JPH083006Y2 - 半導体装置の実装構造 - Google Patents

半導体装置の実装構造

Info

Publication number
JPH083006Y2
JPH083006Y2 JP1990025766U JP2576690U JPH083006Y2 JP H083006 Y2 JPH083006 Y2 JP H083006Y2 JP 1990025766 U JP1990025766 U JP 1990025766U JP 2576690 U JP2576690 U JP 2576690U JP H083006 Y2 JPH083006 Y2 JP H083006Y2
Authority
JP
Japan
Prior art keywords
chip
chips
mounting structure
circuit board
pressing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990025766U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03116034U (cg-RX-API-DMAC10.html
Inventor
稔 平井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP1990025766U priority Critical patent/JPH083006Y2/ja
Publication of JPH03116034U publication Critical patent/JPH03116034U/ja
Application granted granted Critical
Publication of JPH083006Y2 publication Critical patent/JPH083006Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/07352—
    • H10W72/321—
    • H10W72/877—
    • H10W90/724—

Landscapes

  • Wire Bonding (AREA)
JP1990025766U 1990-03-14 1990-03-14 半導体装置の実装構造 Expired - Fee Related JPH083006Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990025766U JPH083006Y2 (ja) 1990-03-14 1990-03-14 半導体装置の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990025766U JPH083006Y2 (ja) 1990-03-14 1990-03-14 半導体装置の実装構造

Publications (2)

Publication Number Publication Date
JPH03116034U JPH03116034U (cg-RX-API-DMAC10.html) 1991-12-02
JPH083006Y2 true JPH083006Y2 (ja) 1996-01-29

Family

ID=31528689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990025766U Expired - Fee Related JPH083006Y2 (ja) 1990-03-14 1990-03-14 半導体装置の実装構造

Country Status (1)

Country Link
JP (1) JPH083006Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008029802A (ja) * 2006-06-29 2008-02-14 Sadao Kiyomiya 遊技媒体数量表示システム、並びに遊技媒体数量測定装置及び同方法

Also Published As

Publication number Publication date
JPH03116034U (cg-RX-API-DMAC10.html) 1991-12-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees