JPH1121696A - Partially plated resin products and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the quality of appearance, to reduce the production cost, to increase the latitude of shapes of the product and plating and to simplify the die at the time of producing partially plated resin products. SOLUTION: A plate main body 3 of ABS resin is formed by using a die simple in structure. Subsequently, the boundary part between the necessary part and unnecessary part is machined with a laser beam to annularly form a stripe groove 6 having an almost V-shaped section. Etching is then applied to impart a catalyst nucleus. The part corresponding to the groove 6 is not etched, and the catalyst nucleus is not imparted to the part. An electroless plating 7 is formed by electroless plating on the surface of the main body 3 except the groove 6. Further, electroplating is applied to form an electroplating layer 8. The plating layer 4 is covered with an electrocast mask, and a coating- film layer 5 is formed by spray coating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin product in which only a portion of a surface of a resin base material that requires plating is partially plated, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, two techniques are known as this kind of technique. The first technique is to apply a resist coating so as to form a ring or a part of a ring on a boundary portion between a portion requiring plating and a portion not requiring plating on the surface of a resin base material. It is something to give. In this technique, first, electroless plating is applied to the surface of the base material. At this time, no electroless plating layer is formed on the resist coating layer. In other words, the electroless plating layer is formed on all parts except the resist coating layer.

[0003] Next, the substrate on which the electroless plating layer is formed is subjected to electroplating. That is, the base material is immersed in a predetermined electroplating solution to electrically conduct portions requiring plating. Then, the electroless plating layer formed in a portion that does not require plating is dissolved by an electroplating solution or the like. In portions requiring plating, an electroplating layer is formed on the surface of the electroless plating layer. In this way, the electroless plating layer and the electroplating layer are formed only on the portions requiring plating on the base material. That is, through the above steps, a so-called partially plated resin product is obtained.

[0004] However, in the above-described technique of applying a resist coating, a separate resist coating step is required, which has led to an increase in man-hours. Further, in the electroplating step, it is difficult to completely shut off the electrical continuity of the non-plated portion, and there is a problem that uneven plating is apt to occur. In addition, the boundary between the plated portion and the non-plated portion was not clearly distinguished, and it was difficult to improve the appearance quality.

The second technique is disclosed in, for example,
This has been proposed in JP-A-152195 and JP-A-52-50937. That is, instead of the resist coating, a groove having a substantially V-shaped cross section is formed so as to form a ring or a part of a ring. In such a technique, the grooves having a substantially V-shaped cross section are formed at the same time when the base material is formed using the mold, so that the number of steps does not increase. In addition, the boundary between the plated portion and the non-plated portion is clearly separated, and the appearance quality can be improved.

[0006]

However, in the second prior art, since the groove having a substantially V-shaped cross section is formed by a mold, there are the following problems.
That is, as shown in FIG. 3 (b), fine and high-accuracy ridges 55 corresponding to the grooves must be formed on the molding surface of the mold 51, and the mold processing is extremely difficult. Yes,
The cost required for the mold 51 has been increased. In addition, since such a ridge 55 is worn by use,
There was also a problem in terms of durability. Furthermore, when different plating portions are to be formed on a substrate having the same shape, a plurality of dies must be used, and the versatility is poor.

In addition, as shown in the figure, when the portion corresponding to the groove has an undercut shape in relation to the parting line of the mold 51, in addition to the fixed mold 52 and the movable mold 53, as shown in FIG. Therefore, it was necessary to separately use the slide dies 56, 57 and the like. As a result, there are problems that the mold 51 is complicated and the degree of freedom of the shape is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to improve the appearance quality when obtaining a partially plated resin product, and to reduce the manufacturing cost. It is an object of the present invention to provide a partially plated resin product capable of reducing the size, increasing the degree of freedom of a product shape and a plating shape, and simplifying a mold for forming a base material, and a method of manufacturing the same.

[0009]

In order to achieve the above object, according to the first aspect of the present invention, a portion of the surface of a resin substrate that requires plating and a portion that does not require plating are provided. In the boundary line portion, a groove is formed so as to form an annular shape, and after applying electroless plating to the base material, electroplating is applied to a portion requiring plating, thereby forming a surface of the base material. Among them, the gist is that the resin product has a plating layer formed only on a portion requiring plating, and the groove is formed by laser processing.

[0010] According to the second aspect of the present invention, the laser is formed so as to form an annular shape at the boundary between the portion requiring plating and the portion not requiring plating on the surface of the resin base material. A groove forming step of forming a groove by processing,
An etching step of etching a portion of the surface of the base material other than the grooves, a catalyst nucleus providing step of providing a catalyst nucleus to the etched portion, and removing the grooves of the surface of the base material An electroless plating step of forming an electroless plating layer on a portion, of the electroless plating layer formed on the base material that has undergone the electroless plating step, electrically conducts a necessary portion of plating, A gist of the present invention is a method of manufacturing a partially plated resin product comprising: an electroplating step of forming an electroplating layer on a portion of the electroless plating layer that requires plating.

According to a third aspect of the present invention, in the method of manufacturing a partially plated resin product according to the second aspect, after the electroplating step, a portion where the electroplating layer is formed is masked. And cover the exposed part.
The gist is that a painting process for painting is provided.

According to a fourth aspect of the present invention, in the method of manufacturing a partially plated resin product according to the second or third aspect, the groove has a depth of 0.5 mm or more. That is the main point.

(Effects) According to each of the above-mentioned inventions, a ring or a part of a ring is formed at the boundary between the portion requiring plating and the portion not requiring plating on the surface of the resin base material. The grooves are formed by laser processing as described.

By forming the grooves by the laser processing in this way, not only the grooves are formed in shape, but also the surface portions of the grooves are chemically decomposed. Therefore, even in the subsequent etching step, the surface of the base material corresponding to the groove is hardly eroded, and the catalyst nucleus is hardly formed. Therefore, no electroless plating layer is formed in the groove. That is, an electroless plating layer is formed in a portion other than the grooves on the surface of the base material.

Then, in the subsequent electroplating step, the electroless plating is dissolved in portions that do not require plating by a plating solution or the like. At the same time, electroplating is performed only on portions that require plating after electroless plating is performed. As a result, a resin product in which a plating layer is formed only on a portion requiring plating can be obtained.

According to the present invention, as in the prior art in which the grooves were formed during the molding of the mold, the grooves serve as the boundary between the plated portion and the non-plated portion. It will be. In addition, in particular, according to the invention described in claim 4, since the depth of the groove is 0.5 mm or more, the above operation is more reliably achieved.

Further, in each invention, since the groove is not formed by a mold, it is not necessary to provide a convex in the mold for forming the groove. Therefore, machining of the mold is facilitated, and the mold becomes simpler. Also, there is no need to worry about the wear of the ridges. Further, it is possible to form a groove at an arbitrary position irrespective of the mold.

In addition, according to the third aspect of the present invention,
After the electroplating step, the portion where the electroplating layer is formed is covered with a mask, and the exposed portion is painted. Therefore, the parting appearance of the painted portion and the plating layer portion is further improved.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 and 2, a plate 1 as a resin product has a disk shape, and a recess 2 is formed on the front side (the left side surface in FIG. 2). The plate 1 in the present embodiment is formed of a plate body 3 as a base material made of ABS resin, a plating layer 4 partially formed, and a portion of the surface of the plate body 3 other than the plating layer 4. And a coating layer 5 (a portion with a mesh pattern in FIG. 2). That is, on the side surface of the plate 1, a groove 6 having a substantially V-shaped cross section is formed in an annular shape. The plating layer 4 is formed in a portion surrounded by the groove 6.

As shown in FIG. 1, the plating layer 4 includes an electroless plating layer 7 and an electroplating layer 8.
In the present embodiment, the electroless plating layer 7 is formed of nickel to a thickness of about “0.3 to 0.4 μm”. The electroplating layer 8 is formed of three kinds of metals, copper, nickel, and chromium, to a thickness of about “20 to 50 μm”, for example, a strike plating layer made of nickel,
It is formed of various metals in the order of a copper plating layer, a semi-bright nickel plating layer, a bright nickel plating layer, and a chromium plating layer (all not shown).

The plating solution for forming the electroless plating layer 7 will be described below. The electroless plating solution is composed of nickel sulfate 26 g / L, ethylenediamine 90 g / L,
It contains 11 g / L of sodium hypophosphite.

Further, various plating solutions for forming each metal plating constituting the electroplating layer 8 will be described. The plating solution for forming the strike plating layer is nickel sulfate 250 g / L, nickel chloride 30
g / L and 30 g / L boric acid. The plating solution for forming the copper plating layer contains 200 g / L of copper sulfate, 50 g / L of sulfuric acid, 0.01 g / L of hydrochloric acid, and a slight amount of brightener. Further, the plating solution for forming the semi-bright nickel plating layer contains 280 g / L of nickel sulfate, 45 g / L of nickel chloride, 40 g / L of boric acid, and a trace amount of brightener. In addition, the plating solution for forming the bright nickel plating layer is nickel sulfate 240 g / L,
It contains 45 g / L of nickel chloride, 30 g / L of boric acid and trace amounts of brighteners and additives. In addition, the plating solution for forming the chromium plating layer is chromic anhydride 250
g / L, sodium silicofluoride 10 g / L, sulfuric acid 1 g /
Contains L.

Further, regarding the size of the groove 6,
For example, the width W is “0.7 mm” and the depth D is “1.2 mm”
Is formed. However, the width W is not particularly limited, but is preferably “0.3 mm” or more from the viewpoint of processing, and is preferably “1.0 mm” or less from the viewpoint of improving design. For the depth D, “0.5 mm”
It is necessary to be above. Further, for the depth D,
It is more preferably at least “0.9 mm”, and “1.
2 mm "or more is still more preferable. In the present embodiment, the groove 6 is formed by laser processing.

Next, a method of manufacturing the plate 1 configured as described above will be described. First, at the time of molding the plate body 3, a mold 11 as shown in FIG.
Is used. That is, the mold 11 includes a fixed mold 12 and a movable mold 13 provided so as to be able to contact and separate from the fixed mold 12. A cavity 14 is formed. Here, the conventional mold 51 will be described again for reference. As shown in FIG. 3B, the conventional mold 51 includes a fixed mold 52 and a movable mold 53 and a slide mold 56. , 57 as well. This is because it is necessary to form the groove at the same time as the molding of the base material, and thus it is necessary to integrally form the ridge 55 corresponding to the groove in the mold 51, but the ridge 55 has an undercut shape. This is because it was not possible to configure only one fixed mold 52 and one movable mold 53 due to the configuration. Thus, in the present embodiment, the mold 11 is very simple in its configuration.

Then, the melted ABS resin is injected and filled into the cavity 14 by a known injection molding method. Once the resin has cooled and solidified,
2 and 13 are opened, and the plate body 3 is taken out. In this way, as shown in FIG.
Is obtained.

Subsequently, laser processing is performed on the plate body 3. That is, as shown in FIG. 5, a predetermined scanning speed (for example, 1 m / min) is applied to a boundary portion between the plating layer 4 and the coating film layer 5 by using a laser processing device (for example, Seidensha Co., Ltd.) 15. A laser beam is irradiated with a predetermined output (for example, 25 W). Then, the portion irradiated with the laser beam is hollowed out in a substantially V-shaped cross section,
ABS resin undergoes chemical decomposition. More specifically, ABS
The double bond of the butadiene component of the resin is cleaved and decomposed, resulting in a decrease in molecular weight. By performing such laser processing, the above-described groove 6 having a substantially V-shaped cross section is formed in an annular shape on the side surface of the plate body 3.

Next, the plate body 3 having the grooves 6 formed thereon
Is subjected to an etching process. That is, after degreasing with acid and alkali, it is immersed in an etching solution (about 70 ° C.) containing 400 g / L of chromic acid and 200 ml / L of sulfuric acid for 7 to 15 minutes. Thereby, as shown in FIG. 6, innumerable etching marks 16 are formed on the surface of the plate body 3 except for the grooves 6. Here, the etching trace 1 is formed in the groove 6.
It is considered that the reason why the grooves 6 are not formed is that the etching solution hardly penetrates into the grooves 6 and that the portions of the grooves 6 are hardly affected by the etching solution due to the chemical change.

Further, after the plate body 3 having undergone the above etching step is neutralized, the plate body 3 is subjected to a catalyst step. Here, the catalyst step is a step of applying a catalyst core 17 for electroless plating to the etching trace 16. In the present embodiment, 0.2 g / L of palladium chloride,
Stannous chloride 50 g / L, sodium stannate 5 g / L, hydrochloric acid 35
Catalyst solution containing 0 ml / L (about 30 ° C)
The plate body 3 is immersed therein for 1 to 5 minutes. As a result, as shown in FIG. 7, catalyst nuclei 17 are provided on the etching marks 16.

Next, the plate body 3 in which the catalyst nucleus 17 is provided on the etching mark 16 is immersed in an electroless plating solution to perform electroless plating. At this time, as shown in FIG. 8, the surface of the plate body 3 corresponding to the groove 6 is not etched and the catalyst nucleus 17 is not provided. Plating layer 7
Is not formed. In other words, the electroless plating layer 7 is formed on all portions of the surface of the plate body 3 except for the portions where the grooves 6 are formed.

Further, as shown in FIG. 9, the plate body 3 on which the electroless plating layer 7 is formed is subjected to electroplating. More specifically, the electroplating step includes a plurality of steps such as a strike plating step, a copper plating step, a semi-bright nickel plating step, a bright nickel plating step, and a chromium plating step. That is, the plate body 3 is immersed a plurality of times in each of the above-described predetermined electroplating solutions, and a portion requiring plating in the plating solution is electrically conducted.

Then, the electroless plating layer 7 formed in a portion not requiring plating is dissolved by the electroplating solution (right side in FIG. 9). Further, in portions requiring plating, the electroplating layer 8 having the above-described multilayer structure is formed on the surface of the electroless plating layer 7. In this way, the plate body 3 on which the electroless plating layer 7 and the electroplating layer 8 (plating layer 4) are formed only in a portion requiring plating is obtained.

Thereafter, as shown in FIG.
Is formed with an electroformed mask 18. The portion not covered with the electroformed mask 18 is exposed, and spray coating is applied to the exposed portion. By this coating, the coating film layer 5 is formed at a necessary portion of the coating film. In the drawings, some of the electroless plating layers 7, the electroplating layers 8, the coating layers 5, the grooves 6, the etching marks 16, and the like are drawn larger than the actual ones for convenience of explanation.

After the coating layer 5 is formed, the coating of the electroformed mask 18 is released to obtain the final resin product plate 1 as shown in FIG. next,
The operation and effect of the present embodiment will be described.

According to the present embodiment, the annular groove 6 is formed at the boundary between the portion requiring plating and the portion not requiring plating on the surface of the resin plate body 3.
Are formed by laser processing. By forming the grooves 6 by the laser processing in this way, not only are grooves formed simply in shape, but also the surface portions of the grooves 6 are chemically decomposed. Therefore, thereafter, the portion is not subjected to the etching and the catalyst nucleus is not provided, so that the electroless plating layer 7 is not formed. Therefore, in the subsequent electroplating step, the electroless plating layer 7 is dissolved by the plating solution in the portion not requiring plating, and the electroplating layer 8 is formed only in the portion requiring plating. Therefore, plating can be partially applied only to a portion requiring plating.

According to the present embodiment, similarly to the prior art in which the grooves are formed during the molding of the mold, the grooves 6 serve as the boundary between the plated portion and the non-plated portion. Clearing is clear. In particular, according to the present embodiment, since the depth of the groove 6 is relatively deep as “1.2 mm”, the above-described operation and effect can be more reliably achieved.

In addition, according to the present embodiment, after the electroplating step, the portion where the electroplating layer 8 is formed is covered with the electroformed mask 18 and the exposed portion is painted. Therefore, the appearance of the boundary between the coating layer 5 and the plating layer 4 can be improved.

Further, in the present embodiment, the groove 6 is
Since it is not formed by a mold, it is not necessary to provide a protrusion on the mold 11 for forming the groove 6.
Therefore, processing of the mold 11 is facilitated, and simplification can be achieved accordingly. In addition, since a slide mold or the like, which is conventionally required by forming a convex strip, is not required, the mold 11 can be simplified in this respect. As a result, the cost can be drastically reduced.

There is no need to worry about wear of the ridges. As a result, the durability of the mold 11 can be improved. In addition, irrespective of the mold 11, the groove 6 can be formed at an arbitrary portion by laser processing. As a result, the degree of freedom of the product shape and the plating shape can be increased.

It should be noted that the present invention is not limited to the above-described embodiment, and may be carried out as follows by appropriately changing a part of the configuration without departing from the spirit of the invention. (1) In the above embodiment, the present invention is embodied in a disk-shaped plate 1. For example, a front grill for a vehicle,
It may be embodied as an outer cover for a door mirror bracket, a back panel for a vehicle, a louver for a vehicle, a pillar garnish for a vehicle, a quarter vent for a vehicle, a mark plate, or the like. Further, the present invention is not limited to the above resin products, and the present invention may be embodied in other resin products having a plating layer partially.

Further, the present invention may be embodied without a coating layer. (2) In the above embodiment, the ABS resin is used as the resin material constituting the base material. However, for example, polypropylene, polyphenylene oxide, polyamide,
Various resin materials such as polysulfone and polyester may be used.

(3) In the above embodiment, the electroless plating layer 7 is formed of nickel, but may be formed of copper or the like. Further, in the above-described embodiment, the electroplating layer 8 is formed of a three-layered metal of copper, nickel, and chromium so as to form a multilayer structure. However, other metals may be used. The present invention may be embodied when the structure is not used.

(4) In the above embodiment, before the formation of the strike plating layer, the electroless plating layer 7 in the unnecessary portion of plating is dissolved by using a predetermined solution (for example, an aqueous ammonia solution). You may do so.
In this case, in the subsequent electroplating step, unnecessary electroless plating layer 7 is prevented from being dissolved in the plating solution, and contamination of the plating solution can be prevented.

[0043]

As described above in detail, according to the partially plated resin product and the method of manufacturing the same of the present invention, the appearance quality is improved when the partially plated resin product is obtained. Thus, the present invention has an unprecedented excellent effect that the manufacturing cost can be reduced, the degree of freedom of the product shape and the plating shape can be increased, and the mold for forming the base material can be simplified.

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view of a partially plated plate according to an embodiment of the present invention.
Sectional view on the AA line of FIG.

FIG. 2 is a perspective view showing a plate.

FIG. 3A is a cross-sectional view illustrating a mold according to the present embodiment, and FIG. 3B is a cross-sectional view illustrating a mold according to the related art.

FIG. 4 is a perspective view showing a plate body.

FIG. 5 is a perspective view showing a state where laser processing is performed on the plate body.

FIG. 6 is an enlarged sectional view showing a state where the plate body is etched.

FIG. 7 is an enlarged sectional view showing a state where a catalyst nucleus is provided.

FIG. 8 is an enlarged sectional view showing a state where electroless plating is performed.

FIG. 9 is an enlarged cross-sectional view showing a state where electroplating is performed.

FIG. 10 is an enlarged cross-sectional view showing a state in which painting is performed.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Plate as a resin product, 3 ... Plate body as a base material, 4 ... Plating layer, 5 ... Coating layer, 6 ... Groove, 7 ...
Electroless plating layer, 8: electroplating layer, 11: mold, 15
... Laser processing equipment.

Claims (4)

[Claims] 1. A method according to claim 1, wherein, on the surface of the resin base material, a groove is formed in an annular shape at a boundary between a portion requiring plating and a portion not requiring plating, and After applying electroless plating, by applying electroplating to a portion requiring plating, a resin product having a plating layer formed only on a portion requiring plating on the surface of the base material, The groove is formed by laser processing, wherein the resin product is partially plated. 2. A groove formed by laser processing so as to form an annular shape at a boundary portion between a portion requiring plating and a portion not requiring plating on the surface of a resin base material. A forming step, an etching step of etching a portion of the surface of the base material other than the grooves, a catalyst nucleus providing step of providing a catalyst nucleus to a portion on which the etching is performed, and An electroless plating step of forming an electroless plating layer in a portion other than the groove, and, of the electroless plating layer formed on the base material that has undergone the electroless plating step, electrically necessary portions of the electroless plating layer are plated. An electroplating step of forming an electroplating layer on a portion of the electroless plating layer where plating is required by conducting the electroplating layer, a method of manufacturing a partially plated resin product. 3. The method according to claim 2, further comprising, after the electroplating step, a coating step of coating a portion where the electroplating layer is formed with a mask and coating the exposed portion. Method for manufacturing resin products with partial plating. 4. The method according to claim 2, wherein the groove has a depth of 0.5 mm or more.