JPH1092999A - Press fit pin grid array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a pin grid array(PGA) easily and surely on a printed board while keeping high contact reliability without requiring any special means such that the PGA can be inserted into the printed board and drawn out therefrom freely. SOLUTION: The PGA 10 is arranged with a plurality of leads 11 comprising press fit pins each having a shaft part 11a and a press fit part 11b. When the lead 11 comprising a press fit pin is press fitted in a through-hole 21 made through a printed board 20, the press fit part 11b of the lead 11 comes into press contact with the plated part 21a of the through-hole 21 and the PGA 10 is mounted on the printed board 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin grid grid used in an information processing apparatus such as a personal computer.
Regarding an array (hereinafter simply referred to as “PGA”),
In particular, the present invention relates to a press-fit PGA in which all or some of a plurality of leads arranged in a row are formed by press-fit pins.

[0002]

2. Description of the Related Art With the recent high integration of LSI chips and the miniaturization and high performance of electronic devices, it is possible to increase the number of terminals by arranging a plurality of pins in a grid or a matrix. PGA having a high density has been put to practical use as a package of a semiconductor device.

FIG. 6 is a sectional view showing a conventional general PGA mounting structure. As shown in FIG.
Is a PGA 110 having a plurality of leads 111 arranged on one side.
And a printed circuit board 120 on which the PGA 110 is mounted,
And arranged on the four outer sides of the PGA 110,
0 and an insulating mount 130 interposed between the printed circuit board 120 and the printed circuit board 120.

A conventional PGA having such a structure is as follows.
A plurality of leads 111 are soldered while penetrating through holes (not shown) of the printed circuit board 120, and four sides of the PGA 110 are supported and mounted on the printed circuit board 120 by the mount 130. According to such a conventional PGA, vibrations, shocks, and the like applied to the printed circuit board 120 and the like are not affected by the
Thus, the PGA 110 could be reliably mounted on the printed circuit board 120 while preventing the lead 111 from breaking and the soldered portion from breaking.

However, in such a conventional PGA, P
The GA lead was fixed directly to the through hole of the printed circuit board by soldering, so the PGA once mounted
It was difficult to remove. For this reason, especially in an evaluation that requires repeated mounting and removal on a printed circuit board, PGA cannot be soldered and mounted, and an accurate evaluation cannot be performed in the same state as the completed state. Was.

Further, since a large number of leads are soldered to a printed circuit board, there is also a problem that the mounting operation is troublesome and the cost is increased. Further, when the leads are directly soldered to the through holes of the printed circuit board, the PGA gold-plated leads and the solder are connected by different kinds of metals, which causes a problem that the contact reliability is reduced.

In order to solve such a problem, a PGA as shown in FIG. 7 has been proposed. The PGA shown in FIG.
11 is inserted into a PGA socket 230 previously soldered and mounted in a through hole 221 of the printed circuit board 220, so that the PGA 210 is
It was designed to be able to be inserted and removed on top.

As a result, in the PGA shown in FIG. 7, even after the PGA 210 is once mounted on the printed circuit board 220, the PGA 210 can be easily removed, and operations such as evaluation can be easily performed. It was possible to do this very easily and reliably. In the drawing, reference numeral 221a denotes a plated portion of the through hole 211.

[0009]

However, in such a PGA, the PGA socket formed separately beforehand must be directly soldered to the printed circuit board when mounting the PGA, so that the number of parts and the mounting work are increased. In addition, there has been a problem that the cost increases and the reliability decreases due to an increase in the number of contact points.

Further, since the PGA socket needs to be mounted on the printed circuit board by soldering before the PGA is mounted, it is necessary to retrofit the PGA on the printed circuit board for some reason such as a design change. In such a case, it is extremely difficult to additionally mount the PGA socket, and there has been a problem that the number of steps and the like are greatly increased.

The present invention has been proposed in order to solve such problems of the prior art, and simply and reliably mounts PGA on a printed circuit board without using a special means such as a PGA socket. In addition, an object of the present invention is to provide a press-fit PGA in which a PGA can be freely inserted into and removed from a printed circuit board, and high contact reliability between the PGA and the printed circuit board can be maintained.

[0012]

According to a first aspect of the present invention, there is provided a press-fit PGA comprising: a plurality of leads arranged in a row; All or a part of the shaft and the press-fit pin composed of the press-fit portion,
The lead formed of the press-fit pin is mounted on the printed board by being pressed into a through hole formed in the printed board.

A press-fit PG according to claim 2
In A, all or a part of the plurality of leads is constituted by two or more types of press-fit pins having different lengths from the tip of the shaft portion to the press-fit portion.

Further, the press-fit P according to claim 3
The GA is configured such that all or a part of the plurality of leads is formed by a press-fit pin having a press-fit portion having an outer diameter smaller than that of the through-hole of the printed circuit board. Is formed in such a manner that the press-fit portion is formed by plating with a thickness to be press-fitted.

According to the press-fit PGA of the present invention having such a configuration, since the press-fit pin is used for the lead of the PGA, the PGA can be inserted and removed freely without using a special means such as a PGA socket. It can be mounted on a printed circuit board. Then, since the lead of the PGA can be directly inserted into the through hole of the printed board, high contact reliability between the PGA and the printed board can be maintained while the PGA is configured to be detachable from the printed board.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a press-fit P of the present invention will be described.
An embodiment of a GA will be described with reference to the drawings. [First Embodiment] FIG. 1 shows a press-fit P of the present invention.
FIG. 2 is an overall perspective view showing a first embodiment of the GA, and FIG.
FIG. 2 is an enlarged perspective view of a circle shown in FIG. 1. FIG. 3 is a partially enlarged front view showing a mounted state of the press-fit PGA in the present embodiment.

As shown in these figures, the press-fit PGA of this embodiment is a PGA 10 in which a plurality of leads 11 are arranged in a row on one surface, and the plurality of leads 11 are constituted by press-fit pins. is there.

A lead 1 comprising this press-fit pin
As shown in FIG. 2, reference numeral 1 denotes a shaft portion 11a and the shaft portion 11a.
a press-fit portion 1 formed in a hollow shape in which a central portion of a a swells outward and can be repeatedly pressed inward.
1b.

Then, as shown in FIG. 3, the lead 11 made of the press-fit pin is press-fitted into a through-hole 21 formed in the printed circuit board 20, so that the press-fit portion 11b becomes a plated portion 2 of the through-hole 21.
1a, the PGA 10 is mounted on the printed circuit board 20.

Here, as a material of the press-fit pin, an elastic metal capable of repeatedly elastically deforming the press-fit portion 11b is used. For example, phosphor bronze or beryllium copper is preferable. In the present embodiment, the press-fit pin is formed in a hollow bulging shape as shown in FIGS. 2 and 3, but the bulging shape that can be pressed inward is formed in the through hole 21. There is no particular limitation as long as it is in a press-fit state.

In this embodiment, a plurality of leads 11
Are formed by press-fit pins, but it is also possible to form only some of the leads 11 by press-fit pins.

Next, the operation of the press-fit PGA of the present embodiment having such a configuration will be described. FIG.
As shown in (a), first, the tip of the shaft 11 a of the lead 11 of the press-fit pin of the PGA 10 is aligned with the through hole 21 of the printed circuit board 20.

Next, as shown in FIG.
0 is gradually lowered, and the lead 11 made of a press-fit pin is inserted into the through hole 21. And
As shown in FIG. 3C, when the press-fit portion 11b of the lead 11 is press-fitted into the through-hole 21 and is pressed against the plated portion 12a on the inner wall of the through-hole 21, the mounting on the printed circuit board 20 is completed. .

As a result, the PGA of this embodiment can be mounted on the printed circuit board 20 without using soldering or a PGA socket or the like, and the printed circuit board can be freely mounted after mounting by simply pulling out the leads 11 from the through holes 21. 20 can be removed.

If it is not necessary to remove the PGA after mounting, the press-fit portion 11
b is formed to have a large diameter to increase the press-fitting into the through-hole 21 so that the PGA 10 can be mounted more firmly. Conversely, when it is necessary to repeatedly remove the PGA, the press-fit portion 11b Is formed to have a small diameter, so that press-fitting to the through-hole can be weakened, and insertion and removal can be facilitated.

As described above, according to the press-fit PGA of the present embodiment, since the press-fit pin is used for the lead 11 of the PGA 10, insertion and removal of the press-fit PGA can be performed without using a special means such as a conventional PGA socket. PG freely
A10 can be mounted on the printed circuit board 20 and the leads 11 of the PGA 10 can be directly connected to the printed circuit board 20.
Of the PG
While A10 is configured to be detachable from the printed circuit board 20, P10
High contact reliability between the GA 10 and the printed circuit board 20 can be maintained.

[Second Embodiment] Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a partially enlarged front view showing a mounted state of the press-fit PGA in the present embodiment.

As shown in FIG.
Is a modification of the above-described first embodiment, in which a plurality of leads 11 are press-fitted from a tip of a shaft portion 11a to a press-fit portion 11.
It is composed of two types of press-fit pins having different lengths up to b.

In the first embodiment described above, the lead 11
In the present embodiment, the lead 11 is formed by two types of press-fit pins, and the press-fit pin is formed from the tip of the shaft portion 11a, as shown in FIG. The distance to the portion 11b is shifted.

Thus, when the PGA 10 is mounted on the printed circuit board 20, the press-fitting of the press-fit portion 11b into the through hole 21 is started in two stages, so that the initial insertion force can be reduced, and the PGA 10 can be printed. Mounting on the substrate 20 can be made easier.

In this embodiment, the lead 11 is composed of two types of press-fit pins. However, it is also possible to configure the lead 11 with three or more types of press-fit pins.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a partially enlarged front view showing a mounted state of the press-fit PGA in the present embodiment.

As shown in FIG.
Is a modified example of the above-described first embodiment.
And a press-fit pin having a small-diameter press-fit portion 11b that is not press-fitted.

A small-diameter press-fit portion 1 of the lead 11 is provided in the through hole 21 of the printed circuit board 20.
The plating portion 21a is formed thick so that 1b is inserted in a press-fit state.

In the above-described first and second embodiments, the press-fit pin having a width capable of being pressed into the through hole 21 is used for the lead 11, but in such a case, the plated portion 21a of the through hole is used. Since the thickness of the PGA 10 is reduced, the plated portion 21a of the through hole 21 may be peeled or damaged during repeated insertion and removal of the PGA 10.

Therefore, in this embodiment, as shown in FIG. 4, the plating portion 21a of the through hole 21 is formed thicker, and the press-fitting force of the lead 11 is reduced by making the press-fit portion 11b smaller in diameter. Can be more easily inserted and removed, and the plated portion 21a of the through hole 21 is not damaged by repeated insertion and removal a plurality of times. This is particularly effective when performing an evaluation that requires repeated insertion and removal of the PGA 10.

In this embodiment, all of the leads 11 are constituted by press-fit pins having a small-diameter press-fit portion 11b.
Only the other leads 11 may be constituted by the press-fit pins having the normal diameter in the first and second embodiments.

The lead 11 having the small-diameter press-fit portion 11b according to the present embodiment also has two or more types having different lengths from the tip of the shaft portion 11a to the press-fit portion 11b in the second embodiment. It is also possible to use press-fit pins.

[0039]

As described above, according to the press-fit PGA of the present invention, the PGA can be easily and reliably mounted on the printed circuit board without using any special means such as a PGA socket, and the PGA can be transferred from the printed circuit board. It can be freely inserted and removed, and high contact reliability between the PGA and the printed circuit board can be maintained.

[Brief description of the drawings]

FIG. 1 is an overall perspective view showing a first embodiment of a press-fit PGA of the present invention.

FIG. 2 is an enlarged perspective view of a circle shown in FIG.

FIG. 3 is a partially enlarged front view showing a mounted state of the press-fit PGA of the first embodiment of the present invention.

FIG. 4 is a partially enlarged front view showing a mounted state of a press-fit PGA according to a second embodiment of the present invention.

FIG. 5 is an enlarged partial cross-sectional front view showing a mounted state of a press-fit PGA according to a third embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a conventional general PGA mounting structure.

FIG. 7 is an enlarged sectional view showing a main part of another conventional PGA mounting structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 PGA 11 Lead 11a Shaft part 11b Press fit part 20 Printed circuit board 21 Through hole 21a Plating part

Claims (3)

[Claims] 1. A pin grid array having a plurality of leads arranged in a row, wherein all or a part of the plurality of leads is constituted by a press-fit pin comprising a shaft portion and a press-fit portion. A press-fit pin grid array, wherein a lead made of a fit pin is mounted on a printed board by being pressed into a through hole formed in the printed board. 2. The press-fit pin according to claim 1, wherein all or a part of the plurality of leads are constituted by two or more types of press-fit pins having different lengths from the tip of the shaft portion to the press-fit portion. Grid array. 3. A press-fit pin having a press-fit portion having an outer diameter smaller than a through-hole of the printed circuit board, wherein all or a part of the plurality of leads are formed, and the press-fit pin is provided in the through-hole. 3. The press-fit pin grid array according to claim 1, wherein said small-diameter press-fit portion is press-fitted with a plating having a thickness.