JPH08292382A - 薄膜アクチュエーテッドミラーアレイの製造方法 - Google Patents
薄膜アクチュエーテッドミラーアレイの製造方法Info
- Publication number
- JPH08292382A JPH08292382A JP8084620A JP8462096A JPH08292382A JP H08292382 A JPH08292382 A JP H08292382A JP 8084620 A JP8084620 A JP 8084620A JP 8462096 A JP8462096 A JP 8462096A JP H08292382 A JPH08292382 A JP H08292382A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- layer
- array
- manufacturing
- actuated mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 154
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000010410 layer Substances 0.000 claims abstract description 106
- 239000011241 protective layer Substances 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 46
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000012153 distilled water Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical group F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 claims description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 238000001020 plasma etching Methods 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000001771 vacuum deposition Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000003980 solgel method Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S359/00—Optical: systems and elements
- Y10S359/90—Methods
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Transforming Electric Information Into Light Information (AREA)
- Optical Elements Other Than Lenses (AREA)
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950009395A KR960039450A (ko) | 1995-04-21 | 1995-04-21 | 광로 조절 장치의 건조방법 |
| KR1019950009390A KR0153999B1 (ko) | 1995-04-21 | 1995-04-21 | 광로 조절 장치의 건식 식각장치 |
| KR1019950010581A KR0154926B1 (ko) | 1995-04-29 | 1995-04-29 | 광로 조절 장치의 에어갭 형성방법 |
| KR1019950010582A KR0154927B1 (ko) | 1995-04-29 | 1995-04-29 | 광로 조절 장치의 에어갭 형성방법 |
| KR1995P10582 | 1995-06-30 | ||
| KR1995P9395 | 1995-06-30 | ||
| KR1019950018673A KR0159369B1 (ko) | 1995-06-30 | 1995-06-30 | 광로 조절 장치의 에어갭 형성방법 |
| KR1995P10581 | 1995-06-30 | ||
| KR1995P18673 | 1995-06-30 | ||
| KR1995P9390 | 1995-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08292382A true JPH08292382A (ja) | 1996-11-05 |
Family
ID=27532174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8084620A Pending JPH08292382A (ja) | 1995-04-21 | 1996-03-13 | 薄膜アクチュエーテッドミラーアレイの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5677785A (de) |
| JP (1) | JPH08292382A (de) |
| IN (1) | IN187493B (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7684106B2 (en) | 2006-11-02 | 2010-03-23 | Qualcomm Mems Technologies, Inc. | Compatible MEMS switch architecture |
| US8964280B2 (en) | 2006-06-30 | 2015-02-24 | Qualcomm Mems Technologies, Inc. | Method of manufacturing MEMS devices providing air gap control |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6969635B2 (en) * | 2000-12-07 | 2005-11-29 | Reflectivity, Inc. | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| US5949568A (en) * | 1996-12-30 | 1999-09-07 | Daewoo Electronics Co., Ltd. | Array of thin film actuated mirrors having a levelling member |
| CN1283369A (zh) * | 1997-10-31 | 2001-02-07 | 大宇电子株式会社 | 光学投影系统中的薄膜驱动的反光镜组的制造方法 |
| JP3527117B2 (ja) | 1998-12-24 | 2004-05-17 | 富士電機デバイステクノロジー株式会社 | 半導体力学量センサの製造方法およびその製造装置 |
| US6203715B1 (en) * | 1999-01-19 | 2001-03-20 | Daewoo Electronics Co., Ltd. | Method for the manufacture of a thin film actuated mirror array |
| FR2820834B1 (fr) * | 2001-02-15 | 2004-06-25 | Teem Photonics | Procede de fabrication d'un micro-miroir optique et micro-miroir ou matrice de micro-miroirs obtenu par ce procede |
| US6906846B2 (en) * | 2002-08-14 | 2005-06-14 | Triquint Technology Holding Co. | Micro-electro-mechanical system device and method of making same |
| US7289259B2 (en) | 2004-09-27 | 2007-10-30 | Idc, Llc | Conductive bus structure for interferometric modulator array |
| US7420725B2 (en) | 2004-09-27 | 2008-09-02 | Idc, Llc | Device having a conductive light absorbing mask and method for fabricating same |
| KR100851074B1 (ko) | 2005-12-14 | 2008-08-12 | 삼성전기주식회사 | 보호막을 가지는 광변조기 소자 및 그 제조 방법 |
| US8541315B2 (en) * | 2011-09-19 | 2013-09-24 | International Business Machines Corporation | High throughput epitaxial lift off for flexible electronics |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5172262A (en) * | 1985-10-30 | 1992-12-15 | Texas Instruments Incorporated | Spatial light modulator and method |
-
1996
- 1996-02-08 US US08/598,478 patent/US5677785A/en not_active Expired - Fee Related
- 1996-02-12 IN IN246CA1996 patent/IN187493B/en unknown
- 1996-03-13 JP JP8084620A patent/JPH08292382A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8964280B2 (en) | 2006-06-30 | 2015-02-24 | Qualcomm Mems Technologies, Inc. | Method of manufacturing MEMS devices providing air gap control |
| US7684106B2 (en) | 2006-11-02 | 2010-03-23 | Qualcomm Mems Technologies, Inc. | Compatible MEMS switch architecture |
Also Published As
| Publication number | Publication date |
|---|---|
| US5677785A (en) | 1997-10-14 |
| IN187493B (de) | 2002-05-04 |
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