JPH083026Y2 - ケ−ス内回路基板に対するコ−ド導入機構 - Google Patents
ケ−ス内回路基板に対するコ−ド導入機構Info
- Publication number
- JPH083026Y2 JPH083026Y2 JP1987058698U JP5869887U JPH083026Y2 JP H083026 Y2 JPH083026 Y2 JP H083026Y2 JP 1987058698 U JP1987058698 U JP 1987058698U JP 5869887 U JP5869887 U JP 5869887U JP H083026 Y2 JPH083026 Y2 JP H083026Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- cord
- guide plate
- case
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005452 bending Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987058698U JPH083026Y2 (ja) | 1987-04-20 | 1987-04-20 | ケ−ス内回路基板に対するコ−ド導入機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987058698U JPH083026Y2 (ja) | 1987-04-20 | 1987-04-20 | ケ−ス内回路基板に対するコ−ド導入機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63165888U JPS63165888U (en, 2012) | 1988-10-28 |
JPH083026Y2 true JPH083026Y2 (ja) | 1996-01-29 |
Family
ID=30889497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987058698U Expired - Lifetime JPH083026Y2 (ja) | 1987-04-20 | 1987-04-20 | ケ−ス内回路基板に対するコ−ド導入機構 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH083026Y2 (en, 2012) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014199842A (ja) * | 2013-03-29 | 2014-10-23 | アズビル株式会社 | 電気機器の配線構造 |
JP2015035479A (ja) * | 2013-08-08 | 2015-02-19 | 新コスモス電機株式会社 | 電気機器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6042781U (ja) * | 1983-08-30 | 1985-03-26 | 日本精機株式会社 | 回路収納ケ−スのコ−ド導出構造 |
-
1987
- 1987-04-20 JP JP1987058698U patent/JPH083026Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63165888U (en, 2012) | 1988-10-28 |
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