JP3215244B2 - Device package and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element package in which elements connected to external electrodes are incorporated, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In general, as a mounting technology of an element such as an IC or an LSI, a wire bonding method, a TAB (Tape) is used.
Automated Bonding) method, FC (Philip chip)
There are methods. In each method, pads and leads formed on the element are electrically connected using wires or bumps as a medium.

Next, a CCD package in which leads of a substrate and pads of a CCD (charge coupled device) are connected via bumps will be described with reference to the drawings. FIG. 5 is a longitudinal sectional view showing a conventional CCD package.

A CCD package manufactured by a COG (Chip on Glass) method has a glass substrate 1 as shown in FIG.
And a CCD 3 joined to the glass substrate 1. On one surface of the glass substrate 1, a thick film-shaped wiring path 2 made of a gold material is formed.
A plurality of low melting point metal bodies (not shown) such as -Pb are printed.

On the other hand, the CCD 3 has a plurality of bumps 4
Are connected, and each bump 4 is formed by a ball bonding method. Each bump 4 is joined to a corresponding low melting point metal body.

A lead 5 is joined to the wiring path 2, and the lead 5 is made of a flexible wiring board.

[0007] The space formed between the glass substrate 1 and the CCD 3 is sealed with a resin material 6, and the sealing strength between the glass substrate 1 and the CCD 3 is improved by this resin material sealing.

Next, a method of manufacturing a CCD package by the COG method will be described.

First, a thick-film-shaped wiring path 2 made of a gold material is formed on a glass substrate 1, and a low-melting metal body made of In-Pb is printed on the wiring path 2.

On the other hand, ball-shaped bumps are formed on the pads of the CCD 3 by a ball bonding method.

Next, the glass substrate 1 and the CCD 3 are positioned such that the low-melting point metal body and the bump face each other. After the positioning is completed, the glass substrate 1 and the CCD 3 are heated and pressurized, and the low melting metal body of the glass substrate 1 and the CCD 3 are heated.
Are bonded to each other.

After joining the low melting point metal body of the glass substrate 1 and the bumps 4 of the CCD 3, a resin material 6 is poured into a space formed between the glass substrate 1 and the CCD 3, and the space is sealed with the resin material 6. Is stopped. The sealing strength of the glass substrate 1 and the CCD 3 is increased by the sealing of the resin material 6.

Next, the wiring path 2 of the glass substrate 1 and the lead 5 are joined, and the fabrication of the CCD package is completed.

However, since the space between the glass substrate 1 and the CCD 3 is sealed with the resin material, the incident light reaches the CCD 3 through the glass substrate 1 and the resin material 6. Therefore, the image obtained by the CCD 3 may be affected by the optical characteristics of the resin material 6. Further, since the microlens for achieving high sensitivity of the CCD 3 is covered with the resin material 6, the effect of the microlens may not be obtained.
Further, the bending strength of the lead 5 is the same as that of the glass substrate 1.
Since the bonding strength with CD3 is large, the glass substrate 1
It is necessary to bend the lead 5 so as not to break the joint between the lead 5 and the CCD 3, and it is necessary to pay sufficient attention to the operation of bending the lead 5.

As alternatives to the COG type CCD package, there are a SP-TAB type CCD package and a TOG (Tab On Glass) type CCD package.

First, a CCD package based on the SP-TAB method will be described with reference to the drawings. FIG. 6 shows SP
It is a longitudinal cross-sectional view which shows the CCD package by -TAB system.

As shown in FIG. 6, a CCD package according to the SP-TAB method has a plurality of bumps 4 formed on the surface and a microlens (not shown) incorporated therein.
It has CD3. Each bump 4 is formed by a transfer bump method.

A TAB lead 10 is bonded to the bump 4. Each TAB lead 10 has a flexible substrate 11
It comprises a plurality of strip-shaped copper foil bodies 12 formed on one surface of a flexible substrate 11. The copper foil body 12 of each TAB lead 10 is electrically connected to the corresponding bump 4. Each TAB lead 10 is bent at right angles to the CCD 3.

The surface of the CCD 3 is covered with a glass cover 13. The glass cover 13 is adhered to the surface of the CCD 3, and an adhesive layer 14 is formed in a space between the glass cover 13 and the CCD 3.

However, since the adhesive layer 14 is formed in the space between the glass cover 13 and the CCD 3, the incident light passes through the glass cover 13 and the adhesive
Reach D3. Therefore, the image obtained by the CCD 3 may be affected by the optical characteristics of the adhesive layer 14. In addition, since the microlens for achieving high sensitivity of the CCD 3 is covered with the adhesive layer 14, the effect of the microlens may not be obtained. Furthermore, TAB lead 10
Is larger than the bonding strength between the TAB lead 10 and the bumps of the CCD 3.
It is necessary to bend the TAB lead 10 so as not to break the junction between the CD3 and the bump.

Next, a CCD package according to the TOG method will be described with reference to the drawings. FIG. 7 is a longitudinal sectional view showing a CCD package by the TOG method.

As shown in FIG. 7, the CCD package according to the TOG method has a plurality of bumps 4 formed on the surface and a microlens (not shown).
Is provided.

A TAB lead 10 is bonded to the bump 4. Each TAB lead 10 has a flexible substrate 11
It comprises a plurality of strip-shaped copper foil bodies 12 formed on one side of a flexible substrate 11 by printing. The copper foil body 12 of each TAB lead 10 is electrically connected to the corresponding bump 4. Each TAB lead 10 is bent at right angles to the CCD 3.

The surface of the CCD 3 is covered with a glass cover 13. The glass cover 13 is bonded to the other surface of each TAB lead 10, and the glass cover 13 and the TAB lead 1
0 and the adhesion between the TAB lead 10 and the CCD 3 are sealed with a resin material 15.

Therefore, since the space formed between the glass cover 13 and the CCD 3 is not filled with a resin material or an adhesive, the effect of the micro lens provided in the CCD 3 can be sufficiently obtained. High joining strength cannot be obtained. Since the bending strength of the TAB lead 10 is larger than the bonding strength between the TAB lead 10 and the bump of the CCD 3, the bending strength of the TAB lead 10
TAB lead 10 so as not to break the joint with the bump.
It is necessary to perform the bending operation of the joint, which may result in damage to the joint.

[0026]

As described above, in the conventional CCD package based on the COG system or the SP-TAB system, the function of the CCD cannot be sufficiently obtained, and the lead 5 or the TAB lead 10 must be folded. The bending operation is very difficult and may result in damage to the joint.

In the TOG type CCD package,
Although the function of the CCD can be sufficiently obtained, the work of bending the TAB lead 10 is very difficult, and the joint may be damaged.

An object of the present invention is to provide an element package and a method of manufacturing the element package which can sufficiently obtain the functions of the element and can prevent the occurrence of damage due to the bending of the lead. I do.

According to the present invention, the device is formed at a substantially linear intermittent position.
Having a bent cut formed by the cut,
By bending along the prescribed bending part,
The bent cut portion opens to form a projecting piece
A lead, electrically connected to said lead, and
Openings and protruding pieces caused by bending of the lead
And an element joined by an adhesive.

[0030]

In the device package of the present invention, a lead for connecting the device to the external electrode is provided, and the lead is formed by a projecting piece whose portion defined by a cut provided in advance protrudes to the outside. It has a flexible substrate that is bent to form, and a conductor line formed on one surface of the substrate.

For example, when the element comprises a CCD having a microlens on the surface, the surface of the CCD is covered with a glass cover. One of the bent leads is sandwiched between the CCD and the glass cover, and one of the leads is bonded to the CCD and the glass cover with an adhesive.

Since the base material of the lead is bent so that a portion defined by a cut provided in advance forms a protruding piece projecting to the outside, the bonding between the glass cover and the lead is made by the protruding piece. The area and the bonding area between the CCD and the lead are increased, and the bonding strength between the glass cover, the CCD and the lead can be increased without filling the glass cover and the CCD with a resin material, an adhesive, or the like. . As a result, loss of the effect of the microlens can be prevented, that is, the function of the element can be sufficiently obtained.

Since the cut is provided in the base material, the lead can be easily bent, and it is not necessary to perform the lead bending operation while considering the bonding strength between the glass cover, the CCD and the lead. As a result, it is possible to prevent the occurrence of damage due to the lead bending operation.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a device package CC of the present invention.
It is a longitudinal section showing one example of a D package. FIG. 2 is a plan view showing a TAB lead used in the CCD package of FIG. 1, and FIG. 3 is a TA bent along the line AA in FIG.
It is a perspective view which shows B lead.

As shown in FIG. 1, the CCD package 20 includes a CCD 3 having a plurality of bumps 4 formed on its surface and a microlens (not shown).

A TAB lead 21 is bonded to the bump 4. Each TAB lead 21 is, as shown in FIG.
It has a tape-shaped flexible substrate 22 made of polyimide and a plurality of strip-shaped copper foil bodies 23 formed on one surface of the flexible substrate 22 by printing.

A plurality of U-shaped cuts 24 are formed in the flexible substrate 22. The cuts 24 are arranged in the width direction of the flexible substrate 22 at intervals from each other, and a corresponding copper foil body 23 is arranged between the cuts 24. Each TAB
The copper foil 23 of the lead 21 is electrically connected to the corresponding bump 4.

By bending each TAB lead 21 along the line AA, a plurality of protruding pieces 25 and an opening 27 are formed in each TAB lead 21 as shown in FIG. Each TAB lead 21 is bent at right angles to the CCD 3.

The surface of the CCD 3 is covered with a glass cover 13. The glass cover 13 is bonded to the other surface of each TAB lead 21, and the glass cover 13 and the TAB lead 2
1 and the bonding portion between the TAB lead 21 and the CCD 3 are covered with an adhesive layer 26.

Next, a method for manufacturing a CCD package will be described.

First, ball-shaped bumps are formed on the pads of the CCD 3 by a ball bonding method.

On the other hand, on the flexible substrate 22 for forming the TAB leads 21, a plurality of U-shaped cuts 24 are arranged in the width direction of the flexible substrate 22 at intervals. Is formed by laser processing. In this embodiment, laser processing is used for forming the cuts.
Alternatively, a notch can be formed by etching.

Next, a plurality of strip-shaped copper foil bodies 23 are formed on the flexible substrate 22 so as to be arranged between the cuts 24.

After the preparation of the CCD 3 and the TAB lead 21 is completed, an adhesive is applied to each surface of the TAB lead 21. One of the adhesive coated surfaces of the TAB lead 21 has a CCD
3 are superimposed, and each of the copper foils 23 of the TAB lead 21 and the corresponding bump 4 of the CCD 3 are joined to each other. The glass cover 13 is overlaid on the other adhesive-coated surface of the TAB lead 21, and the other surface of the TAB lead 21 and the glass cover 13 are joined to each other.

Next, the TAB lead 21 is bent at a predetermined bending curve, the portion of the flexible substrate 22 defined by the cut 24 formed in advance is not bent, and a plurality of protruding pieces 25 are formed. It is formed. A plurality of openings 27 are formed with the formation of the plurality of projecting pieces 25.

With the formation of each protruding piece 25, the CCD 3 and the TA
Since the bonding area between the B lead 21 and the bonding area between the glass cover 13 and the TAB lead 21 increase, the CCD
3, the bonding strength between the glass cover 13 and the TAB lead 21 is increased, and there is no need to fill the glass cover 13 and the CCD 3 with a resin material, an adhesive, or the like, thereby preventing the loss of the effect of the microlens. it can.

Further, since the notch 24 is provided in the flexible substrate 22, the TAB lead 21 can be easily bent, and the glass cover 13, the CCD 3 and the TAB lead 2 can be bent.
There is no need to perform the bending work of the TAB lead while considering the bonding strength between the two. As a result, it is possible to prevent the occurrence of damage due to the bending operation of the TAB lead 21 beforehand.

In this embodiment, the TAB lead 21 is bent after the CCD 3 and the glass cover 13 are bonded to the TAB lead 21, but after the TAB lead 21 is bent, the TAB lead 21, the CCD 3 and the glass cover 13 are bent.
Can also be bonded. When bonding the TAB lead 21 to the CCD 3 and the glass cover 13 after bending the TAB lead 21, an adhesive is poured into the surface of the TAB lead 21 on the CCD 3 side through the opening 27, and
The CCD 3 and the glass cover 13 can be simultaneously bonded to the B lead 21.

Next, another CCD package will be described with reference to the drawings. FIG. 4 is a plan view showing another embodiment of a CCD package which is an element package of the present invention.

As shown in FIG. 4, the CCD package 30 includes a cylindrical housing 31 in which a CCD (not shown) is incorporated, and a glass cover 13 that covers the CCD of the housing 31.

A plurality of TAB leads 21 are connected to the CCD in the housing 31. Each TAB lead 21 has a tape-shaped flexible substrate 22 made of polyimide, and a plurality of strip-shaped copper foil bodies 23 formed on one surface of the flexible substrate 22 by printing. The flexible substrate 22 has U
A plurality of cuts 24 having a character shape are formed. 24 for each cut
Are arranged in the width direction of the flexible substrate 22 at an interval from each other, and a corresponding copper foil body 23 is arranged between the cuts 24. The copper foil body 23 of each TAB lead 21 has a corresponding C
It is electrically connected to the bump of the CD.

Each TAB lead 21 extends outward of the housing 31, and a predetermined portion of each TAB lead 21 is bent along a predetermined curve. By bending each TAB lead 21, a plurality of projecting pieces 25 are formed on each TAB lead 21.

Since each TAB lead 21 is bent along a curve, the stress applied to the joint between the bump of the CCD and the copper foil body 23 of the TAB 21 is reduced.

In this embodiment, the CCD package is described. However, by using the TAB lead, a similar effect can be obtained for an element package in which elements such as other ICs and LSIs are incorporated. Can be.

8 to 10 show another embodiment of the present invention.

In this embodiment, the formation of the projecting piece 25 is different from that of the first embodiment by 90 degrees, and the operation and effect are the same as those of the first embodiment.

[0058]

As described above, according to the element package of the present invention, the function of the element can be sufficiently obtained, and the damage caused by the bending operation of the lead can be prevented from occurring. Can be.

According to the method for manufacturing an element package of the present invention, it is possible to obtain an element package in which the function of the element can be sufficiently obtained and the damage caused by the lead bending operation can be prevented.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing one embodiment of a CCD package which is an element package of the present invention.

FIG. 2 shows a TA used in the CCD package of FIG. 1;
It is a top view which shows B lead.

FIG. 3 is a perspective view showing a TAB lead bent along the line AA in FIG. 2;

FIG. 4 is a longitudinal sectional view showing another embodiment of a CCD package which is an element package of the present invention.

FIG. 5 is a longitudinal sectional view showing a conventional COG-based CCD package.

FIG. 6 is a longitudinal sectional view showing a conventional CCD package according to the SP-TAB method.

FIG. 7 is a vertical sectional view showing a conventional TOG type CCD package.

FIG. 8 is a longitudinal sectional view showing another embodiment of the present invention.

FIG. 9 shows a TA used in the CCD package of FIG. 8;
It is a top view which shows B lead.

FIG. 10 is a perspective view showing a TAB lead bent along the line AA in FIG. 9;

[Explanation of symbols]

3 ... CCD, 4 ... Bump, 13 ... Glass cover, 20,
30 ... CCD package, 21 ... TAB lead, 22 ...
Flexible substrate, 23: copper foil, 24: cut, 25: projecting piece, 26: adhesive, 27: opening.

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazunari Oi 8 Shinsugita-cho, Isogo-ku, Yokohama-shi, Kanagawa Pref. Toshiba Multimedia Technology Research Institute (72) Inventor Tadashi Sugigi 8 Shin-Sugita-cho, Isogo-ku, Yokohama-shi, Kanagawa (72) Inventor Kenichi Shinozuka 3-3-9, Shimbashi, Minato-ku, Tokyo Inside Toshiba AV EE Co., Ltd. (56) References JP-A-2-35442 (JP, U) (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60

Claims (6)

(57) [Claims] 1. A bend formed at a substantially linear intermittent position.
Having a notch-like notch, defined by said notch
By bending along the bent part, the bent shape
A notch is opened to form a protruding piece, and a lead is electrically connected to the lead, and
Contact at the opening and protruding piece caused by bending
And an element bonded by an adhesive.
Device package. 2. The device package according to claim 1, wherein said leads are TAB leads having a conductor line formed integrally with a base material . 3. The device package according to claim 1, wherein said device comprises a charge-coupled device provided with a microlens. 4. The method for manufacturing an element package according to claim 1, further comprising a step of bending the lead. 5. The method according to claim 1, wherein the lead is bent before bending the lead.
Method of manufacturing a device package according to claim 4 in which the conductor paths formed in the base material, characterized in that it comprises a step of connecting to said element. 6. The lead is formed after bending the lead.
Method of manufacturing a device package according to claim 4 in which the conductor paths formed in the base material, characterized in that it comprises a step of connecting to said element.