JPH0823157A - Manufacture of plated circuit body provided with terminal - Google Patents

Manufacture of plated circuit body provided with terminal

Info

Publication number
JPH0823157A
JPH0823157A JP15326494A JP15326494A JPH0823157A JP H0823157 A JPH0823157 A JP H0823157A JP 15326494 A JP15326494 A JP 15326494A JP 15326494 A JP15326494 A JP 15326494A JP H0823157 A JPH0823157 A JP H0823157A
Authority
JP
Japan
Prior art keywords
terminal
circuit
resist agent
resist
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP15326494A
Other languages
Japanese (ja)
Inventor
Takeshi Oshima
毅 大島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP15326494A priority Critical patent/JPH0823157A/en
Publication of JPH0823157A publication Critical patent/JPH0823157A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To provide the manufacture of a plated circuit body, which is provided with a widely applicable terminal, allows the terminal to be bonded at a discretionary position and allows high degree of freedom in circuit design and structure. CONSTITUTION:Circuit resist A is printed on the parts other than the circuit pattern on a metal film which forms a lamination board 1, and a terminal 5, which is formed by applying terminal resist B that does not dissolve in the solvent for the circuit resist A, is bonded to the circuit pattern. Then, a circuit conductor 9 is formed by plating the circuit pattern provided with the terminal 5, the circuit resist A is removed by using the solvent for circuit resist A, and the remaining metal film is removed by etching. Then, the terminal resist B applied to the terminal 5 is removed by using the solvent for the terminal resist B, and a circuit body provided with the terminal is formed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、プリント配線板等のめ
っき回路体を構成する回路導体に、外部接続用端子を接
続して成る端子付きめっき回路体の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a plated circuit body with a terminal, which is formed by connecting a terminal for external connection to a circuit conductor which constitutes a plated circuit body such as a printed wiring board.

【０００２】[0002]

【従来の技術】従来、プリント配線板の回路導体に外部
接続用端子を接続する方法として、たとえば、特開平３
−１０２７９１号公報に、次のような方法が開示されて
いる。すなわち、図９に示すように、絶縁基板ａにはエ
ッチングによって回路導体ｂが形成されており、この回
路導体ｂには端子ｃを固定するスルーホールｄが開けら
れている。図１０に示すように、スルーホールｄに端子
ｃを差し込んで固定する。次に、無電解めっき等を施す
ことにより、図１１に示すように、厚膜化した回路導体
ｂ′が形成されると共に、析出した金属（銅）によって
回路導体ｂ′と端子ｃとが固着して電気的に接続が行わ
れるようにしている。2. Description of the Related Art Conventionally, as a method of connecting an external connection terminal to a circuit conductor of a printed wiring board, for example, Japanese Unexamined Patent Application Publication No. Hei 3 (1999) -311.
The following method is disclosed in Japanese Patent Laid-Open No. 102791. That is, as shown in FIG. 9, a circuit conductor b is formed on the insulating substrate a by etching, and a through hole d for fixing the terminal c is formed in the circuit conductor b. As shown in FIG. 10, the terminal c is inserted and fixed in the through hole d. Next, electroless plating or the like is performed to form a thickened circuit conductor b ′ as shown in FIG. 11, and the deposited metal (copper) fixes the circuit conductor b ′ and the terminal c. Then, electrical connection is made.

【０００３】しかし、上記の方法においては、端子ｃの
相手側との接触部（突出している部分）に不必要な金属
が析出しないように、めっき液から端子ｃの接触部が完
全に露出した状態で処理を行わなければならない。その
ため、めっき処理工程においては、端子ｃの位置を的確
に保持するために細心の注意を払う必要が生じ、作業が
煩雑となって生産性が低下する欠点がある。また、端子
の固定方向は、絶縁基板ａの一方の面、あるいは一方の
側縁に限定されてしまうため、回路設計や構造が制限さ
れる問題点を有している。However, in the above method, the contact portion of the terminal c is completely exposed from the plating solution so that unnecessary metal is not deposited on the contact portion (protruding portion) of the terminal c with the mating side. Processing must be done in the state. Therefore, in the plating process, it is necessary to pay close attention in order to accurately hold the position of the terminal c, and there is a drawback that the work becomes complicated and the productivity is reduced. Further, since the fixing direction of the terminal is limited to one surface or one side edge of the insulating substrate a, there is a problem that the circuit design and structure are limited.

【０００４】[0004]

【発明が解決しようとする課題】本発明は、上記の問題
点に着目してなされたもので、任意の位置に端子を付設
することができ、回路設計や構造の自由度が大きく適用
範囲の広い端子付きめっき回路体の製造方法を提供する
ことを課題とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and terminals can be attached at arbitrary positions, so that the degree of freedom of circuit design and structure is large and the range of application is large. An object is to provide a method of manufacturing a plated circuit body with a wide terminal.

【０００５】[0005]

【課題を解決するための手段】前記の課題を達成するた
め、本発明は、積層板を構成する金属膜に回路用レジス
ト剤を回路パターンを除く部分に印刷し、該回路パター
ンの所定の位置に、回路用レジスト剤の溶剤に対して不
溶性を有する端子用レジスト剤を電気接触部に被覆して
成る端子を接合した後、めっき処理を施して該回路パタ
ーンに回路導体を形成し、次いで回路用レジスト剤の溶
剤を用いて回路用レジスト剤を除去した後、エッチング
処理により残存する金属膜を除去し、しかる後、端子用
レジスト剤の溶剤を用いて端子の電気接触部を被覆した
端子用レジスト剤を除去することを特徴とする。In order to achieve the above-mentioned object, the present invention prints a circuit resist agent on a portion excluding a circuit pattern on a metal film forming a laminated plate, and a predetermined position of the circuit pattern. After joining a terminal formed by coating a terminal resist agent, which is insoluble in the solvent of the circuit resist agent, on the electric contact portion, a plating treatment is performed to form a circuit conductor on the circuit pattern, and then the circuit pattern is formed. After removing the resist agent for circuits using the solvent of the resist agent for etching, the remaining metal film is removed by etching, and then the solvent of the resist agent for terminals is used to cover the electrical contact part of the terminal It is characterized in that the resist agent is removed.

【０００６】[0006]

【作用】本発明によれば、積層板の回路導体に付設する
端子の電気接触部に、積層板に印刷した回路用レジスト
剤の溶剤に対して不溶性を有する端子用レジスト剤を被
覆しているため、めっき処理後の回路用レジスト剤の除
去工程において、端子が回路用レジスト剤の溶剤に浸漬
されても、端子用レジスト剤は除去されず端子の電気接
触部を被覆したままの状態が保持される。そのため、次
のエッチング工程において、端子の電気接触部がエッチ
ング液により溶解や損傷を受けることが確実に防止され
る。 したがって、メッキ処理において端子の位置を特
別な状態に保持する必要がないので、処理工程の生産性
が向上すると共に、端子を付設する位置が制約されない
ため、めっき回路体としての回路設計や、その構造の自
由度が増大し、適用範囲の広い端子付きめっき回路体が
得られる。According to the present invention, the electric contact portion of the terminal attached to the circuit conductor of the laminated board is coated with the terminal resist agent which is insoluble in the solvent of the circuit resist agent printed on the laminated board. Therefore, in the process of removing the circuit resist agent after the plating process, even if the terminal is immersed in the solvent of the circuit resist agent, the terminal resist agent is not removed and the electrical contact part of the terminal is kept covered. To be done. Therefore, in the next etching step, the electric contact portion of the terminal is reliably prevented from being dissolved or damaged by the etching solution. Therefore, since it is not necessary to hold the position of the terminal in a special state in the plating process, the productivity of the processing step is improved and the position where the terminal is attached is not restricted. The degree of freedom in structure is increased, and a plated circuit body with a terminal having a wide range of application can be obtained.

【０００７】[0007]

【実施例】以下、本発明の実施例として、端子付きめっ
き回路体の製造工程について説明する。図１は、本発明
の実施例に係わる積層板１の構造を示す説明図である。
積層板１は、ポリエステルフィルム２の片面に、金属膜
３として厚み３５μｍの銅箔を積層してなるものであ
る。積層板１の金属膜３上に、図２に示すように、有機
溶剤で除去可能な回路用レジスト剤Ａを用いて、回路パ
ターン４以外の部分に印刷する。回路用レジスト剤Ａと
しては、太陽インキ製造株式会社製のＭ８５Ｋを用い
た。EXAMPLES The steps of manufacturing a plated circuit body with terminals will be described below as examples of the present invention. FIG. 1 is an explanatory view showing a structure of a laminated board 1 according to an embodiment of the present invention.
The laminated plate 1 is formed by laminating a copper foil having a thickness of 35 μm as the metal film 3 on one surface of the polyester film 2. As shown in FIG. 2, a circuit resist agent A that can be removed with an organic solvent is used to print on a portion other than the circuit pattern 4 on the metal film 3 of the laminated plate 1. As the circuit resist agent A, M85K manufactured by Taiyo Ink Mfg. Co., Ltd. was used.

【０００８】一方、図３は、回路パターン４に付設する
ための端子５を示し、その電気接触部６には、回路用レ
ジスト剤Ａの溶剤に不溶性を有する端子用レジスト剤Ｂ
が塗布されている。端子用レジスト剤Ｂとしては、太陽
インキ製造株式会社製のＭＡ８３０を用いた。On the other hand, FIG. 3 shows a terminal 5 to be attached to the circuit pattern 4, and the electric contact portion 6 thereof has a terminal resist agent B which is insoluble in the solvent of the circuit resist agent A.
Has been applied. As the terminal resist agent B, MA830 manufactured by Taiyo Ink Mfg. Co., Ltd. was used.

【０００９】端子５は、その接続部６の両側縁に複数の
加締片７が形成されており、図４に示すように、積層板
１に対し回路パターン４の上から、加締片７を挿通し、
図５に示すように、積層板１のポリエステルフィルム２
側で加締片７を加締めることにより固定される。The terminal 5 has a plurality of caulking pieces 7 formed on both side edges of the connecting portion 6. As shown in FIG. 4, the caulking pieces 7 are formed on the laminated plate 1 from above the circuit pattern 4. Through
As shown in FIG. 5, the polyester film 2 of the laminate 1
It is fixed by swaging the swaging piece 7 on the side.

【００１０】端子５を固定した積層板１に、銅めっき処
理を施すことにより、図６に示すように、回路パターン
４に銅を析出させて回路導体９を形成する。めっき液と
しては、硫酸銅２００ｇ／リットル、硫酸５０ｇ／リッ
トルの硫酸銅溶液を使用し、電流密度を２０〜８０Ａ／
ｄｍ2 とする条件でめっき処理を行った。さらに、エッ
チングレジストとして半田めっきを行うと、より好まし
い結果が得られる。The laminated plate 1 having the terminals 5 fixed thereto is subjected to a copper plating treatment to deposit copper on the circuit pattern 4 to form a circuit conductor 9, as shown in FIG. As the plating solution, a copper sulfate solution of copper sulfate 200 g / liter and sulfuric acid 50 g / liter is used, and the current density is 20 to 80 A /
The plating treatment was performed under the condition of dm 2 . Further, if solder plating is performed as an etching resist, more preferable results can be obtained.

【００１１】次に、回路用レジスト剤Ａの溶剤であるシ
ンナー等を用いて、回路用レジスト剤Ａを除去した後、
エッチング処理を行って不要な金属膜３（銅箔）を除去
することにより、図７に示すように、ポリエステルフィ
ルム２上に回路導体９が形成されたメッキ回路体１０が
得られる。このとき、端子５の電気接触部６に塗布した
端子用レジスト剤Ｂは、回路用レジスト剤Ａの除去工程
およびエッチング工程において除去されずに残存し、端
子５の電気接触部６はエッチング液の影響を受けずに保
護される。Next, after removing the circuit resist agent A by using a thinner or the like which is a solvent of the circuit resist agent A,
By performing the etching process to remove the unnecessary metal film 3 (copper foil), the plated circuit body 10 having the circuit conductor 9 formed on the polyester film 2 is obtained as shown in FIG. 7. At this time, the terminal resist agent B applied to the electric contact portion 6 of the terminal 5 remains without being removed in the circuit resist agent A removing step and the etching step, and the electric contact portion 6 of the terminal 5 remains in the etching solution. Be protected without being affected.

【００１２】最後に、メッキ回路体１０に対し、端子用
レジスト剤Ｂの溶剤として水酸化ナトリウム溶液を用い
て端子用レジスト剤Ｂを除去することにより、図８に示
すように、回路導体９と端子５が接続され、端子５の電
気接触部６が露出した端子付きめっき回路体Ｐが形成さ
れる。Finally, by removing the terminal resist agent B from the plated circuit body 10 using a sodium hydroxide solution as a solvent for the terminal resist agent B, as shown in FIG. The terminal 5 is connected and the plated circuit body P with a terminal is formed in which the electric contact portion 6 of the terminal 5 is exposed.

【００１３】[0013]

【発明の効果】本発明によれば、付設する端子の電気接
触部に、積層板に印刷する回路用レジスト剤と異なる溶
剤特性を有する端子用レジスト剤を被覆しているため、
めっき処理後の回路用レジスト剤の除去工程において端
子を被覆した端子用レジスト剤は除去されず、エッチン
グ工程において端子の電気接触部がエッチング液に浸漬
されてもエッチング液により溶解されることが確実に防
止される。したがって、メッキ処理において端子の位置
を特別な状態に保持する必要がないので、処理工程の生
産性が向上すると共に、端子を付設する位置が制約され
ないため、めっき回路体としての回路設計や、その構造
の自由度が増大し、適用範囲の広い端子付きめっき回路
体が得られるなどの利点がある。According to the present invention, the electrical contact portion of the terminal to be attached is coated with a terminal resist agent having a solvent characteristic different from that of the circuit resist agent printed on the laminated board.
The terminal resist agent that covers the terminals is not removed in the circuit resist removal step after plating, and it is certain that the electrical contact parts of the terminals will be dissolved by the etching solution even if they are immersed in the etching solution in the etching step. To be prevented. Therefore, since it is not necessary to hold the position of the terminal in a special state in the plating process, the productivity of the processing step is improved and the position where the terminal is attached is not restricted. There are advantages that the degree of freedom of the structure is increased and a plated circuit body with a terminal having a wide range of application can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例に係わる積層板の構造を示す斜
視図である。FIG. 1 is a perspective view showing a structure of a laminated board according to an embodiment of the present invention.

【図２】図１の積層板に回路用レジスト剤を用いて回路
パターンを印刷した状態をしめす説明図である。FIG. 2 is an explanatory diagram showing a state in which a circuit pattern is printed on the laminated board of FIG. 1 using a circuit resist agent.

【図３】図１の積層板に付設する端子の斜視図である。FIG. 3 is a perspective view of a terminal attached to the laminated plate of FIG.

【図４】図３の端子を積層板に付設する工程を示す説明
図である。FIG. 4 is an explanatory view showing a process of attaching the terminal of FIG. 3 to a laminated board.

【図５】図３の端子を積層板に付設した状態を示す説明
図である。5 is an explanatory diagram showing a state in which the terminals of FIG. 3 are attached to a laminated plate.

【図６】図５に示す端子を付設した積層板にめっき処理
を施して回路導体を形成した状態を示す説明図である。FIG. 6 is an explanatory diagram showing a state in which a circuit conductor is formed by performing a plating process on the laminated plate provided with the terminals shown in FIG.

【図７】図６の積層板に残存する不要な銅箔をエッチン
グ処理により除去した状態を示す説明図である。7 is an explanatory diagram showing a state where unnecessary copper foil remaining on the laminated plate of FIG. 6 is removed by an etching process.

【図８】図７の端子の端子用レジスト剤を除去して形成
された端子付きめっき回路体を示す斜視図である。8 is a perspective view showing a plated circuit body with a terminal formed by removing the terminal resist agent of the terminal of FIG. 7. FIG.

【図９】従来のプリント配線板の回路導体に外部接続用
端子を接続する工程を示す説明図である。FIG. 9 is an explanatory diagram showing a step of connecting an external connection terminal to a circuit conductor of a conventional printed wiring board.

【図１０】図９の回路導体に端子を挿着した状態を示す
説明図である。10 is an explanatory diagram showing a state in which a terminal is attached to the circuit conductor of FIG.

【図１１】図１０の端子と回路導体とをめっき処理によ
り接続した状態を示す説明図である。11 is an explanatory diagram showing a state in which the terminals and circuit conductors of FIG. 10 are connected by plating.

【符号の説明】[Explanation of symbols]

Ａ 回路用レジスト剤 Ｂ 端子用レジスト剤 Ｐ 端子付きめっき回路体 １ 積層板 ３ 金属膜 ４ 回路パターン ５ 端子 ６ 電気接触部 ９ 回路導体 A Circuit resist agent B Terminal resist agent P Terminaled plated circuit body 1 Laminated plate 3 Metal film 4 Circuit pattern 5 Terminal 6 Electrical contact part 9 Circuit conductor

【手続補正書】[Procedure amendment]

【提出日】平成７年３月１６日[Submission date] March 16, 1995

【手続補正１】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】０００９[Correction target item name] 0009

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【０００９】端子５は、その接続部６の両側縁に複数の
加締片８が形成されており、図４に示すように、積層板
１に対し回路パターン４の上から、加締片８を挿通し、
図５に示すように、積層板１のポリエステルフィルム２
側で加締片８を加締めることにより固定される。[0009] terminal 5, the plurality of clamping pieces 8 on both side edges of the connecting portion 6 is formed, as shown in FIG. 4, from the top of the circuit pattern 4 to laminate 1, Kashimehen 8 Through
As shown in FIG. 5, the polyester film 2 of the laminate 1
It is fixed by swaging the swaging piece 8 on the side.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/40 Ｃ 7511−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical indication H05K 3/40 C 7511-4E

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 積層板を構成する金属膜に回路用レジス
ト剤を回路パターンを除く部分に印刷し、該回路パター
ンの所定の位置に、回路用レジスト剤の溶剤に対して不
溶性を有する端子用レジスト剤を電気接触部に被覆して
成る端子を接合した後、めっき処理を施して該回路パタ
ーンに回路導体を形成し、次いで回路用レジスト剤の溶
剤を用いて回路用レジスト剤を除去した後、エッチング
処理により残存する金属膜を除去し、しかる後、端子用
レジスト剤の溶剤を用いて端子の電気接触部を被覆した
端子用レジスト剤を除去することを特徴とする端子付き
めっき回路体の製造方法。1. A terminal for printing a circuit resist agent on a portion excluding a circuit pattern on a metal film constituting a laminated plate, and for a terminal which is insoluble in a solvent of the circuit resist agent at a predetermined position of the circuit pattern. After joining the terminals formed by coating the electrical contact portion with a resist agent, plating treatment is performed to form a circuit conductor on the circuit pattern, and then the circuit resist agent is removed using a solvent for the circuit resist agent. , A residual metal film is removed by an etching process, and thereafter, the terminal resist agent covering the electrical contact portion of the terminal is removed using a solvent for the terminal resist agent. Production method.
JP15326494A 1994-07-05 1994-07-05 Manufacture of plated circuit body provided with terminal Withdrawn JPH0823157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15326494A JPH0823157A (en) 1994-07-05 1994-07-05 Manufacture of plated circuit body provided with terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15326494A JPH0823157A (en) 1994-07-05 1994-07-05 Manufacture of plated circuit body provided with terminal

Publications (1)

Publication Number Publication Date
JPH0823157A true JPH0823157A (en) 1996-01-23

Family

ID=15558661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15326494A Withdrawn JPH0823157A (en) 1994-07-05 1994-07-05 Manufacture of plated circuit body provided with terminal

Country Status (1)

Country Link
JP (1) JPH0823157A (en)

Similar Documents

Publication Publication Date Title
EP0226620B1 (en) Method of manufacturing printed circuit boards
US4720324A (en) Process for manufacturing printed circuit boards
US5266748A (en) Printed wiring board having through-holes covered with ink layer and method of manufacture thereof
US5985521A (en) Method for forming electrically conductive layers on chip carrier substrates having through holes or via holes
CN110402020B (en) Flexible printed circuit board and manufacturing method thereof
JP3606785B2 (en) Wiring board manufacturing method
JP3226959B2 (en) Manufacturing method of multilayer flexible printed circuit board
EP1049364A1 (en) Method of manufacturing multilayer wiring boards
JPH06105827B2 (en) Printed wiring board
JP4070429B2 (en) Rigid flex printed wiring board and manufacturing method thereof
JPH0823157A (en) Manufacture of plated circuit body provided with terminal
JP2700259B2 (en) Method of forming solder layer having recess in printed wiring board
EP0835046B1 (en) Component mounting board, process for producing the board, and process for producing the module
JPH0578199B2 (en)
JPH08107263A (en) Manufacturing method of printed-wiring board
JP3077392U (en) Printed board
JPH03245593A (en) Manufacture of printed wiring board
JP2002076582A (en) Component mounting board and its producing method
JPH118465A (en) Manufacture of printed wiring board through additive method
JPH05259614A (en) Resin filling method for printed wiring board
JPH05327184A (en) Manufacture of board on which electronic components are mounted
KR20030042873A (en) The method for manufacturing circuit pattern of printed circuit board using resist plating by pure metal
JPH05218598A (en) Printed-wiring board
KR20220082481A (en) Manufacturing method of wiring substrates
JPH08172256A (en) Printed-wiring board and its manufacture

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20011002