JP3129091B2 - Method for manufacturing resist paint for partial plating and resin product subjected to partial plating - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a partially plated resin product in which a plating layer is formed only on a portion of the surface of a resin base material which requires plating. Further, the present invention relates to a resist coating for partial plating used in obtaining the resin product.

[0002]

2. Description of the Related Art Conventionally, as a resin product in which a plating layer is formed only on a portion requiring plating, there are decorative articles for exterior use such as a front grill and a mark plate for a vehicle. For example, in a front grill, a plating layer is formed on a predetermined portion of a front surface (design surface) of the grill, and a coating layer is formed on part or all of the other portions (however, the design surface). ing. Thus, a front grill partially having a plating layer is manufactured, for example, as follows.

[0003] First, a portion of an ABS resin grill body that requires plating is covered with an electroformed mask or a simple mask. Then, a resist paint is applied by spraying in this state. Then, a resist layer is formed in a portion where plating is unnecessary. Thereafter, the grill main body on which the resist layer is formed is subjected to etching and electroless plating.
Then, an electroless plating layer is formed on a portion of the grill main body surface where the resist layer is not formed. Next, it is subjected to an electroplating process including a plurality of processes. Then, an electroplating layer is formed on the electroless plating layer. That is,
A plating layer composed of an electroless plating layer and an electroplating layer is formed only in a portion requiring plating.

[0004] An uncoated portion is covered with an electroformed mask, and a predetermined paint is applied to the other portion, that is, mainly on the resist layer (so-called overcoat is applied). Then, a coating layer is formed at a desired location.

[0005] However, conventionally, during the etching step or the electroless plating step, there is a risk that the resist layer may be dissolved in the strongly acidic etching solution or plating solution. For this reason, these solutions may be significantly contaminated. Further, if the resist layer completely melts out during these steps, the electroplating layer cannot be formed at a desired location. Therefore, conventionally, the thickness of the resist layer is sufficient (for example, “15
μm ”) to prepare for the above-mentioned elution.

On the other hand, a method disclosed in Japanese Patent Publication No. 48-16987 is known as a method for solving the above problem. In this technique, a polymer which is hardly attacked by acids such as polyvinyl chloride and polyvinylidene chloride is blended as a main component in the above-mentioned resist coating. Therefore, the resist layer can be prevented from being dissolved in the acidic etching solution or plating solution to some extent. As a result, the occurrence of the above-mentioned inconvenience can be prevented at all.

[0007]

However, although the resist paints in the above-mentioned techniques have some acid resistance (resist properties), they are still not satisfactory.

[0008] Further, with the above-mentioned paint, the properties of the coating film including the paintability at the time of application of the paint cannot be said to be good, resulting in deterioration of workability. Further, when a coating layer is formed on the resist layer, the adhesion to the coating layer is poor. Therefore, when the resin product having the coating film layer is exposed to water, blisters may be generated. That is, the water resistance of the coating layer formed on the resist layer has been poor.

The present invention has been made to solve the above problems, and an object of the present invention is to form a plating layer only on a portion of a surface of a resin base material which requires plating. In obtaining a resin product, a method of manufacturing a resist coating for partial plating and a method of manufacturing a resin product that has been subjected to partial plating, which can be prevented from being dissolved in an acidic solution and can improve coatability and water resistance. To provide.

[0010]

In order to achieve the above object, according to the first aspect of the present invention, a portion of the surface of a resin substrate that does not require plating or a portion that does not require plating is provided. Is a resist coating for partial plating that is applied so as to form a ring or a part of a ring so as to surround the resin, wherein the resist coating is formed of a vinyl chloride-vinyl acetate copolymer and an acrylic-styrene copolymer.
95% by weight: 50 to 5% by weight as a main component.

The mixing ratio of the vinyl chloride-vinyl acetate copolymer and the acrylic-styrene copolymer is 70
８５85% by weight: more preferably 30 to 15% by weight.

Further, in the invention according to claim 2,
Step of molding a resin base material, of the base material surface,
A step of applying the resist paint according to claim 1 so as to form a ring or a part of a ring so as to form a resist layer over the entire surface not requiring plating or surrounding the portion not requiring plating; A step of forming an electroless plating layer on a portion other than the resist layer on the surface of the material, and, among the electroless plating layers formed on the base material that have undergone the electroless plating step, electrically necessary portions of the electroless plating layer Forming an electroplating layer on a portion of the electroless plating layer that requires plating, and a method for producing a partially plated resin product. .

Further, in the invention according to the third aspect, the resin product produced by the production method according to the second aspect is further coated on the upper surface of the resist layer or on the inner peripheral side of the resist layer. By applying
The gist of the present invention is a method of manufacturing a resin product having a partial plating, which includes a step of forming a top coat layer.

In addition, in the invention according to the fourth aspect, the step of forming a resin base material and the step of applying a coating material to a portion of the base material surface which does not require plating to form a coating film layer. Forming a resist layer by applying the resist paint according to claim 1 on the upper surface of the coating film layer, and electroless plating on a portion of the base material surface other than the resist layer. A step of forming a layer, of the electroless plating layer formed on the base material that has undergone the electroless plating step, by electrically conducting a portion of the electroless plating layer that requires plating, and plating on the electroless plating layer. And a step of forming an electroplating layer on a necessary portion of the resin product.

[0015]

According to the first aspect of the present invention,
A resist paint is applied so as to form a ring or a part of a ring on the entire surface of a resin base material that does not require plating or around a portion that does not require plating, thereby forming a resist layer. At this time, the resist coating was 50 to 95% by weight of the vinyl chloride-vinyl acetate copolymer and the acrylic-styrene copolymer: 50 to 5% by weight.
The mixture is the main component. For this reason, since the vinyl chloride-vinyl acetate copolymer has excellent chemical resistance, the coating does not elute when exposed to an acidic solution during plating. In addition, the paint has excellent coatability because the acrylic-styrene copolymer is added.

Furthermore, since the formed resist layer is firmly adhered to the base material and, in some cases, the overcoat layer formed on the resist layer, blisters may be generated even when exposed to water. There is no. Therefore, according to the resist coating, it is possible to prevent the resist coating from being dissolved in an acidic solution, and to achieve an excellent effect of improving the coating property and the water resistance as compared with the related art.

On the other hand, when the mixing ratio of the vinyl chloride-vinyl acetate copolymer is less than 50% by weight, the amount of the acryl-styrene copolymer having poor chemical resistance is increased.
Acid resistance decreases. On the other hand, when the mixing ratio of the vinyl chloride-vinyl acetate copolymer exceeds 95% by weight, the paint is dried immediately, and the leveling property of the paint is reduced and the paintability is reduced. Therefore, it is difficult to form a paint layer, and the acid resistance is poor. In addition, the amount of the acryl-styrene copolymer for providing adhesion to the base material is reduced, so that the water resistance is reduced.

According to the second aspect of the present invention, a resin base material is formed, and the surface of the base material is formed in an annular or circular shape so as to cover the entire surface of the portion not requiring plating or the portion not requiring plating. The resist paint according to claim 1 is applied so as to form a part of a ring,
A resist layer is formed. Then, an electroless plating layer is formed on a portion of the substrate surface that requires plating. At this time, no electroless plating is performed on the resist layer. Thereafter, portions of the electroless plating layer that require plating are electrically conducted, and an electroplating layer is formed on the portion of the electroless plating layer that requires plating. In addition, the electroless plating layer formed at a place where electrical conduction is not made is dissolved and disappears in a plating solution for electroplating. In this way, a resin product in which a plating layer is formed only on a portion requiring plating can be obtained.

Also in the present invention, when a resist paint is applied, the above-described excellent coatability is exhibited. Also,
In the resist layer, the resist paint does not elute in the acidic solution for plating.

Further, according to the third aspect of the present invention,
In addition to the functions and effects described in claim 2, an overcoat layer is formed on the upper surface of the resist layer or on the inner peripheral side of the resist layer. Here, since the resist layer is firmly adhered to the top coat layer, no blister is generated even when exposed to water, and the water resistance can be improved.

In addition, according to the invention described in claim 4,
A base material made of resin is formed, and a coating material is applied to a portion of the surface that does not require plating to form a coating layer. Next, a resist layer is formed by applying the resist paint according to claim 1 on the upper surface of the coating layer. An electroless plating layer is formed on the surface of the substrate other than the resist layer. At this time, no electroless plating is performed on the resist layer. Then, of the electroless plating layer formed on the base material that has undergone the electroless plating step, a portion requiring plating is electrically conducted, and an electroplating layer is formed on the portion of the electroless plating layer that requires plating. Is formed.
In addition, the electroless plating layer formed at a place where electrical conduction is not made is dissolved and disappears in a plating solution for electroplating. In this way, a resin product in which a plating layer is formed only on a portion requiring plating can be obtained. Here, if the resist layer is transparent, the coating layer formed thereunder can be recognized in a state protected by the resist layer.

Also in the present invention, when the resist paint is applied, the above-mentioned excellent paintability is exhibited. Also,
In the resist layer, the resist paint does not elute in the acidic solution for plating.

[0023]

【Example】

(First Embodiment: Paint) Hereinafter, a first embodiment of the resist paint of the present invention will be described.

The resist coating composition of this embodiment is made of vinyl chloride
The main component is a 50 to 95% by weight: 50 to 5% by weight mixture of a vinyl acetate copolymer and an acrylic-styrene copolymer. Further, the composition of the coating material is as follows.
A paint was prepared by blending the same weight of thinner with a base material consisting of 7% by weight and a solvent of 83% by weight. About vinyl chloride-vinyl acetate copolymer, manufactured by Denki Kagaku Co., Ltd.
Denka Vinyl # 1000 AKT (vinyl chloride 86% by weight / vinyl acetate 14% by weight) was used. As the acrylic-styrene copolymer, Acrydic A-165 (styrene 50% by weight / MMA 50% by weight) manufactured by Dainippon Ink and Chemicals, Inc. was used. Further, as a solvent, 38% by weight of toluene and methyl isobutyl ketone (M
IBK) 5 wt%, ethyl acetate 35 wt% and cyclohexanone 22 wt% were used. In addition, as a thinner, methyl ethyl ketone (MEK) 49% by weight, toluene 29% by weight, butyl acetate 11% by weight, M
A material composed of 6% by weight of IBK and 5% by weight of cellosolve acetate was used.

Then, paints were prepared by changing the mixing ratio of the vinyl chloride-vinyl acetate copolymer and the acrylic-styrene copolymer in various ways. The following evaluation was performed about the produced paint. Table 1 shows the results.

The resist properties (acid resistance) in the table were evaluated by visual observation after plating and treatment with an acid. The appearance of the parting and the absence of discoloration were visually evaluated after plating. Further, the paintability was visually evaluated at the time of painting.
At the same time, the water resistance was evaluated by a Goban peel test after performing a plating water resistance test.

[0027]

[Table 1]

As is clear from Table 1 above, when the resist coating composition of this embodiment was used, excellent resist properties were obtained.
It can be seen that paintability and water resistance can be obtained. In addition, the appearance of the parting with the adjacent plating layer is not jagged, but a good appearance is obtained. Furthermore, according to the composition of this example, it is understood that the degree of discoloration with time is small.

On the other hand, in the case of a paint having a composition deviating from this example (comparative example), if the proportion of the vinyl chloride-vinyl acetate copolymer is too large, the paint is dried immediately. The paintability was very poor. For this reason, the coating layer was not formed well, and as a result, the resist properties were slightly inferior. Further, when a top coat layer was formed on the resist layer and exposed to water, blisters were generated, resulting in poor water resistance.

(Second Embodiment: Resin Product) Hereinafter, a second embodiment in which the present invention is embodied in a method of manufacturing a resin product using a resist paint having the above composition will be described. As the resist paint in this example, the sample of Example 2 of the above-described first example (with a mixing ratio of vinyl chloride-vinyl acetate copolymer and acrylic-styrene copolymer of 82:18) was used. did.

As shown in FIGS. 1 and 2, for example, a mark plate 2 as a resin product is mounted at a predetermined position of an automobile. On the surface of the mark plate 2, a mark 1 shaped like a letter "T" is formed. The mark plate 2 has a substantially disk shape.
Mark plate body 3 as a base material made of BS resin, and partially formed plating layer 4 (the portion of the mesh pattern in FIG. 2)
It is composed of That is, an annular groove 5 having a substantially U-shaped cross section is formed on the surface of the mark plate body 3 so as to form a letter “T”. The portion surrounded by the groove 5 (the portion other than the mesh pattern in FIG. 2) has a shape in which the mark plate main body 3 is exposed.

The plating layer 4 is formed of an electroless plating layer 6
And an electroplating layer 7. In this embodiment, the electroless plating layer 6 is made of nickel and has a thickness of “0.3
.About.0.4 .mu.m ". The electroplating layer 7 is formed of three kinds of metals, copper, nickel and chromium, to a thickness of about 20 to 50 μm, and has a multilayer structure.

Further, a resist layer 8 is formed annularly along the groove 5, that is, so as to surround a portion where the plating layer 4 is not formed. Next, a description will be given of a method of manufacturing the above-described mark plate 2 and the effects of the manufacturing process.

First, as shown in FIG. 3, the mark plate main body 3 having the above-described groove 5 is formed by a known molding method. At this time, the projections 9 for the plating legs are integrally formed on the back side (the lower side in the figure) of the mark plate body 3.

Next, as shown in FIG. 4, the resist paint is annularly applied along the inner peripheral side of the groove 5. Then, a resist layer 8 as shown in FIG. Then, as shown in FIG. 5, the mark plate body 3 is immersed in an electroless plating solution to perform electroless plating. At this time, the electroless plating is not performed on the resist layer 8, and the electroless plating layer 6 is formed on the other surface of the mark plate body 3. Although the plating solution for electroless plating is acidic, the resist layer 8 does not dissolve into the plating solution due to the characteristics of the first embodiment.

Subsequently, as shown in FIG. 6, the mark plate body 3 on which the electroless plating layer 6 is formed is subjected to electroplating. That is, the main body 3 is immersed in a predetermined electroplating solution a plurality of times, and a portion requiring plating is electrically connected. In the present embodiment, an alligator clip 11 is engaged with the projection 9 to flow an electric current. Then, the electroless plating layer 6 formed in the portion that does not require plating (the inside of the groove 5) is blocked by the resist layer 8 and is not electrically conducted, so that it is dissolved by the acidic electroplating solution. In a portion requiring plating, the electroplating layer 7 having the above-mentioned multilayer structure is formed on the surface of the electroless plating layer 6. In this way,
The mark plate 2 on which the electroless plating layer 6 and the electroplating layer 7 are formed is formed only in a portion around the shape of the letter "T".

According to this embodiment, as described above, particularly excellent resist properties can be obtained. In addition, the appearance of the parting with the adjacent plating layer is not jagged, but a good appearance is obtained. Further, in the present embodiment, although the resist layer 8 is partially exposed, the degree of discoloration of the resist layer 8 with time can be reduced.

(Third Embodiment: Resin Product) Hereinafter, a third embodiment in which the present invention is embodied in a method for manufacturing a resin product will be described. Note that the sample of Example 2 of the above-described first example was also used as the resist paint in this example. Also in this embodiment, the same mark plate body 3 as in the second embodiment was used.

As shown in FIG. 7, in this embodiment,
The mark plate 12 as a resin product is composed of a mark plate main body 3, a plating layer 4 partially formed on the surface of the main body 3, a resist layer 13 and a top coat layer 14 formed inside the plating layer 4. Have been. That is, the resist layer 13 is applied and formed on the entire surface of the portion surrounded by the groove 5 formed on the surface of the mark plate body 3. Further, on the upper surface, a top coat layer 1
4 is applied and formed. Further, the plating layer 4 formed therearound comprises an electroless plating layer 6 and an electroplating layer 7, as in the second embodiment.

Next, a description will be given of a method of manufacturing the above-described mark plate 12, and the operational effects at the time of manufacturing and the like. First, as shown in FIG. 8, the mark plate body 3 having the groove 5 as described above is formed by a known mold forming method, and the resist paint is applied to the entire inner surface of the groove 5.
Then, a resist layer 13 as shown in FIG. At this time, good paintability is obtained. That is, a uniform and even coating film can be easily obtained.

Then, as shown in FIG. 9, the mark plate main body 3 is immersed in an electroless plating solution to perform electroless plating. At this time, the electroless plating is not performed on the resist layer 13, and the electroless plating layer 6 is formed on the other surface of the mark plate body 3. Although the plating solution for electroless plating is acidic, the resist layer 13 does not dissolve into the plating solution due to the characteristics of the first embodiment.

Subsequently, as shown in FIG. 10, the mark plate body 3 on which the electroless plating layer 6 is formed is subjected to electroplating in the same manner as in the second embodiment. At this time, the resist layer 13 formed in a portion that does not require plating is not dissolved by the acidic electrolytic plating solution. Further, since the resist layer 13 is not electrically conducted, the electroplating layer 7 is not formed thereon. On the other hand, the electroplating layer 7 having the above-described multilayer structure is formed on the surface of the electroless plating layer 6 in a portion requiring plating. In this way, the electroless plating layer 6 and the electroplating layer 7 are formed only in the area around the shape of the letter "T", and the inside with the resist layer 13 is obtained.

Next, as shown in FIG. 11, the plating layer 4 is covered with an electroformed mask 15. The electroformed mask 15 is a metal plate having a thickness of “several mm” and has a shape conforming to the mark plate 12. Further, the electroformed mask 15 is appropriately formed with a T-shaped opening which is opened only at a portion necessary for forming the overcoat layer 14.
By the coating of the electroformed mask 15, a portion necessary for forming the overcoat layer 14 is exposed from the opening. Then, spray coating is performed on the exposed portion. By this coating, a top coat layer 14 is formed at a necessary portion of the coat.

Then, as shown in FIG. 7, after the top coat layer 14 is formed, the coating of the electroformed mask 15 is released to obtain the mark plate 12 described above. The present embodiment has the following effects in addition to the effects described in the second embodiment. That is, the resist layer 13 is applied and formed on the inner front surface surrounded by the groove 5, and at this time, good paintability can be obtained. In addition, the resist layer 13
An overcoat layer 14 is formed on the top, and in this embodiment, the resist layer 13 and the overcoat layer 14 are firmly adhered to each other. Therefore, even when the mark plate 12 is exposed to water, no blister is generated. That is, the mark plate 12 having excellent water resistance can be obtained.

(Fourth Embodiment: Resin Product) A fourth embodiment in which the present invention is embodied in a method for manufacturing a resin product will be described below. Note that the resist paint in this embodiment also used the sample of the second embodiment of the first embodiment, and used the same mark plate body 3 as the second and third embodiments.

As shown in FIG. 12, in this embodiment, the mark plate 22 as a resin product has a mark plate main body 3, a plating layer 4 partially formed on the surface of the main body, and a plating layer 4 formed on the inside thereof. And a resist layer 24. That is, a coating layer 23 is applied to the entire surface of the portion surrounded by the groove 5 formed on the surface of the mark plate body 3. Further, a transparent resist layer 24 is formed on the upper surface by coating. Further, the plating layer 4 formed therearound.
Is the same as in the second and third embodiments.
And an electroplating layer 7.

Next, a description will be given of a method of manufacturing the above-described mark plate 22 and the operational effects at the time of manufacturing and the like. First, as shown in FIG. 13, the mark plate main body 3 having the groove 5 as described above is formed by a known mold forming method, and a portion required for plating is covered with an electroforming mask 15 and an opening portion is formed. (Overall inner surface of the groove 5) is coated with an overcoating paint. Then, the coating layer 23 as shown in FIG.
Is formed.

Subsequently, as shown in FIG. 14, a resist paint is applied on the coating layer 23 to form a resist layer 24. Then, as shown in FIG. 15, the mark plate body 3 is immersed in an electroless plating solution to perform electroless plating, and then to perform electroplating. At this time, electroless plating and electroplating are not performed on the resist layer 24,
On the other surface of the mark plate main body 3, a plating layer 4 including an electroless plating layer 6 and an electroplating layer 7 is formed. Although each plating solution is acidic, the resist layer 24 does not dissolve into the plating solution due to the characteristics of the first embodiment. Of course, since the coating layer 23 is covered with the resist layer 24, it does not dissolve. In this way, the electroless plating layer 6 and the electroplating layer 7 are formed only in the area around the shape of the letter "T", and inside the mark, the coating layer 23 and the resist layer 24 are formed. A plate 22 is obtained.

In this embodiment, in addition to the effects described above, the coating step (the step of forming the coating layer 23 and the resist layer 24) can be continuously performed. Therefore, compared to the second and third embodiments in which both steps are provided apart from each other,
Workability can be improved. Further, the coating film layer 23 becomes just as if it were covered with the transparent resist layer 24, and the design can be improved.

The present invention is not limited to the above embodiment, and may be configured as follows, for example. (1) In the second embodiment, the mark plate body 3 is exposed inside the resist layer 8 formed in a ring shape. However, as shown in FIG. 25 may be formed.

(2) The composition of the solvent and the like in the first embodiment is not limited at all. (3) In each of the second to fourth embodiments, the groove 5 having a substantially U-shaped cross section is formed in a ring shape. However, the cross-sectional shape of the groove 5 is not limited at all. A V-shaped groove may be formed. In such a case, since the electroless plating layer 6 is hardly formed at the bottom of the groove, the appearance of parting can be further improved. Further, a configuration in which no groove is provided may be employed.

(4) In the second to fourth embodiments,
Although the groove 5 and the resist layers 8, 13, 24, etc. are all formed only on the design surface side, they are not necessarily required. That is, for example, one closed curve may be formed by the groove on the design surface side and the groove on the non-design surface. In this case, the groove and the resist layer form a part of an annular shape.

(5) In the second to fourth embodiments, the present invention is embodied in the mark plates 2, 12, and 22 for a vehicle. However, other than the above, for example, a front grill for a vehicle, an outer cover for a door mirror bracket, The present invention may be embodied as a vehicle back panel, a vehicle louver, a vehicle pillar garnish, a vehicle quarter vent, or the like. Also,
The present invention is not limited to the above resin products, and the present invention may be embodied in other resin products that have been subjected to partial plating.

(6) In each of the above embodiments, the resin material constituting the base material is made of ABS resin. However, other than that, for example, polypropylene, polyphenylene oxide, polyamide, polysulfone, polyester, etc. Various resin materials may be used.

(8) In each of the above embodiments, the electroless plating layer 6 is formed of nickel, but may be formed of copper or the like. Further, in each of the above-described embodiments and other examples, the electroplating layer 7 is formed to have a multilayer structure by using three kinds of metals of copper, nickel and chromium, but other metals may be used. Further, the present invention may be embodied in a case where a multilayer structure is not used.

The technical ideas which are not described in each claim of the claims but can be grasped from the above embodiment are described below together with their effects. (A) The resist coating for partial plating according to claim 1, wherein the resist coating comprises 70 to 85 of a vinyl chloride-vinyl acetate copolymer and an acryl-styrene copolymer.
% By weight: 30 to 15% by weight as a main component. With the above configuration, acid resistance, paintability and water resistance can be further improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view taken along line AA of FIG. 2, showing a mark plate according to a second embodiment of the present invention.

FIG. 2 is a plan view schematically showing a mark plate in a second embodiment.

FIG. 3 is a cross-sectional view showing a mark plate main body when a mark plate is manufactured in a second embodiment.

FIG. 4 is a cross-sectional view showing a state in which a resist layer is formed on a mark plate body when a mark plate is manufactured in the second embodiment.

FIG. 5 is a cross-sectional view showing a state in which an electroless plating layer is formed on a mark plate body when a mark plate is manufactured in a second embodiment.

FIG. 6 is a cross-sectional view showing a state in which an electroplating layer is formed on an electroless plating layer when a mark plate is manufactured in the second embodiment.

FIG. 7 is a sectional view showing a mark plate according to a third embodiment of the invention.

FIG. 8 is a cross-sectional view showing a state in which a resist layer is formed on a mark plate body when a mark plate is manufactured in the third embodiment.

FIG. 9 is a cross-sectional view showing a state in which an electroless plating layer is formed on a mark plate body when a mark plate is manufactured in a third embodiment.

FIG. 10 is a sectional view showing a state in which an electroplating layer is formed on an electroless plating layer when a mark plate is manufactured in the third embodiment.

FIG. 11 is a cross-sectional view showing a state in which a top coat layer is formed on a resist layer when a mark plate is manufactured in the third embodiment.

FIG. 12 is a sectional view showing a mark plate according to a fourth embodiment of the present invention.

FIG. 13 is a cross-sectional view showing a state in which a coating layer is formed on a mark plate body when a mark plate is manufactured in the fourth embodiment.

FIG. 14 is a cross-sectional view showing a state where a resist layer is formed on a coating layer when a mark plate is manufactured in a fourth embodiment.

FIG. 15 is a cross-sectional view showing a state where a plating layer is formed on a mark plate main body when a mark plate is manufactured in the fourth embodiment.

FIG. 16 is a sectional view showing a mark plate according to another embodiment of the present invention.

[Explanation of symbols]

2, 12, 22 ... Mark plate as resin product, 3
... mark plate body as base material, 6 ... electroless plating layer, 7 ... electroplating layer, 8, 13, 24 ... resist layer,
14, 25: overcoat layer, 23: coating layer.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-58-17181 (JP, A) JP-A-7-168357 (JP, A) JP-A-58-217692 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) C09D 127/06 B05D 3/10 C09D 125/00 C25D 5/02

Claims (4)

(57) [Claims] 1. Partial plating applied to form an annular shape or a part of an annular shape so as to cover the entire surface of a portion of a resin substrate (3) that does not require plating or to surround a portion that does not require plating. A resist coating composition for use as a coating composition, wherein the resist coating composition contains, as a main component, a mixture of a vinyl chloride-vinyl acetate copolymer and an acrylic-styrene copolymer at 50 to 95% by weight: 50 to 5% by weight. Resist coating for partial plating. 2. A step of forming a resin base material (3); and forming a ring or a ring on the entire surface of the base material (3) not requiring plating or surrounding the portion not requiring plating. Applying the resist paint according to claim 1 to form a part of the resist layer, and forming a resist layer (8, 13); and a step other than the resist layer (8, 13) on the surface of the base material (3). A step of forming an electroless plating layer (6) on a portion; and, of the electroless plating layer (6) formed on the base material (3) that has undergone the electroless plating step, electrically converting a portion requiring plating to an electroless plating layer. Forming an electroplating layer (7) on a portion of the electroless plating layer (6) where plating is required by electrically conducting the resin product. Production method. 3. A top coat is further applied to the resin product manufactured by the manufacturing method according to claim 2 on the upper surface of the resist layer (13) or the inner peripheral side of the resist layer (8). Forming a top coat layer (14, 25). 4. A step of forming a resin base material (3), and forming a coating film layer (23) by applying a paint to a portion of the surface of the base material (3) that does not require plating. Forming a resist layer (24) by applying the resist paint according to claim 1 on the upper surface of the coating layer (23); and forming the resist layer (24) on the surface of the substrate (3). (24) a step of forming an electroless plating layer (6) in a portion other than the above; and, of the electroless plating layer (6) formed on the base material (3) after the electroless plating step, Forming an electroplating layer (7) on a portion of the electroless plating layer (6) where plating is required by electrically conducting necessary portions. Manufacturing method of manufactured resin products.