JPH08307043A - Flip chip bonding device - Google Patents
Flip chip bonding deviceInfo
- Publication number
- JPH08307043A JPH08307043A JP7111535A JP11153595A JPH08307043A JP H08307043 A JPH08307043 A JP H08307043A JP 7111535 A JP7111535 A JP 7111535A JP 11153595 A JP11153595 A JP 11153595A JP H08307043 A JPH08307043 A JP H08307043A
- Authority
- JP
- Japan
- Prior art keywords
- bumps
- protective film
- bump
- hole
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
- H01L2224/13018—Shape in side view comprising protrusions or indentations
- H01L2224/13019—Shape in side view comprising protrusions or indentations at the bonding interface of the bump connector, i.e. on the surface of the bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8134—Bonding interfaces of the bump connector
- H01L2224/81345—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81399—Material
- H01L2224/81498—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/81499—Material of the matrix
- H01L2224/8159—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81399—Material
- H01L2224/81498—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/81598—Fillers
- H01L2224/81599—Base material
- H01L2224/816—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/8185—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
- H01L2224/81898—Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はバンプを有するベアチッ
プをフレキシブル回路基板上に直接ボンディングするフ
リップチップ接合装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip bonding apparatus for directly bonding a bare chip having bumps onto a flexible circuit board.
【０００２】[0002]
【従来の技術】従来、この種の装置の例として特開平５
−７５２２７号公報に開示された発明が知られている。
同公報記載の装置は図１２に示すようにフレキシブル回
路基板５０の保護フィルム４１及び接合ランド４２に穴
４３を形成させ、その穴４３周縁部にメッキにより接触
用電極４４を形成させて、その接触用電極４４に対して
バンプ４５を当接させるとともにベアチップ４６に押圧
力を加えて、バンプ４５と接触用電極４４とを接合させ
るように構成したものである。2. Description of the Related Art Conventionally, as an example of this type of apparatus, Japanese Patent Laid-Open No.
The invention disclosed in Japanese Patent Publication No. -75227 is known.
As shown in FIG. 12, the device described in the publication has a hole 43 formed in the protective film 41 and the bonding land 42 of the flexible circuit board 50, and a contact electrode 44 is formed on the peripheral portion of the hole 43 by plating, and the contact is made. The bump 45 is brought into contact with the working electrode 44 and a pressing force is applied to the bare chip 46 to bond the bump 45 and the contact electrode 44.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記従
来の装置は保護フィルム４１に形成した穴４３の周縁部
に接触電極４４を形成していることにより、ボンディン
グ時のバンプ４５に対する位置決めが容易になり、かつ
ランド４２との接合が確実になる点は優れているが、フ
レキシブル回路基板５０の接触電極４４上にバンプ４５
を載置するのみの構造であるため、バンプ４５と接触電
極４４を常に接合させるためにはベアチップ４６に押圧
力をかけ続けなければならないという問題がある。However, in the conventional device, the contact electrode 44 is formed on the peripheral portion of the hole 43 formed in the protective film 41, which facilitates the positioning with respect to the bump 45 during bonding. Although it is excellent in that the bonding with the land 42 is reliable, the bump 45 is formed on the contact electrode 44 of the flexible circuit board 50.
Since it is a structure only for mounting the bumps, there is a problem that the pressing force must be continuously applied to the bare chip 46 in order to always bond the bump 45 and the contact electrode 44.
【０００４】よって本発明は前記問題点に鑑みてなされ
たものであり、ベアチップに押圧力をかけ続けなくても
バンプと接合ランドとの接合を保つことができるフリッ
プチップ接合装置の提供を目的とする。Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a flip chip bonding apparatus capable of maintaining bonding between bumps and bonding lands without continuously pressing a bare chip. To do.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、ベアチップに形成したバンプとフレキシ
ブル回路基板に設けられた接合ランドとを導電性接着剤
を用いて接合するフリップチップ接合装置において、先
端部を山形に尖らせた円柱状のバンプと、回路基板上に
形成するとともに前記バンプの位置に対応して設けられ
た接合ランド面に前記バンプ径より大きい径の穴を設け
た保護フィルムと、前記保護フィルムの穴内に施して前
記接合ランドと前記バンプとを接合する導電性接着剤
と、前記保護フィルム及び前記導電性接着剤上に形成す
るとともに前記保護フィルムの穴と同芯状にかつ前記バ
ンプ径より小さい径の穴を設けた弾性体からなる保護フ
ィルムとから成ることを特徴とする。また、前記円柱状
バンプにおいてその先端部を傘状に形成し、あるいは前
記バンプ径より小さい穴を設けた保護フィルムの穴の周
縁部に切欠を設けたことを特徴とする。In order to achieve the above object, the present invention provides a flip chip bonding apparatus for bonding a bump formed on a bare chip and a bonding land provided on a flexible circuit board using a conductive adhesive. In, a protection is provided by forming a cylindrical bump whose tip is pointed in a mountain shape, and a bonding land surface which is formed on a circuit board and is provided corresponding to the position of the bump, with a hole having a diameter larger than the bump diameter. A film, a conductive adhesive that is applied in the hole of the protective film to bond the bonding land and the bump, and is formed on the protective film and the conductive adhesive and is concentric with the hole of the protective film. And a protective film made of an elastic body having a hole having a diameter smaller than the bump diameter. Further, the columnar bump is characterized in that its tip portion is formed in an umbrella shape, or a notch is provided in a peripheral portion of a hole of a protective film having a hole smaller than the bump diameter.
【０００６】[0006]
【作用】本発明によれば、請求項１に係る作用として、
フレキシブル回路基板の最上層部の弾性体からなる保護
フィルムに形成した穴がバンプ径より小さく形成してい
るが、円柱状に形成したバンプの先端が山形に尖ってい
るので穴径を押し拡げて挿入することができるととも
に、押し拡げられた保護フィルムがバンプが押さえつけ
る力が発生するので、この押さえつけ力によりバンプと
接合ランドとの接合力が安定する。According to the present invention, as the operation according to claim 1,
The hole formed in the protective film made of elastic material on the uppermost layer of the flexible circuit board is formed smaller than the bump diameter, but the tip of the cylindrical bump has a chevron shape, so expand the hole diameter. Since the protective film that has been inserted can be inserted and a force that the bumps press down is generated, the pressing force stabilizes the bonding force between the bumps and the bonding lands.
【０００７】請求項２に係る作用として、円柱状バンプ
の先端が傘状に形成しているので、フレキシブル回路基
板の最上層部の弾性体からなる保護フィルムに形成した
穴にバンプを挿入した際に、傘状に広がった径部が保護
フィルムの裏面に掛止されるので穴から抜けにくくな
り、何らかの理由でバンプに抜ける方向の力が作用して
も接合力は前記請求項１の場合に比べてさらに安定す
る。その他の作用は前記請求項１と同様な作用が得られ
る。According to the second aspect of the present invention, since the tip end of the cylindrical bump is formed in an umbrella shape, when the bump is inserted into the hole formed in the protective film made of the elastic body of the uppermost layer of the flexible circuit board. In addition, since the diameter portion that spreads like an umbrella is hooked on the back surface of the protective film, it becomes difficult to pull out from the hole, and even if a force in the direction of pulling out to the bump acts on the bump for some reason, the joining force is the same as in the case of claim 1. More stable than in comparison. The other actions are similar to those of the first aspect.
【０００８】請求項３に係る作用として、請求項１また
は２の場合におけるフレキシブル回路基板の最上層部の
弾性体からなる保護フィルムに形成した穴の周縁部に切
欠を設けているので、先端が尖った形状または傘状形状
の円柱状バンプを穴に挿入する際に、バンプ径にて穴径
を押し拡げることが容易になる他、前記請求項１または
２と同様な作用が得られる。According to the third aspect of the present invention, since the notch is provided in the peripheral portion of the hole formed in the protective film made of the elastic body of the uppermost layer of the flexible circuit board in the case of the first or second aspect, the tip is When inserting a cylindrical bump having a sharp shape or an umbrella shape into the hole, it becomes easy to expand the hole diameter by the bump diameter, and the same effect as in claim 1 or 2 can be obtained.
【０００９】[0009]
【実施例】以下、本発明の実施例を図面とともに具体的
に説明する。なお各実施例において共通の要旨は共通の
符号を付して対応させることにより重複する説明を省略
する。Embodiments of the present invention will be specifically described below with reference to the drawings. In each of the embodiments, common points will be denoted by common reference numerals and corresponding description will be omitted.
【００１０】[0010]
【実施例１】図１及び図２は本発明の実施例１を示し、
図１はフリップチップ接合装置の断面図、図２はベアチ
ップと接続ランドとを接合した状態を示す断面図であ
る。Embodiment 1 FIGS. 1 and 2 show Embodiment 1 of the present invention,
FIG. 1 is a sectional view of a flip chip bonding apparatus, and FIG. 2 is a sectional view showing a state in which a bare chip and a connection land are bonded.
【００１１】図１に示すように、バンプ８ａはベアチッ
プ７の面に突設し、材質Ａｕにて直径３０〜５０μｍの
円柱状に形成し、その先端を山形に尖らせている。ま
た、バンプ８ａに対向して配設されたフレキシブル回路
基板９の面には、バンプ８ａに対応する位置に材質Ｃｕ
にて幅約１００μｍの接合ランド１０を面位置に埋設
し、接合ランド１０の位置に対応して直径約１００μｍ
の穴１１を形成したポリイミド製の保護フィルム１２を
フレキシブル回路基板９の面に貼設している。さらにそ
の穴１１内には導電性接着剤１３を充填している。As shown in FIG. 1, the bump 8a is projected on the surface of the bare chip 7 and is formed of a material of Au into a cylindrical shape having a diameter of 30 to 50 μm, and the tip thereof is pointed in a chevron shape. Further, on the surface of the flexible circuit board 9 arranged so as to face the bumps 8a, the material Cu is provided at a position corresponding to the bumps 8a.
And a bonding land 10 having a width of about 100 μm is embedded in the surface position, and a diameter of about 100 μm is provided corresponding to the position of the bonding land 10.
A protective film 12 made of polyimide and having holes 11 is attached to the surface of the flexible circuit board 9. Further, the hole 11 is filled with a conductive adhesive 13.
【００１２】前記の保護フィルム１２の面に対して、保
護フィルム１２と同芯状に２０〜３０μｍの穴１４を形
成したポリイミド製の保護フィルム１５を貼設してい
る。なお前記両者の保護フィルム１２，１５の厚さは１
２．５〜２５μｍである。On the surface of the protective film 12, a protective film 15 made of polyimide having a hole 14 of 20 to 30 μm formed concentrically with the protective film 12 is attached. The thickness of the protective films 12 and 15 of the both is 1
It is 2.5 to 25 μm.
【００１３】この構成のフリップチップ接合装置の作用
としては、保護フィルム１５が弾性体から成っているの
で穴１４がバンプ８ａの径より小さくても、図２に示す
ように、先端を尖らせたバンプ８ａにて穴１４を押し拡
げつつ挿入することが可能であるとともに、押し拡げた
穴の弾性力によりバンプ８ａを側面から押さえつけるこ
とができる。これによりベアチップ７を常時押さえつけ
ていなくてもバンプ８ａと接合ランド１０との接合状態
を常に安定に保たせることができる。As the function of the flip chip bonding apparatus having this structure, since the protective film 15 is made of an elastic body, even if the hole 14 is smaller than the diameter of the bump 8a, the tip is sharpened as shown in FIG. The hole 8 can be inserted while being expanded by the bump 8a, and the bump 8a can be pressed from the side surface by the elastic force of the expanded hole. As a result, the bonding state between the bumps 8a and the bonding lands 10 can always be kept stable even if the bare chip 7 is not constantly pressed.
【００１４】本実施例によれば、バンプ８ａを保護フィ
ルム１５の穴内に容易に挿入することができ、しかもバ
ンプと接合ランドとの接合が安定する。さらに構造が簡
単なので製造コストを低減させることができる。According to this embodiment, the bump 8a can be easily inserted into the hole of the protective film 15, and the bonding between the bump and the bonding land is stable. Further, since the structure is simple, the manufacturing cost can be reduced.
【００１５】[0015]
【実施例２】図３から図１０は本発明の実施例２を示
し、図３はフリップチップ接合装置の断面図、図４から
図１０はバンプの形成方法を示す図である。本実施例で
は前記実施例１におけるバンプ８ａの先端を傘状に形成
し、その傘状を材質Ａｕを用いたメッキ法により形成し
たことを異にするものであり、その他の構成は前記実施
例１と同様である。Second Embodiment FIGS. 3 to 10 show a second embodiment of the present invention, FIG. 3 is a sectional view of a flip chip bonding apparatus, and FIGS. 4 to 10 are views showing a bump forming method. The present embodiment is different from the first embodiment in that the tip of the bump 8a is formed in an umbrella shape and the umbrella shape is formed by a plating method using a material Au, and other configurations are the same as those in the embodiment. The same as 1.
【００１６】バンプ８ｂを傘状に形成する方法は、図４
に示すようにベアチップ７の面に対して、その面に形成
したパッド１９以外の部分に厚さ２０〜３０μｍのフォ
トレジスト膜１７を形成させる。次に図５に示すように
パッド１９の面に材質Ａｕのメッキ１８を施す。次に図
６に示すようにフォトレジスト膜１７を除去する。次に
図７に示すようにメッキ１８の周縁に厚さ１〜２μｍの
薄いフォトレジスト膜２０を形成させる。この時のレジ
スト開口部２１はメッキ１８の直径より数μｍ小さく形
成させる。次に図８に示すように開口部２１にメッキ２
２を施す。次に図９に示すようにフォトレジスト膜２０
を除去して図９に示す形状を得る。以下レジスト開口部
２１の径を徐々に小さくして図７から図９を繰り返すこ
とにより図１０に示すような傘状のバンプ８ｂを得るこ
とができる。A method for forming the bumps 8b in an umbrella shape is shown in FIG.
As shown in FIG. 6, a photoresist film 17 having a thickness of 20 to 30 μm is formed on the surface of the bare chip 7 except the pad 19 formed on the surface. Next, as shown in FIG. 5, the surface of the pad 19 is plated with the material Au. Next, as shown in FIG. 6, the photoresist film 17 is removed. Next, as shown in FIG. 7, a thin photoresist film 20 having a thickness of 1 to 2 μm is formed on the periphery of the plating 18. At this time, the resist opening 21 is formed to be smaller than the diameter of the plating 18 by several μm. Next, as shown in FIG.
Apply 2. Next, as shown in FIG.
Are removed to obtain the shape shown in FIG. Thereafter, the diameter of the resist opening portion 21 is gradually reduced and FIGS. 7 to 9 are repeated to obtain an umbrella-shaped bump 8b as shown in FIG.
【００１７】この構成のフリップチップ接合装置の作用
としては、傘状を形成したバンプ８ｂを保護フィルム１
５内の挿入した場合に、傘状に拡大された径の部分が図
３に示すように保護フィルム１５の裏面に掛止されるた
め、何らかの理由でバンプ８ｂに穴１４から抜ける方向
の力が作用しても傘部が抜け止めとなって接合強度が増
し、容易に抜けなくなる。その外は前記実施例１と同様
な作用効果を得ることができる。The function of the flip-chip bonding apparatus having this structure is that the bumps 8b having an umbrella shape are formed on the protective film 1.
In the case of insertion in 5, the portion having an umbrella-like enlarged diameter is hooked on the back surface of the protective film 15 as shown in FIG. Even if it works, the umbrella portion prevents the cap from coming off and the joint strength increases, so that the cap does not come off easily. Other than that, it is possible to obtain the same effect as that of the first embodiment.
【００１８】[0018]
【実施例３】図１１は本発明の実施例３を示すフリップ
チップ接合装置の斜視図である。本実施例では、フレキ
シブル回路基板９の最上層部に形成したポリイミド製保
護フィルム１５に形成した穴１４の周縁部に４箇所の切
欠１６を施したことを前記実施例２と異にするものであ
り、その他の構成は前記実施例２と同様である。Third Embodiment FIG. 11 is a perspective view of a flip chip bonding apparatus showing a third embodiment of the present invention. This embodiment is different from Embodiment 2 in that four notches 16 are formed in the peripheral portion of the hole 14 formed in the protective film 15 made of polyimide formed in the uppermost layer portion of the flexible circuit board 9. The other configurations are the same as those in the second embodiment.
【００１９】この構成のフリップチップ接合装置の作用
としては、穴１４の周縁部に４箇所の切欠１６を施した
ことにより前記実施例１及び２における尖った形状また
は傘状に形成したバンプ８ｂの挿入が実施例１及び２の
場合に比べて容易になる、即ち、接合作業が容易になる
他、前記実施例１及び２と同様な作用効果が得られる。The function of the flip-chip bonding apparatus having this structure is that the bumps 8b formed in the pointed shape or the umbrella shape in the first and second embodiments by forming the four notches 16 in the peripheral portion of the hole 14 are used. The insertion is easier than in the case of the first and second embodiments, that is, the joining work is easy, and the same effects as those of the first and second embodiments are obtained.
【００２０】[0020]
【発明の効果】本発明によれば、ベアチップに押圧力を
かけ続けなくてもバンプとフレキシブル回路基板の接合
ランドとの接合を保つことができる。According to the present invention, the bonding between the bump and the bonding land of the flexible circuit board can be maintained without continuously pressing the bare chip.
【図１】本発明の実施例１を示すフリップチップ接合装
置の断面図。FIG. 1 is a sectional view of a flip chip bonding apparatus showing a first embodiment of the present invention.
【図２】ベアチップと接続ランドとを接合した状態を示
す断面図。FIG. 2 is a cross-sectional view showing a state in which a bare chip and a connection land are joined together.
【図３】本発明の実施例２を示すフリップチップ接合装
置の断面図。FIG. 3 is a cross-sectional view of a flip chip bonding apparatus showing a second embodiment of the present invention.
【図４】バンプの形成方法を示す図。FIG. 4 is a diagram showing a method of forming bumps.
【図５】バンプの形成方法を示す図。FIG. 5 is a diagram showing a method of forming bumps.
【図６】バンプの形成方法を示す図。FIG. 6 is a diagram showing a method of forming bumps.
【図７】バンプの形成方法を示す図。FIG. 7 is a diagram showing a method of forming bumps.
【図８】バンプの形成方法を示す図。FIG. 8 is a diagram showing a method of forming bumps.
【図９】バンプの形成方法を示す図。FIG. 9 is a diagram showing a method of forming bumps.
【図１０】バンプの形成方法を示す図。FIG. 10 is a diagram showing a method for forming bumps.
【図１１】本発明の実施例３を示すフリップチップ接合
装置の断面図。FIG. 11 is a cross-sectional view of a flip chip bonding apparatus showing a third embodiment of the present invention.
【図１２】従来のフリップチップ接合装置の説明図。FIG. 12 is an explanatory diagram of a conventional flip chip bonding apparatus.
７ ベアチップ ８ バンプ ９ フレキシブル回路基板 １０ 接続ランド １１，１４ 穴 １２，１５ 保護フィルム １３ 導電性接着剤 １６ 切欠 7 Bare Chip 8 Bump 9 Flexible Circuit Board 10 Connection Land 11, 14 Hole 12, 15 Protective Film 13 Conductive Adhesive 16 Notch
Claims (3)
ブル回路基板に設けられた接合ランドとを導電性接着剤
を用いて接合するフリップチップ接合装置において、先
端部を山形に尖らせた円柱状のバンプと、回路基板上に
形成するとともに前記バンプの位置に対応して設けられ
た接合ランド面に前記バンプ径より大きい径の穴を設け
た保護フィルムと、前記保護フィルムの穴内に施して前
記接合ランドと前記バンプとを接合する導電性接着剤
と、前記保護フィルム及び前記導電性接着剤上に形成す
るとともに前記保護フィルムの穴と同芯状にかつ前記バ
ンプ径より小さい径の穴を設けた弾性体からなる保護フ
ィルムとから成ることを特徴とするフリップチップ接合
装置。1. A flip chip bonding apparatus for bonding a bump formed on a bare chip and a bonding land provided on a flexible circuit board by using a conductive adhesive, and a cylindrical bump whose tip is pointed in a chevron shape. A protective film formed on a circuit board and provided with a hole having a diameter larger than the bump diameter on a bonding land surface provided corresponding to the position of the bump, and the bonding land provided in the hole of the protective film. An electrically conductive adhesive for joining the bumps, and an elastic body formed on the protective film and the electrically conductive adhesive and having a hole concentric with the hole of the protective film and having a diameter smaller than the bump diameter. A flip-chip bonding apparatus comprising a protective film made of.
したことを特徴とする請求項１記載のフリップチップ接
合装置。2. The flip chip bonding apparatus according to claim 1, wherein the tip end portion of the cylindrical bump is formed in an umbrella shape.
保護フィルムの穴の周縁部に切欠を設けたことを特徴と
する請求項１または２記載のフリップチップ接合装置。3. The flip chip bonding apparatus according to claim 1, wherein a notch is provided in a peripheral portion of the hole of the protective film provided with a hole having a diameter smaller than the bump diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7111535A JPH08307043A (en) | 1995-05-10 | 1995-05-10 | Flip chip bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7111535A JPH08307043A (en) | 1995-05-10 | 1995-05-10 | Flip chip bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08307043A true JPH08307043A (en) | 1996-11-22 |
Family
ID=14563820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7111535A Withdrawn JPH08307043A (en) | 1995-05-10 | 1995-05-10 | Flip chip bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08307043A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009105209A (en) * | 2007-10-23 | 2009-05-14 | Nec Corp | Electronic device and method of manufacturing the same |
| WO2010030474A1 (en) * | 2008-09-11 | 2010-03-18 | Micron Technology, Inc. | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias |
| JP2010206038A (en) * | 2009-03-05 | 2010-09-16 | Fujitsu Ltd | Mounting structure of electronic component, and manufacturing method of substrate for mounting electronic component |
| EP2261965A1 (en) * | 2009-06-12 | 2010-12-15 | Nxp B.V. | Crimp bump interconnection |
-
1995
- 1995-05-10 JP JP7111535A patent/JPH08307043A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009105209A (en) * | 2007-10-23 | 2009-05-14 | Nec Corp | Electronic device and method of manufacturing the same |
| WO2010030474A1 (en) * | 2008-09-11 | 2010-03-18 | Micron Technology, Inc. | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias |
| US7872332B2 (en) | 2008-09-11 | 2011-01-18 | Micron Technology, Inc. | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods |
| CN102187458A (en) * | 2008-09-11 | 2011-09-14 | 美光科技公司 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias |
| US8435836B2 (en) | 2008-09-11 | 2013-05-07 | Micron Technology, Inc. | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods |
| US8680654B2 (en) | 2008-09-11 | 2014-03-25 | Micron Technology, Inc. | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods |
| US9165888B2 (en) | 2008-09-11 | 2015-10-20 | Micron Technology, Inc. | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods |
| JP2010206038A (en) * | 2009-03-05 | 2010-09-16 | Fujitsu Ltd | Mounting structure of electronic component, and manufacturing method of substrate for mounting electronic component |
| EP2261965A1 (en) * | 2009-06-12 | 2010-12-15 | Nxp B.V. | Crimp bump interconnection |
| WO2010143132A1 (en) * | 2009-06-12 | 2010-12-16 | Nxp B.V. | Crimp bump interconnection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6482676B2 (en) | Method of mounting semiconductor chip part on substrate | |
| US5897337A (en) | Process for adhesively bonding a semiconductor chip to a carrier film | |
| JP3536650B2 (en) | Bump forming method and apparatus | |
| JP2934202B2 (en) | Method for forming conductive bumps on wiring board | |
| JP3830125B2 (en) | Semiconductor device manufacturing method and semiconductor device | |
| JP2002016101A (en) | Semiconductor device and its manufacturing method | |
| JPH0234949A (en) | Method for mounting semiconductor device | |
| JPH08307043A (en) | Flip chip bonding device | |
| JP2002009108A (en) | Semiconductor device, its manufacturing method, circuit board and electronic equipment | |
| JP3184014B2 (en) | Semiconductor device | |
| JP3052300B2 (en) | Wiring board and pressure tool | |
| JPH046841A (en) | Mounting structure of semiconductor device | |
| JPH1117050A (en) | Circuit board and manufacture thereof | |
| JP2003243455A (en) | Tape, method of manufacturing the same, semiconductor device, method of manufacturing the same | |
| JP3350454B2 (en) | Semiconductor integrated circuit device, method of manufacturing the same, and manufacturing apparatus | |
| JPH0338084A (en) | Connection of circuit board | |
| JP2928822B2 (en) | Semiconductor device and connection method thereof | |
| JPH07282878A (en) | Anisotropy electrical conductivity connection component and manufacture thereof | |
| JP2004207293A (en) | Semiconductor device and its manufacturing method, circuit board, and electronic equipment | |
| JP3215244B2 (en) | Device package and method of manufacturing the same | |
| JPH098202A (en) | Lead frame for integrated circuit | |
| JP2002151628A (en) | Semiconductor device and its manufacturing method | |
| JPH09246331A (en) | Manufacture of semiconductor device and wire pattern film using it | |
| JPS631551A (en) | Ink jet head | |
| KR930007520B1 (en) | Lead frame and method for manufacturing thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020806 |