JPH0818266A - Electromagnetic wave shielded circuit unit - Google Patents

Electromagnetic wave shielded circuit unit

Info

Publication number
JPH0818266A
JPH0818266A JP6171581A JP17158194A JPH0818266A JP H0818266 A JPH0818266 A JP H0818266A JP 6171581 A JP6171581 A JP 6171581A JP 17158194 A JP17158194 A JP 17158194A JP H0818266 A JPH0818266 A JP H0818266A
Authority
JP
Japan
Prior art keywords
case body
circuit unit
electromagnetic wave
sheet
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP6171581A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Tomita
一良 富田
Naoji Ozaki
直二 尾崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sega Corp
Original Assignee
Sega Enterprises Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sega Enterprises Ltd filed Critical Sega Enterprises Ltd
Priority to JP6171581A priority Critical patent/JPH0818266A/en
Publication of JPH0818266A publication Critical patent/JPH0818266A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the cost and weight of a circuit unit by forming board holding pieces for holding a circuit board therebetween and sheet inside bent pieces on the bottom of an upper case or top of a lower case and sheet outside bent pieces on the top of the lower case or bottom of the upper case. CONSTITUTION:An electromagnetic wave shielded circuit unit 1 is composed of a circuit board 2 and flattened rectangular shield case 3. A synthetic resin upper and lower cases 4 and 5 are formed as an upper and lower halves of a shield case 3. On a central part of the top of the case 5, two sets of board holding pieces 5a are formed and two vertically up directed sheet inside bent pieces 5b are formed near each piece 5a. On a central part of the bottom of the case 4, board hold pieces 4a are formed at positions corresponding to the pieces 5a and two vertically down directed sheet outside bent pieces 4b are formed near each piece 4a.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、テレビ遊戯機等の電子
機器に装着される回路ユニットから電磁波を外部へ漏洩
させないように、回路基板を略直方体状導電性シールド
ケースで包囲した電磁波遮蔽型回路ユニットに関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding type in which a circuit board is surrounded by a substantially rectangular parallelepiped conductive shield case so as to prevent electromagnetic waves from leaking to the outside from a circuit unit mounted on an electronic device such as a television game machine. It relates to a circuit unit.

【0002】[0002]

【従来技術および解決しようとする課題】回路基板を、
扁平な直方体状の導電性シールドケースで包囲してなる
電磁波遮蔽型回路ユニットでは、実公昭57−3356号公
報、実開平3− 13793号公報に示されるように、金属板
をプレス加工によって成形して導電性シールドケースを
構成したため、その機械強度、剛性を金属板の板厚に依
存せざるを得ず、軽量化が困難であった。
2. Description of the Related Art A circuit board is
In an electromagnetic wave shielding type circuit unit surrounded by a flat rectangular parallelepiped conductive shield case, a metal plate is formed by pressing as shown in JP-B-57-3356 and JP-A-3-13793. Since the conductive shield case is constructed by using the conductive shield case, its mechanical strength and rigidity must be dependent on the thickness of the metal plate, and it is difficult to reduce the weight.

【0003】また導電性シールドケース内空間の略中央
に回路基板を保持させるために、シールドケース奥内の
保持片に回路基板を固定する作業や、回路基板のケース
突出部を上下から挟持する蓋をシールドケースに固着す
る作業が必要となって部品点数や作業工数を削減し難
く、大巾なコストダウンができなかった。
Further, in order to hold the circuit board in the approximate center of the space inside the conductive shield case, the work of fixing the circuit board to a holding piece inside the shield case, and a lid for holding the case projecting portion of the circuit board from above and below. It became difficult to reduce the number of parts and work man-hours because it was necessary to fix the to the shield case, and it was not possible to significantly reduce the cost.

【0004】[0004]

【課題を解決するための手段および作用効果】本発明
は、このような難点を克服した電磁波遮蔽型回路ユニッ
トの改良に係り、回路基板を略直方体状導電性シールド
ケースで包囲し、回路基板から外部への電磁波の漏減を
防止する電磁波遮蔽型回路ユニットにおいて、前記直方
体状導電性シールドケースの外形を上下2分割に分割し
た形状に形成された上部ケース本体および下部ケース本
体と、該上部ケース本体の下面に接触しうる上部導電性
シートと、該下部ケース本体の上面に接触しうる下部導
電性シートと、前記上部ケース本体および下部ケース本
体で構成された内部空間の略上下中央に保持される回路
基板とよりなり、前記上部ケース本体の下面および下部
ケース本体の上面には、ケース本体厚さ中央に向って突
出して前記回路基板を上下から挟持する基板保持片が形
成され、前記上部ケース本体の下面または下部ケース本
体の上面には、前記基板保持片より外周側に位置して前
記ケース本体厚さ中央に向って突出したシート内側折曲
片が形成され、前記下部ケース本体の上面または上部ケ
ース本体の下面には、前記シート内側折曲片よりも該シ
ート内側折曲片の厚さに相当する寸法だけ外周側に位置
して前記ケース本体厚さ中央に向って突出したシート外
側折曲片が形成されたことを特徴とするものである。
SUMMARY OF THE INVENTION The present invention relates to an improvement of an electromagnetic wave shielding type circuit unit which overcomes the above-mentioned problems, and a circuit board is surrounded by a substantially rectangular parallelepiped conductive shield case, In an electromagnetic wave shielding type circuit unit for preventing leakage of electromagnetic waves to the outside, an upper case body and a lower case body formed by dividing the outer shape of the rectangular parallelepiped conductive shield case into upper and lower halves, and the upper case. An upper conductive sheet capable of contacting the lower surface of the main body, a lower conductive sheet capable of contacting the upper surface of the lower case body, and held in a substantially vertical center of an internal space formed by the upper case body and the lower case body. And a circuit board that protrudes toward the center of the thickness of the case body on the lower surface of the upper case body and the upper surface of the lower case body. A board holding piece that is sandwiched from above and below is formed, and the inside of the sheet that is located on the outer peripheral side of the board holding piece and projects toward the center of the case body thickness is formed on the lower surface of the upper case body or the upper surface of the lower case body. A bent piece is formed, and a bent piece is formed on the upper surface of the lower case body or the lower surface of the upper case body, and is located on the outer peripheral side by a dimension corresponding to the thickness of the seat inner bent piece with respect to the seat inner bent piece. A sheet outer side bent piece that protrudes toward the center of the thickness of the case body is formed.

【0005】本発明は前記したように構成されているの
で、回路ユニットのケース本体は金属板製でなくて合成
樹脂製で足り、しかも上部導電シートおよび下部導電シ
ートはケースの機械的強度・剛性を負担する必要がなく
なって薄くてよく、その結果、材料費節減によるコスト
ダウンと、軽量化とを図ることができる。
Since the present invention is constructed as described above, the case body of the circuit unit need not be made of a metal plate but made of synthetic resin, and the upper conductive sheet and the lower conductive sheet are mechanical strength and rigidity of the case. Therefore, it is possible to reduce the cost by saving the material cost and to reduce the weight.

【0006】また本発明では、上、下ケース本体と上下
導電性シートとを合せて、上、下両ケース本体を相互に
一体に結合することにより、回路基板を電磁的に密閉で
きるため、部品点数および工数を減少させてこの面での
コストを削減することができる。
In the present invention, the circuit board can be electromagnetically sealed by combining the upper and lower case bodies with the upper and lower conductive sheets and integrally connecting the upper and lower case bodies to each other. The number of points and man-hours can be reduced to reduce the cost in this respect.

【0007】さらに本発明においては、上下ケース本体
より内方へ突出した基板保持片でもって回路基板を挟持
するため、該回路基板を安定して確固と保持することが
でき、またケース本体の上下厚さを薄くすることができ
るので、輸送の際の衝撃を抑制する緩衝材を節減するこ
とができるとともに容積を減らして効率良く運搬でき、
しかも保管場所を狭くすることができる。
Further, in the present invention, since the circuit board is sandwiched by the board holding pieces protruding inward from the upper and lower case bodies, the circuit board can be stably and firmly held, and the upper and lower sides of the case body can be held firmly. Since the thickness can be reduced, it is possible to save the cushioning material that suppresses the impact during transportation, reduce the volume, and carry it efficiently,
Moreover, the storage space can be reduced.

【0008】また本発明を請求項2のように構成するこ
とにより、前記上、下導電性シートを容易に折曲変形す
ることができ、生産性を大巾に向上させることができ
る。
By configuring the present invention as in claim 2, the upper and lower conductive sheets can be easily bent and deformed, and the productivity can be greatly improved.

【0009】さらに本発明を請求項3または請求項4記
載のように構成することにより、前記上、下導電性シー
トの折曲変形可能処理を容易に遂行することができる。
Further, by constructing the present invention as claimed in claim 3 or 4, it is possible to easily perform the bending and deformable processing of the upper and lower conductive sheets.

【0010】さらにまた本発明を請求項5記載のように
構成することにより、下部ケース本体上に下部導電性シ
ート、回路基板、上部導電性シートおよび上部ケース本
体を順次重ね、これらを下方へ圧下するだけで、前記
上、下導電性シートの端部を直角に折曲して、該上、下
導電性シートで前記回路基板を電磁的に密封でき、頗る
容易に能率良く電磁波遮蔽型回路ユニットを生産するこ
とができる。
Further, according to the present invention, the lower conductive sheet, the circuit board, the upper conductive sheet and the upper case body are sequentially stacked on the lower case body, and these are pressed downward. By simply bending the ends of the upper and lower conductive sheets at a right angle, the circuit board can be electromagnetically sealed by the upper and lower conductive sheets, and it is easy to efficiently and efficiently shield the electromagnetic wave shielding circuit unit. Can be produced.

【0011】[0011]

【実 施 例】以下、図1ないし図6に図示された本発
明の電磁波遮蔽型回路ユニット1の一実施例について説
明する。テレビ遊戯機に用いられる電磁波遮蔽型回路ユ
ニット1は、回路基板2と扁平直方体状シールドケース
3とよりなり、回路基板2は、通常のプリント回路基板
または多層回路基板でもよく、外部接続端子2aと主回
路2bとを具備している。
EXAMPLES An example of the electromagnetic wave shielding circuit unit 1 of the present invention shown in FIGS. 1 to 6 will be described below. An electromagnetic wave shielding type circuit unit 1 used in a television game machine comprises a circuit board 2 and a flat rectangular parallelepiped shield case 3. The circuit board 2 may be an ordinary printed circuit board or a multilayer circuit board, and has an external connection terminal 2a. It has a main circuit 2b.

【0012】またシールドケース3の外形を上下2分割
に分割した形状に、合成樹脂製の上部ケース本体4、下
部ケース本体5は形成され、該上部ケース本体4の下面
および下部ケース本体5の上面にそれぞれ接触しうる上
部導電性シート6、下部導電性シート7は薄金属板製で
あり、該上部導電性シート6、下部導電性シート7で
は、回路基板2の左右両側縁2cと奥側縁2dとに対応
した部位に、図2に図示されるような局部的曲げ加工部
6a,7aが形成されている。
An upper case body 4 and a lower case body 5 made of synthetic resin are formed in a shape obtained by dividing the outer shape of the shield case 3 into upper and lower parts, and the lower surface of the upper case body 4 and the upper surface of the lower case body 5 are formed. The upper conductive sheet 6 and the lower conductive sheet 7, which can be respectively contacted with, are made of a thin metal plate. In the upper conductive sheet 6 and the lower conductive sheet 7, the left and right side edges 2c and the back side edge of the circuit board 2 are Local bending parts 6a and 7a as shown in FIG. 2 are formed at the portions corresponding to 2d.

【0013】さらに下部ケース本体5の上面の略中央部
には、2個の基板保持片5aが形成されるとともに、該
基板保持片5aより左右外側方および奥側に位置してシ
ート内側折曲片5bがそれぞれ2個ずつ直角に上方へ指
向して突設され、前記基板保持片5aの頂端に基板係合
突起5cが形成されている。
Further, two substrate holding pieces 5a are formed in the substantially central portion of the upper surface of the lower case body 5, and the seat inner side bending portion is located on the left and right outer sides and the inner side of the substrate holding pieces 5a. Two pieces 5b are respectively provided to project upward at a right angle and two board engaging projections 5c are formed on the top ends of the board holding pieces 5a.

【0014】さらにまた上部ケース本体4の下面の略中
央部には、前記基板保持片5aに対応した位置にて基板
保持片4aが形成されるとともに、前記下部ケース本体
5のシート内側折曲片5bの外面に上部導電性シート6
を介して接触しうる位置にてシート外側折曲片4bがそ
れぞれ2個ずつ直角に下方へ指向して突設されている。
Furthermore, a board holding piece 4a is formed at a position corresponding to the board holding piece 5a at a substantially central portion of the lower surface of the upper case body 4, and a sheet inside bent piece of the lower case body 5 is formed. The upper conductive sheet 6 is provided on the outer surface of 5b.
Two sheet outer side bending pieces 4b are provided at right angles and project downward at a position where they can contact each other.

【0015】しかも回路基板2の主回路2bには、下部
ケース本体5の基板係合突起5cが嵌合することができ
る係合孔2eが形成されている。
Further, the main circuit 2b of the circuit board 2 is formed with an engagement hole 2e into which the board engagement protrusion 5c of the lower case body 5 can be fitted.

【0016】また上部導電性シート6および下部導電性
シート7には、上部ケース本体4の基板保持片4aおよ
び下部ケース本体5の基板保持片5aが嵌合できる嵌合
孔6b,7bがそれぞれ設けられている。
The upper conductive sheet 6 and the lower conductive sheet 7 are provided with fitting holes 6b and 7b, respectively, into which the board holding piece 4a of the upper case body 4 and the board holding piece 5a of the lower case body 5 can be fitted. Has been.

【0017】図1ないし図7に図示の実施例は前記した
ように構成されているので、電磁波遮蔽型回路ユニット
1を組立てるには、図4に図示するように、下部導電性
シート7の局部的曲げ加工部7aが下部ケース本体5の
シート内側折曲片5bの内側に位置した状態で、下部導
電性シート7を下部ケース本体5のシート内側折曲片5
b上に載置し、回路基板2の左右両側縁2c,奥側縁2
dが下部導電性シート7の局部的曲げ加工部7aの直上
に位置するように、回路基板2を下部導電性シート7上
に重ね、回路基板2を全面に亘って均等に下方へ圧下す
ることにより、図5に図示するように、下部導電性シー
ト7の局部的曲げ加工部7aを境に下部導電性シート7
の左右両側部7cおよび奥側部7dを直角上方に折曲さ
せることができるとともに、該下部ケース本体5のシー
ト内側折曲片5bの内側面に添接させることができ、し
かも回路基板2の係合孔2eを下部ケース本体5の基板
係合突起5cに係合させることができる。
Since the embodiment shown in FIGS. 1 to 7 is constructed as described above, in order to assemble the electromagnetic wave shielding type circuit unit 1, as shown in FIG. The lower conductive sheet 7 is inserted into the sheet inner side bent piece 5 of the lower case body 5 in a state where the dynamic bending portion 7a is positioned inside the sheet inner side bent piece 5b of the lower case body 5.
Placed on b, the left and right side edges 2c, the back side edge 2 of the circuit board 2
The circuit board 2 is placed on the lower conductive sheet 7 so that d is located directly above the locally bent portion 7a of the lower conductive sheet 7, and the circuit board 2 is evenly pressed down over the entire surface. Thus, as shown in FIG. 5, the lower conductive sheet 7 is bordered by the locally bent portion 7a of the lower conductive sheet 7.
The right and left side portions 7c and the rear side portion 7d can be bent upward at a right angle, and can be attached to the inner side surface of the seat inner side bent piece 5b of the lower case body 5, and further, the circuit board 2 The engagement hole 2e can be engaged with the board engagement protrusion 5c of the lower case body 5.

【0018】次に図6に図示するように、上部導電性シ
ート6の局部的曲げ加工部6aが下部導電性シート7の
左右両側部7c先端より外方に位置した状態で、上部導
電性シート6を下部導電性シート7の左右両側部7c先
端上に載置し、上部ケース本体4のシート外側折曲片4
bの下端が上部導電性シート6の局部的曲げ加工部6a
の外側方に位置するように、上部導電性シート6上に上
部ケース本体4を重ね、上部ケース本体4を下部ケース
本体5に対して平行に保持させたまま下方へ圧下するこ
とにより、図7に図示するように、下部導電性シート7
を下部ケース本体5の上面上に密接させ、上部導電性シ
ート6の左右両側部6cおよび奥側部6dを直角下方に
折曲させて、シート内側折曲片5bの外面とシート外側
折曲片4bの内面との間に介装させ、かつ上部導電性シ
ート6を上部ケース本体4の下面に密接させるととも
に、回路基板2を基板保持片4aと基板保持片5aとに
挟持させることができ、上部ケース本体4および下部ケ
ース本体5の当接部を、接着剤または熱融着等により一
体に接合すれば、電磁波遮蔽型回路ユニット1を組立て
ることができる。
Next, as shown in FIG. 6, with the locally bent portions 6a of the upper conductive sheet 6 positioned outside the tips of the left and right side portions 7c of the lower conductive sheet 7, the upper conductive sheet 6 is formed. 6 is placed on the left and right side portions 7c of the lower conductive sheet 7, and the sheet outer side bent piece 4 of the upper case body 4 is placed.
The lower end of b is the locally bent portion 6a of the upper conductive sheet 6
7 is formed by stacking the upper case body 4 on the upper conductive sheet 6 so that the upper case body 4 is positioned parallel to the lower case body 5. As shown in FIG.
Is closely contacted with the upper surface of the lower case body 5, and the right and left side portions 6c and the rear side portion 6d of the upper conductive sheet 6 are bent downward at right angles, and the outer surface of the sheet inner side bending piece 5b and the sheet outer side bending piece are bent. 4b, and the upper conductive sheet 6 is brought into close contact with the lower surface of the upper case body 4, and the circuit board 2 can be sandwiched between the board holding piece 4a and the board holding piece 5a. The electromagnetic wave shielding circuit unit 1 can be assembled by integrally joining the abutting portions of the upper case body 4 and the lower case body 5 with an adhesive or heat fusion.

【0019】このように図1ないし図7に図示の実施例
では、電磁波遮蔽型回路ユニット1を頗る簡単に組立て
ることができ、生産性を著しく向上させることができ
る。
As described above, in the embodiment shown in FIGS. 1 to 7, the electromagnetic wave shielding circuit unit 1 can be easily assembled and the productivity can be remarkably improved.

【0020】またビス、ボルトナット等の固定手段を必
要とせず、上部ケース本体4、下部ケース本体5を射出
成形で成形し、上部導電性シート6、下部導電性シート
7を単純なプレス加工で成形すればよいので、部品点数
を大巾に削減するとともに材料費を削減でき、大巾なコ
ストダウンと軽量化を図ることができる。
Further, the upper case body 4 and the lower case body 5 are molded by injection molding without fixing means such as screws and bolts and nuts, and the upper conductive sheet 6 and the lower conductive sheet 7 are simply pressed. Since it can be molded, the number of parts can be greatly reduced, the material cost can be reduced, and the cost and weight can be greatly reduced.

【0021】さらに回路基板2は上部ケース本体4、下
部ケース本体5の基板保持片4a,5aに挟持されると
ともに係合孔2eが下部ケース本体5の基板係合突起5
cに係合されるため、電磁波遮蔽型回路ユニット1にど
のような力が作用しても、回路基板2は確固として安定
して保持される。
Further, the circuit board 2 is sandwiched between the board holding pieces 4a, 5a of the upper case body 4 and the lower case body 5, and the engaging holes 2e are provided in the board engaging protrusions 5 of the lower case body 5.
Since it is engaged with c, no matter what force acts on the electromagnetic wave shielding circuit unit 1, the circuit board 2 is firmly and stably held.

【0022】図1ないし図7に図示の電磁波遮蔽型回路
ユニット1では、電磁波遮蔽型回路ユニット1の手前側
が開放しているため、電磁波遮蔽効果を充分に奏するこ
とができないことがあるが、図8ないし図9に図示する
ように電磁波遮蔽型回路ユニット11を構成すれば、電磁
波遮蔽型回路ユニット11の手前側は、上部導電性シート
16、下部導電性シート17の手前側部16e、17eでもって
密封され、より一層高い電磁波遮蔽効果を奏することが
できる。
In the electromagnetic wave shielding circuit unit 1 shown in FIGS. 1 to 7, since the front side of the electromagnetic wave shielding circuit unit 1 is open, the electromagnetic wave shielding effect may not be sufficiently exerted. If the electromagnetic wave shielding circuit unit 11 is configured as shown in FIGS. 8 to 9, the front side of the electromagnetic wave shielding circuit unit 11 is an upper conductive sheet.
16, the lower conductive sheet 17 is hermetically sealed by the front side portions 16e, 17e of the lower conductive sheet 17, so that a higher electromagnetic wave shielding effect can be achieved.

【0023】なお、図8ないし図9に図示された電磁波
遮蔽型回路ユニット11における各構成部分には、図1な
いし図7に図示された電磁波遮蔽型回路ユニット1の各
構成部分の符号に10を加算した符号が付されている。
The components of the electromagnetic wave shielding type circuit unit 11 shown in FIGS. 8 to 9 are the same as those of the electromagnetic wave shielding type circuit unit 1 shown in FIGS. Is added.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る電磁波遮蔽型回路ユニットの一実
施例を図示した全体斜視図である。
FIG. 1 is an overall perspective view showing an embodiment of an electromagnetic wave shielding type circuit unit according to the present invention.

【図2】図4のII部拡大正面図である。FIG. 2 is an enlarged front view of a portion II of FIG.

【図3】図1の分解斜視図である。FIG. 3 is an exploded perspective view of FIG.

【図4】電磁波遮蔽型回路ユニットを組立てる場合の第
1工程を示した正面図である。
FIG. 4 is a front view showing a first step in assembling an electromagnetic wave shielding circuit unit.

【図5】電磁波遮蔽型回路ユニットを組立てる場合の第
2工程を示した正面図である。
FIG. 5 is a front view showing a second step of assembling the electromagnetic wave shielding circuit unit.

【図6】電磁波遮蔽型回路ユニットを組立てる場合の第
3工程を示した正面図である。
FIG. 6 is a front view showing a third step of assembling the electromagnetic wave shielding circuit unit.

【図7】電磁波遮蔽型回路ユニットを組立てる場合の第
4工程を示し電磁波遮蔽型回路ユニットの組立を完成し
た状態の正面図である。
FIG. 7 is a front view showing a fourth step of assembling the electromagnetic wave shielding circuit unit, showing a state where the electromagnetic wave shielding circuit unit is completely assembled.

【図8】本発明の他の実施例の全体斜視図である。FIG. 8 is an overall perspective view of another embodiment of the present invention.

【図9】図8に図示の実施例の分解斜視図である。9 is an exploded perspective view of the embodiment shown in FIG.

【符号の説明】[Explanation of symbols]

1…電磁波遮蔽型回路ユニット、2…回路基板、3…シ
ールドケース、4…上部ケース本体、5…下部ケース本
体、6…上部導電性シート、7…下部導電性シート、11
…電磁波遮蔽型回路ユニット、12…回路基板、13…シー
ルドケース、14…上部ケース本体、15…下部ケース本
体、16…上部導電性シート、17…下部導電性シート。
DESCRIPTION OF SYMBOLS 1 ... Electromagnetic wave shielding type circuit unit, 2 ... Circuit board, 3 ... Shield case, 4 ... Upper case main body, 5 ... Lower case main body, 6 ... Upper conductive sheet, 7 ... Lower conductive sheet, 11
... electromagnetic wave shielding type circuit unit, 12 ... circuit board, 13 ... shield case, 14 ... upper case body, 15 ... lower case body, 16 ... upper conductive sheet, 17 ... lower conductive sheet.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 回路基板を略直方体状導電性シールドケ
ースで包囲し、回路基板から外部への電磁波の漏減を防
止する電磁波遮蔽型回路ユニットにおいて、 前記直方体状導電性シールドケースの外形を上下2分割
に分割した形状に形成された上部ケース本体および下部
ケース本体と、 該上部ケース本体の下面に接触しうる上部導電性シート
と、 該下部ケース本体の上面に接触しうる下部導電性シート
と、 前記上部ケース本体および下部ケース本体で構成された
内部空間の略上下中央に保持される回路基板とよりな
り、 前記上部ケース本体の下面および下部ケース本体の上面
には、ケース本体厚さ中央に向って突出して前記回路基
板を上下から挟持する基板保持片が形成され、 前記上部ケース本体の下面または下部ケース本体の上面
には、前記基板保持片より外周側に位置して前記ケース
本体厚さ中央に向って突出したシート内側折曲片が形成
され、 前記下部ケース本体の上面または上部ケース本体の下面
には、前記シート内側折曲片よりも該シート内側折曲片
の厚さに相当する寸法だけ外周側に位置して前記ケース
本体厚さ中央に向って突出したシート外側折曲片が形成
されたことを特徴とする電磁波遮蔽型回路ユニット。
1. An electromagnetic wave shielding type circuit unit in which a circuit board is surrounded by a substantially rectangular parallelepiped conductive shield case to prevent leakage of electromagnetic waves from the circuit board to the outside. An upper case main body and a lower case main body formed in a shape divided into two parts, an upper conductive sheet capable of contacting a lower surface of the upper case main body, and a lower conductive sheet capable of contacting an upper surface of the lower case main body. A circuit board which is held substantially vertically in the center of the internal space formed by the upper case body and the lower case body, and the case body has a center thickness in the lower surface of the upper case body and the upper surface of the lower case body. A board holding piece is formed to project toward and clamp the circuit board from above and below. A sheet-inside bent piece that is located on the outer peripheral side of the substrate holding piece and protrudes toward the center of the case body thickness is formed, and the sheet-inside folded piece is formed on the upper surface of the lower case body or the lower surface of the upper case body. An electromagnetic wave characterized in that a sheet outer side bent piece is formed which is located on the outer peripheral side by a dimension corresponding to the thickness of the sheet inner side bent piece with respect to the bent piece and protrudes toward the center of the thickness of the case main body. Shielded circuit unit.
【請求項2】 前記上部導電性シートおよび下部導電性
シートには、前記上部ケース本体のシート折曲片および
下部ケース本体のシート折曲片の各内側縁を境として容
易に折曲変形可能な処理が施されたことを特徴とする前
記請求項1記載の電磁波遮蔽型回路ユニット。
2. The upper conductive sheet and the lower conductive sheet can be easily bent and deformed with each inner edge of the sheet bending piece of the upper case body and the sheet bending piece of the lower case body as a boundary. The electromagnetic wave shielding circuit unit according to claim 1, wherein the circuit unit is treated.
【請求項3】 前記処理は局部的曲げ加工であることを
特徴とする請求項2記載の電磁波遮蔽型回路ユニット。
3. The electromagnetic wave shielding circuit unit according to claim 2, wherein the processing is local bending.
【請求項4】 前記処理はミシン目加工であることを特
徴する請求項2記載の電磁波遮蔽型回路ユニット。
4. The electromagnetic wave shielding circuit unit according to claim 2, wherein the processing is perforation processing.
【請求項5】 前記シート内側折曲片およびシート外側
折曲片の上下突出寸法は、前記上部ケース本体および下
部ケース本体を合せてなるケース本体の内法(うちの
り)に略一致したことを特徴とする前記請求項1記載の
電磁波遮蔽型回路ユニット。
5. The upper and lower protruding dimensions of the seat inner side bent piece and the seat outer side bent piece are substantially the same as the inner diameter (outer) of the case body formed by combining the upper case body and the lower case body. The electromagnetic wave shielding type circuit unit according to claim 1, which is characterized in that.
JP6171581A 1994-07-01 1994-07-01 Electromagnetic wave shielded circuit unit Withdrawn JPH0818266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6171581A JPH0818266A (en) 1994-07-01 1994-07-01 Electromagnetic wave shielded circuit unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6171581A JPH0818266A (en) 1994-07-01 1994-07-01 Electromagnetic wave shielded circuit unit

Publications (1)

Publication Number Publication Date
JPH0818266A true JPH0818266A (en) 1996-01-19

Family

ID=15925813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6171581A Withdrawn JPH0818266A (en) 1994-07-01 1994-07-01 Electromagnetic wave shielded circuit unit

Country Status (1)

Country Link
JP (1) JPH0818266A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9820394B2 (en) 2015-10-09 2017-11-14 Kabushiki Kaisha Toshiba Circuit board attachment structure and electronic device adopting the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9820394B2 (en) 2015-10-09 2017-11-14 Kabushiki Kaisha Toshiba Circuit board attachment structure and electronic device adopting the same

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A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20010904