JPH08220548A - Laminating method for liquid crystal panel and its device - Google Patents

Abstract

PURPOSE: To laminate substrates together by preventing the respective substrates from being relatively slipped off when the substrates are pressed by a hydraulic means, and performing alignment in position accurately. CONSTITUTION: Holding a substrate 1 by suction blocks 2b provided for a work stage 2, holding a substrate 1' by a light permeable window section 3, and alignment marks AM provided with the substrates be photographed by alignment units 4, so that alignment in the relative positions of the two substrates is thereby performed. Next, the two substrates 1 and 1' are brought into contact with each other while spacers are being sandwiched in between, in a state that the substrate 1 is held by the suction blocks 2b, a space between the work stage 2 and the light permeable window section 3 is made negative in pressure, and a diaphragm 2a is displaced downward, so that the substrates 1 and 1' are thereby pressed. At this time, the suction blocks 2b are displaced together with the diaphragm 2a while the substrate 1 is being held as it is. Following which, light is radiated from a lamp 8 to adhesives applied to the substrates, so that the adhesives are thereby hardened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel bonding method and device for bonding a transparent substrate and a transparent substrate or a transparent substrate and a semiconductor substrate with a photo-curing adhesive in the process of assembling a liquid crystal panel.

[0002]

2. Description of the Related Art Liquid crystal screens are classified into transmission type and reflection type. The transmissive liquid crystal screen includes a liquid crystal panel, a driver that controls the liquid crystal panel, and a backlight that illuminates the liquid crystal panel from the back side. The liquid crystal panel encloses liquid crystal and controls the voltage applied to it to transmit or block light from the backlight to display a screen. In this case, the liquid crystal panel is composed of two glass substrates.

On the other hand, the reflection type liquid crystal screen utilizes room light without using a backlight, and one substrate is composed of a semiconductor substrate or the like having a mirror surface for reflecting light.
The room light incident on the liquid crystal panel passes through the glass substrate and the liquid crystal layer, is then reflected by the reflecting mirror surface, passes through the liquid crystal layer and the glass substrate again, and displays a screen. The reflective liquid crystal screen has an advantage of low power consumption because it does not use a backlight.

Recently, a resin substrate has been used instead of a glass substrate for cost reduction. Usually, a driving element for driving a liquid crystal, for example, a thin film transistor (TFT), is provided on one of two substrates (a glass substrate, a resin substrate or a semiconductor substrate) constituting a liquid crystal panel.
And a liquid crystal driving electrode formed of a transparent conductive film.

On the other glass substrate (or resin substrate), a light shielding film called a black matrix and a color filter in the case of a color liquid crystal panel are formed. The black matrix is formed of, for example, a chrome vapor-deposited film or a black resin, and the light other than the liquid crystal that is not related to image display, that is, the liquid crystal drive element or the wiring part, emits light from the backlight or reflecting mirror surface. It acts as a blindfold so as not to leak and disturb the image.

FIG. 12 is a diagram showing an example of the above-mentioned liquid crystal panel (color liquid crystal panel). In FIG.
Is a color filter substrate, 102 is a TFT substrate, 103 is a TFT element (thin film transistor), 104 is a black matrix, 105 is a scattering spacer, 106 is an alignment film,
107 is a sealant, and 108 is a display ITO electrode. It should be noted that the figure is shown in a reduced scale in the horizontal direction as compared with the vertical direction in order to facilitate understanding.

In the manufacturing process of the liquid crystal panel, the above two glass substrates are separately manufactured and then bonded together with an adhesive (a sealant 107 in FIG. 12). At this time, spherical fine particles called spacers (see FIG. 1) are formed between the two glass substrates.
The spacer 105 in 2 is sprayed to form a gap for injecting liquid crystal between the two glass substrates.
The adhesive also serves as a seal for preventing liquid crystal from leaking. That is, the adhesive is applied in a thin line shape so as to surround the screen display portion. The width of the line is 1 to 1.5 m
m.

FIG. 13 is a view showing a state in which an adhesive (sealant) is applied on a glass substrate. As shown in FIG. 13, usually a plurality of products (four faces in the same figure) are formed on the glass substrate. Is installed. Then, an adhesive is applied so as to surround each product, and after adhering to a part thereof, an injection port for injecting liquid crystal is provided. If necessary, an adhesive is applied to the four corners of the glass substrate for temporary fixing, and the two glass substrates are temporarily fixed with the adhesive for temporary fixing, and then the two glass substrates are bonded together.

When the two substrates are bonded together, the two substrates are aligned so that the black matrix correctly overlaps with the portion to be shielded from light. Furthermore, so that the gap (gap) is uniform over the entire surface of the substrate,
The adhesive is cured while applying pressure in the direction in which the two substrates are relatively close to each other. As a method of bonding two substrates, a method of temporarily fixing the two substrates and then permanently curing the adhesive has been used as described in (1) below. (1) Method of Main Curing Adhesive After Temporary Fixing As shown in FIG. 13, a thermosetting adhesive is applied to the substrate, and the temporary fixing adhesive is applied to the four corners thereof. Then, after aligning the two substrates, heat or irradiate light such as ultraviolet rays, and use the adhesive for temporary fixing to
Temporarily fix the substrates.

As the above-mentioned temporary fixing device, for example, the device shown in FIG. 14 can be used. In order to temporarily fix a substrate (referred to as a work), the two works 1 and 1'are fixed to the work stage 202 and the work stage 203 by vacuum suction or the like, and the two works 1 and 1'are set to about 0. 5m
The distance is about m. Then, alignment light is emitted from the alignment light source 206 through the light guide fiber 204, and the work 1 is produced by the alignment unit 4 including an optical microscope and an image receiving element such as a CCD.
Alignment mark AM marked on the opposite surface of 1 '
Is displayed, and the alignment mark AM is displayed on the monitor 205 (the alignment unit 4 is provided at at least two places (not shown in the figure)).

Next, the X, Y, Z and θ axis moving mechanism 201
One of the workpieces 1'is X, Y, θ (X, Y are orthogonal axes parallel to the substrate surface, Z is an axis perpendicular to the substrate surface, and θ is a rotation about an axis perpendicular to the X and Y planes). The alignment marks AM of the two workpieces are aligned with each other. Next, the work 1 ′ is moved in the Z-axis direction and pressure is applied in a direction in which the two works relatively approach each other, and the work 1 and the work 1 1 ′ are heated by the heaters incorporated in the work stage 202 and the work stage 203. Is heated to cure the temporary adhesive.

Then, a plurality of temporarily fixed two substrates (workpieces) are stacked and placed in a heating furnace or the like so that the gaps between the substrates become uniform over the entire surface of the substrate.
The adhesive is fully cured by heating while applying a larger pressure in a direction in which the two substrates relatively approach each other. The above temporary fixing method has the following problems. (a) Two steps are required, a temporary fixing step and a main curing step for the adhesive, which complicates the steps. (b) In order to align the two substrates at the time of temporary fixing, it is necessary to keep the distance between the substrates by a predetermined amount (for example, about 0.5 mm). If the depth of focus of the microscope of the alignment unit is increased for simultaneous observation, the magnification or resolving power of the microscope of the alignment unit cannot be increased, and high-precision alignment cannot be performed.

The method (1) has the above-mentioned problems, and therefore, recently, the following method (2) of main curing without temporary fixing has been proposed. (2) A method of fully curing the adhesive without temporary fixing. A thermosetting adhesive is applied to the substrate as shown in FIG. Then, the two substrates are brought into contact with each other, the two substrates are aligned with each other, and the thermosetting adhesive is fully cured by heating while applying pressure in a direction in which the two substrates approach each other.

At that time, as a method of pressing the substrate,
(A) A method of applying a mechanical pressure in a direction in which two substrates approach each other by using a hydraulically driven cylinder or the like, or (b) a method of pressurizing the substrates using air pressure or a vacuum. A method of applying a pressure by a fluid means such as applying a negative pressure between two substrates to apply pressure is used. FIG. 15 is a diagram showing an example of an apparatus for adhering liquid crystal substrates without temporary fixing by the method (a).

In the figure, in order to bond the liquid crystal substrates, first, the substrate (referred to as a work) 1 coated with the adhesive as described above is placed on the work stage 202, and the work 1'is placed on the work stage 203 in vacuum. Fix by adsorption. Next, the work stage 203 is moved in the vertical direction by the X, Y, Z, θ moving mechanism 201, and the work 1, 1 ′ is moved.
To contact and pressurize.

Then, the alignment light is guided from the optical fiber 204, and the alignment mark AM marked on the facing surfaces of the works 1 and 1'is composed of an optical microscope and an image receiving element such as a CCD. An image is received by the alignment unit 4 and displayed on the monitor 205 (not shown in the figure, the alignment unit 4 is provided at at least two places as described above).

Then, the work stage 203 is moved horizontally by the X, Y, Z, θ moving mechanism 201,
The alignment mark AM on the work 1 and the alignment mark AM on the work 1 ′ are made to coincide with each other by rotating.
When the alignment marks AM on the works 1 and 1 ′ match, the through hole 203 provided in the work stage 203
Air is blown onto the lower surface of the work 1 ′ via a to press the work 1, 1 ′.

Then, the works 1 and 1'are heated by a heater or the like provided on the work stages 202 and 203 to cure the thermosetting adhesive, or the works 1 and 1 '
1'is irradiated with light to cure the photocurable adhesive.

[0019]

By the way, the above-mentioned FIG.
The conventional technique shown in 1) has the following problems. (1) When pressurizing the works 1, 1'by fluid means,
Work 1'shifts left and right with respect to work 1 (usually this is called "image shift"). Therefore, the work 1,
Even if 1'is aligned with high precision, the positions of the 1's are displaced from each other when being pressed, resulting in product defects. In particular, in recent years, an accuracy of about 1 μm has been required for the alignment of the works 1 and 1 ′, and the above positional deviation becomes a serious problem. (2) When the positions of the two substrates in the XY directions are finely adjusted in a pressurized state to perform the alignment, the spacers arranged between the substrates are rubbed on the substrate surface, and the substrates are scratched or damaged. There is a danger of destroying the elements above.

In order to prevent the substrate from being scratched,
Although it is possible to perform the alignment by separating the substrates by about 0.5 mm as in the case of (1), in this case, the alignment accuracy is lowered as in the case of (1). Furthermore, in the above method, when the substrates are bonded together by using a thermosetting adhesive, a high temperature treatment is required to cure the adhesive, and the thermal expansion of the substrate causes the two substrates to adhere during curing. The board may be displaced, which may cause product defects.

For this reason, recently, as described above, an adhesive technique has been developed and used in which a photo-curable adhesive agent is used and it is cured by light without applying heat. However, in the above-described method, in order to cure the photo-curable adhesive by irradiating light such as ultraviolet rays, a mechanism for fixing the substrate such as vacuum suction means to the work stage, and a mechanism for pressing the substrate. Furthermore, it is necessary to provide a light transmitting portion for irradiating the substrate with light, which complicates the structure of the work stage.

The present invention has been made in order to solve the above-mentioned problems of the prior art, and a first object of the present invention is to prevent positional displacement between substrates when pressure is applied by a fluid means. An object of the present invention is to provide a liquid crystal substrate bonding method and device capable of performing highly accurate alignment. A second object of the present invention is to provide a liquid crystal panel laminating apparatus capable of curing an adhesive using a photocurable adhesive without heating the substrate.

A third object of the present invention is to provide a liquid crystal capable of highly accurately aligning the substrates without temporarily fixing the substrates, without damaging the substrates or destroying the elements on the substrates. A panel bonding method and device are provided.

[0024]

In order to solve the above problems, the invention of claim 1 of the present invention is a liquid crystal panel in which a transparent substrate and a transparent substrate or a transparent substrate and a semiconductor substrate are bonded by a photocurable adhesive. In the bonding method, the two substrates are held by the work stage and the light transmitting window portion to align the relative positions of the two substrates, and then the two substrates are sandwiched by a spacer. In the direction in which the two substrates are relatively close to each other in a state where the substrates are held by the substrate holding means provided on the work stage and movable in the direction perpendicular to the substrate holding surface of the work stage. The substrate is pressed by a fluid means and the adhesive is irradiated with light to cure the adhesive.
According to a second aspect of the present invention, in the first aspect of the invention, the two substrates have a gap larger than the diameter of the spacers dispersed between the substrates and the adhesive is not separated or divided. And the relative positions of the two substrates are aligned in this state.

According to a third aspect of the present invention, in the second aspect of the invention, a direction in which the two substrates come into contact with each other from a time point when the two substrates cannot substantially move with the spacer interposed therebetween. The adjustment mechanism that absorbs the force of
At least three work stages or light transmission window portions are provided, and the work stage and / or the light transmission window portion are moved in a direction in which the two substrates are in contact with each other with the spacer interposed therebetween, and the two substrates serve as spacers. Even if they are sandwiched and come into contact with each other, the movement is still continued, and when all of the adjusting mechanisms are displaced by a predetermined amount, the work stage and / or
Alternatively, by stopping the movement of the light transmitting window and holding the displacement state at that time in each adjusting mechanism,
Place the two substrates in contact with each other with the spacers in between,
Then, by moving the work stage and / or the light transmitting window portion by a predetermined distance in the direction opposite to the moving direction, a gap larger than the diameter of the spacer and in which the adhesive is not peeled or divided is formed. The two substrates are held in parallel with each other.

According to a fourth aspect of the present invention, a light irradiation section for emitting light, a work stage for holding a transparent substrate or a semiconductor substrate, and a transparent substrate are held, and the light from the light irradiation section is transparent. A light-transmitting window part having a light-transmitting window for irradiating the substrate or the transparent substrate or the adhesive applied to the semiconductor substrate; and a moving mechanism for rotating the work stage or the light-transmitting window part in a horizontal and vertical direction. A fluid pressure applying means for applying a pressure in a direction in which the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate are relatively close to each other, and the relative position of the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate is a predetermined position. In a device for laminating a liquid crystal panel, which is provided with a position adjusting mechanism for adjusting the relationship, it is possible to move to the work stage in a direction perpendicular to the work stage. , It is provided with a substrate holding means equipped with a mechanism for holding the one of the substrates.

According to a fifth aspect of the present invention, in the fourth aspect of the invention, a diaphragm that is displaced by air pressure is attached to the work holding surface of the work stage, an opening is provided in the diaphragm, and a substrate is provided in the opening. The substrate holding surface of the holding means is fixed. According to a sixth aspect of the present invention, in the fifth aspect of the invention, means for providing a negative pressure to the space between the work stage and the light transmitting window portion is provided, and by making the space negative, the diaphragm is displaced. It is configured to pressurize two substrates.

The invention of claim 7 of the present invention is the invention of claims 4 and 5.
Alternatively, in the invention of claim 6, a support plate and a stopper are provided in the peripheral portion of the light transmitting window portion, the substrate is placed on the light transmitting window portion, and the substrate is sandwiched by the support plate and the stopper to expose the substrate to the light. The adhesive is cured by being held in the transmission window portion and irradiating the substrate with light from a light irradiation portion provided below the light transmission window portion through the light transmission window portion.

The invention of claim 8 of the present invention is the invention of claim 4,
In the invention of claim 5, 6 or 7, a light guide fiber for guiding the light from the light irradiation portion to the emission end and a moving mechanism for moving the emission end relative to the adhesive applied to the substrate are provided. The adhesive is cured by irradiating light while moving relative to the adhesive. According to a ninth aspect of the present invention, in the invention according to the fourth, fifth, sixth, seventh or eighth aspect, a gap setting for setting the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate in parallel and at a constant interval. A mechanism is provided, and the gap setting mechanism is configured by at least three adjusting mechanisms provided on the work stage or the light transmitting window portion, and means for displacing the three adjusting mechanisms by absorbing the driving force from the moving mechanism. And a detecting means for detecting that the adjusting mechanism is displaced by a desired amount, and a holding means for retaining the displacement state at that time, and driving the moving mechanism to move the work stage or the light transmitting window part. When the two substrates are moved in the contacting direction with the spacer interposed therebetween and the moving mechanism is continuously driven even after the two substrates are contacted with the spacer interposed therebetween, the two substrates are Contact across the spacer, from the time that can no longer be moved substantially higher, so that the adjustment mechanism begins to displace to absorb the driving force from the moving mechanism is obtained by placing each adjustment mechanism.

[0030]

According to the first aspect of the present invention, each of the two substrates is held by the work stage and the light transmitting window, and the relative positions of the two substrates are aligned.
Next, the two substrates are brought into contact with each other with a spacer interposed therebetween, and while the substrates are held by the substrate holding means, the two substrates are pressurized by fluid means in a direction in which the two substrates relatively approach each other, Since the adhesive is irradiated with light to cure the adhesive, the substrates are not laterally displaced when the two substrates are pressed by the fluid means. Therefore, the works can be attached to each other without lowering the alignment accuracy.

In the invention of claim 2 of the present invention, in the invention of claim 1, a range in which the two substrates are larger than the diameter of the spacers scattered between the substrates and the adhesive is not peeled or divided. Since the two substrates are positioned with a gap between them and the relative positions of the two substrates are aligned in this state, the liquid crystal substrates can be bonded together without temporarily fixing them and without lowering the alignment accuracy. You can Further, at that time, the substrate is not scratched and the elements on the substrate are not destroyed.

According to a third aspect of the present invention, in the second aspect of the invention, the two substrates come into contact with each other from a time point when the two substrates cannot substantially move with the spacer interposed therebetween. Since at least three adjusting mechanisms that absorb the force in the directional direction and start to be displaced are provided on the work stage or the light transmitting window section, it is possible to make the two substrates parallel and in parallel by adding a simple and inexpensive mechanism. Can be set to the gap of.

According to a fourth aspect of the present invention, a light irradiation section that emits light, a work stage that holds a transparent substrate or a semiconductor substrate, and a transparent substrate are held, and the light from the light irradiation section is held by the work stage. A light transmitting window portion having a light transmitting window for irradiating the transparent substrate or the adhesive applied to the transparent substrate or the semiconductor substrate, and a moving mechanism for rotating and moving the work stage or the light transmitting window portion in the horizontal and vertical directions. A fluid pressure means for applying a pressure in a direction in which the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate are relatively close to each other, and the relative position of the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate is set to a predetermined value. In a device for laminating a liquid crystal panel equipped with a position adjusting mechanism for adjusting a positional relationship, the work stage can be moved in a direction perpendicular to the work stage. Further, since the substrate holding means having a mechanism for holding one of the substrates is provided, when the two substrates are pressurized by the fluid means, the substrates are laterally displaced as in the invention of claim 1. The work can be attached without degrading the alignment accuracy.

Further, since the photo-curing adhesive can be used to cure the adhesive without heating the substrates, thermal expansion of the substrates causes the two substrates to shift during the bonding and curing, It does not cause product defects. According to a fifth aspect of the present invention, in the fourth aspect of the invention, a diaphragm that is displaced by air pressure is attached to the work holding surface of the work stage, an opening is provided in the diaphragm, and the substrate holding means is provided in the opening. Since the substrate holding surface is fixed, the substrate can be pressed by the substrate holding means without blowing air onto the substrate, and the work is not contaminated by air containing dust.

According to a sixth aspect of the present invention, in the fifth aspect of the invention, means for making the space between the work stage and the light transmitting window portion negative pressure is provided, and by making the space negative pressure, Since the diaphragm is displaced to pressurize the two substrates, the air existing between the works can be discharged and the gap between the works can be made uniform.

According to a seventh aspect of the present invention, in the fourth, fifth or sixth aspect of the invention, a support plate and a stopper are provided in the peripheral portion of the light transmitting window portion, and the substrate is provided in the light transmitting window portion. The substrate is held on the light transmitting window portion by placing it and sandwiching the substrate with the support plate and the stopper, and the light from the light irradiation portion provided below the light transmitting window portion is passed through the light transmitting window portion. Since the substrate is irradiated, the substrate can be fixed to the light-transmitting window simply by sandwiching the substrate with the support plate, and the vacuum suction mechanism, etc., is attached to the light-transmitting window made of quartz glass, which is relatively difficult to process. The structure of the light transmitting window portion can be simplified because there is no need to provide any.

The invention of claim 8 of the present invention is the invention of claim 4,
In the invention of claim 5, 6 or 7, a light guide fiber for guiding the light from the light irradiation portion to the emission end and a moving mechanism for moving the emission end relative to the adhesive applied to the substrate are provided. Since the adhesive is hardened by irradiating light while moving it relative to the adhesive, the light utilization rate can be significantly improved, and the adhesive can be effectively used with a lamp with a small output. Can be cured. Further, since the light spot does not come off from the adhesive, there is no risk of irradiating light to an undesired part and causing deterioration or the like.

The invention of claim 9 of the present invention is the same as that of claim 4,
In the invention of claim 5, 6, 7 or claim 8, a gap setting mechanism for setting the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate in parallel and at a constant interval is provided, and the gap setting mechanism is used as a work stage or an optical device. It is composed of at least three adjusting mechanisms provided in the transmission window, and the three adjusting mechanisms absorb the driving force from the moving mechanism and are displaced, and detect that the adjusting mechanism is displaced by a desired amount. Since the detecting means and the holding means for holding the displacement state at that time are provided, the two substrates can be arranged in parallel and in a desired manner by adding a simple and inexpensive mechanism as in the invention of claim 3. It can be set to a gap.

[0039]

FIG. 1 is a diagram showing a first embodiment of the present invention. In FIG. 1, 1 and 1'are works, 2 is a work stage, and 3 is a light transmission window. A diaphragm 2a made of, for example, stainless steel is attached to the lower surface of the work stage 2, and the work stage 2 is provided with an air suction pipe 2d for sucking air.
A flange 2e is attached to the upper part of the work stage 2, and an air suction port 2h is attached to the upper end of the flange 2e.
Is provided.

A suction block 2b is attached to the work stage 2 so as to be vertically slidable with respect to the work stage 2. The lower end of the suction block 2b is fixed to the diaphragm 2a by means such as brazing. Has been done. Then, the suction block 2b and the diaphragm 2
An air suction pipe 2c is provided so as to penetrate through a. Further, a flange 2f is attached to the peripheral portion of the work stage 2, and the flange 2f is connected to the light transmitting window portion 3 via a bellows 2g. The work stage 2, the flange 2f, the bellows 2g, and the light transmitting window. The part 3 forms a closed space.

FIG. 2 is a view showing an example of the attachment structure of the suction block in the work stage 2 described above. FIG. 2 (a) is a view of the work stage 2 seen from above, (b).
Is a sectional view taken along the line AA in FIG.
-B sectional drawing, (d) has shown the attachment part of the adsorption | suction block. As shown in the figure, the flange 2e is attached so as to cover the upper surface of the work stage 2,
e and a hole penetrating the work stage 2 are provided, and the suction block 2b is slidably attached to the hole.

At least three suction blocks 2b are provided as shown in FIG.
As shown in FIG. 3D, the suction block 2b is slidably attached to the work stage 2 by a cross roller guide 2j, and is attached to the lower end of the suction block 2b by means such as brazing. The diaphragm 2a is attached.

An air suction pipe 2c is provided so as to penetrate the suction block 2b and the diaphragm 2a. Then, as will be described later, air is sucked from the air suction pipe 2c to hold the works 1, 1'into the suction block.
On the other hand, the work stage 2 is provided with an air suction pipe 2d, and when the works 1, 1'are fixed to the work stage 2, air is sucked from the air suction port 2h provided in the flange 2e, and the diaphragm 2a is fixed to the work stage 2. Vacuum adsorption to.

When pressurizing the works 1 and 1 ', the air suction port 2h is opened to the atmosphere, and air is sucked from an air suction pipe 3d provided in a light transmission window described later to displace the diaphragm 2a downward. (Diaphragm displacement is about 1 mm at most). At this time, the suction block 2b moves together with the diaphragm 2a while vacuum-sucking the work 1.

Returning to FIG. 1, the work stage 2 is attached to one end of the gap adjusting mechanism 7, and the other end of the gap adjusting mechanism 7 is attached to the base 21b.
Then, as will be described later, when the work stage 2 is pushed upward, the lower end portion of the gap adjusting mechanism 7 moves upward, and the gap (gap) between the works 1 and 1 ′ is set parallel and constant. .

Although the example in which the gap adjusting mechanism is attached to the four corners is shown in the same drawing, it is sufficient if the gap adjusting mechanism at least at the three corners functions, and the other one is the light transmitting window portion 3. A support member that movably supports the base 21a may be used. On the other hand, the light transmission window portion 3 is provided with the air suction pipe 3d as described above, and when pressurizing the works 1 and 1 ', air is sucked from the air suction pipe 3d, the work stage 2 and the flange. The closed space formed by 2f, the bellows 2g, and the light transmission window portion 3 is in a negative pressure state.

A support plate 5 and a stopper 6 are provided on the light transmitting window portion 3, and the work 1'is fixed to the light transmitting window portion 3 by the support plate 5 and the stopper 6. Further, the light transmitting window portion 3 is provided with a light transmitting window 3a, and light such as ultraviolet rays emitted from below is transmitted through the light transmitting window 3a.
1'is irradiated. FIG. 3 shows the support plate 5 and the light transmission window 3 described above.
It is a figure which shows the attachment structure of a, and as shown in the figure (b), the support plate 5 is attached to two sides of the periphery of the light transmission window 3a, and the stopper 6 is attached to the side which opposes them, for example. Has been. The light transmitting window 3a made of quartz glass or the like is attached to the light transmitting window portion 3 by a window fixing plate 3c.

Then, the support plate 5 is biased in the direction of the stopper 6 by the spring 5a, and the work 1'is clamped by the support plate 5 and the stopper 6 and fixed on the light transmitting window 3. Further, as shown in FIG. 3A, an opening of an air suction pipe 3b is provided on the lower surface side of the support plate 5 as necessary, and the work 1'is clamped by the support plate 5 and the stopper 6, and then air suction is performed. By sucking air from the tube 3b and fixing the support plate 5 by vacuum suction, the work 1'can be prevented from moving due to vibration or the like.

If the pressure sucked from the air suction pipe 3b is V1 (negative pressure) and the pressure sucked air from the air suction pipe 3d is V2 (negative pressure), then | V1 |
By setting> | V2 |, the fixed state of the support plate 5 is released when the closed space formed by the work stage 2, the flange 2f, the bellows 2g, and the light transmission window portion 3 is set to a negative pressure state. Never.

Returning to FIG. 1, the light transmitting window 3 has X, Y, and θ.
An axis moving mechanism 23 and a Z axis moving mechanism 24 are provided,
When aligning the workpiece, the light transmission window 3
It is driven in the X, Y, Z, and θ directions by the X, Y, and θ axis moving mechanism 23 and the Z axis moving mechanism 24. FIG. 4 shows the above X, Y,
It is a figure which shows an example of a structure of the (theta) axis moving mechanism 23 and the Z axis moving mechanism 24, The figure (a) is the figure which looked at the light transmission window part and X, Y, (theta), and Z axis moving mechanism from the side, FIG. 6B shows a view of the light transmitting window and the X, Y, θ and Z axis moving mechanism as viewed from above.

As shown in FIG. 9A, a Z-axis drive section 24b is attached to the base 21a, and the cam 24c is driven by the Z-axis drive section 24b in the direction of the arrow in the figure. A Z stage 24a is mounted on the cam 24c via a roller 24d so as to be movable in the vertical direction.
When the cam 24c moves in the direction of the arrow in the figure by the Z-axis drive unit 24b, the Z stage 24a moves up and down.

Further, on the Z stage 24a, FIG.
As shown in, X-axis drive units 23a and 23a 'and Y-axis drive unit 23d are attached, and X-axis drive units 23a and 23a are attached.
a'and the Y-axis drive unit 23d drive the rollers 23b, 23
b ′ and 23e are driven in the direction of the arrow in the figure. On the other hand, the light transmitting window portion 3 is attached by a bearing or the like so as to be movable and rotatable in the X and Y axis directions on the Z stage 24a, and the light transmitting window portion 3 is attached by a spring or the like (not shown). ) Downward and to the left. Also,
The X-axis driven members 23c, 23c ', Y
The shaft driven member 23f is attached to the roller 23.
It is in contact with b, 23b 'and 23e.

When the light transmitting window portion 3 is moved in the X-axis direction, the X-axis driving portions 23a and 23a 'are driven without driving the Y-axis driving portion 23d, and the rollers 23b and 23b are driven.
b ′ is moved in the direction of the arrow in FIG. As a result, the light transmitting window portion 3 moves in the vertical direction in FIG.
Further, when moving the light transmitting window portion 3 in the Y-axis direction,
The Y-axis driving unit 23d is driven without driving the X-axis driving units 23a and 23a 'to move the roller 23e in the arrow direction of FIG. As a result, the light transmission window portion 3 moves in the left-right direction in FIG.

Further, when the light transmitting window portion 3 is rotated in the clockwise direction (counterclockwise direction), the X-axis drive portions 23a, 23 are provided.
a ', the Y-axis drive unit 23d is driven to drive the X-axis drive unit 23d.
The roller 23b 'of a'is moved upward (downward) in FIG.
To move the roller 23e of the Y-axis drive unit 23d rightward (leftward), and move the roller 23b of the X-axis drive unit 23a downward (upward).

Returning to FIG. 1, reference numeral 4 denotes an alignment unit composed of an optical microscope and an image receiving element such as a CCD. The alignment unit 4 is provided at at least two places as shown in FIG. Workpieces 1 and 1'by receiving the alignment marks AM marked 1 and 1 '
Align the. Also, the alignment unit 4
Is attached so as to be movable in the direction of the arrow in the figure, and moves forward to the position shown in the figure during alignment, and retracts from the position shown in the figure during light irradiation.

The alignment unit 4 is provided with a high-magnification and low-magnification optical microscope and two CCDs so that images of different magnifications can be received. As will be described later, the magnification of the alignment unit can be switched. , Coarse alignment and fine alignment are performed. FIG. 5A is a diagram showing the structure of the alignment unit, in which light emitted from a light source (not shown) is marked on the work 1, 1 ′ through the optical fiber 4j → half mirror 4c → mirror 4a. -It is irradiated on the mark, and the reflected light enters the alignment unit.

The light incident on the alignment unit 4 is received by the CCD 4h via the mirror 4a → lens 4b → half mirror 4c → half mirror 4d → lens 4f, and at the same time the mirror 4a → lens 4b → half mirror 4c → half mirror 4d → half mirror 4e → lens 4
The image is received by the CCD 4i via g. The magnification of the optical system is different from the above, and for example, the image received by the CCD 4h has a higher magnification than the image received by the CCD 4i. The CCD output of the optical system having a low magnification is used during the rough alignment, and the CCD output of the optical system having a high magnification is used during the fine alignment.

As a mechanism for switching the magnification of the alignment unit 4, as shown in FIG.
As shown in (b), the lenses 4b, 4 having different magnifications
It is also possible to provide a turret 4k to which b'is attached and rotate the turret 4k to switch the lens. Returning to FIG. 1, 8 is a lamp such as a high pressure mercury lamp or a metal halide lamp that emits light such as ultraviolet rays, 9 is a mirror, and the light emitted by the lamp 8 is collected by the mirror 9 and passes through the light transmission window 3a. It is irradiated at 1, 1 '.

Reference numeral 31 is the X, Y and θ axis moving mechanism 23 described above.
And the Z-axis moving mechanism 24, the alignment unit 4, the gap adjusting mechanism 7, and the control unit for controlling the suction / supply of air to the air suction / supply port 2h. 6 is an exploded perspective view showing an example of the structure of the gap adjusting mechanism 7 described above, FIG.
FIG. 8 is a diagram for explaining the operation of the gap adjusting mechanism described above, and the structure and operation of the gap adjusting mechanism of the present embodiment will be described with reference to FIG.

7 (a) and 8 (a) are sectional views of the gap adjusting mechanism viewed from the X direction in FIG.
FIGS. 8B and 8B are cross-sectional views of the gap adjusting mechanism viewed from the Y direction in FIG. 6, and FIGS. 8A and 8B show the same state. In FIG. 6, 2 is a work stage, 7a is a V-shaped receiver, and V-shaped receiver 7a
Is embedded in the upper surface of the work stage 2 and is connected to the ball receiver 7d via the hard sphere 7b. A conical recess 7c corresponding to the hard sphere 7b is provided in the center of the ball receiver 7d. Therefore, when the work stage 2 is pushed from below, the work stage 2 can freely move only in the direction of the groove of the V-shaped receiver.

The work stage 2 and the ball receiver 7d
Are attracted to each other by a tension spring 7g and support the work stage 2 in the direction of the base 21b. A shaft 7e is connected above the ball receiver 7d. The shaft 7e reaches a casing 7h via a spline 7f which is a guide member, and after passing through the casing 7h,
It is connected to a leaf spring 7j which is a plate-shaped elastic body.

The shaft 7e slides within the spline 7f, and the movement of the shaft 7e is restricted only in the vertical direction by the spline 7f. Shaft 7 inside casing 7h
A compression coil spring 7i that exerts a force on the shaft 7e is provided around e. The leaf spring 7j is sandwiched by a suction block 7k which is a holding means, and a convex portion 7m is formed in a part thereof.
Is provided. The suction block 7k is provided with a sensor 7n that detects the position of the convex portion 7m. The sensor 7n is, for example, an optical sensor including a light emitting unit and a light receiving unit, and detects an interruption of light by the convex portion 7m and generates an output. Further, the suction block 7k is provided with a vacuum suction path for sucking and holding the leaf spring 7j.

The gap adjusting mechanism of this embodiment has the above-mentioned structure, and the work 1 fixed to the work stage 2 and the work 1 fixed to the work stage 2 by moving the light transmission window 3 upward. When the light transmission window portion 3 is further raised after the contact of the workpieces 1'to reach the position where the works 1 and 1'cannot move relative to each other, the compression coil spring 7i starts to compress so as to absorb the driving force. [Fig. 7 (a) (b)
reference〕.

When the light transmitting window portion 3 moves further upward, the entire surface of the work 1 comes into full contact with the work 1'of the light transmitting window portion 3. At this time, the compression amounts of the compression coil springs 7i in the gap adjusting mechanisms 7 do not necessarily match. Due to this compression, the relative position of the leaf spring 7j with respect to the suction block 7k changes, the convex portion 7m provided on the leaf spring 7j also moves, and this movement is detected by the sensor 7n (FIGS. 8A and 8B). reference〕.

As described above, when each of the gap adjusting mechanisms 7 provided on the work stage 2 is displaced by the rise of the light transmission window portion 3, the sensor 7n produces an output, and this output is produced by the control portion 31 described above. Sent to. When all the sensors 7n of the gap adjusting mechanism 7 generate an output,
The control unit 31 stops the upward movement, and the vacuum suction path 7p provided in the suction block 7k of each gap adjustment mechanism 7
Further, air is sucked to attract the leaf spring 7j, and the compression state of the compression coil 7i of the gap adjusting mechanism 7 is maintained.

As a result, the works 1 and 1'are set in a parallel state. Therefore, when the light transmitting window 3 is lowered in this state, the works 1 and 1 fixed to the work stage 2 and the light transmitting window 3 are formed. 'Can be parallel and the gap can be constant. In the above embodiment, the displacement amount of the gap setting device 7 is detected by the convex portion attached to the leaf spring, but other known means can be used as the means for detecting the displacement amount.

Further, in the above embodiment, the position of the leaf spring 7j is held by vacuum suction, but as a means for holding the displacement amount of the gap adjusting mechanism, an electric means is used, and other well-known methods are used. Means can be used.
Next, the process of bonding the liquid crystal panels by the device of the first embodiment shown in FIG. 1 will be described. (a) The light transmitting window portion 3 is moved downward by the Z-axis moving mechanism 24 to remove a part of the bellows 2g from the work stage 2 or the light transmitting window portion 3.

Next, one work 1 is attached to a predetermined position of the work stage 2, air is sucked from the air suction pipe 2c to suck the work 1 in vacuum on the suction block 2b, and air is sucked from the air suction pipe 2d. Is sucked in to suck the diaphragm 2a to the work stage 2 side, and the work 1 is fixed to the work stage 2. Further, after placing the other work 1 ′ on the light transmitting window 3 and sandwiching the work by the support plate 5 and the stopper 6, air is sucked from the air suction pipe 3 b provided in the light transmitting window 3. The support plate 5 is fixed by inhaling.

Next, the bellows 2g is attached to the periphery of the work stage 2 or the light transmitting window portion 3, and the work stage 2, the flange 2f, the bellows 2g, and the light transmitting window portion 3 form a closed space. (b) The light transmission window portion 3 is moved upward by the Z-axis moving mechanism 24 so that the work 1 fixed to the work stage 2 and the work 1 fixed to the light transmission window portion 3 are 0.2 mm to 0.3 mm.
Bring it close enough. (c) Illumination light is introduced into the alignment unit 4 to receive the alignment mark AM marked on the works 1, 1 '. In this case, the depth of focus of the alignment unit is set to 0.3 to 0.5 mm, and the alignment mark AM is received by the optical system having a low magnification (for example, the magnification is set to about x3 and the CCD 4i is used. The alignment mark AM is received).

The image of the alignment mark AM received by the alignment unit 4 is sent to the control unit 31. The control unit 31 controls the alignment mark A of the work 1.
The X-, Y-, and θ-axis moving mechanisms 23 are driven so that the positions of M and the alignment mark AM of the work 1 ′ coincide with each other,
The position of the light transmission window 3 is controlled to perform rough alignment. As a result, the alignment is performed with an accuracy of ± 3 μm at maximum. (d) The Z-axis moving mechanism 24 moves the light transmitting window portion 3 upward so that the work 1 and the work 1'are brought into contact with each other, and the light transmitting window portion 3 is further moved upward. At this time, the works 1 and 1 ′ come into contact with each other through the spacers, and the work 1
The distance between them is 5 μm to 15 μm. (e) When the light transmitting window 3 is moved further upward and all the sensors 7n of the gap adjusting mechanism 7 generate outputs, the movement of the light transmitting window 3 is stopped and the gap adjustment is performed as described above. The vacuum suction function of the mechanism 7 is activated to maintain the compression state of the compression coil 7i of the gap adjusting mechanism 7.
As a result, the work 1 and the work 1'are held in parallel.

In this state, the Z-axis moving mechanism 24 is driven to move the light transmitting window portion 3 downward so that the work 1 and the work 1 '
Is set to be larger than the diameter of the spacer and not to separate or divide the adhesive. This gap is usually 20 μm to 30 μm. (f) Illumination light is introduced into the alignment unit 4 to receive the alignment mark AM marked on the works 1, 1 ′. In this case, the depth of focus of the alignment unit is set to about 30 μm, and the alignment mark AM is received by an optical system having a high magnification (for example,
The magnification is set to about x10 to x30 and the alignment mark AM is received by the CCD 4h).

The image of the alignment mark AM received by the alignment unit 4 is sent to the control unit 31. The control unit 31 controls the alignment mark A of the work 1.
The X-, Y-, and θ-axis moving mechanisms 23 are driven so that the positions of M and the alignment mark AM of the work 1 ′ coincide with each other,
The position of the light transmission window 3 is controlled to perform fine alignment. As a result, alignment is performed with an accuracy of about ± 1 μm.

The alignment operations in (c) and (f) are performed in the X, Y, Z, and θ directions while the operator observes a monitor (not shown) in addition to the automatic alignment by the control unit 31 as described above. Manual alignment can also be done manually. (g) The Z-axis moving mechanism 24 moves the light transmitting window portion 3 upward to bring the works 1 and 1 ′ into contact with each other. Next, the air intake port 2h provided on the flange 2e of the work stage 2 is opened to the atmosphere, the upper surface of the diaphragm 2a is brought to atmospheric pressure, and air is taken in from the air intake pipe 3d provided in the light transmitting window section 3. The closed space formed by the work stage 2, the flange 2f, the bellows 2g, and the light transmitting window 3 is negative pressure. As a result, the diaphragm 2a is displaced downward, and the works 1, 1'are pressurized. At this time, air is continuously sucked from the air suction pipe 2c of the suction block 2b, and the negative pressure of the air suction pipe 2c causes the work stage 2,
It is set to be larger than the negative pressure of the closed space formed by the bellows 2g, the light transmission window portion 3, and the like. Therefore, the suction block 2b moves downward together with the diaphragm 2a while holding the work 1.

Then, the work 8 is irradiated with light from the lamp 8 through the light transmission window 3a to cure the photo-curable adhesive applied to the works 1 and 1 '. (h) After the adhesive is hardened, the pressurization to the works 1 and 1'is stopped, the light transmission window 3 is lowered, and the bonded works 1 and 1'are taken out. As described above, in this embodiment, the work stage is provided with the slidable suction block, and the work is held by the suction block.
When the pressure of 1'is applied, the work 1 does not laterally shift and the image shift does not occur.

Therefore, the works can be bonded together without degrading the alignment accuracy. Further, a diaphragm is provided on the lower surface of the work stage, and when the pressure is applied, the closed space formed by the work stage, the bellows, and the light transmission window is made negative, so that the air existing between the works is discharged. Therefore, the gap between the works can be made uniform, and the work can be pressurized without blowing air onto the works, so that the works are not contaminated by the air containing dust.

Furthermore, since the photo-curing adhesive can be used to cure the adhesive without heating the substrates, thermal expansion of the substrates causes the two substrates to shift during bonding / curing. It does not cause product defects. Further, since the light transmitting window is provided in the light transmitting window and the light is emitted from the lower side of the substrate, the substrate can be fixed to the light transmitting window only by sandwiching the substrate with the support plate. It is not necessary to provide a vacuum suction mechanism or the like on the light transmission window made of quartz glass or the like, which is relatively difficult, but the structure of the light transmission window can be simplified.

Further, the two workpieces are brought close to each other to perform the rough alignment, and then the two workpieces are brought into contact with each other to be in a parallel state. Then, while maintaining the parallel state, the two workpieces have the diameter of the spacer. Since the two work pieces are aligned by setting them in a gap that is larger and the adhesive is not separated or divided, it is possible to perform highly accurate alignment and to bond the liquid crystal substrates without temporary fixing. it can.
Further, at that time, the substrate is not scratched and the elements on the substrate are not destroyed.

FIG. 9 is a diagram showing a second embodiment of the present invention. In this embodiment, ultraviolet rays and the like are applied only to the position on the work where the adhesive is applied using the emitting end moving mechanism and the light guide fiber. It is configured to irradiate the above light. In the figure, 40 is an emission end moving mechanism, 51 is a light irradiation section for irradiating light such as ultraviolet rays, 52 is a light guide fiber for guiding the light from the light irradiation section 51, 53 is an emission end, and 53 is an emission end. Is provided with a lens that collects the light guided from the light guide fiber 51.

The other structure is similar to that of the first embodiment shown in FIG. 1, and the same components are designated by the same reference numerals. Further, in the storage means (not shown) of the control unit 31, application position information indicating the application position of the adhesive with respect to the position of the alignment mark AM on the work 1, 1 ′, speed control information indicating the moving speed of the emitting end. Etc. are stored, and the control unit 3
1 controls the position of the emitting end 53 by the emitting end moving mechanism 40 based on the above information.

FIG. 10 is a view showing an example of the above-mentioned emission end moving mechanism 40. In FIG. 10, 53 is the above-mentioned emission end, and a light guide fiber 52 is attached to the emission end 53 to guide light. The fiber 52 has the above-mentioned light irradiation unit 51.
Light is introduced from. Further, the above-mentioned light transmission window 3a is arranged so as to face the emission end 53. 41 is a frame, 42 is an X-axis arm to which the emission end 53 is attached, the X-axis arm 42 is engaged with a ball screw 43c, and the ball screw 43c is further connected to an X-axis drive motor 43a via a coupling 43b. Are combined.

Therefore, when the X-axis drive motor 43a rotates, the ball screw 43c rotates and the X-axis arm 42 moves in the X-axis direction. The X-axis drive motor 43a, the coupling 43b, and the ball screw 43c are supported by the Y-axis arm 44, and the Y-axis arm 44 is provided with the guide rails 46a, 4 provided on the first and second guide members 46, 47.
It is attached so as to be movable along 7a. further,
The guide members 46 and 47 are fixed to the frame 41. Then, one end of the Y-axis arm is engaged with the ball screw 45c, and the ball screw 45c is further coupled with the coupling 45b.
Is coupled to the Y-axis drive motor 45a via.

Therefore, when the Y-axis drive motor 45a rotates, the ball screw 45c rotates, and the Y-axis arm 44, that is, the emitting end 53 moves in the Y-axis direction. Therefore,
By driving the X-axis drive motor 43a and the Y-axis drive motor 45a, the emission end 53 can be moved to an arbitrary position within the movable range of the X-axis arm 42 and the Y-axis arm 44 (note that the emission described above is performed). If necessary, regarding the configuration and operation of the end and emission end moving mechanism, the Japanese Patent Application No.
305910).

Next, the process of bonding the liquid crystal panels by the device of the second embodiment shown in FIG. 9 will be described. (a) Similar to (a) to (f) of the first embodiment described above, after fixing the works 1 and 1 ′ to the work stage 2 and the light transmitting window portion 3, the rough positions of the works 1 and 1 ′ are set. Align and fine position. (b) The Z-axis moving mechanism 24 moves the light transmitting window portion 3 upward to bring the works 1 and 1 ′ into contact with each other. Then, as in the first embodiment, the air intake port 2e is opened to the atmosphere, the upper surface of the diaphragm 2a is brought to atmospheric pressure, and the light transmission window portion 3 is formed.
Air is sucked through the air suction pipe 3d provided in the above, the diaphragm 2a is displaced downward, and the works 1, 1'are pressurized. . At this time, the suction block 2b moves downward together with the diaphragm 2a while holding the work 1. (c) As described above, the controller 31 stores the adhesive application position information for the position of the alignment mark AM, the movement origin information, the relative position information up to the light irradiation start position with respect to the movement origin, the speed control information, and the like. Based on these pieces of information, the control unit 31 drives the emission end moving mechanism 40 to move the emission end 53 to the movement origin, and then the work 1,
It is moved to the light irradiation start position on 1 '. (d) The control unit 31 opens the shutter 51a of the light irradiation unit 51, introduces the light emitted by the light irradiation unit 51 into the light guide fiber 52, and irradiates the light from the emission end 53 to the adhesive application portion of the work 1. . Moreover, the wavelength range of the light irradiated by the optical filter 51b is selected as needed. (e) The control unit 31 reads the adhesive application position information and the speed control information, and moves the emitting end 53 at a speed instructed by the speed control information along the adhesive application position of the work 1, 1 ′. The adhesive is moved and the light emitted from the emitting end 53 is irradiated to the application portion of the adhesive to cure the photocurable adhesive.

When the first irradiation of the adhesive is completed and the emitting end 53 returns to the light irradiation start position, the emitting end 53 is moved along the adhesive as described above, if necessary, and the second and subsequent times are performed. Irradiation. (f) When the irradiation of all the applied parts of the adhesive is completed, the control unit 31 stops the irradiation of the light from the light irradiation unit 51 and stops the movement of the emission end 53 by the emission end moving mechanism 40. (g) After the adhesive is hardened, the pressurization to the works 1 and 1'is stopped, the light transmitting window 3 is lowered, and the bonded works 1 and 1 '
Take out.

As described above, in this embodiment, the first
In addition to obtaining the same effect as the embodiment of the above, since the emitting end is moved along the application position of the adhesive and the adhesive is irradiated with light, the light utilization rate can be significantly improved. A low power lamp can effectively cure the adhesive. Further, since the light spot does not come off from the adhesive, there is no risk of irradiating light to an undesired part and causing deterioration or the like.

Further, the liquid crystal panels can be bonded while maintaining good gap uniformity by dividing the irradiation amount of light required for curing the adhesive into a plurality of times. In particular, it is possible to control the irradiation amount of light by controlling the moving speed of the emitting end, and it is possible to perform optimum irradiation of light according to the characteristics of the adhesive. In the above embodiment, the irradiation amount of light to the adhesive is controlled by the moving speed of the emission end, but the intensity of the light emitted by the light irradiation unit may be changed by a neutral density filter or the like. It is possible to control the irradiation amount of light with which the adhesive is irradiated.

Further, in the above embodiment, the adhesive application position information is stored in the control unit, and the position of the emission end is controlled by the position information. However, a sensor is attached to the emission end and the sensor is used. It is also possible to move the emitting end along the adhesive while detecting the application position of the adhesive.
FIG. 11 is a diagram showing a third embodiment of the present invention, and this embodiment shows an embodiment in which the work is pressurized by pressing the upper surface of the diaphragm with air to displace the diaphragm downward. .

In FIG. 11, the same parts as those shown in FIG. 1 are designated by the same reference numerals, and this embodiment is different from the first embodiment in that the flange 2f, bellows 2g, and
The air suction pipe 3d is removed, and when pressurizing, the flange 2e
Air is supplied to the upper surface of the diaphragm 2a from an air intake port 2h (referred to as an air intake / supply port in this embodiment) provided in the air via an air intake pipe 2d (referred to as an air intake / supply pipe in this embodiment). Other configurations are the same as those of the first embodiment shown in FIG.

Next, the process of laminating the liquid crystal panels by the device of the third embodiment shown in FIG. 11 will be described. (a) The light transmission window portion 3 is moved downward by the Z-axis moving mechanism 24, one work 1 is attached to a predetermined position of the work stage 2 as in the first embodiment, and the air suction pipe 2c is used. Air is sucked to hold the work 1 on the suction block 2b, and air is sucked from the air suction / supply pipe 2d to suck the diaphragm 2a to the work stage 2 side and fix the work 1 to the work stage 2.

The other work 1 ′ is placed on the light transmitting window 3 and the work is sandwiched by the support plate 5 and the stopper 6, and then the air suction pipe 3 provided in the light transmitting window 3 is provided.
The support plate 5 is fixed by sucking air from b. (b) Similar to (b) to (f) of the first embodiment, the work 1,
1'rough alignment and fine alignment are performed. (c) The light-transmitting window portion 3 is moved upward by the Z-axis moving mechanism 24 to bring the works 1 and 1 ′ into contact with each other. Next, air is supplied from the air suction / supply port 2h provided on the flange 2e of the work stage 2 and is supplied to the upper side of the diaphragm 2a via the air suction / supply pipe 2d, and the diaphragm 2a is displaced downward. Then, the works 1, 1 ′ are pressurized.
At this time, from the air suction pipe 2c of the suction block 2b,
As in the first embodiment, air is continuously inhaled,
The suction block 2b moves downward together with the diaphragm 2a while holding the work 1.

Next, the work 1 or 1'is irradiated with light from the lamp 8 through the light transmission window 3a to cure the photo-curable adhesive applied to the work 1 or 1 '. (h) After the adhesive is hardened, the pressurization to the works 1 and 1'is stopped, the light transmission window 3 is lowered, and the bonded works 1 and 1'are taken out. As described above, in this embodiment, air is supplied to the upper surface of the diaphragm to pressurize the work, so that the flange 2f and the bellows 2g are provided as in the first embodiment.
It is possible to simplify the configuration without the need to provide the like.

Also in this embodiment, as in the case of the second embodiment, light such as ultraviolet rays is radiated only to the position on the work where the adhesive is applied using the emitting end moving mechanism and the light guide fiber. It may be configured as follows. In addition, in the third embodiment, without providing the diaphragm 2a, air is blown out from the air suction / supply pipe 2d at the time of pressurization, so that the work 1,
You may make it pressurize 1 '.

Furthermore, in the first to third embodiments,
The X, Y, θ axis moving mechanism 23 and the Z axis moving mechanism 24 are provided on the light transmitting window side, and the gap adjusting mechanism is provided on the work stage side. The mechanism 24 may be provided on the work stage side, and the gap adjusting mechanism may be provided on the light transmission window side so as to move the work stage during alignment or when moving the work in the Z direction.

Furthermore, in the first to third embodiments, the gap adjusting mechanism is provided and the gap between the works 1 and 1'is set in parallel and constant by the gap adjusting mechanism. Instead of providing the mechanism, a means for measuring the gap between the works such as a laser interferometer may be provided, and the gap between the works may be set parallel and constant based on the measurement result by the measuring means.

Further, in the above first to third embodiments,
The light irradiation part including the lamp 8 and the mirror 9, or the light irradiation part 51 and the emission end 53 may be provided above, and the light transmission window part 3, the work stage 2 and the like may be arranged upside down correspondingly. .

[0096]

As described above, the following effects can be obtained in the present invention. (1) The work stage is provided with a substrate holding means that is movable in the vertical direction with respect to the work stage and has a mechanism for holding one of the substrates, and two substrates are held in a state of holding the substrates. Since the two substrates are pressed by the fluidic means in a direction in which they relatively approach each other, when the two substrates are pressed by the fluidic means, the substrates are not laterally displaced and the alignment accuracy is reduced. Work pieces can be attached without being forced. (2) A substrate that holds the substrate is held by attaching a diaphragm that is displaced by air pressure to the work holding surface of the work stage, providing an opening in the diaphragm, and fixing the substrate holding surface of the substrate holding means to the opening. While being held by the means, it is possible to pressurize the air without blowing it onto the substrate, and the work is not contaminated by air containing dust or the like. Further, by providing a means for making a negative pressure in the space between the work stage and the light transmission window, and by making the space negative, the diaphragm is displaced and the two substrates are pressurized. Air existing between them can be discharged, and the gap between the works can be made uniform. (3) Position the two substrates with a gap larger than the diameter of the spacers scattered between the substrates and within a range in which the adhesive is not peeled or divided, and in this state, the relative distance between the two substrates By aligning the positions, the liquid crystal substrates can be bonded to each other without temporary fixing and without lowering the alignment accuracy. In addition, during alignment, the substrate is not scratched and the elements on the substrate are not destroyed. (4) The adjusting mechanism, which absorbs the force in the contacting direction of the two substrates and starts to be displaced from the time when the two substrates cannot move substantially further with the spacer interposed therebetween, By providing at least three light-transmitting window portions, it is possible to set the two substrates in parallel and in a desired gap only by adding a simple and inexpensive mechanism. (6) A support plate and a stopper are provided around the light transmitting window portion to hold the substrate in the light transmitting window portion, and the light from the light irradiation portion provided below the light transmitting window portion is guided through the light transmitting window portion. By irradiating the substrate through the substrate, it is not necessary to provide a vacuum suction mechanism or the like on the light transmission window made of quartz glass or the like, which is relatively difficult to process, and the structure of the light transmission window can be simplified. (7) A light guide fiber that guides the light from the light irradiation section to the emission end,
By providing a moving mechanism that moves the emitting end relative to the adhesive applied to the substrate, the light utilization rate can be significantly improved, and the adhesive can be effectively removed by a lamp with a small output. Can be cured. Further, since the light spot does not come off from the adhesive, there is no risk of irradiating light to an undesired part and causing deterioration or the like.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing an example of a suction block attachment structure.

FIG. 3 is a view showing a mounting structure of a support plate and a light transmission window.

FIG. 4 is a diagram showing an example of a configuration of an X-, Y-, θ-, and Z-axis moving mechanism.

FIG. 5 is a diagram showing a structure of an alignment unit.

FIG. 6 is an exploded perspective view showing an example of the structure of a gap adjusting mechanism.

FIG. 7 is a diagram illustrating the operation of the gap adjusting mechanism.

FIG. 8 is a diagram illustrating the operation of the gap adjusting mechanism.

FIG. 9 is a diagram showing a second embodiment of the present invention.

FIG. 10 is a diagram showing an example of an emission end moving mechanism.

FIG. 11 is a diagram showing a third embodiment of the present invention.

FIG. 12 is a diagram showing an example of a liquid crystal panel (color liquid crystal panel).

FIG. 13 is a diagram showing a state in which an adhesive (sealant) is applied on a glass substrate.

FIG. 14 is a diagram showing an example of a conventional temporary fixing device.

FIG. 15 is a diagram showing an example of an apparatus for bonding liquid crystal substrates without temporary fixing.

[Explanation of symbols]

 1,1 'Work 2 Work stage 2a Diaphragm 2b Adsorption block 2c, 2d Air suction pipe 2e, 2f Flange 2g Bellows 2h Air suction port 3 Light transmission window part 3a Light transmission window 3b Air suction pipe 3c Window fixing plate 3d Air suction pipe 4 Alignment unit 5 Support plate 6 Stopper 7 Gap adjustment unit 7a V-shaped receiver 7b Hard ball 7c Recess 7d Ball receiver 7e Shaft 7f Spline 7g Extension spring 7h Casing 7i Compression coil spring 7j Leaf spring 7k Adsorption block 7m Leaf spring convex 7n Vacuum suction path 8 Lamp 9 Mirror 21a, 21b Base 23 X, Y, θ-axis moving mechanism 24 Z-axis moving mechanism 24b Z-axis driving unit 24c Cam 24d Roller 24a Z stage 23a, 23a 'X-axis driving unit 23d Y-axis driving unit 23 , 23b ', 23e Rollers 23c, 23c' X-axis driven member 23f Y-axis driven member 31 Control unit 40 Output end moving mechanism 41 Frame 42 X-axis arm 43a X-axis drive motor 43c, 45c Ball screw 43b, 45b Coupling 44 Y-axis arm 45a Y-axis drive motor 46,47 Guide member 46a, 47a Guide rail 51 Light irradiation part 52 Light guide fiber 53 Emitting end AM Alignment mark

Claims (9)

[Claims] 1. A method for laminating a liquid crystal panel, comprising laminating a transparent substrate and a transparent substrate or a transparent substrate and a semiconductor substrate with a photo-curing adhesive, wherein a work stage and a light transmission window are provided with two substrates, respectively. The two substrates are held and the relative positions of the two substrates are aligned with each other. Next, the two substrates are brought into contact with each other with a spacer interposed therebetween, and the two substrates are provided on the work stage and perpendicular to the substrate holding surface of the work stage. In the state where the substrate is held by the substrate holding means movable in the direction, the two substrates are pressed by the fluid means in the direction in which the two substrates relatively approach each other, and the adhesive is irradiated with light to form the adhesive. A method for laminating a liquid crystal panel, which comprises curing the. 2. The two substrates are positioned with a gap larger than the diameter of the spacers scattered between the substrates and within a range in which the adhesive is not peeled or divided, and the two substrates are placed in this state. The method for laminating a liquid crystal panel according to claim 1, wherein the relative positions are aligned. 3. An adjusting mechanism for absorbing a force in a contacting direction of the two substrates and starting displacement when the two substrates cannot move substantially with the spacer interposed therebetween. At least three are provided on the stage or the light transmission window part, and the work stage and / or the light transmission window part are moved in a direction in which the two substrates are in contact with each other with the spacer interposed therebetween. Even when they come into contact with each other, the movement is still continued, and when all of the adjusting mechanisms are displaced by a predetermined amount, the movement of the work stage and / or the light transmitting window is stopped, and each adjusting mechanism is By holding the displacement state at that time, the two substrates are brought into contact with each other with the spacer interposed therebetween to be in a parallel state, and thereafter, the work stage and / or the light transmission window portion is moved by a predetermined distance. By moving in a direction opposite to the moving direction, the two substrates are positioned in parallel with each other with a gap larger than the diameter of the spacer and not allowing the adhesive to be peeled or divided. The method for laminating a liquid crystal panel according to claim 2. 4. A light irradiation unit that emits light, a work stage that holds a transparent substrate or a semiconductor substrate, and a transparent substrate that holds the light from the light irradiation unit, the transparent substrate, the transparent substrate, or the semiconductor substrate. A light-transmissive window portion having a light-transmissive window for irradiating the adhesive applied to the work stage, a moving mechanism for rotating and moving the work stage or the light-transmissive window portion in the horizontal and vertical directions, the transparent substrate and the transparent substrate or A fluid pressure applying means for applying a pressure in a direction in which the transparent substrate and the semiconductor substrate are relatively close to each other, and a positioning mechanism for matching the relative positions of the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate to a predetermined positional relationship. A liquid crystal panel laminating apparatus comprising: a work stage, which is movable in a direction perpendicular to the work stage and which holds one of the substrates. An apparatus for laminating a liquid crystal panel, comprising substrate holding means having a holding mechanism. 5. A diaphragm, which is displaced by air pressure, is attached to the work holding surface of the work stage, an opening is provided in the diaphragm, and the substrate holding surface of the substrate holding means is fixed to the opening. Item 4
LCD panel laminating device. 6. A means for applying a negative pressure to the space between the work stage and the light transmitting window portion, and by applying a negative pressure to the space, the diaphragm is displaced to pressurize the two substrates. The device for laminating a liquid crystal panel according to claim 5. 7. A substrate is provided with a support plate and a stopper in the periphery of the light transmitting window portion, the substrate is placed on the light transmitting window portion, and the substrate is sandwiched by the support plate and the stopper so that the substrate is the light transmitting window portion. 7. The adhesive is cured by irradiating the substrate with light from a light irradiating portion provided below the light transmitting window portion through the light transmitting window portion to cure the adhesive. Alternatively, the device for laminating a liquid crystal panel according to claim 6. 8. A light guide fiber for guiding light from a light irradiating section to an emission end, and a moving mechanism for moving the emission end relative to an adhesive applied to the substrate, the relative movement being made relative to the adhesive. The liquid crystal panel laminating apparatus according to claim 4, 5, 6 or 7, wherein the adhesive is cured by irradiating with light while being moved. 9. A gap setting mechanism is provided for setting the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate in parallel and at a constant interval, and the gap setting mechanism is provided at least on the work stage or the light transmitting window portion. In addition to being composed of three adjusting mechanisms, the three adjusting mechanisms absorb the driving force from the moving mechanism and are displaced, a detecting means for detecting that the adjusting mechanism is displaced by a desired amount, and a displacement at that time. Holding means for holding the state, and driving the moving mechanism to move the work stage or the light transmitting window in a direction in which the two substrates are in contact with each other with the spacer interposed therebetween. When two moving substrates contact each other with the spacer in between and cannot move any more when the moving mechanism is continuously driven in that direction even after the spacer is in contact. From the point, each adjusting mechanism is arranged such that the adjusting mechanism absorbs the driving force from the moving mechanism and starts to be displaced.
A device for laminating a liquid crystal panel according to claim 6, 7 or 8.