JPH03259593A - Flexible printed wiring board and chip component attachment method - Google Patents
Flexible printed wiring board and chip component attachment methodInfo
- Publication number
- JPH03259593A JPH03259593A JP5651490A JP5651490A JPH03259593A JP H03259593 A JPH03259593 A JP H03259593A JP 5651490 A JP5651490 A JP 5651490A JP 5651490 A JP5651490 A JP 5651490A JP H03259593 A JPH03259593 A JP H03259593A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible printed
- printed wiring
- chip
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 229920001187 thermosetting polymer Polymers 0.000 claims description 28
- 239000006071 cream Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 239000004634 thermosetting polymer Substances 0.000 abstract 5
- 230000035882 stress Effects 0.000 description 11
- 238000005476 soldering Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、チップ部品をリフローソルダリングによって
取り付けたフレキシブルプリント配線板およびフレキシ
ブルプリント配線板にチップ部品を取り付ける方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible printed wiring board on which chip components are attached by reflow soldering, and a method of attaching chip components to a flexible printed wiring board.
なお、本明細書において、「チップ部品」は、フレキシ
ブルプリント配線板に面実装するチップ部品を意味する
。Note that in this specification, "chip component" means a chip component that is surface-mounted on a flexible printed wiring board.
フレキシブルプリント配線板は、リジッドプリント配線
板と可動部分とを電気的に接続するため、あるいは狭い
スペースに収納するためのものであるが、近年、電子機
器の小型化に対する要求が強くなり、フレキシブルプリ
ント配線板にもチップ部品を搭載するようになってきた
。Flexible printed wiring boards are used to electrically connect rigid printed wiring boards and movable parts, or to be stored in narrow spaces, but in recent years, there has been a strong demand for smaller electronic devices, and flexible printed wiring boards Chip components have also begun to be mounted on wiring boards.
フレキシブルプリント配線板にチップ部品を搭載する場
合、予めフレキシブルプリント配線板上に設けられた配
線パターンの銅箔部分に、はんだメツキを施して電極ラ
ンドが形成される。当該電極ランドにクリームはんだを
印刷し、その上にチップ部品がクリームはんだの粘着力
で仮付けされる。その後、ベルトヒーターまたは雰囲気
炉により加熱する、いわゆるリフローソルダリングによ
りチップ部品は、フレキシブルプリント配線板の電極ラ
ンドに取り付けられる。When mounting chip components on a flexible printed wiring board, electrode lands are formed by applying solder plating to a copper foil portion of a wiring pattern previously provided on the flexible printed wiring board. Cream solder is printed on the electrode land, and the chip component is temporarily attached thereon using the adhesive force of the cream solder. Thereafter, the chip components are attached to the electrode lands of the flexible printed wiring board by so-called reflow soldering, which is heated by a belt heater or an atmospheric furnace.
しかし、フレキシブルプリント配線板の電極ランドにチ
ップ部品を取り付けるために、リフローソルダリングを
行うと、はんだが固まる際に、はんだの表面張力により
チップ部品に応力が働く。However, when reflow soldering is performed to attach chip components to electrode lands of a flexible printed wiring board, stress is applied to the chip components due to the surface tension of the solder when the solder hardens.
この応力は、フレキシブルプリント配線板が薄いために
、フレキシブルプリント配線板をチップ部品搭載面側に
反らせる。Since the flexible printed wiring board is thin, this stress causes the flexible printed wiring board to warp toward the chip component mounting surface.
フレキシブルプリント配線板が、チップ部品搭載面側に
反ったまま電子機器に組み込まれると、チップ部品とフ
レキシブルプリント配線板の電極ランドとにかかる不必
要な応力により、チップ部品は経年変化によって脱落す
る恐れがある。If a flexible printed wiring board is assembled into an electronic device with its chip component mounting surface warped, unnecessary stress will be applied to the chip components and the electrode lands of the flexible printed wiring board, causing the chip components to fall off over time. There is.
本発明は、以上のような問題を解決するために、フレキ
シブルプリント配線板にチップ部品をリフローソルダリ
ングにより取り付けても、反りの発生しないフレキシブ
ルプリント配線板およびチップ部品の取り付は方法を提
供することを目的とする。In order to solve the above-mentioned problems, the present invention provides a flexible printed wiring board and a method for attaching chip components that do not cause warping even when the chip components are attached to the flexible printed wiring board by reflow soldering. The purpose is to
前記目的を達成するために、本発明のフレキシブルプリ
ント配線板は、チップ部品が搭載されている搭載面と反
対側の面で、チップ部品の搭載位置と対応する位置に熱
硬化性樹脂が形成されているような構成とする。また、
前記熱硬化性樹脂を網目状に形成することもできる。In order to achieve the above object, the flexible printed wiring board of the present invention has a thermosetting resin formed at a position corresponding to the mounting position of the chip component on the surface opposite to the mounting surface on which the chip component is mounted. The structure should be such that Also,
The thermosetting resin can also be formed into a mesh shape.
本発明のフレキシブルプリント配線板にチップ部品を取
り付ける方法は、フレキシブルプリント配線板の配線パ
ターン上にクリームはんだを介してチップ部品を搭載す
る第１工程と、第１工程においてチップ部品が搭載され
たフレキシブルプリント配線板の面と反対側の面で、チ
ップ部品を搭載した位置と対応する位置に熱硬化性樹脂
を塗布する第２工程と、未乾燥の熱硬化性樹脂が接着し
ないように間隔を空けて支持する支持具に載置された第
１工程および第２工程を終了したフレキシブルプリント
配線板１をリフローソルダリングするｖＪ３工程とから
構成される。The method of attaching chip components to a flexible printed wiring board of the present invention includes a first step of mounting the chip components on the wiring pattern of the flexible printed wiring board via cream solder, and a flexible printed wiring board on which the chip components are mounted in the first step. The second step is to apply thermosetting resin on the opposite side of the printed wiring board to the position corresponding to the position where the chip components are mounted, leaving a gap so that the undried thermosetting resin does not adhere. The process includes a vJ3 process in which the flexible printed wiring board 1, which has been placed on a supporting tool and which has been subjected to the first and second processes, is subjected to reflow soldering.
フレキシブルプリント配線板にチップ部品を搭載する場
合、予めフレキシブルプリント配線板上に設けられた配
線パターンの銅箔部分に、はんだメツキを施して電極ラ
ンドが形成される。当該電極ランドにクリームはんだを
印刷し、その上にチップ部品がクリームはんだの粘着力
で仮付けされる。フレキシブルプリント配線板のチップ
部品搭載面と反対側の面で、チップ部品搭載位置と対応
した位置に熱硬化性樹脂を塗布する。当該熱硬化性樹脂
が熱硬化する際の応力は、クリームはんだが溶けた後に
固化する時に発生する応力を打ち消すような成分に予め
調整する。チップ部品と熱硬化性樹脂とが仮付けされて
いるフレキシブルプリント配線板は、熱硬化性樹脂が接
着しないように間隔を空けた支持具により支持された状
態で、ベルトヒーターまたは雰囲気炉により加熱する。When mounting chip components on a flexible printed wiring board, electrode lands are formed by applying solder plating to a copper foil portion of a wiring pattern previously provided on the flexible printed wiring board. Cream solder is printed on the electrode land, and the chip component is temporarily attached thereon using the adhesive force of the cream solder. A thermosetting resin is applied to the surface of the flexible printed wiring board opposite to the chip component mounting surface at a position corresponding to the chip component mounting position. The stress when the thermosetting resin is thermosetted is adjusted in advance to a component that cancels out the stress that occurs when the cream solder solidifies after melting. The flexible printed wiring board to which the chip components and thermosetting resin are temporarily attached is heated using a belt heater or an atmospheric furnace while being supported by supports spaced apart to prevent the thermosetting resin from adhering. .
当該加熱によりリフローされて、チップ部品は、フレキ
シブルプリント配線板の電極ランドに取り付けられる、
と同時に熱硬化性樹脂も乾燥する。The chip component is reflowed by the heating and attached to the electrode land of the flexible printed wiring board.
At the same time, the thermosetting resin is also dried.
第１図ないし第３図を参照しつつ本発明の一実施例を説
明する。第１図（イ）は本発明における一実施例説明図
で、部品搭載面平面図、第１図（ロ）は同じく部品搭載
面と反対側を示す平面図、第２図（イ）および（ロ）は
本発明における他の実施例説明図、第３図（イ）および
（ロ）は本発明におけるフレキシブルプリント配線板支
持具説明図である。An embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1(a) is an explanatory view of one embodiment of the present invention, in which a plan view of the component mounting surface is shown, FIG. 1(b) is a plan view of the side opposite to the component mounting surface, and FIGS. B) is an explanatory diagram of another embodiment of the present invention, and FIGS. 3A and 3B are explanatory diagrams of a flexible printed wiring board support in the present invention.
第１図において、フレキシブルプリント配線板１は、た
とえば、ポリイミド樹脂からなる柔軟性を有するもので
、電子機器内の狭い部分に配線を行えるような形状をし
ている。そして、フレキシブルプリント配線板１には、
チップ部品２を搭載する面Ａを備えている。チップ部品
２が搭載されている搭載面Ａは、配線パターンの銅箔部
分に、はんだメツキを施して図示されていない電極ラン
ドが形成される。当該電極ランドにクリームはんだを印
刷し、その上にチップ部品２がクリームはんだの粘着力
で第１図（イ）図示のごとく、仮付けされる。フレキシ
ブルプリント配線板１のチップ部品搭載面Ａと反対側の
面Ｂには、チップ部品２の搭載位置と対応した位置に、
たとえば、エポキシ系熱硬化性樹脂３が樹脂塗布機によ
って第１図 （ロ）図示のごとく、塗布される。In FIG. 1, a flexible printed wiring board 1 is made of, for example, polyimide resin and has flexibility, and has a shape that allows wiring to be installed in a narrow area within an electronic device. And, on the flexible printed wiring board 1,
It has a surface A on which a chip component 2 is mounted. On the mounting surface A on which the chip component 2 is mounted, electrode lands (not shown) are formed by applying solder plating to the copper foil portion of the wiring pattern. Cream solder is printed on the electrode land, and the chip component 2 is temporarily attached thereon by the adhesive force of the cream solder, as shown in FIG. 1(a). On the surface B of the flexible printed wiring board 1 opposite to the chip component mounting surface A, at a position corresponding to the mounting position of the chip component 2,
For example, the epoxy thermosetting resin 3 is applied by a resin coating machine as shown in FIG. 1(b).
樹脂塗布機による塗布幅は、たとえば、−個のチップ部
品２に対して、２〜３ｍｒｒｉ角で、厚さ０゜１ｍｍと
した。また、搭載チップ部品の数が多い場合には、第２
図（イ）および（ロ）図示のごとく、フレキシブルプリ
ント配線板１の裏面Ｂ全体に熱硬化性樹脂３を網目のよ
うに塗布することもできる。この際、フレキシブルプリ
ント配線板１に柔軟性を残しておく必要がある。The coating width by the resin coating machine was, for example, 2 to 3 mrri square and 0° to 1 mm thick for the - number of chip parts 2. In addition, if there are many chip components mounted, the second
As shown in Figures (A) and (B), the thermosetting resin 3 can be applied to the entire back surface B of the flexible printed wiring board 1 in a mesh pattern. At this time, it is necessary to leave flexibility in the flexible printed wiring board 1.
熱硬化性樹脂３が熱硬化する際の応力は、クリームはん
だが溶けた後に固化する時に発生する応力を打ち消すよ
うなエポキシ樹脂の成分に予め調整する。チップ部品２
と熱硬化性樹脂３とが仮付けされているフレキシブルプ
リント配線板１は、熱硬化性樹脂３が接着しないように
第３図図示のごとく、間隔を空けるために支持突起５を
有するたとえば、アルミ製の支持具４により支持された
状態で、図示されていないベルトヒーターまたは雰囲気
炉によりたとえば、２３０度Ｃ（ピーク）で加熱する。The stress that occurs when the thermosetting resin 3 is thermosetted is adjusted in advance to a component of the epoxy resin that cancels out the stress that occurs when the cream solder solidifies after melting. Chip parts 2
The flexible printed wiring board 1 to which the thermosetting resin 3 and the thermosetting resin 3 are temporarily attached is made of aluminum, for example, which has supporting protrusions 5 to provide a space as shown in FIG. 3 so that the thermosetting resin 3 does not adhere. While being supported by a supporter 4 made of aluminum, it is heated at, for example, 230 degrees C (peak) using a belt heater or an atmosphere furnace (not shown).
当該加熱によりリフローされて、チップ部品２は、フレ
キシブルプリント配線板１の図示されていない電極ラン
ドに取り付けられる。The chip component 2 is reflowed by the heating and attached to an electrode land (not shown) of the flexible printed wiring board 1.
これと同時に熱硬化性樹脂３は乾燥する。At the same time, the thermosetting resin 3 dries.
フレキシブルプリント配線板Ｉの幅りと、チップ部品２
を搭載した面の一番低い面から反り上がった一番高い部
分との距離ｌとの比
反り＝ Ｘ１００％
を各種火きさのフレキシブルプリント配線板１について
測定した。その結果、本発明のような熱硬化性樹脂３を
フレキシブルプリント配線板■の裏面Ｂに形成した場合
には、反りが１．２３％であるのに対して、熱硬化性樹
脂を形成しない従来例のものは、反りが４％であった。Width of flexible printed wiring board I and chip parts 2
The ratio of warpage (=X100%) to the distance 1 from the lowest surface on which the board was mounted to the highest warped part was measured for flexible printed wiring boards 1 of various scorches. As a result, when the thermosetting resin 3 of the present invention was formed on the back side B of the flexible printed wiring board (■), the warpage was 1.23%, whereas in the conventional case where no thermosetting resin was formed, the warpage was 1.23%. In the example, the warpage was 4%.
以上、本発明の実施例を詳述したが、本発明は、前記実
施例に限定されるものではない。そして、特許請求の範
囲に記載された本発明を逸脱することがなければ、種々
の設計変更を行うことが可能である。Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Various design changes can be made without departing from the scope of the invention as set forth in the claims.
たとえば、熱硬化性樹脂および熱硬化性樹脂の網目の形
状は、限定するものではなく、はんだ付けの際の応力が
打ち消せればいかなる形でも良い。For example, the shape of the thermosetting resin and the network of the thermosetting resin is not limited, and may be of any shape as long as it can cancel out the stress during soldering.
本発明によれば、フレキシブルプリント配線板のチップ
部品搭載面と反対側の面に熱硬化性樹脂を塗布して、リ
フローソルダリングによる応力を打ちけしたので、電子
機器に組込む際に不必要な応力がかからない。したがっ
て、経年変化によってもチップ部品の取り付けに信頼性
が保たれる。According to the present invention, thermosetting resin is applied to the surface of the flexible printed wiring board opposite to the chip component mounting surface to eliminate stress caused by reflow soldering, which eliminates unnecessary stress when incorporating it into electronic equipment. No stress applied. Therefore, the reliability of mounting the chip components is maintained even after aging.
また、本発明によれば、熱硬化性樹脂の乾燥は、リフロ
ーの加熱と同時に行えるので、熱硬化性樹脂を塗布する
工程の増加だけで取り付けの信頼性が増加する。Furthermore, according to the present invention, the drying of the thermosetting resin can be performed simultaneously with the heating for reflow, so that the reliability of attachment is increased simply by increasing the number of steps for applying the thermosetting resin.
第１図は本発明における一実施例説明図で、（イ）は部
品搭載面平面図、（ロ）は同じく部品搭載面と反対側を
示す平面図、第２図（イ）および（ロ）は本発明におけ
る他の実施例説明図、第３図（イ）および（ロ）は本発
明におけるフレキシブルプリント配線板支持具説明図で
ある。
１・・・フレキシブルプリント配線板
２・・・チップ部品
３・・・熱硬化性樹脂
４・・・支持具
５・・・支持突起FIG. 1 is an explanatory view of one embodiment of the present invention, in which (a) is a plan view of the component mounting surface, (b) is a plan view also showing the side opposite to the component mounting surface, and FIGS. 2 (a) and (b) 3A and 3B are explanatory diagrams of another embodiment of the present invention, and FIGS. 3A and 3B are explanatory diagrams of a flexible printed wiring board support according to the present invention. 1... Flexible printed wiring board 2... Chip component 3... Thermosetting resin 4... Support tool 5... Support protrusion
Claims (3)
部品２が搭載されている搭載面Ａと反対側の面Ｂで、チ
ップ部品２の搭載位置と対応する位置に熱硬化性樹脂３
が形成されていることを特徴とするフレキシブルプリン
ト配線板。(1) In the flexible printed wiring board 1, on the surface B opposite to the mounting surface A on which the chip component 2 is mounted, a thermosetting resin 3 is placed at a position corresponding to the mounting position of the chip component 2.
A flexible printed wiring board characterized by being formed with.
部品２が搭載されている搭載面Ａと反対側の面Ｂに網目
状の熱硬化性樹脂３が形成されていることを特徴とする
フレキシブルプリント配線板。(2) A flexible printed wiring board 1 characterized in that a mesh-like thermosetting resin 3 is formed on a surface B opposite to a mounting surface A on which chip components 2 are mounted. .
にクリームはんだを介してチップ部品２を搭載する第１
工程と、 第１工程においてチップ部品２が搭載されたフレキシブ
ルプリント配線板１の面Ａと反対側の面Ｂで、チップ部
品２を搭載した位置と対応する位置に熱硬化性樹脂３を
塗布する第２工程と、未乾燥の熱硬化性樹脂３が接着し
ないように間隔を空けて支持する支持具４に載置された
第１工程および第２工程を終了したフレキシブルプリン
ト配線板１をリフローソルダリングする第３工程と、 からなることを特徴とするフレキシブルプリント配線板
にチップ部品を取り付ける方法。(3) The first chip component 2 is mounted on the wiring pattern of the flexible printed wiring board 1 via cream solder.
Step: Applying thermosetting resin 3 to a position corresponding to the position where the chip component 2 is mounted on the surface B of the flexible printed wiring board 1 opposite to the surface A on which the chip component 2 is mounted in the first step. In the second step, the flexible printed wiring board 1 that has completed the first and second steps placed on a support 4 that is supported at a distance so that the undried thermosetting resin 3 does not adhere is reflow soldered. A method for attaching a chip component to a flexible printed wiring board, comprising: a third step of ringing;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5651490A JPH03259593A (en) | 1990-03-09 | 1990-03-09 | Flexible printed wiring board and chip component attachment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5651490A JPH03259593A (en) | 1990-03-09 | 1990-03-09 | Flexible printed wiring board and chip component attachment method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03259593A true JPH03259593A (en) | 1991-11-19 |
Family
ID=13029235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5651490A Pending JPH03259593A (en) | 1990-03-09 | 1990-03-09 | Flexible printed wiring board and chip component attachment method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03259593A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008130587A (en) * | 2006-11-16 | 2008-06-05 | Honda Motor Co Ltd | Reflow device |
| JP2008251623A (en) * | 2007-03-29 | 2008-10-16 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board |
-
1990
- 1990-03-09 JP JP5651490A patent/JPH03259593A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008130587A (en) * | 2006-11-16 | 2008-06-05 | Honda Motor Co Ltd | Reflow device |
| JP4713444B2 (en) * | 2006-11-16 | 2011-06-29 | 本田技研工業株式会社 | Reflow device |
| JP2008251623A (en) * | 2007-03-29 | 2008-10-16 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board |
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