JPH0831792A - Processing system for board - Google Patents

Abstract

PURPOSE:To protect a board from bubbles contained in a processing solution. CONSTITUTION:In a board processing system, a board is dipped in a processing solution to peel and clean the board. The board processing system includes a main container 4a, a chemical peeling solution injection unit 7a and a cleaning chemical solution injection unit. In the main container 4a a processing solution like the chemical peeling solution is stored to dip the board (W) therein. The peeling solution injection unit 7a has a main injection unit 15a and an air ventilation tube 18a for discharging bubbles from the processing liquid in the main container 4a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a substrate processing apparatus, and more particularly to
The present invention relates to a substrate processing apparatus that dips a substrate in a processing liquid for processing.

[0002]

2. Description of the Related Art In the manufacturing process of semiconductors and liquid crystal display devices,
Substrate processing steps using a processing liquid such as etching, photoresist stripping after etching, and substrate washing after stripping are essential. A substrate processing apparatus used in this type of process includes a processing bath in which a processing liquid is stored and a substrate is housed so that the substrate is immersed in the stored processing liquid. A treatment liquid supply port is provided at the bottom of the treatment tank,
A rectifying plate having a large number of small holes is provided between the processing liquid supply port and the immersed substrate.

In this type of substrate processing apparatus, air bubbles may flow out from the processing liquid supply port together with the processing liquid, and may come into contact with the substrate via the holes of the current plate. A substrate processing apparatus for preventing this is disclosed in Japanese Patent Application Laid-Open No. 5-25420. This apparatus is provided with a processing tank having a cleaning liquid supply port provided in the lower portion thereof, and a rectifying means provided between the cleaning liquid supply port and the substrate and having a cleaning liquid guiding channel and a bubble removing channel. . The air bubble removal channel is formed on both sides of the processing tank.

In this substrate processing apparatus, the cleaning liquid supplied from the cleaning liquid supply port into the processing bath is rectified by passing through the cleaning liquid guiding passage and supplied to the surface of the substrate. Further, the bubbles contained in the cleaning liquid pass through the bubble removing channel and are guided to the position where the substrate does not exist.

[0005]

SUMMARY OF THE INVENTION In the above conventional configuration,
Bubbles are difficult to contact the substrate because the air bubble removal channels are arranged on both sides of the treatment tank.However, bubbles are generated in the treatment tank, and depending on the flow formed, the bubbles circulate and contact the substrate. I have something to do. An object of the present invention is to prevent contact of bubbles contained in the supplied processing liquid with the substrate.

Another object of the present invention is to improve the processing efficiency with a simple structure.

[0007]

A substrate processing apparatus according to the present invention is an apparatus for processing a substrate by immersing the substrate in a processing liquid.
A processing tank and a processing liquid supply unit are provided. The processing bath stores the processing liquid and stores the substrate so that the substrate is immersed in the stored processing liquid. The processing liquid supply unit has a main body for supplying the processing liquid into the processing tank, and an end portion for discharging bubbles to the outside of the processing liquid stored in the processing tank.

It is preferable that the tip of the end of the treatment liquid supply section is provided at the same position as the treatment liquid surface stored in the treatment tank or at a position higher than the treatment liquid surface. Also,
It is preferable that the end portion of the treatment liquid supply portion projects outside the treatment tank. Further, it is preferable that the end portion is connected to an overflow tank arranged along the outer wall of the processing tank.

In addition, it is preferable that a pair of treatment liquid supply sections be provided with the substrates arranged such that their principal surfaces face each other in the treatment tank, with the substrates sandwiched therebetween. Further, the end portions of the processing liquid supply portions provided as a pair may be connected to one.

[0010]

In the substrate processing apparatus according to the present invention, when the substrate is immersed in the processing bath, the processing liquid is supplied from the processing liquid supply unit into the processing bath. At this time, the bubbles contained in the treatment liquid supply unit are discharged from the end portion to the outside of the treatment liquid. Here, since the bubbles are not discharged into the processing liquid, it is possible to prevent the bubbles from coming into contact with the substrate in the processing bath.

When the tip of the end of the treatment liquid supply unit is provided at the same position as the treatment liquid surface stored in the treatment tank or at a position higher than the treatment liquid surface, it communicates with the treatment tank. The liquid level of the processing liquid that has flowed into the end of the processing liquid supply unit is equal to or lower than the tip of the end. Here, since the tip of the end is located at the same position as or higher than the surface of the treatment liquid, the treatment liquid does not easily flow out from the tip.

Further, when the end portion of the processing liquid supply unit projects outside the processing tank, the bubbles generated in the processing liquid supply unit are discharged from the end portion protruding outside the processing tank. Here, since the bubbles are discharged to the outside of the processing tank, it is possible to reliably prevent the bubbles from being discharged into the processing liquid. Further, when the end portion is connected to the overflow tank arranged along the outer wall of the treatment tank, even if the treatment liquid flows out together with the bubbles from the end portion, the treatment liquid is recovered in the overflow tank. Here, even if the processing liquid flows out from the end portion, it is collected in the overflow tank, so that the device is unlikely to be contaminated.

Further, when a pair of the processing liquid supply units is provided in the processing bath with the substrates arranged so that their main surfaces face each other, the processing liquid supply units are provided from both sides of the substrate. The processing liquid is supplied toward the substrate. Here, since the processing liquid supply unit supplies the processing liquid toward the substrate from both sides of the substrate, the substrate can be efficiently processed. Further, when the pair of processing liquid supply portions are connected at one end, the bubbles and the processing liquid discharged from the end of the processing liquid supply portion are discharged from one place. . Here, the bubbles and the processing liquid discharged from the end of the processing liquid supply unit are discharged from one place, so that they can be easily collected.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, a substrate processing apparatus according to an embodiment of the present invention is an apparatus for removing a photoresist from an etched substrate and cleaning the photoresist after the removal. This substrate processing apparatus is provided with a peeling tank 1 for peeling a square substrate W after etching in a cassette C and two cleaning tanks 2 for cleaning the substrate W after the peeling treatment. These tanks 1 and 2 are arranged in a line. Further, the substrate processing apparatus includes a cassette carrying section 3 that carries the cassette C between the tanks 1 and 2.

As shown in FIG. 2, the stripping tank 1 is composed of, for example, a stainless steel tank body 4a, an overflow tank 5a arranged around the tank body 4a, and a bottom portion of the tank body 4a, which are arranged in parallel with each other. It has a pair of stripping liquid discharge parts 7a. As shown in FIGS. 3 and 4, the stripping liquid ejecting section 7a includes an ejecting section main body 15a that is long in the juxtaposed direction of the substrates W and a large number of nozzles 16 juxtaposed in the longitudinal direction of the ejecting section main body 15a.
a and. The nozzle 16a is formed obliquely upward toward the substrate W so that bubbles do not come out. An air vent hole 17a is formed at the tip of the discharge portion main body 15a. The air vent hole 17a is formed upward so that air bubbles can exit at the tip. Air vent hole 17
An air vent pipe 18a connected to the overflow tank 5a is provided in a. As shown in FIG. 2, the air vent pipe 18a has another air vent hole (not shown) on the way.
It joins with the air vent pipe connected to and extends through the bottom of the overflow tank 5a to the same position as the liquid level of the stripping liquid stored in the stripping tank 1 or to a position higher than the liquid level of the stripping liquid. As a result, the air vent hole 1 is discharged from the discharge unit main body 15a.
Even if the stripping liquid flows into the air vent pipe 18a via 7a, it does not overflow from the tip.

As shown in FIG. 2, a stripping solution supply pipe 10a is connected to the stripping solution discharger 7a. In addition, the stripping liquid return pipe 11a is provided on the bottom surface of the overflow tank 5a.
Is connected. A pump 12a is arranged between the stripping liquid return pipe 11a and the stripping liquid supply pipe 10a. In addition, a filter 13a is provided in the stripping liquid return pipe 11a.
Is disposed, and a drain valve 14a is disposed between the filter 13a and the pump 12a.

As shown in FIG. 5, the washing tank 2 includes a tank body 4b made of polyvinyl chloride (PVC) and a tank body 4b, for example.
Has a pair of cleaning liquid ejecting portions 7b arranged in parallel to each other at the bottom of the. A cleaning liquid supply pipe 10b for supplying pure water as a cleaning liquid is connected to the cleaning liquid discharger 7b. The cleaning liquid discharger 7b is the discharger main body 15b.
And a large number of nozzles 16b, and has the same configuration as the above-described stripping liquid discharger 7a. An air vent hole 17b is provided at the tip of the discharge unit body 15b. An air vent pipe 18b that discharges upward is connected to the air vent hole 17b. The tip of the air vent pipe 18b projects above the liquid surface of the tank body 4b. As a result, even if the cleaning liquid flows from the discharge portion main body 15b through the air vent hole 17b into the air vent pipe 18b, it does not overflow from the tip thereof.

As shown in FIG. 1, the cassette carrying robot 3 includes two arms 20 that project horizontally and an arm 20.
Pair of cassette holders 21 arranged at the tips of the
And have. A base end of the arm 20 is attached to the upper and lower frames 22. The upper and lower frames 22 are tank 1,
It is supported by a horizontal frame 23 that moves in two juxtaposed directions so as to be vertically movable. The horizontal frame 23 is supported by the main body frame 24 so as to be horizontally movable. The cassette holding portion 21 can hold the cassette C at its tip.

Next, the operation of the above-mentioned embodiment will be described. When the cassette C is sent from the etching apparatus (not shown) to the substrate processing apparatus, the cassette carrying unit 3 receives it and immerses it in the peeling tank 1. When the substrate W housed in the cassette C is immersed in the stripping tank 1, the pump 12a is driven to supply the stripping liquid from the stripping liquid supply pipe 10a to the stripping liquid discharger 7a. The stripping liquid supplied to the stripping liquid ejecting portion 7a flows obliquely upward from the nozzle 16a toward the space between the substrates W arranged in parallel. Further, the air mixed in the discharge part main body 15b is discharged from the air vent hole 17a to the air vent pipe 18a.
Through the overflow tank 5a. As a result, bubbles are less likely to be generated from the nozzle 16a, and the bubbles are less likely to contact the substrate W.

The supplied stripping solution overflows from the tank body 4a, and overflow tank 5a and filter 13a.
Flow through the circulation path including. In this stripping tank 1, for example, the stripping solution is adjusted to an appropriate temperature between 75 ° C. and 110 ° C., and the processing time is adjusted to an appropriate time between 2 and 50 minutes to perform the stripping process. As a result, the photoresist remaining on the substrate W can be removed. The circulating flow rate of the pump at this time is, for example, 40 liters / minute.

When the peeling process is completed, the cassette carrying section 3
The cassette C is conveyed to the washing tank 2. In the washing tank 2, the washing process is performed for 10 minutes. At this time, pure water is supplied from the pump (not shown) to the discharge unit main body 15b through the cleaning liquid supply pipe 10b, and jetted from the nozzle 16b. Here, the supplied pure water overflows from the tank body 4b and is discarded. At this time, similarly, the bubbles contained in the pure water are discharged from the air holes 17b through the air vent pipe 18b. Therefore, bubbles are less likely to be generated from the nozzle 16b. The flow rate of water here is, for example, 20 liters / minute.

Subsequently, the cassette C is carried by the cassette carrying robot 3 to the next washing tank 2. In this case as well, the same washing process as in the washing tank 2 is performed. The supply amount at this time is, for example, 20 liters / minute. When the two water washing steps are completed, the substrate is transferred to the next drying processing step. Other Embodiments (a) The present invention can be applied to a circular substrate processing apparatus such as a semiconductor wafer instead of the rectangular substrate processing apparatus. (B) The present invention can be applied to other immersion type substrate processing apparatuses such as an etching apparatus instead of the peeling apparatus. (C) Instead of providing a pair of discharge unit main bodies 15a and 15b, the discharge unit main bodies 15a and 15b may be arranged in a U shape in a tank, for example. In this case, an air hole may be provided at one end and the treatment liquid may be supplied at the other end. (D) The discharge unit main body 15 without the air vent pipe 18b
You may make it provide the air vent hole 17b in the front-end | tip of b. In this case, since the cleaning liquid flows out from the air vent hole 18b, a valve may be provided to periodically release the cleaning liquid.

[0023]

In the substrate processing apparatus according to the present invention, since the bubbles are not discharged into the processing liquid, it is possible to prevent the bubbles from coming into contact with the substrate in the processing bath. When the tip of the end of the treatment liquid supply unit is provided at the same position as the treatment liquid surface stored in the treatment tank or at a position higher than the treatment liquid surface, the tip of the end is treated. Since it is located at the same or higher position as the liquid surface,
Processing liquid does not easily flow out from the tip.

Further, when the end portion of the processing liquid supply portion projects outside the processing tank, the bubbles are discharged to the outside of the processing tank. Therefore, it is possible to reliably prevent the bubbles from being discharged into the processing liquid. Also, when the end is connected to the overflow tank arranged along the outer wall of the processing tank, even if the processing liquid flows out along with the bubbles from the end, the processing liquid is collected in the overflow tank, thus contaminating the device. Hateful.

Further, when a pair of treatment liquid supply units is provided in the treatment tank with the substrates arranged so that their main surfaces face each other, the treatment liquid supply units are provided from both sides of the substrate. Since the processing liquid is supplied toward the substrate, the substrate can be processed efficiently. Further, when the pair of processing liquid supply portions are connected at one end, the bubbles and the processing liquid discharged from the end of the processing liquid supply portion are discharged from one place. Therefore, it is easy to collect them.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic sectional view of a peeling tank.

FIG. 3 is a sectional view taken along the line III-III in FIG. 2;

FIG. 4 is a partial sectional view taken along the line IV-IV in FIG.

FIG. 5 is a view corresponding to FIG. 3 of the washing tank.

[Explanation of symbols]

 1 stripping tank 2 water washing tank 7a stripping liquid discharge part 7b cleaning liquid discharge part 17a, 17b air vent holes 18a, 18b air vent pipe

Front Page Continuation (72) Inventor Kazunori Fujikawa 2426-1 Kuchinogawara, Mikami, Yasu-machi, Yasu-gun, Shiga Prefecture Dainippon Screen Mfg. Co., Ltd.

Claims (6)

[Claims] 1. A substrate processing apparatus for immersing a substrate in a processing liquid for processing, wherein the processing liquid is stored, and the substrate is housed so that the substrate is immersed in the stored processing liquid. A substrate processing apparatus comprising: a processing bath; a main body for supplying a processing liquid into the processing bath; and a processing liquid supply unit having an end portion for discharging bubbles to the outside of the processing liquid stored in the processing bath. 2. The tip of the end of the treatment liquid supply unit is provided at the same position as the treatment liquid surface stored in the treatment tank or at a position higher than the treatment liquid surface. The substrate processing apparatus according to. 3. The substrate processing apparatus according to claim 1, wherein an end of the processing liquid supply unit projects outside the processing bath. 4. The substrate processing apparatus according to claim 3, wherein the end portion is connected to an overflow tank arranged along an outer wall of the processing tank. 5. The processing liquid supply section is provided as a pair with the substrates arranged such that their main surfaces face each other in the processing tank, with one pair sandwiched therebetween. Substrate processing equipment. 6. The substrate processing apparatus according to claim 5, wherein the pair of processing liquid supply units are connected at one end.