of the acceleration sensor.

According to the fifth aspect of the invention, since the inertial portion of the acceleration sensor is mounted on the electronic circuit board such that the moving direction of the inertial portion is parallel to the surface of the electronic circuit board, even if acceleration is applied to the acceleration sensor. The inertial portion does not come into contact with the surface of the substrate. Therefore, the raised parts are unnecessary. According to the sixth aspect of the present invention, by providing the substrate on which the acceleration sensor is mounted with the concave portion corresponding to the inertial portion of the acceleration sensor, acceleration is applied to the acceleration sensor and the inertial portion of the acceleration sensor moves toward the substrate. However, the inertial part does not come into contact with the surface of the substrate. Therefore,
No need for raised parts.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention includes an invention that uses a raised component in a portion between an acceleration sensor and a substrate except an inertial portion of the acceleration sensor when the acceleration sensor is mounted on a substrate, and an invention that does not require the raised component. First, an embodiment of the invention using a raised component will be described.

A first embodiment of the present invention will be described with reference to FIG. 1A and 1B are views showing a mounting structure of an acceleration sensor showing a first embodiment of the present invention, FIG. 1A is a plan view, and FIG. 1B is a sectional view taken along line AA. Reference numeral 10 denotes an acceleration sensor, which has a rectangular cube shape and has a hook-shaped slit 12 from the outer periphery toward the center.
Is penetrated in the thickness direction, and the inertia part 11 is elastically supported.
Are formed. When acceleration is applied to the acceleration sensor 10, the inertial portion 11 moves in the direction opposite to the direction in which the acceleration is applied.
Then, when the inertial portion 11 moves, the resistance value of the acceleration sensor 10 changes according to the amount of movement (the amount of distortion due to movement), so that the changing resistance value is converted from the terminal portion 13 into the extraction acceleration.

The acceleration sensor 10 is used so that the inertia part 11 acts in the direction in which acceleration is to be detected. Since the upper and lower surfaces of the inertial portion 11 and the upper and lower surfaces of the acceleration sensor 10 are flush with each other in a normal state, when the acceleration sensor 10 is directly mounted on the substrate 19, the lower surface of the inertial portion 11 becomes the substrate 19.
Since the inertial portion 11 cannot move in the direction of the substrate 19 because it comes into close contact with the surface of the acceleration sensor 10, it is necessary to raise the outer peripheral lower surface of the acceleration sensor 10 excluding the inertial portion 11. The chip capacitor 14 is used as a raised component of the acceleration sensor 10, and the acceleration sensor 1 is mounted on the chip capacitor 14 mounted on the circuit pattern 15 as a component of the substrate 19.
0 is implemented.

Reference numeral 17 denotes an aluminum post, which has a disk shape and is mounted and soldered on the circuit pattern 15 of the substrate 19, and the terminal portion 13 of the acceleration sensor 10 and the circuit pattern 1 are provided.
It is a terminal for bonding the wire 18 for connecting the wires 5. Reference numeral 19 denotes a substrate on which a conductor circuit pattern 15, resistors and the like are formed on a ceramic plate by thick film printing, and electronic parts and the like are mounted.

Next, the operation will be described. Chip capacitor 1
When an acceleration is applied to the acceleration sensor 10 mounted on the No. 4 in the direction of the arrow H due to a shock or the like, the inertial portion 11 moves in the direction opposite to the arrow H. Since the resistance value of the acceleration sensor 10 changes according to the movement amount of the inertial portion 11, the change amount of the resistance value is extracted and converted into acceleration.

As described above, according to this embodiment, the chip capacitor 1 mounted on the substrate 19 as a circuit component
4, the acceleration sensor 10 is mounted on the inertial unit 1.
1 is lifted up, and the padding part required only for mounting the acceleration sensor 10 is unnecessary. Therefore, the mounting cost of the acceleration sensor 10 can be reduced. Further, since the acceleration sensor 10 is mounted on another circuit mounting component, the space of the board 19 can be saved. Although the acceleration sensor 10 is mounted on the chip capacitor 14 in the present embodiment, it is not necessary to be particular about this and it should be mounted on other components mounted on the substrate 19, for example, chip resistors, IC components and the like. It is also possible to obtain the same effect as this embodiment.

Next, a second embodiment of the present invention will be described with reference to FIG. 2A and 2B are views showing a mounting structure of an acceleration sensor according to a second embodiment of the present invention, in which FIG. 2A is a plan view and FIG.
It is a -B sectional view. The second embodiment is a modification of the raised portion of the first embodiment, and since the other parts are substantially the same as the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted.

Reference numeral 20 denotes a raised portion, which is raised substantially on the surface of the substrate 19 except for the inertial portion 11 of the acceleration sensor 10. The raised portion 20 is formed by repeatedly printing a thick film on the surface of the substrate 19 in the process of manufacturing the substrate 19, for example, a circuit pattern 21, a resistor 22, and a glass 23 for surface protection. In each of these steps, the raised portion 20 of the acceleration sensor 10 is stacked with a thick film to form the raised portion 20. Then, the acceleration sensor 10 is mounted on the raised portion 20.

Next, the operation will be described. When acceleration is applied to the acceleration sensor 10 mounted on the raised portion 20 in the direction of the arrow I due to a shock or the like, the inertial portion 11 moves in the direction opposite to the arrow I. Since the resistance value of the acceleration sensor 10 changes according to the movement amount of the inertial portion 11, the change amount of the resistance value is extracted and converted into acceleration.

As described above, according to the present embodiment, since the acceleration sensor 10 is mounted on the raised portion 20 formed by stacking thick film printing, the raised component necessary only for mounting the acceleration sensor 10 is mounted. Implementation of is unnecessary. Therefore, the mounting cost of the acceleration sensor 10 can be reduced. Next, a third embodiment of the present invention will be described with reference to FIG.

3A and 3B are views showing a mounting structure of an acceleration sensor showing a third embodiment of the present invention. FIG. 3A is a plan view and FIG. 3B is a sectional view taken along line CC. Note that the third embodiment is a modification of the raised portion of the first embodiment and is otherwise substantially the same as the first embodiment. Therefore, the same components are designated by the same reference numerals and description thereof is omitted. In the third embodiment, the bonding terminal (aluminum post 17) of the wire 18 that connects the terminal portion 13 of the acceleration sensor 10 and the circuit pattern 15 is used as a raised component of the acceleration sensor 10. It is mounted and soldered on the substrate 19 so as to stand on the portions corresponding to the outer periphery (four corners) excluding the inertial portion 11.
Then, the acceleration sensor 10 is mounted on the aluminum post 17.

Next, the operation will be described. The acceleration sensor 10 mounted on the aluminum post 17 has an arrow J caused by a shock or the like.
When acceleration is applied in the direction, the inertial portion 11 moves in the direction opposite to the arrow J. Since the resistance value of the acceleration sensor 10 changes according to the movement amount of the inertial portion 11, the change amount of the resistance value is extracted and converted into acceleration.

As described above, according to the present embodiment, the aluminum post 17 is mounted for each purpose so that it can be used in two ways, that is, the terminal portion for wire bonding and the raised part of the acceleration sensor 10, and the aluminum post 17 as the raised part is mounted. Since the acceleration sensor 10 is mounted on the above, it is possible to use common parts without the need for a dedicated padding part. Therefore, the mounting cost of the acceleration sensor 10 can be reduced. Although the disk-shaped aluminum post 17 is used in this embodiment, other shapes such as a square shape may be used.

Next, a fourth embodiment of the present invention will be described with reference to FIG. 4A and 4B are views showing a mounting structure of an acceleration sensor showing a fourth embodiment of the present invention. FIG. 4A is a plan view and FIG.
It is a -D sectional view. The fourth embodiment is a modification of the aluminum post of the third embodiment and is otherwise substantially the same as the third embodiment. Therefore, the same components are designated by the same reference numerals and the description thereof will be omitted.

Reference numeral 25 denotes a raised component, which has a disk shape and is mounted and soldered on the circuit pattern 15 of the substrate 19, and the acceleration sensor 10 is mounted on the raised component 25. Then, the wire 1 is provided between the terminal portion 13 of the acceleration sensor 10 and the raised component 25 mounted on the circuit pattern 15.
Connect with 8. Next, the operation will be described.

When acceleration is applied to the acceleration sensor 10 mounted on the raised component 25 in the direction of arrow K due to a shock or the like, the inertial portion 11 moves in the direction opposite to arrow K. And
Since the resistance value of the acceleration sensor 10 changes depending on the movement amount of the inertial portion 11, the change amount of the resistance value is extracted and converted into acceleration. As described above, according to the present embodiment, the raising component 2 mounted as the raising component of the acceleration sensor 10.
Since the number of aluminum posts 17 can be reduced by also using 5 as a terminal portion for wire bonding, the mounting cost of the acceleration sensor 10 can be further reduced as compared with the third embodiment.

Next, an embodiment of the invention which does not require a raised component will be described. A fifth embodiment of the present invention will be described with reference to FIG. 5A and 5B are views showing a mounting structure of an acceleration sensor according to a fifth embodiment of the present invention, in which FIG. 5A is a plan view and FIG.
It is an E sectional view. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The acceleration sensor 10 is mounted such that the surface of the substrate 19 and the moving direction of the inertial portion 11 of the acceleration sensor 10 are parallel to each other. The side surface 35 of 10 is directly mounted. Others are substantially the same as those in the first embodiment.
The direction in which the acceleration is detected is changed by changing the mounting direction of the board to the chassis or the like.

Next, the operation will be described. When acceleration is applied to the acceleration sensor 10 mounted on the substrate 19 in the direction of the arrow L due to a shock or the like, the inertial portion 11 moves in the direction opposite to the arrow L. Then, the acceleration sensor 1 is determined by the movement amount of the inertial portion 11.
Since the resistance value of 0 changes, the change amount of the resistance value is extracted and converted into acceleration.

As described above, according to this embodiment, since the inertial portion 11 of the acceleration sensor 10 is mounted so that the moving direction thereof is parallel to the surface of the substrate 19, the acceleration sensor 1
Even if acceleration is applied to 0, the inertial portion 11 does not come into contact with the surface of the substrate 19. Therefore, the padding parts are not required, and the mounting cost of the acceleration sensor 10 can be reduced. In addition, the side surface portion 35 of the acceleration sensor 10 is attached to the substrate 1
Since it is mounted on the surface of 9, the mounting area can be reduced.

Next, a sixth embodiment of the present invention will be described with reference to FIG. 6A and 6B are views showing a mounting structure of an acceleration sensor showing a sixth embodiment of the present invention, wherein FIG. 6A is a plan view and FIG.
It is a -F sectional view. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. Reference numeral 30 denotes a substrate, and a concave portion 31 corresponding to the inertial portion 11 is formed in the mounting portion of the acceleration sensor 10 on the ceramic plate. On the surface of the substrate 30, a circuit pattern 15 of a conductor, a resistor and the like are formed by thick film printing, and electronic parts and the like are mounted.

The acceleration sensor 10 is mounted such that the surface of the substrate 19 and the inertial portion 11 of the acceleration sensor 10 are perpendicular to each other. The mounting portion of the acceleration sensor 10 corresponds to the inertial portion 11. Since the concave portion 31 is formed, the acceleration sensor 10 is directly mounted on the surface of the substrate 19 without the need for a raised component. Others are substantially the same as those in the first embodiment.

Next, the operation will be described. When acceleration is applied to the acceleration sensor 10 mounted on the substrate 30 in the direction of the arrow M due to a shock or the like, the inertial portion 11 moves in the direction opposite to the arrow M. Then, the acceleration sensor 1 is determined by the movement amount of the inertial portion 11.
Since the resistance value of 0 changes, the change amount of the resistance value is extracted and converted into acceleration.

As described above, according to the present embodiment, the concave portion 31 corresponding to the inertial portion 11 of the acceleration sensor 10 is provided in the substrate 30 so that the inertial portion 11 is on the surface of the substrate 30 even when acceleration is applied to the acceleration sensor 10. Will not come into contact with.
Therefore, the padding parts are not required, and the mounting cost of the acceleration sensor 10 can be reduced. In this embodiment, the substrate 30 is provided with the concave portion 31 corresponding to the inertial portion 11, but the concave portion 31 may be a through hole.

[0042]

As described above, according to the present invention, the acceleration sensor is mounted on the board, and the raised portion is formed by thick film printing in the board manufacturing process. In addition, since an aluminum post that serves as a terminal for wire bonding is mounted and mounted on the aluminum post, or on an aluminum post that also serves as a pad and a terminal, a dedicated padding component is not required. . Further, the inertial portion of the acceleration sensor is mounted on the side surface of the acceleration sensor so that the moving direction of the inertial portion is parallel to the surface of the substrate, and corresponds to the moving direction of the inertial portion of the acceleration sensor on the substrate. By forming the concave portion, it is possible to prevent the inertial portion from coming into contact with the substrate during movement. Therefore, it is possible to provide a mounting structure of an acceleration sensor that is inexpensive and has high reliability.

[Brief description of drawings]

1A and 1B are views showing a mounting structure of an acceleration sensor showing a first embodiment of the invention, FIG. 1A being a plan view and FIG. 1B being a sectional view taken along line AA.

2A and 2B are views showing a mounting structure of an acceleration sensor showing a second embodiment of the invention, FIG. 2A being a plan view and FIG. 2B being a sectional view taken along line BB.

3A and 3B are views showing a mounting structure of an acceleration sensor showing a third embodiment of the invention, FIG. 3A being a plan view and FIG. 3B being a sectional view taken along line CC.

4A and 4B are diagrams showing a mounting structure of an acceleration sensor showing a fourth embodiment of the invention, in which FIG. 4A is a plan view and FIG. 4B is a sectional view taken along line DD.

5A and 5B are views showing a mounting structure of an acceleration sensor showing a fifth embodiment of the invention, FIG. 5A being a plan view and FIG. 5B being a sectional view taken along line EE.

6A and 6B are views showing a mounting structure of an acceleration sensor showing a sixth embodiment of the invention, FIG. 6A being a plan view and FIG. 6B being a sectional view taken along line FF.

FIG. 7 is a diagram showing a mounting structure of a conventional acceleration sensor,
(A) is a plan view and (b) is a GG sectional view.

[Explanation of symbols]

 10 Acceleration sensor 11 Inertia 12 Slit 13 Connection terminal 14 Chip capacitor 15 Circuit pattern 17 ...・ ・ ・ Aluminum post 18 ・ ・ ・ Wires 19, 30 ・ ・ Substrate 20 ・ ・ ・ Raised part 25 ・ ・ ・ Raised parts 31 ・ ・ ・ Recess

Claims (6)

[Claims] 1. An acceleration sensor for detecting acceleration by moving an elastically supported inertial part is provided on the surface of the electronic circuit board so that the moving direction of the inertial part is perpendicular to the surface of the electronic circuit board. A mounting structure for an acceleration sensor to be mounted, wherein the acceleration sensor is mounted on an electronic component mounted on the electronic circuit board. 2. An acceleration sensor that detects acceleration by moving an elastically supported inertial part is provided on the surface of the electronic circuit board so that the direction of movement of the inertial part is perpendicular to the surface of the electronic circuit board. In a mounting structure of an acceleration sensor to be mounted, a raised portion of the acceleration sensor is formed on the surface of the electronic circuit board by thick film printing, and the acceleration sensor is mounted on the raised portion. The mounting structure of the acceleration sensor according to 1. 3. An acceleration sensor for detecting acceleration by moving an elastically supported inertial part is provided on the surface of the electronic circuit board so that the moving direction of the inertial part is perpendicular to the surface of the electronic circuit board. In the mounting structure of the acceleration sensor to be mounted, an aluminum post serving as a terminal portion of wire bonding is mounted on the electronic circuit board, and the acceleration sensor is mounted on the aluminum post. Construction. 4. The mounting structure for an acceleration sensor according to claim 3, wherein the aluminum post is also used as a terminal portion for wire bonding with a connection terminal of the acceleration sensor. 5. A mounting structure of an acceleration sensor in which an acceleration sensor for detecting acceleration by moving an elastically supported inertial portion is mounted on a surface of an electronic circuit board, wherein a movement direction of the surface of the electronic circuit board and the inertial portion is different from each other. A mounting structure for an acceleration sensor, which is mounted on an electronic circuit board so as to be parallel to a surface of the electronic circuit board. 6. A mounting structure of an acceleration sensor in which an acceleration sensor for detecting acceleration by moving an elastically supported inertial portion is mounted on a surface of an electronic circuit board, wherein a moving direction of the inertial portion of the acceleration sensor of the electronic circuit board is set. A mounting structure for an acceleration sensor, characterized in that a recess is provided in a portion corresponding to.