JPH08213744A - Electronic device mounting board and soldering method therefor - Google Patents
Electronic device mounting board and soldering method thereforInfo
- Publication number
- JPH08213744A JPH08213744A JP1924795A JP1924795A JPH08213744A JP H08213744 A JPH08213744 A JP H08213744A JP 1924795 A JP1924795 A JP 1924795A JP 1924795 A JP1924795 A JP 1924795A JP H08213744 A JPH08213744 A JP H08213744A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- soldering
- lead terminals
- lead terminal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 43
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、パッケージの４方向に
リード端子が設けられている４方向リード端子付きパッ
ケージ電子部品の各リード端子とディスクリート電子部
品の各リード端子とが基板に半田付け接続されている電
子部品実装基板及びその半田付け工法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to solder connection of a lead terminal of a package electronic component with lead terminals provided in four directions of a package and a lead terminal of a discrete electronic component to a board by soldering. The present invention relates to an electronic component mounting board and a soldering method thereof.
【０００２】[0002]
【従来の技術】図２（Ａ）（Ｂ）は、基板１に４方向リ
ード端子付きパッケージ電子部品２の各リード端子２ａ
とディスクリート電子部品３，４の各リード端子３ａ，
４ａとが半田付け接続されている電子部品実装基板の従
来の半田付け工法を示したものである。2. Description of the Related Art FIGS. 2A and 2B show a lead terminal 2a of a package electronic component 2 having a four-way lead terminal on a substrate 1.
And the lead terminals 3a of the discrete electronic components 3 and 4,
4a shows a conventional soldering method for an electronic component mounting board to which 4a and 4a are connected by soldering.
【０００３】この場合には、基板１として、その一方の
面に４方向リード端子付きパッケージ電子部品２の接続
用パターン５が設けられ、他方の面にディスクリート電
子部品３，４の接続用パターン６が設けられている両面
パターン基板が用いられている。In this case, as the substrate 1, a connection pattern 5 for the package electronic component 2 with four-way lead terminals is provided on one surface thereof, and a connection pattern 6 for the discrete electronic components 3, 4 is provided on the other surface. A double-sided pattern substrate provided with is used.
【０００４】この両面パターン基板１の一方の面に設け
られている接続用パターン５に、先ず４方向リード端子
付きパッケージ電子部品２の各リード端子２ａを半田付
け部７で接続する。４方向リード端子付きパッケージ電
子部品２は隣接リード端子２ａの間隔が狭いことと、各
リード端子２ａがパッケージの４方向から出ているた
め、半田付けはリフロー半田付けで行われる。リフロー
半田付けの半田塗布は、例えばスクリーン印刷で行う。
４方向リード端子付きパッケージ電子部品２の各リード
端子２ａの半田付けを噴流半田付けで行うと、リード端
子２ａ間に半田ブリッジが発生してしまうので、噴流半
田付けは好ましくない。First, each lead terminal 2a of the package electronic component 2 with a four-way lead terminal is connected to the connecting pattern 5 provided on one surface of the double-sided pattern substrate 1 by a soldering portion 7. In the package electronic component 2 with four-direction lead terminals, the adjacent lead terminals 2a are closely spaced and each lead terminal 2a is protruded from four directions of the package, so that soldering is performed by reflow soldering. The solder application for reflow soldering is performed by screen printing, for example.
When the lead terminals 2a of the package electronic component 2 with four-way lead terminals are soldered by jet soldering, a solder bridge is generated between the lead terminals 2a, so jet soldering is not preferable.
【０００５】次に、ディスクリート電子部品３，４の各
リード端子３ａ，４ａを、４方向リード端子付きパッケ
ージ電子部品２の各リード端子２ａの半田付け部７とは
反対側の面で半田付け部８で接続する。この場合の半田
付けは、噴流半田付けで行う。Next, the lead terminals 3a and 4a of the discrete electronic components 3 and 4 are soldered on the surface opposite to the soldering portion 7 of the lead terminals 2a of the package electronic component 2 with four-way lead terminals. Connect at 8. In this case, soldering is performed by jet soldering.
【０００６】ディスクリート電子部品３，４の各リード
端子３ａ，４ａの半田付けは、一般に噴流半田付けで行
われているため、４方向リード端子付きパッケージ電子
部品２とディスクリート電子部品３，４とを共通の基板
１に半田付け接続する基板１としては両面パターン基板
が用いられていた。Since soldering of the lead terminals 3a, 4a of the discrete electronic components 3, 4 is generally performed by jet soldering, the package electronic component 2 with four-way lead terminals and the discrete electronic components 3, 4 are connected. A double-sided pattern substrate has been used as the substrate 1 which is connected to the common substrate 1 by soldering.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、両面パ
ターン基板は、片面パターン基板に比べて高価であるた
め、安価な製品を供給することが難しい問題点があっ
た。However, since the double-sided pattern substrate is more expensive than the single-sided pattern substrate, it is difficult to supply an inexpensive product.
【０００８】本発明の目的は、安価な片面パターン基板
に４方向リード端子付きパッケージ電子部品とディスク
リート電子部品とを実装できる電子部品実装基板及びそ
の半田付け工法を提供することにある。An object of the present invention is to provide an electronic component mounting board on which a package electronic component with four-way lead terminals and a discrete electronic component can be mounted on an inexpensive single-sided pattern substrate, and a soldering method therefor.
【０００９】[0009]
【課題を解決するための手段】本発明は、基板に４方向
リード端子付きパッケージ電子部品の各リード端子とデ
ィスクリート電子部品の各リード端子とが半田付け接続
されている電子部品実装基板を改良の対象としている。SUMMARY OF THE INVENTION The present invention improves an electronic component mounting board in which each lead terminal of a package electronic component with four-way lead terminals and each lead terminal of a discrete electronic component are soldered to a substrate. Intended.
【００１０】本発明に係る電子部品実装基板において
は、前記基板は片面パターン基板からなり、前記片面パ
ターン基板の同じ面に前記４方向リード端子付きパッケ
ージ電子部品の各リード端子と前記ディスクリート電子
部品の各リード端子とが半田付け接続され、前記４方向
リード端子付きパッケージ電子部品の各リード端子の半
田付け部は耐熱性被覆材で被覆されていることを特徴と
する。In the electronic component mounting board according to the present invention, the substrate is a single-sided pattern substrate, and the lead terminals of the package electronic component with the four-way lead terminals and the discrete electronic component are provided on the same surface of the single-sided pattern substrate. Each lead terminal is soldered and connected, and a soldering portion of each lead terminal of the package electronic component with four-direction lead terminals is covered with a heat resistant coating material.
【００１１】また、本発明は、基板に４方向リード端子
付きパッケージ電子部品の各リード端子とディスクリー
ト電子部品の各リード端子とが半田付け接続されている
電子部品実装基板の半田付け工法を改良の対象としてい
る。Further, the present invention improves a soldering method of an electronic component mounting substrate in which each lead terminal of a package electronic component with four-way lead terminals and each lead terminal of a discrete electronic component are soldered and connected to the substrate. Intended.
【００１２】本発明に係る電子部品実装基板の半田付け
工法においては、前記基板として片面パターン基板を用
い、前記片面パターン基板の片面に前記４方向リード端
子付きパッケージ電子部品の各リード端子を先に半田付
け接続し、該４方向リード端子付きパッケージ電子部品
の各リード端子の半田付け部を耐熱性被覆材で被覆し、
次に前記ディスクリート電子部品の各リード端子を前記
４方向リード端子付きパッケージ電子部品の各リード端
子の半田付け部と同じ面で噴流半田付け接続することを
特徴とする。In the method for soldering an electronic component mounting board according to the present invention, a single-sided pattern substrate is used as the substrate, and each lead terminal of the package electronic component with the four-way lead terminal is first formed on one surface of the single-sided pattern substrate. Soldering connection, and covering the soldering portion of each lead terminal of the package electronic component with four-direction lead terminals with a heat-resistant coating material,
Next, each lead terminal of the discrete electronic component is connected by jet soldering on the same surface as the soldering portion of each lead terminal of the package electronic component with four-direction lead terminals.
【００１３】[0013]
【作用】このように４方向リード端子付きパッケージ電
子部品の各リード端子の半田付け部を耐熱性被覆材で被
覆しておくと、この半田付け部を噴流半田付けの半田噴
流に通しても該半田付け部が再び半田にふれることがな
いため、各リード端子の間の半田ブリッジは発生しなく
なる。As described above, when the soldering portion of each lead terminal of the package electronic component with four-way lead terminals is covered with the heat-resistant coating material, even if the soldering portion is passed through the solder jet of jet soldering, Since the soldering portion does not touch the solder again, the solder bridge between the lead terminals does not occur.
【００１４】このため４方向リード端子付きパッケージ
電子部品の各リード端子の半田付け部が存在する面で、
ディスクリート電子部品の各リード端子の噴流半田付け
を行うことができる。Therefore, in the surface where the soldering portion of each lead terminal of the package electronic component with the four-direction lead terminal exists,
Jet soldering of each lead terminal of the discrete electronic component can be performed.
【００１５】[0015]
【実施例】以下、本発明の実施例を図１（Ａ）〜（Ｃ）
を参照して詳細に説明する。EXAMPLE An example of the present invention will be described below with reference to FIGS.
This will be described in detail with reference to FIG.
【００１６】本実施例では、基板１として、共通の面に
４方向リード端子付きパッケージ電子部品２の接続用パ
ターン５と、ディスクリート電子部品３，４の接続用パ
ターン６とが設けられている片面パターン基板を用い
る。In this embodiment, one side of the substrate 1 is provided with the connection pattern 5 for the package electronic component 2 with four-way lead terminals and the connection pattern 6 for the discrete electronic components 3, 4 on the common surface. A patterned substrate is used.
【００１７】この片面パターン基板１の４方向リード端
子付きパッケージ電子部品２の接続用パターン５に、図
１（Ａ）に示すように、該４方向リード端子付きパッケ
ージ電子部品２の各リード端子２ａを半田付け部７で接
続する。この場合の半田付けは、リフロー半田付けで行
う。リフロー半田付けの半田塗布は、例えばスクリーン
印刷で行う。As shown in FIG. 1 (A), each lead terminal 2a of the package electronic component 2 with four-direction lead terminals is attached to the connection pattern 5 of the package electronic component 2 with four-direction lead terminals on the one-sided pattern substrate 1. Are connected at the soldering portion 7. In this case, soldering is performed by reflow soldering. The solder application for reflow soldering is performed by screen printing, for example.
【００１８】次に、図１（Ｂ）に示すように、該４方向
リード端子付きパッケージ電子部品２の各リード端子２
ａの半田付け部７をそれぞれ耐熱性被覆材９で被覆す
る。耐熱性被覆材９としては、例えばエポキシ系，アク
リル系，シリコン系の樹脂を使用する。Next, as shown in FIG. 1B, each lead terminal 2 of the package electronic component 2 with the four-direction lead terminal
Each of the soldering parts 7 of a is covered with a heat resistant coating material 9. As the heat-resistant coating material 9, for example, epoxy-based, acrylic-based, or silicon-based resin is used.
【００１９】次に、片面パターン基板１に接続用パター
ン６に対応して設けられている図示しない部品リード挿
入孔にディスクリート電子部品３，４の各リード端子３
ａ，４ａを図１（Ｃ）に示すように通し、接続用パター
ン６を下向きにして噴流半田付けで各リード端子３ａ，
４ａを接続し、半田付け部８をそれぞれ形成する。Next, the lead terminals 3 of the discrete electronic components 3 and 4 are inserted into component lead insertion holes (not shown) provided in the one-sided pattern substrate 1 corresponding to the connection patterns 6.
a and 4a are passed through as shown in FIG. 1C, the connection pattern 6 is directed downward, and each lead terminal 3a,
4a are connected to form soldering portions 8 respectively.
【００２０】このような工程を経ることにより、片面パ
ターン基板１に４方向リード端子付きパッケージ電子部
品２とディスクリート電子部品３，４とを実装すること
ができる。Through these steps, the package electronic component 2 with four-way lead terminals and the discrete electronic components 3 and 4 can be mounted on the single-sided pattern substrate 1.
【００２１】この場合、前述したように、４方向リード
端子付きパッケージ電子部品２の各リード端子２ａの半
田付け部７を耐熱性被覆材９で先に被覆しておくと、該
耐熱性被覆材９は熱が伝わりにくく、この半田付け部７
を噴流半田付けの半田噴流に例えば３〜５秒程度通して
も内部の半田付け部７の半田は溶けず、且つ該耐熱性被
覆材９の接着強度でもその状態が保持される。また、該
耐熱性被覆材９の存在により該半田付け部７が再び半田
にふれることがないため、各リード端子の間の半田ブリ
ッジは発生しなくなる。In this case, as described above, when the soldering portion 7 of each lead terminal 2a of the package electronic component 2 with four-way lead terminals is first coated with the heat resistant coating material 9, the heat resistant coating material is formed. 9 does not easily transfer heat, and this soldering part 7
Even if the liquid is passed through a solder jet for jet soldering for about 3 to 5 seconds, for example, the solder in the internal soldering portion 7 is not melted, and the adhesive strength of the heat-resistant coating material 9 maintains the state. Further, since the soldering portion 7 does not touch the solder again due to the existence of the heat resistant coating material 9, a solder bridge between the lead terminals does not occur.
【００２２】なお、半田付け部８の半田としては、半田
付け部７の半田より融点が低いものを用いると、より良
い効果を得ることができる。If the solder of the soldering portion 8 has a melting point lower than that of the solder of the soldering portion 7, a better effect can be obtained.
【００２３】また、上記実施例では、片面パターン基板
１に１個の４方向リード端子付きパッケージ電子部品２
と２個のディスクリート電子部品３，４を接続した例に
ついて示したが、本発明はこれに限定されるものではな
く、４方向リード端子付きパッケージ電子部品を複数個
実装することもでき、またディスクリート電子部品を１
個または３個以上実装することもできる。In the above embodiment, one package electronic component 2 with four-direction lead terminals is provided on the single-sided pattern substrate 1.
Although an example in which two discrete electronic components 3 and 4 are connected is shown, the present invention is not limited to this, and a plurality of package electronic components with four-way lead terminals can be mounted, and the discrete electronic components can be mounted. Electronic parts 1
It is also possible to mount one or three or more.
【００２４】本明細書に開示した本発明のいくつかの態
様を要約して示すと、次の通りである。A summary of some of the aspects of the invention disclosed herein is as follows.
【００２５】（１） 基板に４方向リード端子付きパッ
ケージ電子部品の各リード端子とディスクリート電子部
品の各リード端子とが半田付け接続されている電子部品
実装基板において、前記基板は片面パターン基板からな
り、前記片面パターン基板の同じ面に前記４方向リード
端子付きパッケージ電子部品の各リード端子と前記ディ
スクリート電子部品の各リード端子とが半田付け接続さ
れ、前記４方向リード端子付きパッケージ電子部品の各
リード端子の半田付け部は耐熱性被覆材で被覆されてい
ることを特徴とする電子部品実装基板。(1) In an electronic component mounting board in which each lead terminal of a package electronic component with four-way lead terminals and each lead terminal of a discrete electronic component are solder-connected to the substrate, the substrate is a single-sided pattern substrate. Each lead terminal of the package electronic component with four-direction lead terminals and each lead terminal of the discrete electronic component are soldered to the same surface of the one-sided pattern substrate, and each lead of the package electronic component with four-way lead terminals is connected. An electronic component mounting board, characterized in that the soldering portion of the terminal is covered with a heat-resistant coating material.
【００２６】（２） 基板に４方向リード端子付きパッ
ケージ電子部品の各リード端子とディスクリート電子部
品の各リード端子とが半田付け接続されている電子部品
実装基板の半田付け工法において、前記基板として片面
パターン基板を用い、前記片面パターン基板の片面に前
記４方向リード端子付きパッケージ電子部品の各リード
端子を先に半田付け接続し、該４方向リード端子付きパ
ッケージ電子部品の各リード端子の半田付け部を耐熱性
被覆材で被覆し、次に前記ディスクリート電子部品の各
リード端子を前記４方向リード端子付きパッケージ電子
部品の各リード端子の半田付け部と同じ面で噴流半田付
け接続することを特徴とする電子部品実装基板の半田付
け工法。(2) In a soldering method of an electronic component mounting board, in which each lead terminal of a package electronic component with four-direction lead terminals and each lead terminal of a discrete electronic component are soldered and connected to the substrate, one side is used as the substrate. Using a pattern substrate, each lead terminal of the package electronic component with four-direction lead terminals is soldered to one surface of the one-sided pattern substrate first, and a soldering portion of each lead terminal of the package electronic component with four-way lead terminals Is coated with a heat-resistant coating material, and then each lead terminal of the discrete electronic component is connected by jet soldering on the same surface as the soldering part of each lead terminal of the package electronic component with four-way lead terminals. Electronic component mounting board soldering method.
【００２７】（３） 前記４方向リード端子付きパッケ
ージ電子部品の各リード端子を半田付けする半田は、前
記ディスクリート電子部品の各リード端子を半田付けす
る半田より融点が高いものを用いることを特徴とする請
求項２に記載の電子部品実装基板の半田付け工法。(3) The solder for soldering the lead terminals of the package electronic component with four-way lead terminals has a higher melting point than the solder for soldering the lead terminals of the discrete electronic component. The method for soldering an electronic component mounting substrate according to claim 2.
【００２８】[0028]
【発明の効果】本発明では、４方向リード端子付きパッ
ケージ電子部品の各リード端子の半田付け部を耐熱性被
覆材で被覆しておくので、この半田付け部を噴流半田付
けの半田噴流に通しても該半田付け部が再び半田にふれ
ることがないため、各リード端子の間の半田ブリッジは
発生しなくなる。このため４方向リード端子付きパッケ
ージ電子部品の各リード端子の半田付け部が存在する面
で、ディスクリート電子部品の各リード端子を噴流半田
付けで接続することができる。According to the present invention, since the soldering portion of each lead terminal of the package electronic component with four-way lead terminals is covered with the heat-resistant coating material, this soldering portion is passed through the solder jet of jet soldering. However, since the soldering portion does not touch the solder again, the solder bridge between the lead terminals does not occur. Therefore, the lead terminals of the discrete electronic component can be connected by jet soldering on the surface where the soldering portions of the lead terminals of the package electronic component with four-way lead terminals are present.
【００２９】それ故、本発明によれば、安価な片面パタ
ーン基板を用いて、４方向リード端子付きパッケージ電
子部品とディスクリート電子部品とを実装することがで
きる。Therefore, according to the present invention, a package electronic component with four-way lead terminals and a discrete electronic component can be mounted using an inexpensive single-sided pattern substrate.
【図１】（Ａ）〜（Ｃ）は本発明に係る電子部品実装基
板の半田付け工法の工程を示す説明図である。1A to 1C are explanatory views showing steps of a method for soldering an electronic component mounting board according to the present invention.
【図２】（Ａ）（Ｂ）は従来の電子部品実装基板の半田
付け工法の工程を示す説明図である。2A and 2B are explanatory views showing steps of a conventional method for soldering an electronic component mounting board.
１ 基板 ２ ４方向リード端子付きパッケージ電子部品 ２ａ リード端子 ３，４ ディスクリート電子部品 ５ ４方向リード端子付きパッケージ電子部品の接続用
パターン ６ ディスクリート電子部品の接続用パターン ７，８ 半田付け部 ９ 耐熱性被覆材1 board 2 package electronic component with 4-way lead terminal 2a lead terminal 3,4 discrete electronic component 5 connection pattern for package electronic component with 4-way lead terminal 6 connection pattern for discrete electronic component 7, 8 soldering part 9 heat resistance Coating material
Claims (2)
電子部品の各リード端子とディスクリート電子部品の各
リード端子とが半田付け接続されている電子部品実装基
板において、 前記基板は片面パターン基板からなり、前記片面パター
ン基板の同じ面に前記４方向リード端子付きパッケージ
電子部品の各リード端子と前記ディスクリート電子部品
の各リード端子とが半田付け接続され、前記４方向リー
ド端子付きパッケージ電子部品の各リード端子の半田付
け部は耐熱性被覆材で被覆されていることを特徴とする
電子部品実装基板。1. An electronic component mounting board in which each lead terminal of a package electronic component with four-way lead terminals and each lead terminal of a discrete electronic component are solder-connected to a substrate, wherein the substrate is a single-sided pattern substrate, The lead terminals of the package electronic component with 4-way lead terminals and the lead terminals of the discrete electronic component are solder-connected to the same surface of the single-sided pattern substrate, and the lead terminals of the package electronic component with 4-way lead terminals. The electronic component mounting board, wherein the soldering portion of is covered with a heat resistant coating material.
電子部品の各リード端子とディスクリート電子部品の各
リード端子とが半田付け接続されている電子部品実装基
板の半田付け工法において、 前記基板として片面パターン基板を用い、前記片面パタ
ーン基板の片面に前記４方向リード端子付きパッケージ
電子部品の各リード端子を先に半田付け接続し、該４方
向リード端子付きパッケージ電子部品の各リード端子の
半田付け部を耐熱性被覆材で被覆し、次に前記ディスク
リート電子部品の各リード端子を前記４方向リード端子
付きパッケージ電子部品の各リード端子の半田付け部と
同じ面で噴流半田付け接続することを特徴とする電子部
品実装基板の半田付け工法。2. A soldering method for an electronic component mounting board, wherein each lead terminal of a package electronic component with four-way lead terminals and each lead terminal of a discrete electronic component are soldered to a substrate, wherein a single-sided pattern is used as the substrate. Using a substrate, each lead terminal of the package electronic component with four-direction lead terminals is soldered and connected to one surface of the one-sided pattern substrate, and a soldering portion of each lead terminal of the package electronic component with four-way lead terminals is provided. It is characterized in that it is coated with a heat-resistant coating material, and then each lead terminal of the discrete electronic component is connected by jet soldering on the same surface as the soldering portion of each lead terminal of the package electronic component with four-way lead terminals. Electronic component mounting board soldering method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1924795A JPH08213744A (en) | 1995-02-07 | 1995-02-07 | Electronic device mounting board and soldering method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1924795A JPH08213744A (en) | 1995-02-07 | 1995-02-07 | Electronic device mounting board and soldering method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08213744A true JPH08213744A (en) | 1996-08-20 |
Family
ID=11994091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1924795A Pending JPH08213744A (en) | 1995-02-07 | 1995-02-07 | Electronic device mounting board and soldering method therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08213744A (en) |
-
1995
- 1995-02-07 JP JP1924795A patent/JPH08213744A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2844778B2 (en) | How to solder two types of parts to a single-sided printed circuit board | |
| JP2000124588A (en) | Electronic circuit unit and manufacture of it | |
| JPH07131139A (en) | Wiring board for electronic part | |
| JPH08213744A (en) | Electronic device mounting board and soldering method therefor | |
| JPH0357295A (en) | Method of mounting electronic components on double-sided mounting board | |
| JP2646688B2 (en) | Electronic component soldering method | |
| JPH09148732A (en) | Method of connection between flexible printed boards | |
| JP3226147B2 (en) | Bonding structure of surface mount components | |
| JPH05206627A (en) | Electrode for connecting lead and connecting method for lead and electrode | |
| JP2697987B2 (en) | Electronic component with connection terminal and mounting method | |
| JPH08279661A (en) | Printed board | |
| KR19990026398A (en) | Parts mounting method of printed circuit board | |
| JP2000124587A (en) | Fitting method and fitting structure of electronic circuit unit to printed board | |
| JPH02101775A (en) | Double-faced printed board and its mounting method | |
| JP2000151056A (en) | Package | |
| JP2923087B2 (en) | Printed circuit board solder joint structure and printed circuit board solder joint method | |
| JPH0382096A (en) | Soldering method | |
| JP3492826B2 (en) | Chip soldering method | |
| JP2000174161A (en) | Flexible substrate and method for mounting semiconductor device using the same | |
| JPH04368196A (en) | Printed substrate | |
| JPH11145602A (en) | Printed wiring board | |
| JPH03194994A (en) | Solder-connecting method for surface mounting ic package | |
| JPH0472651A (en) | Ic package | |
| JPH03259593A (en) | Flexible printed wiring board and chip component attachment method | |
| JPS6377189A (en) | Printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20030218 |