JP2577866B2 - Manufacturing method of local plating target and local plating target - Google Patents

Manufacturing method of local plating target and local plating target

Info

Publication number
JP2577866B2
JP2577866B2 JP31848093A JP31848093A JP2577866B2 JP 2577866 B2 JP2577866 B2 JP 2577866B2 JP 31848093 A JP31848093 A JP 31848093A JP 31848093 A JP31848093 A JP 31848093A JP 2577866 B2 JP2577866 B2 JP 2577866B2
Authority
JP
Japan
Prior art keywords
plating
synthetic resin
resin molded
molded product
paint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31848093A
Other languages
Japanese (ja)
Other versions
JPH07173671A (en
Inventor
一政 堀内
隆司 平山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UEHARA NEEMU PUREETO KOGYO KK
Original Assignee
UEHARA NEEMU PUREETO KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UEHARA NEEMU PUREETO KOGYO KK filed Critical UEHARA NEEMU PUREETO KOGYO KK
Priority to JP31848093A priority Critical patent/JP2577866B2/en
Publication of JPH07173671A publication Critical patent/JPH07173671A/en
Application granted granted Critical
Publication of JP2577866B2 publication Critical patent/JP2577866B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、各種合成樹脂製成型品
の局所にメッキ仕上げ処理を施した装飾標体の製法及び
当該製法により製作された局所メッキ標体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a decorative specimen in which plating is locally applied to various synthetic resin molded articles, and a locally plated specimen produced by the method.

【0002】[0002]

【従来の技術】従来のこの種の局所にメッキ仕上げ処理
を施した装飾標体(以下、単に「局所メッキ標体」とす
る)を図面を参照して説明する。図6は従来の局所メッ
キ標体の正面図、図7はその製作工程の概要を説明する
図である。図中、Aは合成樹脂製成型品の局所メッキ標
体、1はメッキを施した文字部、1′はまだメッキが施
されていない文字部、1″はマスキング、2は塗装を施
すベース面である。
2. Description of the Related Art A conventional decorative specimen (hereinafter simply referred to as a "local plating specimen") which has been subjected to a plating treatment on such a local area will be described with reference to the drawings. FIG. 6 is a front view of a conventional local plating target, and FIG. 7 is a view for explaining the outline of the manufacturing process. In the figure, A is a locally plated specimen of a synthetic resin molded product, 1 is a plated character portion, 1 ′ is a not-yet-plated character portion, 1 ″ is masking, and 2 is a base to be painted. Plane.

【0003】従来の合成樹脂製成型品の局所メッキ標体
Aは、図7(a)に示すように、最初は何も塗装及びメ
ッキされていない合成樹脂製成型品の生地全面に、文字
部1′及びベース面を含めて一律にメッキ(一般的に最
終仕上げに用いられているのはクロームメッキ)仕上げ
処理を施し、次に図7(b)に示すように文字或いは図
案等表示部以外のベース面2を塗装仕上げ加工する手法
にて作成されている。塗装仕上げ処理は、文字部1をマ
スキング1″して、メッキ等の処理されたベース面2を
きれいに洗浄してからなされている。
As shown in FIG. 7 (a), a locally plated specimen A of a conventional synthetic resin molded product is, as shown in FIG. A plating process is applied uniformly including the character portion 1 'and the base surface (chrome plating is generally used for final finishing), and then characters or patterns are displayed as shown in FIG. 7 (b). It is created by a method of painting and finishing the base surface 2 other than the part. The paint finishing process is performed after the character portion 1 is masked 1 "and the base surface 2 that has been subjected to plating or the like is cleaned thoroughly.

【0004】[0004]

【発明が解決しようとする課題】ところで、前記合成樹
脂成型品の局所メッキ標体Aでは、クロームメッキ面上
へ塗装をしているので、塗料の局所メッキ標体Aへの密
着強度(密着性)が悪い。特に、局所メッキ標体A表面
を拭いたり、あるいは自動車等へ局所メッキ標体Aを装
着した場合、外部との擦れ、例えば、局所メッキ標体A
に高速洗車機のブラシが触れたりすると、メッキ処理し
た文字部1以外の塗装処理したベース部2の塗装が剥が
れ落ちたりして、標体の外観が損なわれ、品質管理上の
大きな問題が生じている。
However, since the locally plated specimen A of the synthetic resin molded product is coated on the chrome plated surface, the adhesion strength of the paint to the locally plated specimen A (adhesion) ) Is bad. In particular, when the surface of the local plating target A is wiped, or when the local plating target A is mounted on an automobile or the like, it rubs against the outside, for example, the local plating target A
If the brush of the high-speed car washer touches the surface, the paint on the base part 2 other than the plated character part 1 is peeled off and the appearance of the target body is impaired, causing a major quality control problem. ing.

【0005】昨今では、メッキ面塗装用の塗料の研究も
盛んに行われ、技術的にも大きく進歩して塗料のメッキ
面への密着性、表面強度(傷つきにくさ)等も向上して
きてはいるが、まだまだ品質上問題のない塗料の開発ま
では至っていない。
[0005] In recent years, paints for coating the plating surface have been actively studied, and the technology has been greatly advanced to improve the adhesion of the coating to the plating surface and the surface strength (resistance to scratching). However, the development of paints with no quality problems has not yet been achieved.

【0006】また、電解メッキ(電気メッキ)を利用し
てメッキが必要な部分のみにメッキを行い、それ以外の
部分に関しては、なるべくメッキをしない方法も提案・
実現されている。この方法の一例につき、次に図面を参
照して説明する。図8は装飾標体の表面に導電ラインを
設けて電解メッキを行おうとする方法を説明する図で、
(a)は正面図,(b)は右側面図、図9は仕上がった
局所メッキ標体の正面図、図10は従来のメッキ・塗装
工程ラインの作業手順を説明する流れ図である。図中、
Bは局所メッキ標体、3は文字部、4は導電ライン、5
はメッキ用電極ボス、6は塗料で塗装されるベース面で
ある。
It is also proposed to use electroplating (electroplating) to perform plating only on portions that require plating, and to minimize plating on other portions.
Has been realized. An example of this method will be described next with reference to the drawings. FIG. 8 is a diagram for explaining a method of performing electroplating by providing a conductive line on the surface of the decorative specimen,
9A is a front view, FIG. 9B is a right side view, FIG. 9 is a front view of a finished local plating target, and FIG. 10 is a flow chart for explaining a work procedure of a conventional plating / painting process line. In the figure,
B is a locally plated specimen, 3 is a character portion, 4 is a conductive line, 5
Is an electrode boss for plating, and 6 is a base surface coated with paint.

【0007】この方法における局所メッキ標体Bでは、
一般的な手順では図10に示すように、電解メッキ・マ
スク塗装後段工程において、電解メッキ用にマスク塗装
又はマスク印刷を行ってメッキ用電極ボス5から文字部
3まで導電ライン4を設け、当該導電ライン4により電
解メッキを行い、その後、マスク塗装処理工程で必要な
面に塗装を行ってベース面6を処理するというものであ
る。
[0007] In the local plating specimen B in this method,
In a general procedure, as shown in FIG. 10, in a later step of electrolytic plating and mask coating, a conductive line 4 is provided from the plating electrode boss 5 to the character portion 3 by performing mask coating or mask printing for electrolytic plating. Electroplating is performed by the conductive lines 4, and thereafter, the base surface 6 is processed by coating a required surface in a mask coating process.

【0008】しかしながら、当該方法では、従来の方法
と比較して少しとは言え、メッキが必要な面である文字
部3以外にベース面6上に導電ライン4としてのメッキ
面が残るので、その上にベース面6として塗装処理を行
ってもやはりその部分の塗装が剥がれ易く、問題点が完
全に解決したとは言い難い。ここにおいて本発明は、前
記問題点に鑑み、メッキ仕上げ処理が行われる各種局所
メッキ標体の表面の、塗装面の塗料剥離を起こしにくい
局所メッキ標体の製法及び局所メッキ標体を提供せんと
するものである。
However, in this method, the plating surface as the conductive line 4 remains on the base surface 6 except for the character portion 3 which is a surface requiring plating, though slightly, compared with the conventional method. Even if the upper surface 6 is subjected to the coating treatment, the coating at that portion is also easily peeled off, and it cannot be said that the problem has been completely solved. Here, the present invention has been made in view of the above problems, and provides a method of producing a local plating target and a local plating target that are less likely to cause paint peeling of a painted surface, on the surface of various local plating targets subjected to plating finishing treatment. Is what you do.

【0009】[0009]

【課題を解決するための手段】前記課題の解決は、本発
明の次に列挙する新規な特徴的構成手法及び手段を採用
することにより達成される。すなわち、本発明方法の第
1の特徴は、合成樹脂製成型品に部分的にメッキ仕上げ
処理加工を施した局所メッキ標体の製作に当り、前記合
成樹脂製成型品の表面をエッチング処理した後、化学ニ
ッケルを主体とした無電解メッキを施して通電性を持た
せ、電解メッキ処理を必要とする部分にマスクを施して
塗料を塗装し、当該マスクを外して塗料が塗装されてい
ない部分に電解メッキを行う局所メッキ標体の製法にあ
る。
The object of the present invention can be attained by adopting the following novel characteristic construction methods and means of the present invention. That is, the first feature of the method of the present invention is that, in producing a locally plated specimen in which a synthetic resin molded product is partially subjected to a plating finishing process, the surface of the synthetic resin molded product is etched. After that, electroless plating mainly made of chemical nickel is applied to give electrical conductivity, masks are applied to parts requiring electrolytic plating, paint is applied, and the mask is removed and paint is not applied It is in the method of producing a local plating target for electroplating a part.

【0010】本発明方法の第2の特徴は、合成樹脂製成
型品に部分的にメッキ仕上げ処理加工を施した局所メッ
キ標体の製作に当り、前記合成樹脂製成型品の表面の電
解メッキ処理を必要としない部分には、エッチングを防
止する塗料を塗装してからエッチング処理をし、当該エ
ッチング処理をした部分に化学ニッケルを主体とした無
電解メッキを施して通電性を持たせ、電解メッキを行う
局所メッキ標体の製法にある。
A second feature of the method of the present invention relates to the production of a locally plated specimen in which a synthetic resin molded article is partially subjected to a plating treatment, and the surface of the synthetic resin molded article is electrolyzed. For parts that do not require plating, apply paint to prevent etching and then perform etching, then apply electroless plating mainly using chemical nickel to the parts that have been subjected to the etching, to have electrical conductivity, It is in the method of manufacturing a local plating target for performing electrolytic plating.

【0011】本発明方法の第3の特徴は、前記本発明方
法の第1又は第2の特徴において、前記電解メッキをし
た後、当該電解メッキ処理部分にマスクを施して、既に
塗料が塗装された部分に仕上げ塗料を塗装する局所メッ
キ標体の製法にある。
According to a third feature of the method of the present invention, in the first or second feature of the method of the present invention, after the electrolytic plating is performed, a mask is applied to the electroplated portion, and the paint is already applied. It is in the method of producing a locally plated specimen that applies a finish paint to the part that has been painted.

【0012】本発明方法の第4の特徴は、合成樹脂製成
型品に部分的にメッキ仕上げ処理加工を施した局所メッ
キ標体の製作に当り、まず、前記合成樹脂製成型品の裏
側面に電極用ボスを取付けるとともに、当該合成樹脂製
成型品の表側生地面の所望部位の隣接部から裏側まで貫
通した導電ライン用微小孔を設け、次に、前記合成樹脂
製成型品の表側生地面の前記所望部位以外と周側面に亘
りエッチング防止塗膜層を塗装被覆し、続いて、前記合
成樹脂製成型品の表側生地面の所望部位をエッチング処
理した後、当該所望部位に化学ニッケルを主体とした無
電解メッキを施して通電性を持たせ、前記電極用ボスに
通電して前記導電ライン用微小孔を介して前記所望部位
にさらに電解メッキ層を被覆し、前記電極用ボスを根元
から折除するとともに、前記導電ライン用微小孔に目止
剤(目地剤)を充填させて当該微小孔を塞いで仕上げる
局所メッキ標体の製法にある。
A fourth feature of the method of the present invention resides in the production of a locally plated specimen in which a synthetic resin molded article is partially plated and finished. Attaching an electrode boss to the surface, and providing a fine hole for a conductive line penetrating from a portion adjacent to a desired portion of the front side fabric surface of the synthetic resin molded product to the back side thereof, and then forming the synthetic resin molded product After coating and coating the etching prevention coating layer on the front side fabric surface other than the desired portion and on the peripheral side surface, and subsequently, etching the desired portion of the front side fabric surface of the synthetic resin molded product, By applying electroless plating mainly using chemical nickel to give electrical conductivity, applying electricity to the boss for the electrode, and further covering the desired portion via the fine hole for the conductive line with an electrolytic plating layer, When you cut the boss from the root To, in preparation of local plating target body the conductive line for micropores Metomezai (joint agent) is filled with and finish closes the micropores.

【0013】本発明物品の第1の特徴は、合成樹脂製成
型品の表面には化学ニッケルを主体とした無電解メッキ
層が積層され、当該無電解メッキ層上の所望部位には電
解メッキ層が積層され、当該無電解メッキ層上の所望部
位以外は塗膜層が積層された局所メッキ標体にある。
A first feature of the article of the present invention is that an electroless plating layer mainly composed of chemical nickel is laminated on the surface of a molded article made of synthetic resin, and a desired portion on the electroless plating layer is electroplated. The layers are laminated, and the portions other than the desired portions on the electroless plating layer are on the locally plated specimen on which the coating layer is laminated.

【0014】本発明物品の第2の特徴は、合成樹脂製成
型品の所望部位の表面には塗膜層又は印刷膜が被覆さ
れ、当該所望部位以外の表面には化学ニッケルを主体と
した無電解メッキ層が積層され、さらに当該無電解メッ
キ層上には電解メッキ層が積層された局所メッキ標体に
ある。
A second feature of the article of the present invention is that the surface of a desired portion of the molded article made of synthetic resin is coated with a coating layer or a printed film, and the surface other than the desired portion is mainly made of chemical nickel. An electroless plating layer is laminated, and the electroplating layer is formed on the local plating target on which the electrolytic plating layer is further laminated.

【0015】[0015]

【作用】本発明は前記のような手法及び手段を講ずるか
ら、メッキ仕上げ処理が不要であり塗装処理のみが必要
である部分には、電解メッキを施さずに無電解メッキ層
上又は直接合成樹脂成型品の生地表面に塗装することと
なるので、塗膜との密着性が良く剥れ難い結果、高品質
の製品が製造できる。よって、外部との擦れ、特に自動
車の高速洗車機等でブラシが高速であたっても、塗装部
分の塗料が剥離することはない。
Since the present invention employs the above-described method and means, the portions requiring no plating and only coating are required to be applied on the electroless plating layer or directly on the synthetic resin without electrolytic plating. Since it is applied to the surface of the fabric of the molded product, the adhesiveness to the coating film is good and the product is hard to peel off, so that a high quality product can be manufactured. Therefore, even if the brush rubs against the outside, particularly when the brush is driven at a high speed in a high-speed car washer of an automobile, the paint on the painted portion does not peel off.

【0016】[0016]

【実施例】(方法例1) 本発明の実施例を図面を参照して説明する。図1は本方
法例で製作した局所メッキ標体の正面図、図2は本方法
例の手順を説明したメッキ・塗装工程ラインの作業流れ
図である。図中、Cは局所メッキ標体、7はメッキを施
す文字部、8は塗装を施すベース面である。
Embodiment (Method Example 1) An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a locally plated specimen manufactured by the present method example, and FIG. 2 is a work flow chart of a plating / coating process line for explaining the procedure of the present method example. In the figure, C is a local plating target, 7 is a character portion to be plated, and 8 is a base surface to be painted.

【0017】図2の手順説明の流れ図に示すように、エ
ッチング・無電解メッキ前段工程の最終処理である化学
ニッケル処理工程まで終了後、局所メッキ標体Cの表面
に通電性を持たせる。次にダブルブロックで囲われた処
理工程群に示すよう局所メッキ標体Cを化学ニッケルメ
ッキ槽及びメッキ用取付治具(電極治具)から取り外し
て取出し、水洗い(洗浄−純水シャワー洗浄)し乾燥し
てメッキが必要な標体文字部7のメッキ面をマスクし
て、ベース面8にのみ塗装処理加工をする。続いて、マ
スクを外して電解メッキ(電気メッキ)処理するための
メッキ・塗装工程ラインに標体を取付投入して、脱脂・
酸洗処理工程を経て従来通りの処理工程に戻り最終的に
標体文字部7にだけクローム浸漬メッキ仕上処理を施
す。なお、電解メッキ・マスク塗装後段工程におけるマ
スク塗装処理工程は、当該塗装面が綺麗な状態で再塗装
する必要がない場合には省略しても良い。
As shown in the flowchart of FIG. 2, the surface of the locally plated specimen C is made conductive after the chemical nickel treatment step, which is the final treatment of the pre-etching / electroless plating step. Next, as shown in the processing step group surrounded by the double block, the local plating specimen C is removed from the chemical nickel plating tank and the plating jig (electrode jig), taken out, and washed with water (washing-pure water shower washing). The plating surface of the target character portion 7 which needs to be plated by drying is masked, and only the base surface 8 is coated. Next, remove the mask, attach the target to the plating / coating process line for electrolytic plating (electroplating) treatment, and throw it in.
After the pickling process, the process returns to the conventional process, and finally, only the target character portion 7 is subjected to a chrome immersion plating finishing process. The mask coating process in the latter stage of the electroplating / mask coating may be omitted when it is not necessary to repaint the surface with a clean coated surface.

【0018】本方法例によれば、無電解メッキ面上に塗
装した面(文字等以外の面=ベース面8)にはメッキが
付かず、意匠的にメッキの必要な文字部7の表面にだけ
メッキが付くことにより、安定した局所メッキ標体Cを
作成できる。
According to this method example, the surface painted on the electroless plated surface (the surface other than the character etc. = base surface 8) is not plated, and the surface of the character portion 7 which needs to be plated in design is applied. Only by plating, a stable local plating target C can be formed.

【0019】また、従来のように電解メッキ処理(電気
メッキ処理)が施された上に塗装処理が施されるのでは
無いので、塗装部分の塗料剥離がなく、非常に良質な製
品を製造することが可能となる。
In addition, since a coating process is not performed after the electroplating process (electroplating process) is performed as in the prior art, the paint is not peeled off from the painted portion, and a very high quality product is manufactured. It becomes possible.

【0020】(方法例2) 本発明の第2の方法例を図面につき説明する。図3は、
本方法例の手順を説明するメッキ・塗装工程ラインの作
業流れ図である。本方法例は、樹脂製標体にメッキ(ク
ロームメッキ等)仕上処理を最終的に施す場合等に使用
する。先ず、通常のメッキ・塗装工程ラインのエッチン
グ・無電解メッキ前段工程で、電解メッキ仕上処理を必
要としない面(部位)にエッチング処理がなされないよ
うに、エッチング防止塗装処理工程を行う。エッチング
防止塗装処理工程では、特殊塗料を用いて、塗装処理又
は印刷処理する。その後、通常のメッキ・塗装工程ライ
ンに標体を再度投入して、メッキ処理の必要な面(部
位)にだけメッキ処理加工された標体を製作することが
できる。なお、電解メッキ・マスク塗装後段工程におけ
るマスク塗装処理工程は、方法例1と同様に省略しても
良い。
(Method Example 2) A second method example of the present invention will be described with reference to the drawings. FIG.
It is a work flow chart of a plating and painting process line for explaining a procedure of the present method example. This method example is used when a plating (chrome plating or the like) finish treatment is finally applied to a resin-made specimen. First, in a pre-etching / electroless plating process in a normal plating / coating process line, an etching prevention coating process is performed so that an etching process is not performed on a surface (site) that does not require electrolytic plating finishing. In the etching prevention coating process, a coating process or a printing process is performed using a special paint. After that, the target is put into the usual plating / painting process line again, and the target that has been subjected to the plating process only on the surface (site) requiring the plating process can be manufactured. Incidentally, the mask coating treatment step in the latter step of the electrolytic plating / mask coating may be omitted as in Method Example 1.

【0021】(物品例1) 上記第1方法例又は第2方法例の2つの方法を採用し
て、局所メッキ標体を作成する標体意匠作成方法には、
2通りの場合がある。すなわち、 (1)文字部に塗装処理、ベース部にメッキ処理を所望
する場合、 (2)文字部にメッキ処理、ベース部に塗装処理を所望
する場合、 の2通りの場合が存在するが、それを以下に説明する。
(Article Example 1) A target design creation method for creating a locally plated target by employing the two methods of the first method example or the second method example includes:
There are two cases. In other words, there are two cases: (1) when a coating process is desired for a character portion and a plating process is desired for a base portion; and (2) when a plating process is desired for a character portion and a coating process is desired for a base portion. It is described below.

【0022】まず、第1の物品例を図面につき説明す
る。図4(a)は本物品例の正面図、(b)は図4
(a)中IVb−IVb線視拡大断面図である。図中、Dは
本物品例の局所メッキ標体、9は後段工程で塗装処理を
希望する文字部、10は後段工程で電解メッキによるメ
ッキ処理を希望するベース部である。本物品例は、合成
樹脂製成型品Daの表側生地面の文字部9上には下塗り
塗膜層αと上塗り塗膜層βが二重に塗装被覆され、ベー
ス部10上には下から順にエッチン処理層γ、無電解メ
ッキ層δ、電解メッキ層εが鍍装被覆される。
First, a first example of an article will be described with reference to the drawings. FIG. 4A is a front view of an example of the article, and FIG.
FIG. 4A is an enlarged sectional view taken along line IVb-IVb. In the figure, D is a locally plated specimen of the present article example, 9 is a character portion for which a painting process is desired in a later step, and 10 is a base portion for which a plating process by electrolytic plating is desired in a later step. In this article example, the undercoating layer α and the overcoating layer β are double-coated on the character portion 9 on the front side fabric surface of the synthetic resin molded product Da, and the base portion 10 is coated from below. The etching layer γ, the electroless plating layer δ, and the electrolytic plating layer ε are sequentially plated and covered.

【0023】本物品例は、このような具体的実施態様を
呈する。すなわち、文字部9は塗装処理、ベース部10
はメッキ処理を希望する場合の物品例であるが、ここで
は前記第2方法例を採用した場合の作成工程を説明す
る。
The present article examples exhibit such specific embodiments. That is, the character portion 9 is a coating process, the base portion 10
Is an example of an article in the case where a plating process is desired. Here, a description will be given of a preparation process in a case where the second example of the method is adopted.

【0024】エッチングを施さない文字部9に対しては
特殊塗料による塗装を行い、エッチングを施すベース部
10生地面に対しては何も処理を行わない。このエッチ
ングの処理工程直前段階における処理により、メッキ処
理が必要なベース部10に対してのみ表面処理であるエ
ッチング処理が行われてエッチング処理層が作成され
る。その後の処理工程でメッキ処理が行われ、無電解メ
ッキ層と電解メッキ層が積層被覆され、特殊塗装がなさ
れた文字部9に対してはエッチングが行われず、当然そ
の後の文字部9にはメッキが施されないので、樹脂塗料
による塗装が非常にうまくのる。
The character portion 9 not to be etched is coated with a special paint, and the base portion 10 to be etched is not subjected to any processing. By the processing just before the etching processing step, the etching processing as the surface processing is performed only on the base portion 10 requiring the plating processing, and an etching processing layer is formed. In the subsequent processing step, plating is performed, the electroless plating layer and the electrolytic plating layer are laminated and coated, and the character portion 9 that has been specially coated is not etched. Is not applied, so coating with resin paint works very well.

【0025】なお、当該特殊塗料による塗装は、エッチ
ング処理工程が終了した後に、剥離してもよい。また、
その後の通常の塗料による塗装処理工程の塗料との相性
がよいようならば、そのままにして工程を進めても良
い。
The coating with the special paint may be peeled off after the etching process is completed. Also,
As long as the compatibility with the paint in the subsequent coating treatment step with the usual paint is good, the process may be proceeded without any change.

【0026】(物品例2) 第2の物品例を図面につき説明する。図5(a)は本物
品例の正面図、図5(b)は図5(a)中のVb−Vb
線視断面図である。図中、Eは本物品例の局所メッキ標
体、11は後段工程でメッキ処理を施す文字部、12は
後段工程で塗装処理を施すベース部、13はメッキ用電
極ボス、14は文字部11に接する頂孔縁14a(先端
孔の縁)から局所メッキ標体E裏側の下孔縁14bまで
貫通した上向円錐形導電ライン用微小孔である。なお、
本物品例の説明図面である図5においては、理解しやす
いように導電ライン用微小孔14を誇張して描いてい
る。
(Example 2 of goods) A second example of goods will be described with reference to the drawings. FIG. 5A is a front view of the present article example, and FIG. 5B is Vb-Vb in FIG. 5A.
FIG. In the figure, E is a locally plated specimen of the present article example, 11 is a character portion to be plated in a later step, 12 is a base portion to be painted in a later step, 13 is an electrode boss for plating, and 14 is a letter portion 11 This is a fine hole for the upward conical conductive line penetrating from the top hole edge 14a (edge of the front end hole) in contact with the bottom hole edge 14b on the back side of the local plating target E. In addition,
In FIG. 5, which is an explanatory drawing of the present article example, the conductive line micro holes 14 are exaggerated for easy understanding.

【0027】本物品例は、このような具体的実施態様を
呈する。すなわち、文字部11にメッキ処理を所望し、
ベース部12には通常の塗料による塗装処理を所望する
場合の物品例であるが、前記第1物品例と同様に、前記
第2方法例を採用した場合の作成工程を説明する。図5
における局所メッキ標体Eは、前記第1物品例と同様
に、メッキ処理を所望する文字部11にはエッチングの
直前段階で特殊塗料による塗装処理を施さず、通常の塗
料による塗装処理を所望するベース面12および四周側
面12′には特殊塗料による塗膜層α′の塗装処理を施
す。
The present article examples exhibit such specific embodiments. That is, a plating process is desired for the character portion 11,
The base part 12 is an example of an article in the case where a coating process with a normal paint is desired. As in the first example of the article, a description will be given of a preparation process in the case of adopting the second method example. FIG.
As in the case of the first article, the localized plating specimen E in the above does not need to be coated with a special coating at the stage immediately before etching on the character portion 11 for which plating is desired, but is desired to be coated with a normal coating. The base surface 12 and the four peripheral side surfaces 12 'are subjected to a coating process of a coating layer α' with a special paint.

【0028】そして、特殊塗料による塗装の後に、エッ
チング処理層γ′被覆のエッチング処理を施し、その
後、メッキ・塗装工程ラインに局所メッキ標体Eを投入
して次々に無電解メッキ層δ′、電解メッキ層ε′を重
層被覆するとともにベース面12に仕上げ塗り塗膜層
β′の塗装を施す。
Then, after coating with the special paint, the coating of the etching layer γ 'is etched, and thereafter, the local plating specimen E is put into the plating / coating process line, and the electroless plating layers δ', The electrolytic plating layer ε ′ is coated in multiple layers, and the base surface 12 is coated with a finish coat layer β ′.

【0029】ここで、重要なのは、本物品例において
は、前記従来例の図8のような、導電ライン4を設ける
必要がないということである。というのは、局所メッキ
標体Eの導電ライン用微小孔14の内側面からメッキさ
れ、自然と、表面のメッキを所望する文字部11への導
電ラインLとなり、文字部11にメッキ処理を施すこと
が可能となるからである。さらに、塗膜層α′の表面に
塗膜層β′が二重に塗装される。なお、電解メッキ・マ
スク塗装後段工程における当該塗膜層β′の被覆は省略
しても良い。
What is important here is that in the present article example, there is no need to provide the conductive line 4 as shown in FIG. 8 of the conventional example. That is, the conductive line L is plated from the inner side surface of the conductive line minute hole 14 of the locally plated specimen E, and naturally becomes the conductive line L to the character portion 11 whose surface is desired to be plated. This is because it becomes possible. Further, the coating layer β 'is double coated on the surface of the coating layer α'. The coating of the coating layer β 'in the subsequent step of the electrolytic plating / mask coating may be omitted.

【0030】この導電ライン用微小孔14は、メッキ処
理を所望する文字部11の大きさによって、導電ライン
Lとしての孔の数を増減したり、孔径を変更することに
より、メッキ処理を施す面の仕上がり状態をコントロー
ルすることができる。また、導電ライン用微小孔14の
形状は、メッキ処理を所望する表面近傍では径を小さ
く、裏面部では比較的大径の円錐形の孔が望ましい。
The minute holes 14 for the conductive lines are formed on the surface to be plated by increasing or decreasing the number of holes as the conductive lines L or by changing the hole diameters according to the size of the character portion 11 for which plating is desired. Can control the finished state. Also, the shape of the conductive line micro-holes 14 is desirably a conical hole having a relatively small diameter near the surface where plating is desired and a relatively large diameter on the back surface.

【0031】なお、この導電ライン孔となる導電ライン
用微小孔14は、メッキ・塗装工程ラインによるすべて
の工程終了後に、微小な孔であるがため目止め(目地)
剤Ωを吹き付ければ容易に孔を塞いで目止めができるの
で、製品完成後の外観を損なうことはない。
The conductive-line fine holes 14 serving as the conductive-line holes are small holes after all the steps in the plating / painting process line are completed, so they are filled (joints).
By spraying the agent Ω, the holes can be easily closed and sealed, so that the appearance after completion of the product is not impaired.

【0032】[0032]

【発明の効果】以上のように、本発明の第1の方法によ
れば、エッチング・無電解メッキ前段工程における無電
解メッキの化学ニッケル処理工程まで終了した後、局所
メッキ標体を、メッキ・塗装工程ラインから一時はずし
てメッキを所望する部分以外に塗装を行ってから電極メ
ッキ・マスク塗装後段工程における仕上げのクロムメッ
キ処理工程を行う。そのため、電解メッキ層面上への塗
装とならないので、塗料の密着強度が強く、自動車洗浄
機による塗装剥離等の問題がなくなる。
As described above, according to the first method of the present invention, after completing the chemical nickel treatment step of the electroless plating in the first step of the etching and the electroless plating, the local plating specimen is plated and removed. After temporarily removing from the painting process line, painting is performed on a portion other than the portion where plating is desired, and then a chrome plating process is performed in the final stage of electrode plating and mask painting. For this reason, since the coating does not occur on the electrolytic plating layer surface, the adhesion strength of the coating is strong, and the problem of peeling of the coating by an automobile washer is eliminated.

【0033】さらに、従来から用いられているクロムメ
ッキ面上に塗装する塗料をそのまま使用することが可能
であり、無電解メッキ層面上へ塗装する専用の塗料を使
用すれば、さらに安定した品質維持を実現できる。
Further, it is possible to use the conventional paint for coating on the chromium plating surface as it is, and if a special paint for coating on the electroless plating layer surface is used, more stable quality can be maintained. Can be realized.

【0034】また、本発明の第2の方法によれば、エッ
チング・無電解メッキ前段工程に不可欠なエッチング処
理工程において、後の工程で通常の塗料による塗装が必
要な箇所には、エッチング処理不可能なように特殊塗料
による塗装を行い、そのことにより、塗装が必要な箇所
にはメッキを行わないようにする。よって、塗装密着強
度の点では、ほとんど問題はなくなり、耐久性、品質向
上が図れる。
Further, according to the second method of the present invention, in the etching process indispensable for the first stage of the etching / electroless plating, the etching process is not applied to a portion which needs to be coated with ordinary paint in a later process. Coating with special paints where possible, thereby avoiding plating where necessary. Therefore, there is almost no problem in terms of coating adhesion strength, and durability and quality can be improved.

【0035】また、本発明の第1の物品例による局所メ
ッキ標体であれば、不必要な箇所にはメッキが行われ
ず、また、第2の物品例による局所メッキ標体であれ
ば、従来の技術における電解メッキには不可欠な導電ラ
インを設ける必要がない、等優れた有用性、経済性を発
揮する。
In the case of the locally plated specimen according to the first article example of the present invention, plating is not performed on unnecessary portions. It does not need to provide a conductive line indispensable for the electroplating in the technique described above, and exhibits excellent utility and economy.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の方法例により製作された局所メ
ッキ標体の正面図である。
FIG. 1 is a front view of a locally plated specimen manufactured according to a first method example of the present invention.

【図2】同上、手順を説明したメッキ・塗装工程ライン
の作業流れ図である。
FIG. 2 is a work flow chart of a plating / painting process line for explaining the procedure.

【図3】本発明の第2の方法例の手順説明のためのメッ
キ・塗装工程ラインの作業流れ図である。
FIG. 3 is a work flow chart of a plating / painting process line for explaining a procedure of a second method example of the present invention.

【図4】(a)は、本発明の第1の物品例を示す正面図
(b)は(a)中IVb−IVb線視拡大断面図である。
FIG. 4A is a front view showing a first example of an article of the present invention, and FIG. 4B is an enlarged sectional view taken along line IVb-IVb in FIG.

【図5】(a)は本発明の第2の物品例の正面図、
(b)は(a)中のVb−Vb線視断面図である。
FIG. 5 (a) is a front view of a second article example of the present invention,
(B) is a sectional view taken along line Vb-Vb in (a).

【図6】従来の局所メッキ標体の正面図である。FIG. 6 is a front view of a conventional local plating target.

【図7】(a)(b)は、同上、その製作過程の段階的
概略説明図である。
FIGS. 7 (a) and 7 (b) are step-by-step schematic illustrations of the same manufacturing process.

【図8】同上、局所メッキ標体の表面に導電ラインを設
けて電解メッキを行おうとする方法を説明する図で、
(a)は正面図,(b)は右側面図である。
FIG. 8 is a view for explaining a method of providing a conductive line on the surface of a local plating specimen and performing electrolytic plating.
(A) is a front view, (b) is a right side view.

【図9】同上、局所メッキ標体の表面に導電ラインを設
けて電解メッキを行おうとする方法により仕上がった標
体の正面図である。
FIG. 9 is a front view of a specimen finished by a method in which a conductive line is provided on the surface of a locally plated specimen to perform electrolytic plating.

【図10】従来のメッキ・塗装工程ラインの作業流れ図
である。
FIG. 10 is a work flowchart of a conventional plating / painting process line.

【符号の説明】[Explanation of symbols]

A,B,C,D,E…局所メッキ標体 α,β,α′,β′…塗膜層 γ,γ′…エッチング処理層 δ,δ′…無電解メッキ層 ε,ε′…電解メッキ層 Ω…目止め剤 1…メッキを施した文字部 1′…まだメッキが施されていない文字部 1″…マスキング 2,6,8,10,12…ベース面 3,7,9,11…文字部 4…導電ライン 5,13…メッキ用電極ボス 14…導電ライン用微小孔 14a…頂孔縁 14b…下孔縁 A, B, C, D, E: local plating target α, β, α ', β': coating layer γ, γ ': etching layer δ, δ': electroless plating layer ε, ε ': electrolytic Plating layer Ω ... Sealing agent 1 ... Plated character portion 1 '... Unplated character portion 1 "... Masking 2,6,8,10,12 ... Base surface 3,7,9,11 ... Character part 4 ... Conducting line 5, 13 ... Plating electrode boss 14 ... Micro hole for conducting line 14a ... Top hole edge 14b ... Bottom hole edge

Claims (6)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】合成樹脂製成型品に部分的にメッキ仕上げ
処理加工を施した局所メッキ標体の製作に当り、 前記合成樹脂製成型品の表面をエッチング処理した後、
化学ニッケルを主体とした無電解メッキを施して通電性
を持たせ、電解メッキ処理を必要とする部分にマスクを
施して塗料を塗装し、当該マスクを外して塗料が塗装さ
れていない部分に電解メッキを行う、 ことを特徴とする局所メッキ標体の製法。
In producing a local plating target in which a synthetic resin molded product is partially plated and finished, after etching the surface of the synthetic resin molded product,
Apply electroless plating with chemical nickel as the main component to make it conductive, apply a mask to parts that require electrolytic plating, apply paint, remove the mask, and apply electrolysis to parts where paint is not applied. A method for producing a locally plated specimen, wherein plating is performed.
【請求項2】合成樹脂製成型品に部分的にメッキ仕上げ
処理加工を施した局所メッキ標体の製作に当り、 前記合成樹脂製成型品の表面の電解メッキ処理を必要と
しない部分には、エッチングを防止する塗料を塗装して
からエッチング処理をし、当該エッチング処理をした部
分に、化学ニッケルを主体とした無電解メッキを施して
通電性を持たせ、電解メッキを行う、 ことを特徴とする局所メッキ標体の製法。
2. In producing a locally plated specimen in which a synthetic resin molded product is partially subjected to a plating finish treatment, a portion of the surface of the synthetic resin molded product which does not require electrolytic plating is used. After applying a paint to prevent etching, perform the etching process, apply electroless plating mainly using chemical nickel to the etched portion, make it conductive, and perform electrolytic plating. A method of manufacturing a locally plated specimen that is a feature.
【請求項3】前記電解メッキをした後、当該電解メッキ
処理部分にマスクを施して、既に塗料が塗装された部分
に仕上げ塗料を塗装する、 ことを特徴とする請求項1又は2に記載の局所メッキ標
体の製法。
3. The method according to claim 1, wherein after the electrolytic plating is performed, a mask is applied to the electroplated portion, and a finish paint is applied to a portion where the paint is already applied. Manufacturing method for locally plated specimens.
【請求項4】合成樹脂製成型品に部分的にメッキ仕上げ
処理加工を施した局所メッキ標体の製作に当り、 まず、前記合成樹脂製成型品の裏側面に電極用ボスを取
付けるとともに、当該合成樹脂製成型品の表側生地面の
所望部位の隣接部から裏側まで貫通した導電ライン用微
小孔を設け、次に、前記合成樹脂製成型品の表側生地面
の前記所望部位以外と周側面に亘りエッチング防止塗膜
層を塗装被覆し、続いて、前記合成樹脂製成型品の表側
生地面の所望部位をエッチング処理した後、当該所望部
位に化学ニッケルを主体とした無電解メッキを施して通
電性を持たせ、前記電極用ボスに通電して前記導電ライ
ン用微小孔を介して前記所望部位にさらに電解メッキ層
を被覆し、前記電極用ボスを根元から折除するととも
に、前記導電ライン用微小孔に目止剤(目地剤)を充填
させて当該微小孔を塞いで仕上げる、 ことを特徴とする局所メッキ標体の製法。
4. In producing a local plating target in which a synthetic resin molded product is partially plated and finished, first, an electrode boss is attached to the back side surface of the synthetic resin molded product. Providing a fine hole for a conductive line penetrating from a portion adjacent to a desired portion of the front side fabric surface of the synthetic resin molded product to the back side thereof, and then excluding the desired portion on the front side fabric surface of the synthetic resin molded product. After that, a desired portion of the front side fabric surface of the synthetic resin molded product is subjected to an etching treatment, and then the desired portion is chemically electroless mainly composed of chemical nickel. Applying plating to make it electrically conductive, energizing the electrode boss to further cover the desired portion with the electrolytic plating layer through the conductive line minute hole, and breaking the electrode boss from the base , For the conductive line A method for producing a locally plated specimen, characterized in that a hole is filled with a filler (joining agent) to close and close the microhole.
【請求項5】合成樹脂製成型品の表面には化学ニッケル
を主体とした無電解メッキ層が積層され、当該無電解メ
ッキ層上の所望部位には電解メッキ層が積層され、当該
無電解メッキ層上の所望部位以外は塗膜層が積層され
た、 ことを特徴とする局所メッキ標体。
5. An electroless plating layer mainly composed of chemical nickel is laminated on the surface of a synthetic resin molded product, and an electrolytic plating layer is laminated on a desired portion on the electroless plating layer. A localized plating target, wherein a coating layer is laminated except for a desired portion on the plating layer.
【請求項6】合成樹脂製成型品の所望部位の表面には塗
膜層又は印刷膜が被覆され、当該所望部位以外の表面に
は化学ニッケルを主体とした無電解メッキ層が積層さ
れ、さらに当該無電解メッキ層上には電解メッキ層が積
層された、 ことを特徴とする局所メッキ標体。
6. A coating film layer or a printed film is coated on a surface of a desired portion of the synthetic resin molded product, and an electroless plating layer mainly composed of chemical nickel is laminated on a surface other than the desired portion, Further, an electrolytic plating layer is laminated on the electroless plating layer, wherein the local plating target is provided.
JP31848093A 1993-12-17 1993-12-17 Manufacturing method of local plating target and local plating target Expired - Fee Related JP2577866B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31848093A JP2577866B2 (en) 1993-12-17 1993-12-17 Manufacturing method of local plating target and local plating target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31848093A JP2577866B2 (en) 1993-12-17 1993-12-17 Manufacturing method of local plating target and local plating target

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JPH07173671A JPH07173671A (en) 1995-07-11
JP2577866B2 true JP2577866B2 (en) 1997-02-05

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