JPH08165596A - Method for partially plating resin product - Google Patents

Abstract

PURPOSE: To prevent the part not to be plated from being plated and to improve the appearance quality. CONSTITUTION: A back panel main body 2 having an annular groove 8 having an almost V-shaped section and plural grooves 16 connecting the two points of the groove 8 is electroless-plated. The bottoms 8a of the grooves 8 and 16 are not plated, and an electroless plating layer 13 is formed on the other parts. A strike-plating layer 14A is formed in the first electroplating stage. At this time, although a bipolar phenonmenon is liable to present itself when the area of the part not to be plated is relatively large, the potential difference between the conductive electroless plating layer 13 formed on the part not to be plated and an electroplating soln. is made relatively small by the groove 16, and the bipolar phenomenon is hardly caused. The electroless plating layer 13 remaining on the part not to be plated is dissolved, and a general electroplating layer 14B is formed in the second electroplating stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for partial plating of a resin product in which a plating layer is formed only on a portion of the surface of a resin base material which requires plating.

[0002]

2. Description of the Related Art Conventionally, as this type of technology, for example, those disclosed in Japanese Patent Publication No. 45-37843 (first conventional technique) and Japanese Patent Publication No. 48-16987 (second conventional technique) are disclosed. Are known.

As a plating method to which the first conventional technique is applied, for example, as shown in FIG. 31, first, a base material in which a groove (notch) 81 having a substantially V-shaped cross section is formed in an annular shape by die molding. The main body 82 is molded, and the base material main body 82 is electroless plated. At this time, in the bottom portion 81a of the groove 81, since the gap space is narrow, it is difficult to perform plating, and the electroless plating layer 83 is formed on all the portions except these. Next, the base material body 8 on which the electroless plating layer 83 is formed
2 is subjected to electroplating. This electroplating process is specifically composed of a multi-step process such as a strike plating process, a copper plating process, a nickel plating process and a chromium plating process.
Then, as shown in FIG. 32, in the series of electroplating steps, the electroless plating layer 83 formed in the portion that does not require plating is gradually dissolved by the electroplating solution in each step (see FIG. On the right). On the other hand, in a portion requiring plating, electroplating layer 84 made of various metal plating layers is sequentially formed on the surface of electroless plating layer 83 by energization (left side in the figure). In this way,
A plating layer 85 including the electroless plating layer 83 and the electroplating layer 84 is partially formed on the surface of the base body 82.

On the other hand, as a plating method to which the second conventional technique is applied, for example, as shown in FIG. 33, first, the base material body 91 is molded by die molding. On the base material body 91, a resist coating composed of a polymer compound solution whose surface is hard to be roughened is applied. By this coating, a resist coating layer 92 is formed in a ring shape on the portion of the base material body 91 where plating is not required. Next, the base material body 91 is subjected to electroless plating. At this time, since the surface of the resist coating layer 92 is hard to be roughened, it is difficult to perform plating, and the electroless plating layer 93 is formed on all parts except the resist coating layer 92. Next, as shown in FIG.
Electroplating is performed in the same manner as above, and electroplating layer 94
(Left side of the figure). Further, the electroless plating layer 93 formed in the portion that does not require plating is gradually dissolved by the electroplating solution in each step (right side of the drawing). Even in this case, a resin product obtained by partially forming the plating layer 95 including the electroless plating layer 93 and the electroplating layer 94 can be obtained. Further, in such a technique, the resist coating film layer 92 is not formed on the entire surface where plating is not required, so that workability and cost can be reduced accordingly.

[0005]

By the way, in each of the above-mentioned prior arts, the electroless plating layer 83 formed in a portion that does not require plating during a series of electroplating steps,
93 should be gradually dissolved by the acidic electroplating solution in each step. However, in the electroplating solution, a phenomenon called "bipolar phenomenon" occurs. This is because electroless electroless plating layers 83, 93 formed on the portions that do not require plating.
And a potential difference occurs between the electroplating solution and the electroplating solution. The length of the electroless plating layers 83, 93 formed in the portions not requiring plating (generally, the conduction distance of the portions not requiring plating in the base material main bodies 82, 91 as shown in FIG. 35) is large. This phenomenon becomes stronger as the potential difference becomes larger. This "bipolar phenomenon" means that the electroless plating layers 83 and 93 are not melted at the place where the potential of the cathode is larger than the potential of the electroless plating layer, and the electroless plating layers 83 and 93 are not dissolved. Metal ions will be deposited.

Therefore, when the base material main bodies 82, 93 are large, the area of the portion not requiring plating tends to be large. In such a case, as shown in FIG. 36, even if the electroless plating layers 83 and 93 are insulated by the groove 81 or the resist coating layer 92, as shown in FIG.
There is a possibility that plating may be formed in a portion that does not require plating. In other words, due to the "bipolar phenomenon", the metal ions in the electroplating solution are deposited on the electroless plating layers 83, 93 where the electroless plating layers 83, 93 are eluted (the portions close to the groove 81) and the electroless plating layers 83, 93. Part to be formed (line groove 81
(The central part of the part that does not require plating, apart from the etc.)
And occur together. Therefore, after the electroplating process is completed, the central part of the part that does not require plating is
In some cases, the strong acid of each electroplating solution formed a film thickness that could not be completely dissolved, and the plating remained. Further, as shown in FIG. 38, it was deduced from the experimental result that the film thickness of the plating added at this time increases with the increase of the conduction distance of the portion not requiring the plating. As a result, the desired partially plated product may not be obtained. Further, even if a paint is applied on top of it, the paint does not adhere well, the appearance quality is poor, and even if the paint adheres, there is a problem in durability.

The present invention has been made to solve the above-mentioned problems, and an object thereof is to prevent plating from being applied to a portion which does not require plating, thereby improving the appearance quality. And to provide a method for partially plating a resin product, which can improve the durability of the coating film when it is coated.

[0008]

In order to achieve the above object, in the invention described in claim 1, a portion of the surface of the resin base material that requires plating and a portion that does not require plating. A first electroless plating avoiding means forming step to form an annular shape in the boundary line part of the electroless plating layer for preventing the formation of the electroless plating layer; At least an electroless plating step of forming an electroless plating layer on a portion other than the first electroless plating avoiding means, and a plating step of the electroless plating layer formed on the base material after the electroless plating step Electrically conducting the necessary portion of the, electroplating step of forming an electroplating layer on the required portion of the plating on the electroless plating layer, the method of partial plating of a resin product, Electroless plating In the previous step, by forming the second electroless plating avoidance means at least in the portion surrounded by the first electroless plating avoidance means that does not require the plating, the portion not requiring the plating is removed. The gist is that it is divided into at least two.

According to the second aspect of the invention,
In the invention according to claim 1, the first and second electroless plating avoiding means are constituted by at least one of a groove having a substantially V-shaped cross section and a strip-shaped or linear resist coating layer. That is the point.

Further, in the invention according to claim 3, in the invention according to claim 1 or 2, the second electroless plating avoiding means is at least any of the first electroless plating avoiding means. The gist is that it is formed so as to connect two points.

In addition, in the invention described in claim 4, in the invention described in claim 3, the gist is that the second electroless plating avoiding means has its own intersection. .

[0012] In addition, in the invention described in claim 5, in the invention described in claim 1 or 2, the second electroless plating avoiding means is annular or annular in a portion not requiring plating. The gist is that it is formed on the entire area surrounded by the.

Further, in the invention described in claim 6, in the invention described in any one of claims 1 to 5,
In the electroplating step, a first-stage electroplating step of forming a strike-plated layer on a portion of the electroless-plated layer where plating is required, and the base material that has been subjected to the first-step electroplating step in a predetermined solution And electroless plating dissolution step of dissolving the electroless plating layer in a portion that does not require plating, and electrically the strike plating layer formed on the substrate after the electroless plating dissolution step The gist is that it comprises a second-stage electroplating step of electrically connecting and forming a general electroplating layer made of a plurality of metal platings on the strike plating layer.

[0014]

According to the invention described in claim 1, in the first electroless plating avoiding means forming step, a portion of the surface of the resin base material that requires plating and a portion that does not require plating. A first electroless plating avoiding means for preventing the formation of the electroless plating layer is formed in a ring shape or a part of a ring shape at a boundary line between and. In the electroless plating step, the electroless plating layer is formed on the surface of the base material other than the first electroless plating avoiding means. Furthermore, after passing through the electroless plating step, in the electroplating step, a portion of the electroless plating layer formed on the base material is electrically conducted, and the plating on the electroless plating layer An electroplating layer is formed on a required portion. At this time, the electroless plating layer, which was basically formed in a portion not requiring plating, is gradually dissolved by the electroplating solution. Therefore, in the end, a resin product in which the plating is only performed on the portion requiring the plating can be obtained.

By the way, in the electroplating step, a so-called "bipolar phenomenon" occurs in a portion where plating is not required. The degree of this "bipolar phenomenon" is
The larger the area or the longest conduction distance of the portion surrounded by the electroless plating avoiding means that does not require plating, the larger the area. That is, with only the above configuration, if the area surrounded by the first electroless plating avoiding means that does not require plating or the longest conduction distance is large, the portion that does not require plating is plated by the "bipolar phenomenon". May easily remain.

However, in the present invention, the second electroless plating avoiding means is formed at least in a portion surrounded by the first electroless plating avoiding means, which does not require plating, in the preceding stage of the electroless plating step. To be done. Then, the second electroless plating avoiding means divides the portion surrounded by the first electroless plating avoiding means that does not require plating into at least two parts. Therefore, the area or the longest conduction distance of the portion surrounded by the first and second electroless plating avoiding means does not require plating, and the area surrounded by the first electroless plating avoiding means does not require plating. It will be smaller than that. Therefore, the potential difference between the electroless plating layer having electroconductivity formed in the portion that does not require plating and the solution for electroplating is relatively small, and the "bipolar phenomenon" is unlikely to occur. .

Further, according to the invention described in claim 2, in addition to the function of the invention described in claim 1, the first and second electroless plating avoiding means have a groove having a substantially V-shaped cross section. And at least one of a strip-shaped or linear resist coating layer. Therefore, when the electroless plating avoiding means is a groove having a substantially V-shaped cross section, the plating solution for the electroless plating does not easily infiltrate into the bottom of the groove, which makes it difficult to perform the electroless plating. Become. Therefore, the electroless plating layer can be insulated at the portion. Further, when the electroless plating avoiding means is a strip-shaped or linear resist coating layer, the surface of the resist coating layer is not easily roughened, and the electroless plating layer is not easily formed thereon. Therefore, the electroless plating layer can be insulated at the portion.

Further, according to the invention of claim 3,
In addition to the action of the invention described in claim 1 or 2, the second electroless plating avoiding means is formed so as to connect at least any two points of the first electroless plating avoiding means. For this reason, the first and second electroless plating is performed with respect to the distance from the point farthest from the first electroless plating avoiding means to the first electroless plating avoiding means in the portion that does not require plating. The distance from the point farthest from the plating avoiding means to the first and second electroless plating avoiding means is surely reduced.

In addition, according to the invention of claim 4,
In addition to the effect of the third aspect, the second electroless plating avoiding means has its own intersection. Therefore, the first
Further, the distance from the point farthest from the second electroless plating avoiding means to the first and second electroless plating avoiding means becomes further smaller. Therefore, "bipolar phenomenon"
Is even less likely to occur.

In addition, according to the invention of claim 5,
In addition to the action of the invention described in claim 1 or 2, the second electroless plating avoiding means is formed in an annular portion or on the entire surface of the portion surrounded by the annular portion in a portion that does not require plating. Therefore, the same effect as that described in claim 3 is achieved.

Further, according to the invention described in claim 6, in addition to the effects of the invention described in claims 1 to 5, in the first stage electroplating step in the electroplating step, on the electroless plating layer A strike plating layer is formed on a portion where plating is required. At this time, as described above, since the "bipolar phenomenon" is less likely to occur, it is possible to suppress the precipitation of metal ions in the strike plating solution in the portion where plating is not required.

In the electroless plating melting step, the first step
The base material that has undergone the step electroplating step is dipped in a predetermined solution to dissolve the electroless plating layer in a portion that does not require plating. At this time, the strike plating layer is not dissolved, or even if it is dissolved, the part where the strike plating layer is present has a larger thickness of the plating layer than the part that does not. The electroless plating layer formed only on these portions and the strike plating layer formed thereon remain. Further, since the deposition of metal ions in the strike plating solution is suppressed on the electroless plating layer formed in the other portion, the electroless plating layer in the portion that does not require plating in the dissolution step. Is reliably dissolved.
Therefore, the plating other than the strike plating layer is never exposed on the base material.

Then, in the second stage electroplating step,
The strike plating layer formed on the base material that has undergone the electroless plating dissolution step is electrically conducted to form a general electroplating layer made of a plurality of metal platings on the strike plating layer. At this time, the electroless plating layer of the portion which does not require plating is already dissolved and does not exist at these points. Therefore, in the second-stage electroplating step, the electroless plating layer is not dissolved in each plating solution.

Further, since the electroless plating layer is not exposed in the portion that does not require plating, the general electroplating layer or the like is not formed in the portion that does not require plating.

[0025]

【Example】

(First Embodiment) A first embodiment in which the present invention is embodied in a vehicle back panel 1 as a resin product will be described with reference to FIGS.
It will be described based on.

A back panel 1 as shown in FIG. 1 is attached to a portion of the rear portion of the vehicle where the license plate is attached. This back panel 1 is formed in a substantially box shape. The back panel 1 includes a back panel body 2 (see FIGS. 5 and 6) as a base material made of ABS resin, and a plating layer formed in a substantially rectangular shape on a part of the design surface (tip of the peripheral edge). 3 (the part with the mesh pattern in FIG. 1),
Coating layer 4 applied and formed on the inner side surface and outer peripheral surface (portion marked with a dotted line in FIG. 1) other than the plating layer 3 excluding the non-designed surface
And have. In addition, on the upper part of the back panel body 2, a red transparent decoration member 5 extending in the lateral direction (see FIG. 3).
Is attached.

As shown in FIGS. 5 to 7, in the back panel main body 2, at the boundary between the plating layer 3 on the inner peripheral side and the coating layer 4 on the outer peripheral side, an inner peripheral side step portion for closing off the coating is formed. 6 and the outer peripheral side step portion 7 are formed in an annular shape. The stepped portions 6 and 7 are formed with annular grooves 8 and 9 each having a substantially V-shaped cross section in an annular shape (closed curved shape). Further, as shown in FIG. 3, the portion covered with the decorative member 5 is
A through hole 10 is formed. Further, on the back side of the portion covered with the decorative member 5, an electrode projection 11 is formed so as to project in the non-design surface side direction, that is, in the vehicle front direction. In addition, a groove 12 is formed in an annular shape on the back side of the portion covered with the decorative member 5 so as to surround the through hole 10 and the electrode projection 11. The groove 12 blocks the entire surface of plating on the back surface side. In this embodiment, the above-mentioned groove grooves 8, 9,
12 constitutes a first electroless plating avoiding means.

In addition, as shown in FIG. 5, the plating layer 3 has an electroless plating layer 13 and an electroplating layer 14 formed thereon. In this embodiment, the electroless plating layer 13 is made of copper and has a thickness of “0.3 to 0.4 μm”.
It is formed to a degree. The electroplating layer 14 is formed to have a total thickness of about 20 to 50 μm and includes a strike plating layer 14A made of nickel and a general electroplating layer 14B made of various metals. More specifically, the general electroplating layer 14B is formed by various metal platings in the order of a copper plating layer, a semi-bright nickel plating layer, a bright nickel plating layer, and a chrome plating layer (all not shown) from the lower layer. Has been done.

Regarding the size of each of the grooves 8, 9 and 12, for example, the width W is "0.5 mm" and the depth D is "0.7 mm". However, the width W is not particularly limited, but it is "0.3
"mm" or more is preferable, and "1.0 mm" or less is preferable in the sense of improving designability. The depth D is also not particularly limited, but is preferably “0.3 mm” or more due to the processing limitation. Further, in this embodiment, the ratio of the depth D to the width W (D / W) is formed to be larger than “1.0”, and the ratio (D / W) of the following equations (1) and (2) W)> 6.7 * r1 + 1.0 (1) It is desirable that the ratio (D / W)> 180 * r1-15.7 (2) is satisfied. The upper limit of the ratio (D / W) is not particularly limited, but if the thickness of the back panel body 2 and the like is the same as in the present embodiment, the ratio (D / W) will be reduced due to processing. "5.0" or less is desirable. More preferably, it is "4.0" or less, and if it is "3.0" or less, processing becomes extremely easy.

Further, various plating solutions for forming each metal plating forming the electroless plating layer 13 and the electroplating layer 14 will be described. First, the plating solution used to form the electroless plating layer 13 is 5 g of copper sulfate 5 hydrate /
L, 5 g / L of sodium hydroxide, 10 mL / L of formalin (37% by volume), and 25 g / L of Roussel salt. The plating solution used to form the strike plating layer 14A, which is the lowermost layer of the electroplating layer 14, is 250 g / L of nickel sulfate, 30 g / L of nickel chloride, and 3 parts of boric acid.
It contains 0 g / L.

The plating solution for forming the copper plating layer of the general electroplating layer 14B is 200 g of copper sulfate.
/ L, sulfuric acid 50 g / L, hydrochloric acid 0.01 g / L and a slight amount of brightener. Furthermore, the plating solution for forming the semi-bright nickel plating layer is 280 g of nickel sulfate.
/ L, 45 g / L of nickel chloride, 40 g / L of boric acid and a slight amount of brightener. In addition, the plating solution for forming the bright nickel plating layer is nickel sulfate 240
g / L, nickel chloride 45 g / L, boric acid 30 g / L and a slight amount of brightening agent and additives. In addition, the plating solution for forming the chromium plating layer contains chromic anhydride 250 g / L, sodium silicofluoride 10 g / L, and sulfuric acid 1 g / L.

Further, in the present embodiment, two kinds of predetermined solutions for dissolving the electroless plating layer 13 in a portion where plating is unnecessary are prepared in the subsequent stage after forming the strike plating layer 14A. This solution is an aqueous solution of ammonium peroxodisulfate 30 g / L or an acid such as nitric acid and 1
It is a 0% aqueous ammonia solution, and the liquid temperature is 40 ° C
And 50 ° C.

In this embodiment, as shown in FIGS. 1 to 4, the inner surface of the back panel body 2 (the portion which does not require plating) is divided into the inner surface and the inner surface. Four groove grooves 15, 16, 17, 18 having a substantially V-shaped cross section are formed to connect two points of the groove groove 8, respectively. Therefore, the inner side surface is divided into eight substantially evenly by these groove grooves 15 to 18, and in this embodiment, these groove grooves 15 are divided.
The second to electroless plating avoiding means are constituted by -18.

Next, the operation and effect of manufacturing the back panel 1 will be described. First, as shown in FIGS. 2 to 4, the back panel main body 2 having the groove grooves 8, 9, 12, 15 to 18 is formed by a known mold forming method.
Get.

Then, the back panel body 2 is immersed in an electroless plating solution to perform electroless plating. That is, the back panel body 2 is first immersed in the electroless plating solution. Here, as shown in FIG. 7, each groove 8,
At the bottom portions 8a of 9, 12, 15 to 18, the plating solution does not reach because the gaps are narrow. However, FIG.
In FIG. 10, only the inner peripheral side groove 8 is described for convenience of explanation, but the outer peripheral side and rear surface side groove grooves 9 and 12 and the groove grooves 15 to 18 formed so as to divide the inner peripheral surface.
The same can be said for. Therefore, these bottom parts 8
No plating is applied to a. In other words, the electroless plating layer 13 made of copper is formed on all portions of the surface of the back panel body 2 except the respective bottom portions 8a.

Next, in the strike plating step which is the first stage electroplating step, the back panel body 2 on which the electroless plating layer 13 is formed is immersed in the above plating solution for forming the strike plating layer 14A for a predetermined time. At the same time as immersing, the portion requiring plating is electrically connected. Then, as shown in FIGS. 8 (a) and 8 (b), the portions that do not require plating are strip grooves 8, 9, 12, 15 ...
Since it is electrically blocked by 18, basically no plating is formed on it. On the other hand, in the portion requiring plating, the surface of the electroless plating layer 13 is
The strike plating layer 13A is formed relatively thin.

At this time, when the area of the portion not requiring plating is relatively large, a so-called "bipolar phenomenon" occurs. The degree of this "bipolar phenomenon" is determined by the fact that the grooves 8, 9, 12, 15 of the parts that do not require plating.
From the point farthest from ~ 18, the line groove 8, 9,
The larger the distance to 12, 15-18, the stronger the strength. That is, if the distance from the point farthest from them to the grooves 8, 9, 12 is large only with the grooves 8, 9, 12 by the "bipolar phenomenon", the central portion of the inner surface of the back panel main body 2 is caused. The plating is likely to remain.

However, in this embodiment, the grooves 15 to 18 are formed so as to divide the inner surface in the preceding stage of the electroless plating process. Due to these groove grooves 15-18, the portion surrounded by the groove groove 8 that does not require plating is 8
Divided into two. That is, of all the grooves 8 that do not require plating, the distance from the point farthest from the groove 8 (the central portion of the inner surface) to the groove 8 is
The distance from the point farthest from 9, 12, 15 to 18 to the grooved groove 8, 9, 12, 15 to 18 becomes smaller. Therefore, the potential difference between the electroless plating layer 13 having electroconductivity formed in a portion not requiring plating and the electroplating solution becomes relatively small, and the "bipolar phenomenon" is unlikely to occur. Become. For this reason, it is possible to prevent metal ions in the strike plating solution from precipitating in a portion not requiring plating, particularly in the central portion of the inner surface. Therefore, the electroless plating layer 13 formed in the portion that does not require plating is completely dissolved by the strike plating solution as shown in FIG.
Alternatively, as shown in FIG. 8 (b), it is gradually dissolved to become a thin wall.

Next, in the electroless plating layer melting step,
The film of the electroless plating layer 13 in a portion not requiring plating is dissolved. First, it is immersed in an aqueous solution of ammonium peroxodisulfate for 2 minutes to dissolve the nickel layer deposited on the electroless plating layer 13 by the "bipolar phenomenon".
At this time, since the "bipolar phenomenon" is less likely to occur due to the groove 15 to 18, the thickness of the strike plating layer 14A is sufficiently thicker than the thickness of the deposited nickel layer. Therefore, both the deposited nickel layer and the strike plating layer 14A are made of nickel, and both are dissolved in a predetermined solution, but even after the deposited nickel layer is completely dissolved, the strike plating is performed. The layer 14A remains with a sufficient film thickness. As a result, on the surface of the back panel body 2, the electroless plating layer 13 and the strike plating layer 14A formed only on the portion where plating is required remain.

Subsequently, the back panel body 2 that has been subjected to the above treatment is immersed in an aqueous ammonia solution for 5 minutes. At this time, since the portion where the strike plating layer 14A is formed is made of nickel, it is not dissolved in the alkaline aqueous ammonia solution. On the other hand, as shown in FIG. 8 (b), the electroless plating layer 13 which was slightly left in the unnecessary portion of the plating is made of copper and therefore is dissolved in the alkaline aqueous ammonia solution. Therefore, in the melting step, all of the electroless plating layer 13 that does not require plating is reliably melted. As a result, even if the electroless plating layer 13 is not completely dissolved by the strike plating solution, as shown in FIG. 8A, it is completely dissolved in the dissolution step.

On the surface of the back panel body 2,
Electroless plating layer 1 formed only on the portion where plating is required
3 and the strike plating layer 14A formed thereon remains, the electroless plating layer 13 does not exist in other portions, and any plating other than the strike plating layer 14A does not occur on the back panel body 2. Not exposed.

Subsequently, in the copper plating step, the semi-bright nickel plating step, the bright nickel plating step and the chromium plating step, which are the second-stage electroplating steps, substantially the same operations as in the first-stage electroplating step are performed. At this time, the electroless plating layer 13 of the portion that does not require plating is already dissolved in the above-mentioned predetermined solution and does not exist at these times. Therefore, in the second-stage electroplating process after the copper plating process, the electroless plating layer 13 is not dissolved in each plating solution. As a result, it is possible to prevent each plating solution from being contaminated.

Further, since the electroless plating layer 13 is not exposed at the portion where plating is unnecessary, the general electroplating layer 14B and the like are naturally formed on the electroless plating layer 13 where plating is not required. It will not be done. for that reason,
It is possible to prevent the plating layer 3 from being formed in a portion that does not require plating and short-circuiting between the grooves 8, 9 and 12.

Then, as shown in FIG. 9, a general electroplating layer 14B having a multi-layer structure is formed on the strike plating layer 14A by the second electroplating step including the above-mentioned various steps. In this way, the plating layer 3 including the electroless plating layer 13 and the electroplating layer 14 including the strike plating layer 14A and the general electroplating layer 14B is formed only in a portion that requires plating.

Thereafter, as shown in FIG. 10, the plating layer 3
The formed portion of is covered with an electroforming mask 19.
That is, the electroformed mask 19 is a metal plate having a thickness of “several mm” and has a shape conforming to the shape of the back panel 1. Further, the electroforming mask 19 is appropriately formed with an opening that is opened only in a portion necessary for forming the coating layer 4. By covering the electroformed mask 19, a portion necessary for forming the coating layer 4 is exposed from the opening. Then, spray coating is applied to the exposed portion. By this coating, the coating film layer 4 is formed on the required portions of the coating film. On the other hand, in the place covered by the electroforming mask 19,
The coating layer 4 is not formed.

Then, after the coating layer 4 is formed, as shown in FIG.
As shown in FIG. 6, the back panel 1 is obtained by removing the coating of the electroformed mask 19. As described above, according to this embodiment, the electroless plating layer 1 described above is used.
When forming 3, the electroless plating layer 13 is not formed on the bottom portions 8a of the groove grooves 8, 9, 12, 15-18. Then, when the electroplating layer 14 is formed, only the portion where plating is required is electrically conducted. Therefore, the electroplating layer 14 including the strike plating layer 14A and the general electroplating layer 14B can be formed on the surface of the electroless plating layer 13 in the portion requiring plating.

According to the present embodiment, as described above, since the grooves 15 to 18 are separately formed, the point farthest from the groove 8 in the portion which does not require plating (inner With respect to the distance from the central portion of the side surface) to the groove 8, from the point farthest from all the grooves 8, 9, 12, 15-18, to the grooves 8, 9, 12, 15-18. The distance becomes smaller. Therefore, the electroless plating layer 13 having conductivity formed in a portion that does not require plating.
Then, the potential difference between the solution for electroplating and the solution for electroplating becomes relatively small, and the "bipolar phenomenon" hardly occurs. Therefore, it is possible to suppress the metal ions in the strike plating solution from being deposited in the center portion of the inner surface of the portion that does not require plating, and suppress the formation of plating in the portion that does not require plating. it can. Therefore, in the next electroless plating dissolution step, all the electroless plating layer 13 in the portion which does not require plating can be surely dissolved, and the plating layer 3 is finally formed in the portion. Can be prevented. As a result, the appearance quality of the finally obtained back panel 1 can be remarkably improved, and the durability of the coating layer 4 formed by coating can be improved.

Further, in this embodiment, the groove 18 intersecting with the groove 15 to 17 extending in the vertical direction is formed so as to extend in the horizontal direction. Therefore, the portion that does not require plating is divided into a larger number of portions, so that the above-described effects can be further ensured.

Further, in this embodiment, immediately after the strike plating step which is the first electroplating step, all the electroless plating layers 13 in the portions which do not require plating are dissolved. Therefore, the electroless plating layer 13 is not dissolved in the plating solution in the subsequent electroplating process. Further, in the subsequent general electroplating step, the electroless plating layer 13 is not exposed in the portion that does not require plating, so the general electroplating is performed on the electroless plating layer 13 that does not require plating. The layer 14B and the like are not formed. Therefore, according to this example, the electroless plating layer 13 is not dissolved in the plating solution in the various steps of the general electroplating step. Therefore, it is possible to prevent each plating solution from being contaminated. As a result, it is not necessary to replace each plating solution due to contamination, and thus cost can be reduced.

Further, the plating layer 3 may be formed in a portion that does not require plating, or the grooves 8, 9, 12, 15 may be formed.
It is possible to prevent a short circuit between 18 and 18.

In addition, in this embodiment, the grooves 8, 9,
12 is the boundary between the coating layer 4 and the plating layer 3. For this reason, the parting portion of the boundary portion is clearly formed instead of the zigzag shape. As a result, the parting line can be made clear and clear, and further, the appearance quality can be further improved.

(Second Embodiment) Next, a second embodiment in which the present invention is embodied as an outer cover (hereinafter simply referred to as "outer cover") 31 for a vehicle door mirror bracket as a resin product is shown in FIGS. It will be explained based on. However, in the present embodiment, the description of the portions substantially similar to those of the above-described first embodiment will be omitted, and the description will focus on the differences.

In recent years, it has become common for door mirrors to be attached to door mirror brackets in front of doors of vehicles such as automobiles. However, depending on the user, the conventional so-called fender mirror may be attached instead of the door mirror. In this case, an outer cover 31 as shown in FIG. 11 is attached to the door mirror bracket in order to cover the mounting portion of the bracket and the like.

As shown in FIGS. 11 and 12, the outer cover 31 is formed in a substantially triangular shape in plan view. The outer cover 31 includes an outer cover body 32 (see FIG. 12) as a base material made of ABS resin, and a part of its design surface (including part of the non-design surface) (with the mesh pattern of FIG. 11). Portion) and a coating layer 34 formed by coating on a portion other than the plating layer 33 (excluding the non-designed surface. The portion with a dotted line pattern in FIG. 11). There is.

On the design surface side of the outer cover body 32, at the boundary portion between the plating layer 33 and the coating layer 34,
A recess 35 for parting the coating is formed. In the outer cover body 32 including the recess 35, a simple groove 36 having a substantially U-shaped cross section is formed in an annular shape (closed curved shape) across the design surface and the non-design surface. Further, a resist coating layer 41 as a first electroless plating avoiding means is formed by coating along the simple groove 36. The resist coating layer 41 is composed of a predetermined resist coating that is not easily roughened during plating. Specifically, vinyl chloride / vinyl acetate copolymer or styrene-methylmethacrylic acid copolymer is used. Further, on the non-design surface side of the outer cover body 32, an electrode projection 37 is formed so as to project in the non-design surface side direction (vehicle interior direction). The electrode protrusion 37 may be removed at the time of use.

In addition, as shown in FIG. 13, the plating layer 3
Similarly to the first embodiment, 3 has an electroless plating layer 38 and an electroplating layer 39 formed thereon. Further, the electroplating layer 39 has a strike plating layer 39A and a general electroplating layer 39B.

Now, as shown in FIGS. 13 and 15, for the portion which does not require plating in the present embodiment, the portion is divided into two, and the simple groove 4 is parallel to the simple groove 36.
2 is formed in an annular shape (closed curve shape) across the design surface and the non-design surface. A resist coating layer 43 (see FIG. 15) as a second electroless plating avoiding means is formed by coating along the simple groove 42. The resist coating layer 43 is also made of the same material as the resist coating layer 41.

Next, the operation and effect of manufacturing the outer cover 31 will be described. First,
The outer cover main body 31 in which the simple grooves 36 and 42 are formed in a ring shape at a predetermined position is formed. Next, as shown in FIGS. 14 and 15, resist coating is applied along the simple grooves 36, 42 or inside the simple grooves 42 to form the resist coating layer 4
1, 43 are formed.

Then, the outer cover body 31 on which the resist coating layers 41 and 43 are formed is immersed in an electroless plating solution to perform electroless plating. At this time, since the resist coating layers 41 and 43 are hard to be roughened, the portions are not plated. In other words, as shown in FIG. 16, the electroless plating layer 38 is formed on all portions except the resist coating layer 41 (43). Next, the electroless plating layer 38
The outer cover main body 32 on which is formed is subjected to electroplating. That is, first, in the strike plating step, which is the first-stage electroplating step, the outer cover body 32 on which the electroless plating layer 38 is formed is removed from the strike plating layer 39.
It is immersed in the above-mentioned plating solution for forming A for a predetermined time, and a portion requiring plating is electrically connected. Then, as shown in FIGS. 17 (a) and 17 (b), a portion not requiring plating is electrically blocked by the resist coating layer 41 of the simple groove 36, so basically, there is No plating is formed. On the other hand, in a portion requiring plating, the strike plating layer 39A is formed relatively thin on the surface of the electroless plating layer 13.

At this time, if the area of the portion which does not require plating is relatively large, the "bipolar phenomenon" may occur. The greater the distance from the point farthest from 43 to the resist coating layers 41, 43, the greater the distance. That is, with the resist coating layer 41 alone, if the distance from the point farthest from them to the resist coating layer 41 is large, the tip portion of the outer cover main body 32 (the top vertex portion of FIG. 11) is caused by the “bipolar phenomenon”. There is a possibility that the plating will be likely to remain.

However, in this embodiment, the simple groove 42 and the resist coating layer 43 are formed in an annular shape in a portion that does not require plating in advance. With this resist coating layer 43, all the resist coating is performed with respect to the distance from the point farthest from the resist coating layer 41 (the above-mentioned tip portion) to the resist coating layer 41 in the portion not requiring plating. The distance from the point farthest from the film layers 41 and 43 to the resist coating layers 41 and 43 becomes small. Therefore, the potential difference between the electroless plating layer 38 having electroconductivity formed in the portion not requiring plating and the electroplating solution becomes relatively small, and the "bipolar phenomenon" is unlikely to occur. Become. For this reason, it is possible to prevent metal ions in the strike plating solution from precipitating in a portion not requiring plating, particularly in the central portion of the inner surface.
Therefore, the electroless plating layer 38 formed in the portion that does not require plating is formed by the strike plating solution.
It is completely melted as shown in FIG. 17 (a), or is gradually melted as shown in FIG. 17 (b) to become thin.

Then, in the electroless plating melting step,
The outer cover body 32 on which the strike plating layer 39A is formed is dipped in a predetermined solution as in the first embodiment. At this time, the nickel layer deposited by the "bipolar phenomenon" was dissolved, and the electroless plating layer 3 remained in the unnecessary portion of the plating as shown in FIG. 8B.
8 is dissolved. Here, since the deposition of metal ions in the strike plating solution (bipolar phenomenon) is suppressed on the electroless plating layer 38, the nickel layer does not become thick, and in the melting step of these, Nickel layer and electroless plating layer 3 where plating is not required
All 8 are reliably dissolved. As a result, even if the electroless plating layer 38 is not completely dissolved by the strike plating solution, as shown in FIG. 17A, it is completely dissolved in the dissolution step.

Then, on the surface of the outer cover body 32,
Electroless plating layer 3 formed only on the portion where plating is required
8 and the strike plating layer 39A formed thereon remain, the electroless plating layer 38 does not exist in other portions, and any plating other than the strike plating layer 39A is exposed on the outer cover body 32. do not do.

Subsequently, the same operations as in the first embodiment are carried out in the copper plating step, the semi-bright nickel plating step, the bright nickel plating step and the chromium plating step, which are the second-stage electroplating steps. At this time, the electroless plating layer 38 of the portion that does not require plating is already dissolved in the above-mentioned predetermined solution and does not exist at these times, so in the second-stage electroplating step, each plating is performed. The electroless plating layer 38 is not dissolved in the solution. As a result, it is possible to prevent each plating solution from being contaminated. Then, as shown in FIG. 18, a general electroplating layer 39B having a multi-layered structure is formed on the strike plating layer 39A by passing through the second-stage electroplating step including the above various steps. In this manner, the plating layer 33 including the electroless plating layer 38 and the electroplating layer 39 including the strike plating layer 39A and the general electroplating layer 39B is formed only in the portion that requires plating.

Thereafter, coating is applied to the portion where the plating layer 33 is not formed, whereby the coating film layer 34 is formed at the required portion of the coating film. In this way, FIGS.
The outer cover 31 as shown in FIG.

As described above, according to this embodiment,
When forming the electroless plating layer 38, the electroless plating layer 38 is not formed on the resist coating layers 41 and 43. Then, when the electroplating layer 39 is formed, only the portion where plating is required is electrically conducted. Therefore, the electroplating layer 39 including the strike plating layer 39A and the general electroplating layer 39B can be formed on the surface of the electroless plating layer 38 in the portion requiring plating.

According to the present embodiment, as described above, the resist coating layer 43 is separately formed, so that the portion farthest from the resist coating layer 41 is the portion that does not require plating. With respect to the distance from the (tip portion) to the resist coating layer 41, all the resist coating layers 41,
The distance from the point farthest from 43 to the resist coating layers 41 and 43 becomes small. Therefore, the potential difference between the electroless plating layer 38 having electroconductivity formed in the portion not requiring plating and the electroplating solution becomes relatively small, and the "bipolar phenomenon" is unlikely to occur. Become. Therefore, it is possible to prevent metal ions in the strike plating solution from precipitating in a portion that does not require plating, particularly in a tip portion, and suppress formation of plating in a portion that does not require plating. As a result, the same effect as the first embodiment is obtained.

(Third Embodiment) A third embodiment in which the present invention is embodied in a vehicle front grill 51 as a resin product will be described with reference to FIGS. However, also in the present embodiment, the description of the portions substantially similar to those of the above-described first and second embodiments will be omitted, and mainly the differences will be mainly described.

A front grill 51 as shown in FIG. 19 is mounted on the front surface of the vehicle. Figure 2
As shown in 0, 22, 23, this front grill 51
Includes a front grill body (hereinafter, referred to as a grill body) 52 as a base material made of ABS resin, and a plating layer 53 (in FIG. 20, in FIG. 20) formed on a part of the design surface, that is, the front surface. Portion shown in a mesh),
The coating layer 54 is formed by coating on a portion other than the plating layer 53 (excluding a part of the back side). More specifically, the front grill 51 includes a frame 5 having a substantially rectangular front shape.
5, a plurality of sub partition plates 56 extending in the horizontal direction in the frame 55, a plurality of connecting plates 57 extending in the vertical direction in the frame 55, a mounting plate 58 for mounting a mark plate (not shown) in the central portion, It has a main partition plate 59 extending from the frame 55 toward the mounting plate 58. The plating layer 53 is formed mainly on the front side portion of the frame 55 and on the front side portion of the main partition plate 59. In addition, the sub partition plate 56, the mounting plate 5
8 and the connecting plate 57, the coating layer 54 is formed mainly on the front side portion.

FIG. 21 is an enlarged front view showing a part of the main partition plate 59, and FIG. 22 is a sectional view taken along line DD of FIG. As shown in these figures and FIG. 23, in the front side portion of the grill main body 52, at the boundary portion between the plating layer 53 and the coating layer 54, the front surface protruding vertically from the frame 55 and the main partition plate 59. The side step portion 60 is formed in an annular shape. The front side step portion 60 has a cross section of approximately V
A linear groove 61 as a first electroless plating avoiding means is formed in an annular shape (closed curve shape) (see also FIG. 20). Further, FIG. 24 is an enlarged back view showing a part of the back side of the frame 55. As shown in the figure, the grill body 5
In the rear surface side portion of No. 2, a groove 63 as a first electroless plating avoiding means having a substantially V-shaped cross section is provided at a boundary portion between the plating layer 53 and a portion where the plating layer 53 is not formed.
Are annularly formed (see also FIG. 20). Further, an electrode protrusion 64 is formed on the rear surface side portion of the grill main body 52 so as to protrude in the rear surface direction (vehicle rear direction).

As shown in FIG. 23, the plating layer 53 comprises an electroless plating layer 65 and an electroplating layer 66. This embodiment differs from the first and second embodiments in that the electroless plating layer 65 is made of nickel. In addition, the electroplating layer 66 includes a strike plating layer 66A that constitutes the first-stage electroplating layer and a second electroplating layer 66A.
It is composed of a general electroplating layer 66B constituting a step electroplating layer, and the strike plating layer 66A is made of nickel as in the first and second embodiments. That is, in the third embodiment, the electroless plating layer 65
The strike plating layer 66A and the strike plating layer 66A are both made of nickel.

Next, the composition of the plating solution for forming the electroless plating layer 65 and for forming the strike plating layer 66A will be described. First, the plating solution for forming the electroless plating layer 65 is 20 g of nickel sulfate.
/ L, sodium citrate 30 g / L, ammonium chloride 30 g / L and sodium hypophosphite 15 g / L. The temperature of the solution is 40 ° C. and the hydrogen ion concentration (pH) is 9. Next, the plating solution for forming the strike plating layer 16A contains 250 g / L of nickel sulfate, 30 g / L of nickel chloride, and 30 g / L of boric acid, as in the first and second embodiments. Furthermore, the same composition as that of the first and second embodiments is adopted as the plating solution for forming each plating layer of the general electroplating layer 16B.

Also in this embodiment, a predetermined solution for dissolving the electroless plating layer 65 in a portion where plating is unnecessary is prepared before forming the strike plating layer 66A. As this solution, an aqueous solution of ammonium peroxodisulfate 30 g / L or an acid such as nitric acid is preferably used. The water temperature of the above solution is 40 ° C.

In the present embodiment, as shown in FIG. 25, the mounting plate 58 is formed with a strip-shaped resist coating layer 67 as a second means for avoiding electroless plating in an annular shape. The resist coating layer 67 uses the same paint as in the second embodiment.

Next, the operation and effect of this embodiment will be described. First, the grill main body 52 in which the grooved grooves 61 and 63 are annularly formed at predetermined positions is obtained. Then, as shown in FIGS.
Then, a resist coating is applied to form a resist coating layer 67 in a ring shape.

Next, the grill body 52 having the resist coating layer 67 formed thereon is dipped in an electroless plating solution to perform electroless plating. Then, as shown in FIGS. 27 and 28, an electroless plating layer 65 made of nickel is formed on all portions except the bottom portions 61a of the grooves 61 and 63 on the surface of the grill body 52 and the resist coating layer 67. .

Next, in the strike plating step which is the first stage electroplating step, the grill main body 52 on which the electroless plating layer 65 is formed is dipped in the above plating solution for forming the strike plating layer 66A for a predetermined time. At the same time, the portion requiring plating is electrically connected. Then, as shown in FIGS. 29 (a) and 29 (b), no plating is formed on the portions that do not require plating, because the grooves are electrically cut off by the grooves 61 and 63. On the other hand, in the part that requires plating,
The strike plating layer 66 is formed on the surface of the electroless plating layer 65.
A is formed relatively thin. However, the thickness of the strike plating layer 66A (for example, 0.5 to 5 μm) is sufficiently larger than the thickness of the electroless plating layer 65 (for example, 0.3 to 0.4 μm).

At this time, if the area of the portion which does not require plating is relatively large, the "bipolar phenomenon" may occur. The larger the distance from the furthest point to the groove 61, 63, the larger the distance. That is, if only the grooves 61 and 63 are provided, and if the distance from the point farthest from them to the grooves 61 and 63 is large, the plating is likely to remain in the central portion of the mounting plate 58 due to the "bipolar phenomenon". There is a risk that it will become a thing.

However, in this embodiment, the resist coating layer 67 is formed in an annular shape on the mounting plate 58 in the portion which does not require plating in advance. This resist coating layer 67
Therefore, among the portions that do not require plating, the line grooves 61,
The distance from the point farthest from 63 (mounting plate 58) to the grooves 61 and 63 is farthest from the grooves 61 and 63 and the resist coating layer 67. And the distance to the resist coating layer 67 becomes smaller. For this reason, the potential difference between the electroless plating layer 65 having electroconductivity formed in the portion not requiring plating and the electroplating solution becomes relatively small, and the "bipolar phenomenon" is unlikely to occur. Become. For this reason, it is possible to prevent metal ions in the strike plating solution from precipitating in a portion not requiring plating, particularly in the central portion of the mounting plate 58. Therefore, the electroless plating layer 65 formed in the portion that does not require plating is completely dissolved by the strike plating solution as shown in FIG. 29 (a), or as shown in FIG. 29 (b). Is gradually dissolved into a thin-walled product.

Then, in the electroless plating melting step,
Grill main body 52 on which strike plating layer 66A is formed
Is immersed in the predetermined solution for about 2 minutes. here,
In the immersion time of about 2 minutes, the electroless plating layer 65
It has been clarified from the experimental results that each of the strike plating layers 16A dissolves at a dissolution rate of 0.2 μm / min and the strike plating layer 16A dissolves at a dissolution rate of 0.05 μm / min.
Further, as described above, the thickness of the strike plating layer 66A is sufficiently larger than the thickness of the electroless plating layer 65 (Note: not shown in the figure for convenience). Therefore, the electroless plating layer 65 and the strike plating layer 66
Although both A are made of nickel and both dissolve in a predetermined solution, the strike plating layer 66A has a sufficient thickness even after the electroless plating layer 65 is completely dissolved. It remains in the state. As a result, FIG.
As shown in (a), on the surface of the grill main body 52, the electroless plating layer 65 formed only on the portion where plating is required and the strike plating layer 66A formed thereon remain. Then, the electroless plating layer 65 does not exist in the other portions, and the plating other than the strike plating layer 66A is not exposed on the grill body 52.

Then, in the copper plating step, the semi-bright nickel plating step, the bright nickel plating step and the chromium plating step, which are the second-stage electroplating steps, the same operations as those in the first and second embodiments are performed. At this time, the electroless plating layer 65 of the portion that does not require plating is already dissolved in the above-mentioned predetermined solution and does not exist at these times, so in the second-stage electroplating step, each plating is performed. The electroless plating layer 65 will not be dissolved in the solution. As a result, it is possible to prevent each plating solution from being contaminated. Then, as shown in FIG. 30, a general electroplating layer 66B having a multi-layered structure is formed on the strike plating layer 66A by passing through the second-stage electroplating step including the above-described various steps. In this way, the plating layer 53 including the electroless plating layer 65 and the electroplating layer 66 including the strike plating layer 66A and the general electroplating layer 66B is formed only in the portion requiring plating.

Thereafter, coating is applied to the portion where the plating layer 53 is not formed, whereby the coating film layer 64 is formed at the required portion of the coating film. In this way, FIGS.
A front grill 51 as shown in is obtained.

As described above, also in this embodiment, the "bipolar phenomenon" can be made difficult to occur. Therefore, it is possible to prevent metal ions in the strike plating solution from being deposited in a portion not requiring plating, particularly in a central portion of the mounting plate 58, and to prevent plating from being formed in a portion not requiring plating. You can As a result, the same effects as those of the first and second embodiments are obtained.

Further, according to this embodiment, the electroless plating layer 65 and the strike plating layer 66A are both made of nickel. Therefore, the electroless plating layers 13, 3
As compared with the first and second embodiments in which 8 is made of copper, the plating process can be performed at a relatively low cost.

Further, in the predetermined solution for dissolving the electroless plating layer 65, only the nickel forming the electroless plating layer 65 and the strike plating layer 66A is dissolved. In other words, only nickel ions mainly remain in the waste liquid of the predetermined solution. Therefore, the waste liquid can be treated relatively easily.

The present invention is not limited to the above-described embodiments, but may be implemented as follows with a part of the structure appropriately changed without departing from the spirit of the invention. (1) In the first and second embodiments, the electroless plating layer 1
3 and 38 are made of copper, the strike plating layers 14A and 39A are made of nickel, and in a two-step electroless plating dissolution step, an ammonium peroxodisulfate aqueous solution and an alkaline aqueous solution are sequentially processed to obtain electroless plating. Only the plated layers 13 and 38 were dissolved. On the other hand, conversely, the electroless plating layers 13 and 38 are made of nickel, and the strike plating layers 14A and 39A are made of copper. In the electroless plating dissolving step, an alkaline aqueous solution and an ammonium peroxodisulfate aqueous solution are used. (Acidic solution)
And the electroless plating layers 13 and 38 are processed in this order.
You may make it melt | dissolve only. Even in this case, the same operational effects as those of the first and second embodiments can be obtained.

Further, in the third embodiment, both the electroless plating layer 65 and the strike plating layer 66A are made of nickel, but they are made of other metals of the same kind (for example, copper etc.), It is also possible to have a structure in which any unnecessary portion of plating is dissolved in a predetermined solution.

(2) In each of the above-mentioned embodiments, the second electroplating step is constituted by four steps including the copper plating step, and the general electroplating layer 14 made of a plurality of metal platings.
Although B, 39B, and 66B are formed, if the electroplating step is composed of a plurality of steps,
The number of steps, the type of plating, etc. are not particularly limited. Therefore, for example, one step can be omitted, the order of the plating steps can be changed, or another plating step can be introduced.

(3) In each of the above embodiments, the present invention is embodied in the vehicle back panel 1, the vehicle door mirror bracket outer cover 31 and the front grill 51, respectively. In addition to the above, the louver and the pillar garnish are also provided. ,
You may embody in a quarter vent, a mark plate, etc. Further, the present invention is not limited to the above resin products, and the present invention may be embodied in other resin products partially having a plating layer.

(4) In each of the above embodiments, the resin material forming the base material is made of ABS resin, but in addition to this, various resins such as polypropylene, polyphenylene oxide, polyamide, polysulfone, polyester, etc. Materials may be used.

(5) In each of the above-described embodiments, the grooves 8, 9, 12, 15 to 18 and the simple grooves 36, 42, etc. are formed by the mold, but each groove is formed by an NC cutter, It may be formed by post-processing with a sonic cutter or the like.

(6) The composition of each plating solution described in each of the above embodiments is not limited to the above. (7) The electroless plating dissolution step in each of the above embodiments may be omitted.

[0093]

As described above in detail, according to the method of partial plating of a resin product of the present invention, it is possible to suppress the plating from being applied to a portion which does not need to be plated, so that the appearance quality can be improved. It has an excellent effect that it can be remarkably improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a back panel in a first embodiment.

FIG. 2 is a front view showing a back panel body in the first embodiment.

FIG. 3 is a sectional view showing a back panel body in the first embodiment.

FIG. 4 is a cross-sectional perspective view showing the back panel body in the first embodiment.

FIG. 5 is an enlarged sectional view of an essential part of the back panel in the first embodiment.

FIG. 6 is a partial cross-sectional view of a back panel according to the first embodiment.

FIG. 7 is a cross-sectional view showing a state where electroless plating is performed.

8 (a) and 8 (b) are cross-sectional views when strike plating is applied, and in particular, FIG. 8 (a) is a cross-sectional view showing a state in which the electroless plating layer is completely melted.

FIG. 9 is a cross-sectional view showing a state in which an electroplating layer is formed.

FIG. 10 is a cross-sectional view showing a state when forming a coating layer.

FIG. 11 is a front view showing an outer cover in the second embodiment.

FIG. 12 is a cross-sectional view taken along the line BB of FIG. 11, which is a main part of the outer cover.

FIG. 13 is a cross-sectional view showing an outer cover body in the second embodiment.

FIG. 14 is a cross-sectional view of a state in which a resist coating film layer is formed in the recess simple groove.

FIG. 15 is a sectional view showing a state in which a resist coating layer is formed in another simple groove.

FIG. 16 is a cross-sectional view showing a state where electroless plating is performed.

17 (a) and 17 (b) are cross-sectional views when strike plating is applied, and in particular, (a) is a cross-sectional view showing a state in which the electroless plating layer is completely melted.

FIG. 18 is a cross-sectional view showing a state in which an electroplating layer is formed.

FIG. 19 is a front view showing a front grill in the third embodiment.

FIG. 20 is a schematic view showing the front grill developed on the front side and the back side.

FIG. 21 is an enlarged front view of the main partition plate.

22 is a sectional view taken along line DD of FIG.

FIG. 23 is an enlarged cross-sectional view showing the main parts of the front grill of the third embodiment.

FIG. 24 is an enlarged rear view showing a part of the rear surface of the front grill.

FIG. 25 is a front view schematically showing a mounting plate.

26 is a cross-sectional view taken along the line EE of FIG.

FIG. 27 is a cross-sectional view showing a state where electroless plating is performed.

FIG. 28 is a sectional view of a mounting plate showing a state where electroless plating is performed.

29 (a) and (b) are cross-sectional views when strike plating is applied, and in particular, (a) is a cross-sectional view showing a state in which the electroless plating layer is completely melted.

FIG. 30 is a cross-sectional view showing a state in which an electroplating layer is formed.

FIG. 31 is a cross-sectional view showing a state in which electroless plating according to the related art is applied.

FIG. 32 is a cross-sectional view showing a state in which electroplating according to a conventional technique is performed.

FIG. 33 is a cross-sectional view showing a state in which electroless plating according to the related art is applied.

FIG. 34 is a cross-sectional view showing a state in which electroplating according to a conventional technique is performed.

FIG. 35 is a diagram for schematically explaining the bipolar phenomenon and is a graph showing the relationship of the potential difference with respect to the conduction distance.

FIG. 36 is a cross-sectional view schematically illustrating the bipolar phenomenon.

FIG. 37 is a cross-sectional view schematically illustrating a bipolar phenomenon.

FIG. 38 is a graph showing the relationship of the increased film thickness on the anode side with respect to the conduction distance.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Back panel as a resin product, 2 ... Back panel main body as a base material, 8, 9, 12, 61, 63 ... Line groove | channel which comprises a 1st electroless plating avoiding means, 13, 38, 6
5 ... Electroless plating layer, 14, 39, 66 ... Electroplating layer, 14A, 39A, 66A ... Strike plating layer, 1
4B, 39B, 66B ... General electroplating layer, 15, 1
6, 17, 18 ... Strip grooves that constitute second electroless plating avoiding means, 31 ... Outer cover as a resin product, 32 ...
Outer cover body as a base material, 41 ... Resist coating film layer constituting first electroless plating avoiding means, 43, 67 ...
A resist coating layer constituting the second means for avoiding electroless plating, 51 ... Front grill as a resin product, 52 ... Grill body as a base material.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display area // C08J 7/06 Z

Claims (6)

[Claims] 1. An electroless plating layer (13, 3) is provided at a boundary between a portion requiring plating and a portion not requiring plating on the surface of a resin base material (2, 32, 52).
First electroless plating avoiding means forming step of forming the first electroless plating avoiding means (8, 9, 12, 41, 61, 63) for preventing the formation of And at least the first surface of the substrate (2, 32, 52)
Electroless plating avoiding means (8, 9, 12, 41, 61,
63) except the electroless plating layer (13, 38, 6)
5) to form an electroless plating step, and the base material (2, 32, 5) which has undergone the electroless plating step.
2) said electroless plating layer (13, 38, 6)
In 5), a portion requiring plating is electrically conducted to form an electroplating layer (14, 39, 66) on the portion requiring plating on the electroless plating layer (13, 38, 65). The method for partially plating a resin product, comprising: an electroplating step for performing at least the first electroless plating avoiding means (8, 9, 12, 41,
61, 63) and a second electroless plating avoiding means (15, 16, 1) in a portion not requiring plating.
No. 7, 18, 43, 67) is formed so that the portion not requiring the plating is divided into at least two portions. 2. The first and second electroless plating avoiding means are strip grooves (8, 9, 12, 15, 1) having a substantially V-shaped cross section.
6, 17, 18, 61, 63) and at least one of a strip-shaped or linear resist coating layer (41, 43, 67).
Partial plating method for resin products described in. 3. The second electroless plating avoiding means (1)
5, 16, 17, 18) is formed so as to connect at least two arbitrary points of the first electroless plating avoiding means (8). Partial plating method for products. 4. The second electroless plating avoiding means (1)
5. The partial plating method for a resin product according to claim 3, wherein each of (5, 16, 17, 18) has its own intersection. 5. The second electroless plating avoiding means (4)
3. The partial plating method for a resin product according to claim 1 or 2, wherein (3, 67) is formed on the entire surface of the portion surrounded by the ring or the ring in the portion not requiring plating. 6. The first-stage electroplating step of forming a strike plating layer (14A, 39A, 66A) on a portion of the electroless plating layer (13, 38, 65) where plating is required in the electroplating step. And the base material (2, 32,
52) is immersed in a predetermined solution to form the electroless plating layer (13, 38, 65) in a portion that does not require plating.
And an electroless plating melting step of melting the base material (2, 32,
52) the strike plating layer (14A,
39A, 66A) is electrically conducted, and a general electroplating layer (14B, 39B, 66) made of a plurality of metal platings is formed on the strike plating layer (14A, 39A, 66A).
The method for partially plating a resin product according to any one of claims 1 to 5, further comprising a second-stage electroplating step of forming B).