JPH08255963A - Structure for mounting electronic component - Google Patents
Structure for mounting electronic componentInfo
- Publication number
- JPH08255963A JPH08255963A JP5684195A JP5684195A JPH08255963A JP H08255963 A JPH08255963 A JP H08255963A JP 5684195 A JP5684195 A JP 5684195A JP 5684195 A JP5684195 A JP 5684195A JP H08255963 A JPH08255963 A JP H08255963A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lead pin
- electronic component
- raised
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、リードピン１を電気
回路基板６のスルホール２に挿通し半田付けして実装す
るリードピン付の電子部品７の実装構造及び実装方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure and a mounting method for an electronic component 7 with a lead pin, in which a lead pin 1 is inserted into a through hole 2 of an electric circuit board 6 and soldered for mounting.
【０００２】[0002]
【従来の技術】図３に示すのは、この種の従来技術であ
り、リードピン付電子部品７のリードピン１を電気回路
基板６のスルホール２に挿通し半田付けして実装してい
る。４は半田フィレットである。2. Description of the Related Art FIG. 3 shows a conventional technique of this kind, in which a lead pin 1 of an electronic component 7 with a lead pin is inserted into a through hole 2 of an electric circuit board 6 and soldered. 4 is a solder fillet.
【０００３】半田フィレット４は、通常、半田付け作業
時に下側となる電気回路基板６のリードピン１の遊端部
が突出した側では充分となるが、通常上側となる反対側
の半田フィレット４の盛り上げ量は殆ど期待できない。The solder fillet 4 is usually sufficient on the side where the free end portion of the lead pin 1 of the electric circuit board 6, which is the lower side, protrudes during the soldering work, but the solder fillet 4 on the opposite side, which is usually the upper side, is sufficient. The amount of excitement can hardly be expected.
【０００４】上記のような状態では、リードピン１は、
主に遊端部側の半田付けのみでスルホール２に固定支持
されているので、振動が加わったり、熱応力が加わる
と、この半田付け部に応力が集中し破壊する。In the above state, the lead pin 1 is
Since it is mainly fixedly supported by the through hole 2 only by soldering on the free end side, when vibration is applied or thermal stress is applied, stress concentrates on this soldered part and breaks.
【０００５】そこで、図４に示すように、電気回路基板
６の上面及び下面において、スルホール２の開口端に誘
い込みテーパー面８を設け、リードピン１とテーパー面
８との間に半田フィレット４を盛り上げる方法が試みら
れたこともあるが、この場合でも半田付け作業時に下側
となる電気回路基板６のリードピン１の遊端部が突出し
た側では充分となるが、通常上側となる反対側の半田４
の盛り上げ量は殆ど期待できない状態であった。Therefore, as shown in FIG. 4, on the upper surface and the lower surface of the electric circuit board 6, a guiding taper surface 8 is provided at the opening end of the through hole 2, and the solder fillet 4 is raised between the lead pin 1 and the taper surface 8. Although the method has been tried, even in this case, the side where the free end of the lead pin 1 of the electric circuit board 6 which is the lower side protrudes during the soldering work is sufficient, but the solder on the opposite side which is usually the upper side is sufficient. Four
The amount of excitement was almost impossible to expect.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、上記事由に
鑑みてなしたもので、リードピン１を電気回路基板６の
スルホール２に挿通し半田付けして実装するのが確実・
容易なリードピン付の電子部品の実装構造と実装方法を
提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is sure that the lead pin 1 is inserted into the through hole 2 of the electric circuit board 6 and soldered.
An object of the present invention is to provide a mounting structure and a mounting method for an electronic component with a lead pin that is easy.
【０００７】[0007]
【課題を解決するための手段】本発明の電子部品の実装
構造は、電気回路基板６の上面においてスルホール２の
回りに隆起堤５を設け、該隆起堤５からスルホール２の
内面にかけて開口部が広がるテーパー面９を形成し、ス
ルホール２にリードピン１を挿通し、スルホール２のリ
ードピン１の挿通部に半田フィレット４を盛り上げて成
ることを特徴とするものである。In the electronic component mounting structure of the present invention, a raised bank 5 is provided around the through hole 2 on the upper surface of the electric circuit board 6, and an opening is formed from the raised bank 5 to the inner surface of the through hole 2. The taper surface 9 is formed so as to expand, the lead pin 1 is inserted into the through hole 2, and the solder fillet 4 is raised in the insertion portion of the lead pin 1 of the through hole 2.
【０００８】上記のような、電子部品の実装構造は、電
気回路基板６の上面においてスルホール２の回りに隆起
堤５を設け、該隆起堤５からスルホール２の内面にかけ
て開口部が広がるテーパー面９を形成し、スルホール２
にリードピン１を挿通し、スルホール２のリードピン１
の挿通部に半田フィレット４を盛り上げる実装方法によ
り実現される。In the mounting structure for electronic components as described above, a raised bank 5 is provided around the through hole 2 on the upper surface of the electric circuit board 6, and a tapered surface 9 having an opening extending from the raised bank 5 to the inner surface of the through hole 2. Forming a through hole 2
Insert the lead pin 1 into the
It is realized by a mounting method in which the solder fillet 4 is raised in the insertion part of.
【０００９】また、上記のような、隆起堤５からスルホ
ール２の内面にかけて開口部が広がるテーパー面９は、
スルホール２の上面開口部にリーマ３のごとき楔型の工
具をスルホール２に圧入することにより容易に形成され
る。Further, the tapered surface 9 having an opening extending from the raised bank 5 to the inner surface of the through hole 2 as described above is
It is easily formed by press-fitting a wedge-shaped tool such as a reamer 3 into the through hole 2 at the upper surface opening of the through hole 2.
【００１０】このリードピン１をスルホール２に半田付
けするのは、リードピン１の遊端部側をリフロー炉に浸
したり、リードピン１の遊端部側に溶融半田４を滴下す
る、リードピン１の遊端部側及びその反対側に溶融半田
４を滴下する等任意の方法が採用できる。The lead pin 1 is soldered to the through hole 2 by immersing the free end side of the lead pin 1 in a reflow furnace or by dropping the molten solder 4 on the free end side of the lead pin 1. Any method such as dropping the molten solder 4 on the part side and the opposite side can be adopted.
【００１１】ここで、電子部品７には、ＩＣを樹脂封止
し、その端子としてリードピン１を設けたもの、あるい
は、小さな回路基板に複数のＩＣを搭載したものを樹脂
封止し、その端子として複数のリードピン１を設けたも
の等が用いられる。Here, as the electronic component 7, an IC is resin-sealed and the lead pins 1 are provided as terminals thereof, or an IC mounted with a plurality of ICs on a small circuit board is resin-sealed and its terminals are provided. For example, a device provided with a plurality of lead pins 1 is used.
【００１２】[0012]
【作用】この発明の電子部品の実装構造では、スルホー
ル２の下面側でのリードピン１との半田付けが確実に行
われることは勿論、上面側においても、該隆起堤５から
スルホール２の内面にかけて開口部が広がるテーパー面
９内及び隆起堤５の周囲に半田フイレット４が保持され
るので、リードピン１との半田付けが確実に行われる。
このようにして、リードピン付の電子部品は、半田に
て、スルホール２に強固に実装されている。In the mounting structure of the electronic component of the present invention, not only the soldering with the lead pin 1 on the lower surface side of the through hole 2 is surely performed, but also on the upper surface side from the raised bank 5 to the inner surface of the through hole 2. Since the solder fillet 4 is held in the tapered surface 9 where the opening is widened and around the raised bank 5, the soldering with the lead pin 1 is surely performed.
In this way, the electronic component with the lead pin is firmly mounted on the through hole 2 by soldering.
【００１３】この発明の電子部品の実装方法では、スル
ホール２の下面側でのリードピン１との半田付けが確実
に行われることは勿論、上面側においても、該隆起堤５
からスルホール２の内面にかけて開口部が広がるテーパ
ー面９内及び隆起堤５の周囲に半田フイレット４が保持
されるので、リードピン１との半田付けが確実に行われ
る。このようにして、リードピン付の電子部品は、半田
にて、スルホール２に強固に実装される。In the mounting method of the electronic component of the present invention, the soldering with the lead pin 1 on the lower surface side of the through hole 2 is surely performed, and the raised bank 5 is also provided on the upper surface side.
Since the solder fillet 4 is held in the tapered surface 9 where the opening is widened to the inner surface of the through hole 2 and around the raised bank 5, the soldering with the lead pin 1 is surely performed. In this way, the electronic component with the lead pin is firmly mounted on the through hole 2 by soldering.
【００１４】ここで、スルホール２の上面開口部にリー
マ３のごとき楔型の工具をスルホール２に圧入すると、
隆起堤５からスルホール２の内面にかけて開口部が広が
るテーパー面９が容易に形成される。Here, when a wedge-shaped tool such as a reamer 3 is press-fitted into the through hole 2 in the upper opening of the through hole 2,
A tapered surface 9 having an opening extending from the raised bank 5 to the inner surface of the through hole 2 is easily formed.
【００１５】このようにして、リードピン付の電子部品
は、半田にて電気回路基板６に強固に実装することが、
容易にできた。In this way, the electronic component with the lead pin can be firmly mounted on the electric circuit board 6 by soldering,
It was easy.
【００１６】[0016]
【実施例】本発明の実施例について以下に説明する。EXAMPLES Examples of the present invention will be described below.
【００１７】図１、図２は本発明に係わる一実施例を示
す。図１に示すのは、この発明の電子部品の実装構造で
あり、電気回路基板６の上面においてスルホール２の回
りに隆起堤５を設け、該隆起堤５からスルホール２の下
部内面にかけて開口部が広がるテーパー面９を形成し、
スルホール２にリードピン１を挿通し、スルホール２の
リードピン１の挿通部に半田フィレット４を盛り上げて
成る。1 and 2 show an embodiment according to the present invention. FIG. 1 shows a mounting structure of an electronic component of the present invention, in which a raised bank 5 is provided around the through hole 2 on the upper surface of the electric circuit board 6, and an opening is formed from the raised bank 5 to the lower inner surface of the through hole 2. Forming a widening tapered surface 9,
The lead pin 1 is inserted into the through hole 2, and the solder fillet 4 is raised in the insertion portion of the lead pin 1 of the through hole 2.
【００１８】電子部品７には、ＩＣを樹脂封止し、その
端子としてリードピン１を設けたものである。In the electronic component 7, an IC is resin-sealed and the lead pin 1 is provided as a terminal thereof.
【００１９】リードピン１は、電子部品７に設けられた
もので、このリードピン１が電気回路基板６のスルホー
ル２に挿通され、半田４にて固定されている。The lead pin 1 is provided on the electronic component 7, and the lead pin 1 is inserted into the through hole 2 of the electric circuit board 6 and fixed by the solder 4.
【００２０】電気回路基板６は、上面に電気回路をプリ
ントして形成したものであり、電子部品７のリードピン
１と接続すべきターミナル部にスルホール２が形成され
ている。The electric circuit board 6 is formed by printing an electric circuit on its upper surface, and has a through hole 2 formed in a terminal portion to be connected to the lead pin 1 of the electronic component 7.
【００２１】隆起堤５は、スルホール２の上面全周囲に
わたって設けられている。この隆起堤５は、図２に示す
ごとく、スルホール２の上面開口部にリーマ３のごとき
楔型の工具をスルホール２に圧入することにより、スル
ホール２の周囲を隆起させると共に隆起堤５からスルホ
ール２の内面にかけて開口部が広がるテーパー面９を容
易に形成する。The raised bank 5 is provided all around the upper surface of the through hole 2. As shown in FIG. 2, this raised bank 5 presses a wedge-shaped tool such as a reamer 3 into the through hole 2 at the opening of the upper surface of the through hole 2 so as to raise the periphery of the through hole 2 and to raise the through hole 5 from the raised hole 5. The tapered surface 9 having an opening that spreads toward the inner surface of is easily formed.
【００２２】スルホール２のリードピン１の挿通部に盛
り上げた半田フィレット４は、テーパー面９とリードピ
ン１の間を埋めると共に隆起堤５の外周にわたって盛り
上がっている。The solder fillet 4 raised in the insertion portion of the lead pin 1 of the through hole 2 fills the space between the tapered surface 9 and the lead pin 1 and rises over the outer periphery of the raised bank 5.
【００２３】スルホール２の下面側でのリードピン１と
の半田付けは、従来どうり確実におこなわれている。Soldering with the lead pin 1 on the lower surface side of the through hole 2 is surely performed as in the past.
【００２４】上記の、電子部品の実装構造は、上記の内
容を整理して説明すると、以下のような実装方法で実現
されている。The above-described electronic component mounting structure is realized by the following mounting method, when the above contents are organized and described.
【００２５】スルホール２の上面開口部にリーマ３を圧
入することによりスルホール２の回りに隆起堤５を盛り
上げると共に該隆起堤５からスルホール２の内面にかけ
て開口部が広がるテーパー面９を形成し、スルホール２
にリードピン１を挿通し、スルホール２のリードピン１
の挿通部において、電気回路基板６の上面及び下面に半
田フィレット４を盛り上げて完成している。By pressing the reamer 3 into the upper opening of the through hole 2, the raised bank 5 is raised around the through hole 2 and the tapered surface 9 is formed so that the opening spreads from the raised bank 5 to the inner surface of the through hole 2. Two
Insert the lead pin 1 into the
The solder fillet 4 is raised on the upper surface and the lower surface of the electric circuit board 6 at the insertion portion of the above to complete.
【００２６】[0026]
【発明の効果】この発明の電子部品の実装構造では、上
面側においても、該隆起堤５からスルホール２の内面に
かけて開口部が広がるテーパー面９内及び隆起堤５の周
囲に半田フイレット４が保持されるので、リードピン１
との半田付けが電気回路基板６の上面及び下面の双方で
確実に行われる。このようにして、リードピン付の電子
部品は、半田にて、スルホール２に強固に実装されてい
る。According to the electronic component mounting structure of the present invention, the solder fillet 4 is held on the upper surface side as well in the tapered surface 9 where the opening extends from the raised bank 5 to the inner surface of the through hole 2 and around the raised bank 5. Lead pin 1
The soldering with is surely performed on both the upper surface and the lower surface of the electric circuit board 6. In this way, the electronic component with the lead pin is firmly mounted on the through hole 2 by soldering.
【００２７】この発明の電子部品の実装方法では、上面
側においても、該隆起堤５からスルホール２の内面にか
けて開口部が広がるテーパー面９内及び隆起堤５の周囲
に半田フイレット４が保持されるので、リードピン１と
の半田付けが電気回路基板６の上面及び下面の双方で確
実に行われる。In the mounting method of the electronic component of the present invention, the solder fillet 4 is held also on the upper surface side in the tapered surface 9 where the opening extends from the raised bank 5 to the inner surface of the through hole 2 and around the raised bank 5. Therefore, the soldering with the lead pin 1 is surely performed on both the upper surface and the lower surface of the electric circuit board 6.
【００２８】このようにして、リードピン付の電子部品
７は、半田にて、スルホール２に強固に実装される。In this way, the electronic component 7 with the lead pin is firmly mounted on the through hole 2 by soldering.
【００２９】ここで、スルホール２の上面開口部にリー
マ３のごとき楔型の工具をスルホール２に圧入すると、
スルホール２の周囲が隆起し、且つ、隆起堤５からスル
ホール２の内面にかけて開口部が広がるテーパー面９が
容易に形成される。Here, when a wedge-shaped tool such as a reamer 3 is press-fitted into the through hole 2 in the upper opening of the through hole 2,
A tapered surface 9 is easily formed in which the periphery of the through hole 2 is raised and the opening is widened from the raised bank 5 to the inner surface of the through hole 2.
【００３０】このようにして、リードピン付の電子部品
７は、半田にて電気回路基板６に強固に実装すること
が、容易にできた。In this way, the electronic component 7 with lead pins could be easily mounted firmly on the electric circuit board 6 by soldering.
【図１】本発明の実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】同上の断面図。FIG. 2 is a sectional view of the same.
【図３】従来例を示す断面図。FIG. 3 is a sectional view showing a conventional example.
【図４】従来例を示す断面図。FIG. 4 is a sectional view showing a conventional example.
１ リードピン ２ スルホール ３ リーマ ４ 半田フィレット ５ 隆起堤 ６ 電気回路基板 ７ 電子部品 ８ テーパー面 ９ テーパー面 1 Lead Pin 2 Through Hole 3 Reamer 4 Solder Fillet 5 Ridge 6 Electric Circuit Board 7 Electronic Component 8 Tapered Surface 9 Tapered Surface
Claims (3)
ル２の回りに隆起堤５を設け、該隆起堤５からスルホー
ル２の内面にかけて開口部が広がるテーパー面９を形成
し、スルホール２にリードピン１を挿通し、スルホール
２のリードピン１の挿通部に半田フィレット４を盛り上
げて成ることを特徴とする電子部品の実装構造。1. A raised bank 5 is provided around the through hole 2 on the upper surface of an electric circuit board 6, and a tapered surface 9 is formed so that an opening extends from the raised bank 5 to the inner surface of the through hole 2. The lead pin 1 is attached to the through hole 2. A mounting structure for an electronic component, characterized in that a solder fillet (4) is bulged in the insertion part of the lead pin (1) of the through hole (2).
ル２の回りに隆起堤５を設け、該隆起堤５からスルホー
ル２の内面にかけて開口部が広がるテーパー面９を形成
し、スルホール２にリードピン１を挿通し、スルホール
２のリードピン１の挿通部に半田フィレット４を盛り上
げて成ることを特徴とする電子部品の実装方法。2. A raised bank 5 is provided around the through hole 2 on the upper surface of the electric circuit board 6, and a tapered surface 9 is formed so that the opening extends from the raised bank 5 to the inner surface of the through hole 2. The lead pin 1 is attached to the through hole 2. A method of mounting an electronic component, characterized in that the solder fillet 4 is inserted into a portion of the through hole 2 through which the lead pin 1 is inserted.
入することによりスルホール２の回りに隆起堤５を盛り
上げると共に該隆起堤５からスルホール２の内面にかけ
て開口部が広がるテーパー面９を形成し、スルホール２
にリードピン１を挿通し、スルホール２のリードピン１
の挿通部に半田フィレット４を盛り上げて成ることを特
徴とする電子部品の実装方法。3. A reamer 3 is press-fitted into the upper opening of the through hole 2 to raise the raised ridge 5 around the through hole 2 and to form a tapered surface 9 from the raised ridge 5 to the inner surface of the through hole 2. , Through hole 2
Insert the lead pin 1 into the
A method for mounting an electronic component, characterized in that the solder fillet 4 is raised in the insertion part of the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5684195A JPH08255963A (en) | 1995-03-16 | 1995-03-16 | Structure for mounting electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5684195A JPH08255963A (en) | 1995-03-16 | 1995-03-16 | Structure for mounting electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08255963A true JPH08255963A (en) | 1996-10-01 |
Family
ID=13038636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5684195A Withdrawn JPH08255963A (en) | 1995-03-16 | 1995-03-16 | Structure for mounting electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08255963A (en) |
-
1995
- 1995-03-16 JP JP5684195A patent/JPH08255963A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020604 |