JPH0818266A - Electromagnetic wave shielded circuit unit - Google Patents

Electromagnetic wave shielded circuit unit

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Publication number
JPH0818266A
JPH0818266A JP17158194A JP17158194A JPH0818266A JP H0818266 A JPH0818266 A JP H0818266A JP 17158194 A JP17158194 A JP 17158194A JP 17158194 A JP17158194 A JP 17158194A JP H0818266 A JPH0818266 A JP H0818266A
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Prior art keywords
case body
upper
lower
sheet
circuit unit
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JP17158194A
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Japanese (ja)
Inventor
Naoji Ozaki
Kazuyoshi Tomita
一良 富田
直二 尾崎
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Sega Enterp Ltd
株式会社セガ・エンタープライゼス
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Abstract

PURPOSE:To reduce the cost and weight of a circuit unit by forming board holding pieces for holding a circuit board therebetween and sheet inside bent pieces on the bottom of an upper case or top of a lower case and sheet outside bent pieces on the top of the lower case or bottom of the upper case. CONSTITUTION:An electromagnetic wave shielded circuit unit 1 is composed of a circuit board 2 and flattened rectangular shield case 3. A synthetic resin upper and lower cases 4 and 5 are formed as an upper and lower halves of a shield case 3. On a central part of the top of the case 5, two sets of board holding pieces 5a are formed and two vertically up directed sheet inside bent pieces 5b are formed near each piece 5a. On a central part of the bottom of the case 4, board hold pieces 4a are formed at positions corresponding to the pieces 5a and two vertically down directed sheet outside bent pieces 4b are formed near each piece 4a.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、テレビ遊戯機等の電子機器に装着される回路ユニットから電磁波を外部へ漏洩させないように、回路基板を略直方体状導電性シールドケースで包囲した電磁波遮蔽型回路ユニットに関するものである。 The present invention relates, so as not to leak from the circuit unit to be mounted in an electronic device such as a television game machine electromagnetic waves to the outside, the electromagnetic wave shielding type which surrounds the circuit board in a substantially rectangular parallelepiped conductive shield case it relates to a circuit unit.

【0002】 [0002]

【従来技術および解決しようとする課題】回路基板を、 A circuit board A tries to prior art and the resolution],
扁平な直方体状の導電性シールドケースで包囲してなる電磁波遮蔽型回路ユニットでは、実公昭57−3356号公報、実開平3− 13793号公報に示されるように、金属板をプレス加工によって成形して導電性シールドケースを構成したため、その機械強度、剛性を金属板の板厚に依存せざるを得ず、軽量化が困難であった。 In flat rectangular parallelepiped-shaped conductive shield case in surrounding and shielding electromagnetic type circuit unit comprising, as shown Utility Model 57-3356, JP-in real-Open 3-13793 discloses, molded by pressing a metal plate for configuring the conductive shield case Te, its mechanical strength, rigidity and it is inevitable to depend on the thickness of the metal plate, weight reduction is difficult.

【0003】また導電性シールドケース内空間の略中央に回路基板を保持させるために、シールドケース奥内の保持片に回路基板を固定する作業や、回路基板のケース突出部を上下から挟持する蓋をシールドケースに固着する作業が必要となって部品点数や作業工数を削減し難く、大巾なコストダウンができなかった。 [0003] In order to hold the circuit board substantially at the center of the conductive shield case space, a lid for clamping work and for fixing the circuit board to the holding piece in the back shield case, the case protrusion part of the circuit board from above and below the difficult to reduce the number of parts and the number of working steps become necessary work to be fixed to the shield case, it could not be greatly cost down.

【0004】 [0004]

【課題を解決するための手段および作用効果】本発明は、このような難点を克服した電磁波遮蔽型回路ユニットの改良に係り、回路基板を略直方体状導電性シールドケースで包囲し、回路基板から外部への電磁波の漏減を防止する電磁波遮蔽型回路ユニットにおいて、前記直方体状導電性シールドケースの外形を上下2分割に分割した形状に形成された上部ケース本体および下部ケース本体と、該上部ケース本体の下面に接触しうる上部導電性シートと、該下部ケース本体の上面に接触しうる下部導電性シートと、前記上部ケース本体および下部ケース本体で構成された内部空間の略上下中央に保持される回路基板とよりなり、前記上部ケース本体の下面および下部ケース本体の上面には、ケース本体厚さ中央に向って突出して前記回路基板 Means for Solving the Problems and effects The present invention relates to an improvement of electromagnetic wave shielding type circuit unit which overcome such difficulties, surrounds the circuit board in a substantially rectangular parallelepiped conductive shield case from the circuit board in the electromagnetic-shielding type circuit unit for preventing the decrease leakage of electromagnetic waves to the outside, an upper case body and a lower case body formed in a shape obtained by dividing the outer shape of the rectangular parallelepiped conductive shield case into upper and lower split upper case an upper conductive sheet may contact the lower surface of the main body, and the lower conductive sheet may contact the upper surface of the lower case body, it is held in a substantially vertical center of the upper case body and the internal space configured with the lower case body more become a circuit board that, wherein the lower surface and the upper surface of the lower case body of the upper case body, the circuit board to protrude toward the case body thickness center 上下から挟持する基板保持片が形成され、前記上部ケース本体の下面または下部ケース本体の上面には、前記基板保持片より外周側に位置して前記ケース本体厚さ中央に向って突出したシート内側折曲片が形成され、前記下部ケース本体の上面または上部ケース本体の下面には、前記シート内側折曲片よりも該シート内側折曲片の厚さに相当する寸法だけ外周側に位置して前記ケース本体厚さ中央に向って突出したシート外側折曲片が形成されたことを特徴とするものである。 Upper and lower substrate holding piece for clamping is formed from, wherein the upper surface of the lower surface or the lower case body of the upper case body, the sheet inside which projects toward the casing body thickness center is located closer to that outer edge than the substrate holding piece bent pieces are formed, wherein the lower surface of the top or upper case body of the lower case body, located on only the outer peripheral side dimension corresponding to the thickness of the sheet inside bent piece than the sheet inner bent pieces it is characterized in that the sheet outside bent piece projecting toward the center the case body thickness was formed.

【0005】本発明は前記したように構成されているので、回路ユニットのケース本体は金属板製でなくて合成樹脂製で足り、しかも上部導電シートおよび下部導電シートはケースの機械的強度・剛性を負担する必要がなくなって薄くてよく、その結果、材料費節減によるコストダウンと、軽量化とを図ることができる。 [0005] Since the present invention is constructed as described above, the case body of the circuit unit is insufficient synthetic resin not made of metal plate, yet the mechanical strength and rigidity of the upper conductive sheet and the lower conductive sheet case well-thin and there is no need to bear, as a result, it is possible to reduce the costs by material cost savings, and a lighter.

【0006】また本発明では、上、下ケース本体と上下導電性シートとを合せて、上、下両ケース本体を相互に一体に結合することにより、回路基板を電磁的に密閉できるため、部品点数および工数を減少させてこの面でのコストを削減することができる。 [0006] In the present invention, on, the combined lower case body and the top and bottom conductive sheet, on, by binding together with each other under both case body, it is possible to seal the circuit board electromagnetically, parts It reduces the number and steps can reduce the cost in this respect.

【0007】さらに本発明においては、上下ケース本体より内方へ突出した基板保持片でもって回路基板を挟持するため、該回路基板を安定して確固と保持することができ、またケース本体の上下厚さを薄くすることができるので、輸送の際の衝撃を抑制する緩衝材を節減することができるとともに容積を減らして効率良く運搬でき、 [0007] Furthermore, in the present invention, for holding the circuit board with the substrate holding piece protruding from the upper and lower case body inward, can be held as stably firmly the circuit board, also the upper and lower case body it is possible to reduce the thickness, can transport efficiently by reducing the volume it is possible to save suppressing cushioning material impact during transportation,
しかも保管場所を狭くすることができる。 Moreover, it is possible to narrow the storage location.

【0008】また本発明を請求項2のように構成することにより、前記上、下導電性シートを容易に折曲変形することができ、生産性を大巾に向上させることができる。 [0008] By constituting the present invention as claimed in claim 2, on the, the lower conductive sheet can be easily deformed bending, productivity can be improved by a large margin.

【0009】さらに本発明を請求項3または請求項4記載のように構成することにより、前記上、下導電性シートの折曲変形可能処理を容易に遂行することができる。 [0009] By further configured to claim 3 or claim 4 wherein the present invention, on the can be easily perform bending deformable processing under the conductive sheet.

【0010】さらにまた本発明を請求項5記載のように構成することにより、下部ケース本体上に下部導電性シート、回路基板、上部導電性シートおよび上部ケース本体を順次重ね、これらを下方へ圧下するだけで、前記上、下導電性シートの端部を直角に折曲して、該上、下導電性シートで前記回路基板を電磁的に密封でき、頗る容易に能率良く電磁波遮蔽型回路ユニットを生産することができる。 [0010] By furthermore constituting the present invention as claimed in claim 5, wherein pressure lower conductive sheet on the lower case body, the circuit board are sequentially stacked an upper conductive sheet and the upper case body, these downward simply, the upper, by bending the end portion of the lower conductive sheet perpendicularly, upper, you can seal the circuit board electromagnetically under conductive sheet, extremely easily efficiently shielding electromagnetic type circuit unit it is possible to produce.

【0011】 [0011]

【実 施 例】以下、図1ないし図6に図示された本発明の電磁波遮蔽型回路ユニット1の一実施例について説明する。 [Implementation example will now be described an embodiment of an electromagnetic wave shielding type circuit unit 1 of the present invention shown in FIGS. 1-6. テレビ遊戯機に用いられる電磁波遮蔽型回路ユニット1は、回路基板2と扁平直方体状シールドケース3とよりなり、回路基板2は、通常のプリント回路基板または多層回路基板でもよく、外部接続端子2aと主回路2bとを具備している。 The electromagnetic wave shielding type circuit unit 1 for use in the television game machine becomes more and circuit board 2 and the flat rectangular parallelepiped shield case 3, the circuit board 2 may be a conventional printed circuit board or multilayer circuit board, and the external connection terminal 2a It is and a main circuit 2b.

【0012】またシールドケース3の外形を上下2分割に分割した形状に、合成樹脂製の上部ケース本体4、下部ケース本体5は形成され、該上部ケース本体4の下面および下部ケース本体5の上面にそれぞれ接触しうる上部導電性シート6、下部導電性シート7は薄金属板製であり、該上部導電性シート6、下部導電性シート7では、回路基板2の左右両側縁2cと奥側縁2dとに対応した部位に、図2に図示されるような局部的曲げ加工部6a,7aが形成されている。 Further the shape obtained by dividing the outer shape of the shield case 3 into upper and lower divided, synthetic resin upper case body 4, the lower case main body 5 is formed, the lower surface and the upper surface of the lower case main body 5 of the upper case body 4 each upper conductive sheet 6 may contact the lower conductive sheet 7 is made of thin metal plate, the upper conductive sheet 6, the lower conductive sheet 7, left and right side edges 2c and the rear side edge of the circuit board 2 in the portion corresponding to the 2d, local bending portion 6a as shown in FIG. 2, 7a are formed.

【0013】さらに下部ケース本体5の上面の略中央部には、2個の基板保持片5aが形成されるとともに、該基板保持片5aより左右外側方および奥側に位置してシート内側折曲片5bがそれぞれ2個ずつ直角に上方へ指向して突設され、前記基板保持片5aの頂端に基板係合突起5cが形成されている。 Furthermore a substantially central portion of the upper surface of the lower case main body 5, together with the two substrate holding piece 5a is formed, the sheet inner bent located on the left and right outer side and the back side of the substrate holding pieces 5a piece 5b is protruded directed at right angles to the upper two each, substrate engaging projections 5c the top end of the substrate holding piece 5a is formed.

【0014】さらにまた上部ケース本体4の下面の略中央部には、前記基板保持片5aに対応した位置にて基板保持片4aが形成されるとともに、前記下部ケース本体5のシート内側折曲片5bの外面に上部導電性シート6 [0014] Furthermore a substantially central portion of the lower surface of the upper case body 4, together with the substrate holding piece 4a is formed at the corresponding position on the substrate holding member 5a, the sheet inner bent piece of the lower case body 5 upper conductive to the outer surface of 5b sheet 6
を介して接触しうる位置にてシート外側折曲片4bがそれぞれ2個ずつ直角に下方へ指向して突設されている。 Sheet outer bent pieces 4b are projected directed downwards at right angles two each at a position that can be contacted via.

【0015】しかも回路基板2の主回路2bには、下部ケース本体5の基板係合突起5cが嵌合することができる係合孔2eが形成されている。 [0015] Moreover the main circuit 2b of the circuit board 2, the substrate engaging projections 5c of the lower case body 5 is engaging hole 2e is formed which can be fitted.

【0016】また上部導電性シート6および下部導電性シート7には、上部ケース本体4の基板保持片4aおよび下部ケース本体5の基板保持片5aが嵌合できる嵌合孔6b,7bがそれぞれ設けられている。 [0017] the upper conductive sheet 6 and the lower conductive sheet 7 is provided a fitting hole 6b of the substrate holding piece 5a of the substrate holding piece 4a and a lower case body 5 of the upper case body 4 can be fitted, 7b respectively It is.

【0017】図1ないし図7に図示の実施例は前記したように構成されているので、電磁波遮蔽型回路ユニット1を組立てるには、図4に図示するように、下部導電性シート7の局部的曲げ加工部7aが下部ケース本体5のシート内側折曲片5bの内側に位置した状態で、下部導電性シート7を下部ケース本体5のシート内側折曲片5 [0017] Since the embodiment shown in FIGS. 1 to 7 is constructed as described above, in assembling the electromagnetic wave shielding type circuit unit 1, as shown in FIG. 4, the local areas of the lower conductive sheet 7 in a state in which manner the bent portion 7a is positioned on the inside of the seat inner bent piece 5b of the lower case main body 5, the seat inner bent piece of the lower case main body 5 the lower conductive sheet 7 5
b上に載置し、回路基板2の左右両側縁2c,奥側縁2 Placed on a b, left and right side edges 2c of the circuit board 2, the inner side edges 2
dが下部導電性シート7の局部的曲げ加工部7aの直上に位置するように、回路基板2を下部導電性シート7上に重ね、回路基板2を全面に亘って均等に下方へ圧下することにより、図5に図示するように、下部導電性シート7の局部的曲げ加工部7aを境に下部導電性シート7 As d is positioned directly above the locally bent portion 7a of the lower conductive sheet 7, superimposed circuit board 2 on the lower conductive sheet 7, to reduction to uniformly downwardly across the circuit board 2 on the entire surface Accordingly, as shown in FIG. 5, lower conductive sheet 7 bordering local bending portion 7a of the lower conductive sheet 7
の左右両側部7cおよび奥側部7dを直角上方に折曲させることができるとともに、該下部ケース本体5のシート内側折曲片5bの内側面に添接させることができ、しかも回路基板2の係合孔2eを下部ケース本体5の基板係合突起5cに係合させることができる。 Left and right both side portions 7c and the back side 7d it is possible to bent perpendicularly upwards, it can be spliced ​​to the inner surface of the sheet inside bent piece 5b of the lower case main body 5, moreover the circuit board 2 the engagement hole 2e can be engaged with the substrate engaging projection 5c of the lower case body 5.

【0018】次に図6に図示するように、上部導電性シート6の局部的曲げ加工部6aが下部導電性シート7の左右両側部7c先端より外方に位置した状態で、上部導電性シート6を下部導電性シート7の左右両側部7c先端上に載置し、上部ケース本体4のシート外側折曲片4 [0018] Next, as shown in FIG. 6, in a state where local bending portion 6a of the upper conductive sheet 6 is located outward from the right and left side portions 7c tip of the lower conductive sheet 7, the upper conductive sheet placing a 6 on the left and right side portions 7c tip of the lower conductive sheet 7, the sheet outer bent piece 4 of the upper case body 4
bの下端が上部導電性シート6の局部的曲げ加工部6a Locally bent portions 6a of the b lower end of the upper conductive sheet 6
の外側方に位置するように、上部導電性シート6上に上部ケース本体4を重ね、上部ケース本体4を下部ケース本体5に対して平行に保持させたまま下方へ圧下することにより、図7に図示するように、下部導電性シート7 Of so as to be located outward, overlapping the upper case body 4 on the upper conductive sheet 6, by reduction downward while is held parallel to the lower case main body 5 and the upper case body 4, Fig. 7 as illustrated, the lower conductive sheet 7
を下部ケース本体5の上面上に密接させ、上部導電性シート6の左右両側部6cおよび奥側部6dを直角下方に折曲させて、シート内側折曲片5bの外面とシート外側折曲片4bの内面との間に介装させ、かつ上部導電性シート6を上部ケース本体4の下面に密接させるとともに、回路基板2を基板保持片4aと基板保持片5aとに挟持させることができ、上部ケース本体4および下部ケース本体5の当接部を、接着剤または熱融着等により一体に接合すれば、電磁波遮蔽型回路ユニット1を組立てることができる。 Was close to the upper surface of the lower case main body 5, the left and right side portions 6c and the back side 6d of the upper conductive sheet 6 by bent at right angles downwardly, the outer surface of the sheet inside bent pieces 5b and the sheet outer bent pieces is interposed between the inner surface of 4b, and causes closely the upper conductive sheet 6 on the lower surface of the upper case body 4, it is possible to sandwich the circuit board 2 on the substrate holding member 4a and the substrate holding member 5a, the contact portion of the upper case body 4 and a lower case body 5, if joined together by adhesive or heat fusion or the like, can be assembled electromagnetic wave shielding type circuit unit 1.

【0019】このように図1ないし図7に図示の実施例では、電磁波遮蔽型回路ユニット1を頗る簡単に組立てることができ、生産性を著しく向上させることができる。 [0019] In the illustrated embodiment thus in FIGS. 1-7, it is possible to assemble the electromagnetic wave shielding type circuit unit 1 extremely simple and can be significantly improved productivity.

【0020】またビス、ボルトナット等の固定手段を必要とせず、上部ケース本体4、下部ケース本体5を射出成形で成形し、上部導電性シート6、下部導電性シート7を単純なプレス加工で成形すればよいので、部品点数を大巾に削減するとともに材料費を削減でき、大巾なコストダウンと軽量化を図ることができる。 [0020] bis, without requiring fastening means such as bolts and nuts, the upper case body 4, the lower case main body 5 molded by injection molding, the upper conductive sheet 6, the lower conductive sheet 7 by a simple pressing process it is sufficient molding can reduce the material cost as well as reducing the number of parts by a large margin, it is possible to greatly in cost and weight.

【0021】さらに回路基板2は上部ケース本体4、下部ケース本体5の基板保持片4a,5aに挟持されるとともに係合孔2eが下部ケース本体5の基板係合突起5 Furthermore the circuit board 2 is an upper case body 4, the substrate engaging projections 5 of the engagement hole 2e is lower casing body 5 while being held between the substrate holding piece 4a of the lower case main body 5, to 5a
cに係合されるため、電磁波遮蔽型回路ユニット1にどのような力が作用しても、回路基板2は確固として安定して保持される。 Since that is engaged c, what forces to the electromagnetic wave shielding type circuit unit 1 also act, the circuit board 2 is stably held firmly.

【0022】図1ないし図7に図示の電磁波遮蔽型回路ユニット1では、電磁波遮蔽型回路ユニット1の手前側が開放しているため、電磁波遮蔽効果を充分に奏することができないことがあるが、図8ないし図9に図示するように電磁波遮蔽型回路ユニット11を構成すれば、電磁波遮蔽型回路ユニット11の手前側は、上部導電性シート [0022] In Figure 1 through the electromagnetic wave shielding type circuit unit 1 shown in FIG. 7, since the front side of the electromagnetic wave shielding type circuit unit 1 is open, although it may not be possible to obtain a sufficient electromagnetic wave shielding effect, FIG. by configuring the electromagnetic wave shielding type circuit unit 11 as shown in 8 to 9, the front side of the electromagnetic wave shielding type circuit unit 11 includes an upper conductive sheet
16、下部導電性シート17の手前側部16e、17eでもって密封され、より一層高い電磁波遮蔽効果を奏することができる。 16, the front side 16e of the lower conductive sheet 17 is sealed with a 17e, it is possible to achieve even higher electromagnetic shielding effect.

【0023】なお、図8ないし図9に図示された電磁波遮蔽型回路ユニット11における各構成部分には、図1ないし図7に図示された電磁波遮蔽型回路ユニット1の各構成部分の符号に10を加算した符号が付されている。 [0023] Incidentally, each component in the electromagnetic wave shielding type circuit unit 11 illustrated in FIGS. 8 to 9, 10 to the sign of the components of the electromagnetic wave shielding type circuit unit 1 shown in FIGS. 1 to 7 reference numerals are used obtained by adding a.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明に係る電磁波遮蔽型回路ユニットの一実施例を図示した全体斜視図である。 1 is an overall perspective view illustrating an embodiment of an electromagnetic wave shielding type circuit unit according to the present invention.

【図2】図4のII部拡大正面図である。 2 is a II portion enlarged front view of FIG.

【図3】図1の分解斜視図である。 3 is an exploded perspective view of FIG.

【図4】電磁波遮蔽型回路ユニットを組立てる場合の第1工程を示した正面図である。 4 is a front view illustrating a first step in the case of assembling the electromagnetic wave shielding type circuit unit.

【図5】電磁波遮蔽型回路ユニットを組立てる場合の第2工程を示した正面図である。 5 is a front view showing a second step in the case of assembling the electromagnetic wave shielding type circuit unit.

【図6】電磁波遮蔽型回路ユニットを組立てる場合の第3工程を示した正面図である。 6 is a front view showing a third step in the case of assembling the electromagnetic wave shielding type circuit unit.

【図7】電磁波遮蔽型回路ユニットを組立てる場合の第4工程を示し電磁波遮蔽型回路ユニットの組立を完成した状態の正面図である。 7 is a front view of a fourth state in which to complete the assembly of the electromagnetic wave shielding type circuit unit shows the step in the case of assembling the electromagnetic wave shielding type circuit unit.

【図8】本発明の他の実施例の全体斜視図である。 8 is an overall perspective view of another embodiment of the present invention.

【図9】図8に図示の実施例の分解斜視図である。 9 is an exploded perspective view of the embodiment shown in FIG.

【符号の説明】 DESCRIPTION OF SYMBOLS

1…電磁波遮蔽型回路ユニット、2…回路基板、3…シールドケース、4…上部ケース本体、5…下部ケース本体、6…上部導電性シート、7…下部導電性シート、11 1 ... electromagnetic wave shielding type circuit unit, 2 ... circuit board, 3 ... shield case, 4 ... upper case body, 5 ... lower case body, 6 ... upper conductive sheet, 7 ... lower conductive sheet, 11
…電磁波遮蔽型回路ユニット、12…回路基板、13…シールドケース、14…上部ケース本体、15…下部ケース本体、16…上部導電性シート、17…下部導電性シート。 ... electromagnetic wave shielding type circuit unit, 12 ... circuit board, 13 ... shield case, 14 ... upper case body, 15 ... lower case body, 16 ... upper conductive sheet, 17 ... lower conductive sheet.

Claims (5)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 回路基板を略直方体状導電性シールドケースで包囲し、回路基板から外部への電磁波の漏減を防止する電磁波遮蔽型回路ユニットにおいて、 前記直方体状導電性シールドケースの外形を上下2分割に分割した形状に形成された上部ケース本体および下部ケース本体と、 該上部ケース本体の下面に接触しうる上部導電性シートと、 該下部ケース本体の上面に接触しうる下部導電性シートと、 前記上部ケース本体および下部ケース本体で構成された内部空間の略上下中央に保持される回路基板とよりなり、 前記上部ケース本体の下面および下部ケース本体の上面には、ケース本体厚さ中央に向って突出して前記回路基板を上下から挟持する基板保持片が形成され、 前記上部ケース本体の下面または下部ケース本体の上面には、前 1. A surrounds the circuit board in a substantially rectangular parallelepiped conductive shield case, in the electromagnetic shielding type circuit unit for preventing the decrease leakage of electromagnetic waves from the circuit board to the outside, up and down the outer shape of the rectangular parallelepiped conductive shield case an upper case body and a lower case body formed in a split shape divided into two parts, an upper conductive sheet may contact the lower surface of the upper case body, and a lower conductive sheet may contact the upper surface of the lower case body the more becomes the upper case body and a circuit board which is held in a substantially vertical center of the inner space made up of the lower case body, the upper surface of the lower surface and a lower case body of the upper case body, the case body in the thickness center toward the substrate holding piece for clamping the circuit board from above and below and protrudes is formed on the upper surface of the lower surface or the lower case body of the upper case body, the front 記基板保持片より外周側に位置して前記ケース本体厚さ中央に向って突出したシート内側折曲片が形成され、 前記下部ケース本体の上面または上部ケース本体の下面には、前記シート内側折曲片よりも該シート内側折曲片の厚さに相当する寸法だけ外周側に位置して前記ケース本体厚さ中央に向って突出したシート外側折曲片が形成されたことを特徴とする電磁波遮蔽型回路ユニット。 Serial sheet inner bent piece projecting toward the case body thickness center is located closer to that outer edge than the substrate holding piece is formed on the lower surface of the top or upper case body of the lower case body, the seat inner folding electromagnetic waves, characterized in that the sheet outside bent piece projecting toward the case body thickness centrally located only outer peripheral side dimension corresponding to the thickness of the sheet inside bent pieces are formed than Kyokuhen shield type circuit unit.
  2. 【請求項2】 前記上部導電性シートおよび下部導電性シートには、前記上部ケース本体のシート折曲片および下部ケース本体のシート折曲片の各内側縁を境として容易に折曲変形可能な処理が施されたことを特徴とする前記請求項1記載の電磁波遮蔽型回路ユニット。 Wherein the upper conductive sheet and the lower conductive sheet is easily possible bending deformation of each inner edge of the sheet bent piece and the lower case body of the sheet bent piece of the upper case body as a boundary the electromagnetic wave shielding type circuit unit of claim 1, wherein the processing has been performed.
  3. 【請求項3】 前記処理は局部的曲げ加工であることを特徴とする請求項2記載の電磁波遮蔽型回路ユニット。 3. A wave shielding type circuit unit according to claim 2, wherein the processing is localized bending.
  4. 【請求項4】 前記処理はミシン目加工であることを特徴する請求項2記載の電磁波遮蔽型回路ユニット。 4. The electromagnetic wave shielding type circuit unit according to claim 2, characterized in that said process is a perforation forming.
  5. 【請求項5】 前記シート内側折曲片およびシート外側折曲片の上下突出寸法は、前記上部ケース本体および下部ケース本体を合せてなるケース本体の内法(うちのり)に略一致したことを特徴とする前記請求項1記載の電磁波遮蔽型回路ユニット。 Upper and lower projecting dimension of wherein said sheet inner bent piece and the sheet outer bent piece, that substantially matches the inner size (inner size) of the case body comprising the combined upper case body and a lower case body the electromagnetic wave shielding type circuit unit of claim 1, wherein.
JP17158194A 1994-07-01 1994-07-01 Electromagnetic wave shielded circuit unit Withdrawn JPH0818266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17158194A JPH0818266A (en) 1994-07-01 1994-07-01 Electromagnetic wave shielded circuit unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17158194A JPH0818266A (en) 1994-07-01 1994-07-01 Electromagnetic wave shielded circuit unit

Publications (1)

Publication Number Publication Date
JPH0818266A true true JPH0818266A (en) 1996-01-19

Family

ID=15925813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17158194A Withdrawn JPH0818266A (en) 1994-07-01 1994-07-01 Electromagnetic wave shielded circuit unit

Country Status (1)

Country Link
JP (1) JPH0818266A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9820394B2 (en) 2015-10-09 2017-11-14 Kabushiki Kaisha Toshiba Circuit board attachment structure and electronic device adopting the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9820394B2 (en) 2015-10-09 2017-11-14 Kabushiki Kaisha Toshiba Circuit board attachment structure and electronic device adopting the same

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