JPH08195553A - Repairing device of soldering part by visual inspection - Google Patents

Abstract

PURPOSE: To obtain an enlarged image of a faulty part on a printed circuit board to be corrected by arranging a test glass for enlarging and displaying a faulty part on the printed circuit board to be corrected at the side part of a stereomicroscope with a rotary mirror in scope system and on an XY drive stage mechanism. CONSTITUTION: The fault data of a printed circuit board 11 to be corrected obtained from an appearance inspection device 10 are stored in a personal computer 6. The printed circuit board to be corrected is called by a CPU of the personal computer 6 and pulses are transmitted to the X/Y-axis drive motor of an XY drive stage 4 according to the fault position data of the printed circuit board 11 to be corrected for positioning the faulty part of the printed circuit board to be corrected at the center of the stereomicroscope 1. An image is projected onto the display part of a solid-scope-type stereomicroscope 1. The faulty part of the printed circuit board 11 to be corrected is successively and automatically shifted and the image positioned at the center point is enlarged by a zoom-type optical system lens 2 to obtain the enlarged image of the faulty part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a visual inspection of a soldered portion and a repairing apparatus therefor, and in particular, it is aimed to improve the efficiency of visual inspection which is becoming difficult due to high density and the repair work. The purpose is to inspect the soldering condition and mounting condition of the components mounted on the printed circuit board by visually observing the enlarged image, and the correction work can be performed on the spot based on the judgment result of good or bad. Is.

[0002]

2. Description of the Related Art As a conventional technique, there are a marking system for marking a defective portion by a visual inspection device and a device for indicating a defective portion by a laser utilizing position data of the defective portion extracted by the visual inspection device.

As an example, a defect point indicating device using a laser will be described below.

As shown in FIG. 5, a defective portion X of the to-be-corrected printed circuit board 11 obtained from the soldering appearance inspection apparatus 10
-Y coordinate data is fetched into the personal computer 6 of the defective portion indicating device via a floppy disk (hereinafter referred to as F / D) or a defective data transfer line and stored in memory.

On the other hand, the above-mentioned printed board 11 to be corrected is fixed to the printed board fixing base 13 provided in the defective portion indicating device, and the defective position data already stored in the personal computer 6 is stored in the CPU of the personal computer 6. The laser irradiating unit 14 provided above the reading defective portion pointing device is controlled by the personal computer 6 and the control unit 16 to sequentially deflect the laser 15 to indicate the defective portion on the printed circuit board 11 to be corrected.

The defective portion designated by the laser 15 is minute,
Since the pitch is narrow and it is difficult to correct it with the naked eye, the defective areas are sequentially marked using white ink etc., and after checking and marking all the defective areas, a magnifying glass not shown Alternatively, the printed circuit board 11 to be corrected is moved to the work place where the microscope is installed, and the defective portion is corrected.

[0007]

Generally, a small component or
Due to high packaging density, it is often impossible to judge pass / fail by a normal visual inspection in a printed circuit board inspection. There are many false alarms (those that were judged to be defective even though they were actually normal) even when defects were picked up by the soldering inspection device. As a check method for these, there is also a method of visually inspecting by enlarging with a video image, but it is a flat image,
Since there is a limit to the resolution, it is difficult to overlook soldering defects such as floating of IC leads and to judge pass / fail. In addition, visual inspection with a microscope causes eye fatigue and reduced work efficiency. As an improvement for this, there is an increasing need on the site side, such as marking on a portion that is determined to be defective when performing repair work, and performing repair work on the spot. Since the solder repair method according to the above-described conventional technique has a function of only indicating the fine and narrow-pitch defective portions on the printed board to be repaired sequentially with the laser, after sequentially marking all the defective portions as described above. , It is necessary to move to a work place where a magnifying glass is installed and correct it. or,
Since the method of deflecting the laser to the defective portion deteriorates the positional accuracy of the laser indication, there are many drawbacks such as indicating the defective portion and performing unnecessary marking.

[0008]

In order to achieve the first object, the present invention mounts the printed board to be modified on the XY stage and obtains a defective position obtained by the soldering inspection machine. Using the data, the personal computer and the control unit control the XY stage so that the defective portion on the printed board to be repaired is located in front of the repair worker (hereinafter, worker), and at the same time, the target is displayed on the first stage. The magnifying glass that allows the object to be seen from the side is used to confirm the defective portion and to perform the correction work while magnifying the object in the second stage.

[0009]

As a result, the defective portion on the printed board to be corrected is
It is fixed on the front of the operator and a magnified image can be obtained.
Further, the correction work and the check work can be performed while enlarging the defective portion, and it becomes unnecessary to move the correction target printed board to another work place.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing the overall construction of the embodiment.
Is a known stereoscopic stereoscopic microscope, and 2 is a zoom type optical system lens for magnifying an image. 3 is a rotary mirror 360
The rotation mechanism allows the image of the side surface to be obtained, and is used when it is difficult to make a determination unless the inspection object is in the lateral direction.
An XY drive stage 4 moves the target substrate in the X and Y directions. Reference numeral 5 is a work area in which the XY drive stage moves to make corrections. Reference numeral 6 is a control personal computer, which provides positional information from the visual inspection apparatus 10 in the previous process and XY
The drive stage 4 performs data processing such as quality information. Reference numeral 7 is a magnifying glass such as a scope type stereomicroscope used to monitor a fine portion during a correction operation. Reference numeral 8 is a mount for these systems. A switch box 9 moves to the next step and moves to a correction position.

FIG. 2 is a conceptual diagram of a connection system of the system of FIG. 1, and the same components as those in FIG. 1 are designated by the same reference numerals.

Next, this operation will be described. First, the to-be-corrected printed board 11 is carried in and fixed to the XY drive stage 4 of the embodiment apparatus manually or automatically. The defect data of the printed board 11 to be corrected obtained from the visual inspection device 10 is stored in the personal computer 6
Similarly, in order to call from the memory section of the personal computer 6 to the CPU section of the personal computer 6, the control number of the printed board 11 to be corrected is read by the keyboard section (not shown) or the bar code reader (not shown) of the personal computer 6, input.

The defective position data of the to-be-corrected printed board 11 which is called by the CPU of the personal computer 6 by the above-mentioned operation is supplied to the X-axis drive motor and the Y-axis drive motor (not shown) of the XY drive stage 4, respectively. It is for sending a pulse for positioning a defective portion of the modified printed board 11.

In this way, the defective portion of the modified printed board 11 is positioned at the center point of the stereoscopic stereoscopic microscope 1. An image as shown in FIG. 4 is displayed on the display unit 12 of the stereoscopic stereoscopic microscope 1. The defective portion of the modified printed board 11 is automatically or manually moved sequentially, and the image positioned at the center point is magnified by the zoom optical system lens 2 and viewed from above (FIG. 4a). , Seen with a rotating mirror (Fig. 4b) can be arbitrarily selected.
The obtained image is visually checked for the soldering state and the mounting state and judged according to the quality standard. If correction is necessary, the switch 9 moves the XY drive stage 4 to the correction work area 5. Then, the minute portion is corrected using the magnifying glass 7.

The center point of the magnifying glass 7 is arranged so as to be always the same as the center point of the stereoscopic stereoscopic microscope 1 so that the correction point can be easily determined.

The flow at this time is shown in FIG.

The defective position data extracted by the appearance inspection apparatus 10 may be recorded on a floppy disk and delivered to the personal computer 6 of the apparatus to control the XY drive stage without directly connecting the defective position data inline. Stereoscopic stereo microscope 1
If you place it so that the defective part comes in the center of the screen,
Even when the steps are sequentially moved, a defective portion comes to the center, and the judgment becomes easy. Further, since the center point can be secured during the operation of the rotary mirror 3, it becomes easy to monitor the defective portion. The defective position data is sequentially moved to the next step by the switch 9 (foot switch or switch).

In addition, it is possible to mark with ink on the spot which is determined to be a defect that cannot be repaired on the spot, and the work can be easily performed in another step. In terms of safety and hygiene, since no eyepiece is used, fatigue can be reduced drastically.

When not using the visual inspection apparatus in the previous process,
The XY stage is operated by the step feed program or manually to check the defective portion of the substrate. After the end,
The switch 9 moves to the next step.

[0021]

[Effects of the Invention] Utilizing inspection data corresponding to various boards, and visual inspection of a printed board on an XY stage by using an enlarged three-dimensional upright image, versatile component mounting / non-defectiveness determination and correction of determination results. The efficiency of can be improved.

Further, as described above, since the defective portion can be fixed to a fixed place with high accuracy at all times, auxiliary tools for repair and repair work, for example, a place where an automatic solder supply mechanism, a correction assist mechanism, etc. are additionally installed are also fixed. It becomes possible.
For these reasons, firstly, the work of marking the defective portion and the step of moving the repaired printed board are not required.

Secondly, since it is possible to confirm and determine a false alarm (determining a non-defective product as defective) of the soldering appearance inspection device on the spot, unnecessary marking, correction and repair work are eliminated.

As described above, according to the present invention, in addition to improving work efficiency and ensuring quality, many effects such as reduction of facility development cost can be obtained.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an overall configuration of an embodiment of the present invention.

2 is a conceptual diagram of a connection system of the system of FIG.

FIG. 3 is an operation flowchart of FIG.

FIG. 4 is an enlarged image view of a microscope according to an embodiment of the present invention.

FIG. 5 is a configuration diagram showing an overall configuration of a conventional example.

[Explanation of symbols]

1 stereoscopic stereoscopic microscope, 2 zoom lenses, 3 rotating mirrors, 4 XY drive stage, 5 working areas, 6
PC, 7 magnifying glass, 10 soldering visual inspection equipment, 11 printed circuit board,

Claims (1)

[Claims] 1. An XY drive for carrying out a positioning operation and mounting a to-be-corrected printed circuit board according to position data of a defective portion of the to-be-corrected printed circuit board extracted by a visual inspection device in a previous process in a visual inspection and repair apparatus for a soldering part. A stage mechanism and a scope-type rotary mirror for visual inspection, which is arranged above the XY drive stage mechanism and which can observe the defective portion of the printed circuit board to be corrected from at least the lateral direction and the oblique direction to obtain the image. A stereomicroscope with an X-ray and a side part of the stereomicroscope with a rotating mirror of the scope type and X
A visual inspection and repair device for a soldering part, which is disposed on an upper part of a Y drive stage mechanism and has a magnifying glass which magnifies and displays a defective portion of the printed circuit board to be corrected.