KR101957443B1 - Process for plating a nonmetal with realizing multicoloured pattern - Google Patents

Abstract

The present invention relates to a plating process which can embody a multicolored pattern. A plating process which can embody a multicolored pattern is applied to production of a component part of a vehicle or a garnish, thereby embodying a three-dimensional pattern and two or more colors. Therefore, emotional quality is satisfied, thereby producing a high value-added product and achieving industry advancement.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of plating a plastic material having a multi-

The present invention can be applied to a multi-color pattern which allows a high-value-added product and an industrial advancement to be promoted by satisfying a sensibility quality by applying a plating method that can realize a multi-color pattern to the manufacture of automobile interior parts and garnishes, To a plating method capable of realizing plating.

Generally, emotional quality of automobile interior parts is very important because of the improvement of the conscious level and requirement of the consumer, and various types of materials and construction methods are applied for this purpose.

For example, there are glazes, glazed luster with operation panel, metal finishing trim of functional parts / panel parts, and contrast of color feeling with the interior color of the automobile parts. And the like.

In addition, the plating process is used for various parts used in automobiles, and garnish parts and door inside handles of a crash pad passenger seat are typically applied.

Korean Patent No. 1394968 discloses a technique of forming a metal pattern on a metal substrate. After forming a metal ink layer on the metal substrate, a laser is irradiated to remove the metal ink layer, .

However, the method of forming a metal pattern is not applicable to a plastic substrate due to the deterioration due to a laser, and a layer for implementing a laser pattern is formed by vacuum deposition or patterning in a metal layer on a metal ink layer. There is a disadvantage in that lifting occurs between the metal layer and the pattern.

Korean Patent No. 964574 discloses a technique of laser color marking on the surface of a metal material. The composition of the laser color marking method is disclosed in, for example, Korean Patent No. 964574, which discloses a method of forming a vapor deposition layer on a surface of a metal material by vacuum evaporation, A laser is irradiated to the deposition layer to cause the deposition layer to be discolored due to heat generated by the laser, so that various characters and graphics can be marked on the surface of the metal material in color.

However, in the case of the above patent, there is a problem of mass production and cost competitiveness by applying a clear coating after transferring a pad, or a method of injecting a color after forming a pattern with an engraved pattern, in order to form a multi- The number of working hours increases and it is not suitable for mass production.

It is an object of the present invention to overcome the above-mentioned problems of the prior art by providing a method of manufacturing a multi-color pattern in which an automotive interior part can be applied to an automobile interior part by developing a plating technique, And to provide a plating method that can be implemented.

In addition, due to the fact that the color change of steel occurs depending on the temperature, the use of the phenomenon that the nickel layer reacts to the energy region of the laser and causes the color change. The use of the multicolor pattern to realize a smooth three- And to provide a possible plating method.

In order to achieve the above-described object, the present invention provides a method of forming a decorative layer having a predetermined pattern on a surface of a non-conductive plastic, forming an electroplating layer having conductivity on the surface of the plastic including the decor layer, ; And a step of forming a plating layer having different colors by irradiating laser beams of different intensities to the electroplating layer of the pattern, respectively.

The electroplating layer of the present invention comprises a chemical plating layer for imparting conductivity to the upper side of the ABS resin layer, a CU layer for acting as a buffer for the metal and the ABS resin layer, a semi-glossy NI layer for improving corrosion resistance and corrosion, And a multilayer pattern composed of a glossy NI layer for imparting corrosion resistance, an MP-NI layer for dispersing a corrosion current, and a Cr layer for reducing corrosion resistance and abrasion resistance.

In addition, the electroplating layer of the present invention can be applied to a chemical plating layer having an order of etching, reduction, active 1 plating, active 2 plating and nickel plating

Copper plating, copper plating, copper sulfate plating, semi-gloss nickel plating, glossy nickel plating, MP nickel plating and chromium plating.

The etching conditions were as follows: CrO ₃ : 380 to 420 g / l, H ₂ SO ₄ : 200 to 240 ml / l, Cr ⁺³ : 25 g / 20 to 30 sec and the active 1 condition is 40 to 70, acidity is 250 to 350 ml / l, temperature is 24 to 32 ° C, time is 150 to 162 sec, Ni: ^{2 to} 3.5 to 5.5 g / l, Ph: 8.5 to 9.3, temperature: 26 to 33 ° C, time: 630 to 650 sec, copper plating conditions: CuSO ₄ : 180 to 220 g hour, 1920 to 3600 sec, semi-glossy nickel plating conditions NiSO ₄ : 260 to 300 g / l, NICl ₂ : 1, H ₂ SO ₄ : 60 to 80 g / 60 to 300 g / l of NiSO ₄ , and 40 to 50 g / l of H ₂ BO _3, 45 to 55 g / l of H ₃ BO ₃ , 50 to 60 ° C of temperature, 840 to 1560 sec of time, , NICl ₂ : 40 to 50 g / l H ₂ BO ₃ 45 to 55 g / l Temperature 50 to 60 ° C Time 840 to 1560 sec Ph Phosphorus 4.1 to 4.5 MP Nickel plating NiSO ₄ 260 to 300 g / , NICl ₂ : 60 to 210 sec, Ph: 4.4 to 4.8, chromium plating conditions are 210 to 270 g / l of CrO ₃ , 40 to 50 g / l of H ₃ BO _3, 45 to 55 g / _{H 2 SO 4: 0.4 ~ 1,4} g / l, temperature: 30 ~ 40 ℃, time: is carried out under the condition of 150 ~ 240 Sec copper thickness 20 ~ 30㎛, chrome plating thickness 20 ~ 30㎛, nickel plating thickness 10 to 15 占 퐉.

The color may be a multicolor color that is determined by a combination of any one of the intensity of the laser, the frequency of use, and the marking speed, which is measured when the laser is irradiated on the electroplating layer located at a predetermined focal distance, And provides a plating method capable of implementing a pattern.

In addition, the color may be formed by varying the depth of the pattern so that the relative focal distance of the laser irradiated at the same distance is changed, or by varying the focal length of the laser on a pattern formed on the same plane. And provides a plating method capable of implementing a pattern.

There is provided a plating method capable of realizing a multicolor pattern in which a surface coating process is further performed on the upper side after etching by the laser.

Industrial Applicability As described above, according to the present invention, a plating technique that can realize a pattern of multiple colors in an automobile interior part is developed and applied to automobile interior parts, thereby promoting high value-added products and industrial advancement.

In addition, it is possible to realize a multicolor pattern that allows the surface to be smooth and realize three-dimensional solidity.

1 is a flowchart showing a plating process capable of realizing a multicolor pattern according to the present invention.
2 is a flowchart showing a plating process for pretreatment according to the present invention.
FIGS. 3 and 4 are respectively a sectional view and a plating state showing a pretreated plastic part according to the present invention.
Fig. 5 is a diagram showing the state of the plating layer in the laser irradiation according to the present invention. Fig.
6 is a color change chart of the plating layer according to the laser irradiation measured under a predetermined condition according to the present invention.
7 is a cross-sectional view illustrating a pre-processed plastic part according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention is characterized in that when an electroplating layer (200) laminated on a material 100 made of a plastic material such as ABS resin is supported in a plating rack supported by a jig while being installed in a plating vessel, (Ni ⁺² ), a chromium plating solution (Cu ⁺² ), a nickel plating solution (Ni ⁺² ), and a chromium plating solution are formed on the inner surface of the plating tank. Cr ^{+ 6} ) is attached to the surface of the material to perform the plating process.

Specifically, first, a material made of a non-conductive plastic material is prepared. (S100)

In addition, the decor layer 110 is formed on the surface of the work 100 by a predetermined pattern,

At this time, it is not necessary to form any unevenness on the surface of the material, and the decor layer 110 may be separately provided on the surface formed on the material.

Then, an electroplating layer 200 having conductivity and including a nickel plating layer is formed on the surface of the plastic including the decor layer 110 (S300)

At this time, the nickel plated layer reacts to the irradiation of the laser, thereby realizing a different color depending on the intensity of the laser.

Subsequently, the plating layers having different colors are formed by irradiating laser beams having different intensities to the decor layer 110, which are formed in a predetermined pattern and are separated from each other, as described above (S400)

In addition, a surface coating process may be further performed on the upper side after etching by the laser. (S500)

The electroplated layer 200 of the present invention includes a chemical plating layer 210 for imparting conductivity to the upper side of the ABS resin layer, a copper plating layer 231 for buffering the metal and the ABS resin layer, A multilayer structure of a semi-polished NI plating layer 233 for polishing the surface of the substrate 231, a polished NI plating layer 235 for imparting luster and corrosion resistance, an MP-NI layer 237 for dispersing corrosion current, and a Cr plating layer 239 for corrosion resistance and abrasion resistance .

At this time, the copper plating layer 231, the semi-polished NI plating layer 233, the polished NI plating layer 235, the MP-NI layer 237, and the Cr plating layer 239 are formed in the electroplating line 230.

In addition, the chemical plating layer 210 has an order of etching 211, reduction 213, active 1 plating 215, active 2 plating 217, and nickel plating 219.

The etching conditions applied to the chemical plating layer are: 380 to 420 g / l of CrO ₃ , 200 to 240 g / l of H ₂ SO ₄ , 25 g / l of Cr ⁺³ , 60 to 70 ° C, 560 to 600 sec and the reduction time condition is 20 to 30 sec and the activity 1 condition is a color of 40 to 70, an acidity of 250 to 350 ml / l, a temperature of 24 to 32 ° C, a time of 150 to 162 sec , Ni: ² : 3.5 to 5.5 g / l, Ph: 8.5 to 9.3, temperature: 26 to 33 占 폚, time: 24 to 32 占 폚, : 630 ~ 650 Sec.

The copper plating conditions applied to the electroplating line include CuSO ₄ : 180 to 220 g / l, H ₂ SO ₄ : 60 to 80 g / l, Cl ^- : 50 to 100 g / 1920 to 3600 sec, semi-bright nickel plating conditions are NiSO ₄ : 260 to 300 g / l, NICl ₂ : 40 to 50 g / l, H ₃ BO ₃ 45 to 55 g / l, temperature 50 to 60 ° C, time 840 to 1560 sec, Ph 4 to 4.4 and polished nickel plating conditions NiSO ₄ : g / l, NICl ₂ : The MP nickel plating conditions were NiSO ₄ : 260, H ₂ BO ₃ : 45 to 55 g / l, temperature: 50 to 60 ° C, time: 840 to 1560 sec, Ph: ~ 300 g / l, NICl ₂ : 60 to 210 sec and Ph of 4.4 to 4.8 and the chromium plating conditions were CrO ₃ : 210 to 60 g / l, H ₃ BO ₃ : 45 to 55 g / 270 g / l, H ₂ SO ₄ : 0.4 to 1.4 g / l, temperature: 30 to 40 ° C, and time: 150 to 240 sec.

At this time, when the plating process is performed under the above conditions, the copper plating thickness is 20 to 30 탆, the chrome plating thickness is 20 to 30 탆, and the nickel plating thickness is 10 to 15 탆.

That is, in the chemical plating layer, the solution containing the oxidizing agent by the etching condition elutes the butadiene among the ABS components of the specimen to give the adhesion of the plating, and the nicked liquid of the hexavalent chromium component adhering to the surface of the material upon reduction The catalyst is reacted with the catalytic metal to activate the electroless plating to adsorb palladium and tin on the surface, and in the active 2 condition, the Sn component in the catalyst layer is dissolved The Pd layer is activated to smooth the electroless plating layer, and in the nickel plating process, metal nickel is precipitated in the catalyst layer to perform electroplating, thereby imparting conductivity.

The electroplating line is designed to impart gloss through copper plating and provide cushioning against external impacts, to block corrosion of the Cu layer through a semi-bright nickel layer, Corrosion resistance is provided, and the fine particles are formed through the MP nickel layer to block the corrosion of the Cr layer, and the chrome plating layer is provided to give a brilliant appearance and abrasion resistance of the plating.

 5, the color formed on the electroplating layer of the work is a combination of any one of the intensity of the laser, the frequency of use, and the marking speed, which is measured when the laser is irradiated on the electroplating layer located at a predetermined focal distance To be determined by the color of the predetermined color table.

At this time, the color table was derived by a repeated experiment of the same condition by the applicant of the present invention.

In addition, the color may be formed of one selected from the group consisting of different depths of the pattern so that the relative focal distance of the laser irradiated at the same distance is changed, or a configuration in which the focal distance of the laser is changed in a pattern formed on the same plane good.

That is, the color formed by the irradiation of the laser can be arbitrarily selected by adjusting the laser intensity, the frequency, and the marking speed at the focal distance of the laser, and the desired color can be realized by the above-described method .

Subsequently, the surface coating layer 300 is further formed on the upper side of the wafer after the etching by the laser, so that the surface of the plating layer is protected while obtaining a beautiful surface from the outside.

The operation of the present invention constructed as described above will be described.

As shown in FIGS. 1 to 6, in the present invention, a nickel plated layer provided inside the electroplating layer 200 causes color change due to reaction with a laser, in a material 100 plated with a multi-color pattern using a laser Is used.

That is, when the nickel plating layer is irradiated with the laser energy differently, the nickel plating changes into various colors to realize different color patterns.

In addition, according to the above-described method, since no pattern is formed on the surface, defects due to chemicals, friction or the like are unlikely to occur, a three-dimensional effect can be realized according to the pattern shape, and the pattern itself is formed into a concave- .

In addition, the present invention realizes color based on the phenomenon that the color changes depending on the laser frequency, and keeps the coating of the electroplating layer constant to prevent surface damage due to laser heat.

That is, the laser irradiation distance, the frequency region, and the like are optimized according to the color formed by the irradiation of the laser to achieve a certain color, and the laser irradiation distance, frequency, intensity, A plating process with high reliability is performed by applying the plating process according to the above table.

In addition, the plating process for uniformizing the coating film thickness was optimized in the process of performing the plating, and the limitation of the amount of the plating solution, the temperature and the time, and the acidity of the plating solution provided above was found to be optimum by repeated experiments of the applicant According to the present invention, the copper plating thickness is 20 to 30 占 퐉, the chromium plating thickness is 20 to 30 占 퐉, and the nickel plating thickness is 10 to 15 占 퐉.

That is, the plating thickness as described above is derived by repeated experiments of the applicant, and when such a condition is applied, lifting of the plating layer is prevented by irradiation with the laser, thereby enhancing the stability of the product.

In addition, the above electroplating line repeats the process of attaching a plastic injection material as a raw material to a rack and immersing it in a plating liquid. At this time, a current difference is generated depending on the rack position, which causes a difference in plating thickness.

At this time, the nickel layer in the plating layer reacts with the laser, and if the plating thickness is not uniform, the laser irradiation distance is changed to react with the copper layer at the bottom of the nickel layer or the chromium layer at the top, Or peeling occurs between the coating layer and the plastic article due to energy aggregation.

The present invention makes it possible to achieve a desired uniform color by uniformly maintaining the thickness of the coating at the position where the pattern is intended to be implemented irrespective of the position of the rack.

At this time, since the plating layer is expected to be peeled off at a temperature of 95 캜 or higher due to the characteristics of the plastic substrate, the material can be obtained by changing the material.

In addition, as shown in FIGS. 3 and 7, the color of the above-described color is formed by forming a decor layer having a pattern having concavo-convex patterns on the material, forming an electroplating layer on the decor layer, It is possible to realize a decor layer having colors different from each other by realizing different colors or by forming an electroplating layer on the same plane without forming any irregularities on the surface of the material will be.

100 ... Material 110 ... Deco floor
200 ... Electroplating layer 210 ... Chemical plated layer
230 ... electroplating line

Claims (7)

A decor layer formed of a predetermined pattern on the surface of the non-conductive adult plastic,
Forming an electroplating layer having a conductivity including a nickel plating layer on a surface of the plastic including the decor layer;
And irradiating the pattern with lasers of different intensities to form a plating layer having different colors,
The electroplating layer includes a chemical plating layer having an order of etching, reduction, active 1 plating, active 2 plating, and nickel plating so as to impart conductivity to the upper side of the ABS resin layer,
Copper plated layer that acts as a buffer for metal and ABS resin layers, Semi-polished NI plating layer for corrosion resistance and corrosion, Glossy NI plating layer for gloss and corrosion resistance, MP-NI plating layer for dispersing corrosion current, Corrosion resistance and wear resistance And an electroplating line having a sequence of a Cr-plated layer having a predetermined thickness,
The etching conditions of the plating layer were as follows: CrO ₃ : 380 to 420 g / l, H ₂ SO ₄ : 200 to 240 ml / l, Cr ⁺³ : 25 g / l, temperature: 60 to 70 ° C, The temperature of the active 2 is 24 to 32 ° C. The temperature of the active 2 is 40 to 70, the acidity is 250 to 350 ml / l, the temperature is 24 to 32 ° C, , time: 130 ~ 150 Sec, nickel plating conditions are ^{Ni +2: 3.5 ~ 5.5g / l} , Ph: 8.5 ~ 9.3, temperature: 26 ~ 33 ℃, time: 630 ~ 650 Sec, copper plating condition CuSO _4: 180 And NiSO ₄ : 260 to 300 g / l, NICl ₂ : 220 g / l, H ₂ SO ₄ : 60 to 80 g / 60 to 300 g / l of NiSO ₄ , and 40 to 50 g / l of H ₂ BO _3, 45 to 55 g / l of H ₃ BO ₃ , 50 to 60 ° C of temperature, 840 to 1560 sec of time, , NICl ₂ : 40 to 50 g / l H ₃ BO ₃ 45 to 55 g / l Temperature 50 to 60 ° C Time 840 to 1560 sec Ph Phosphorus 4.1 to 4.5 MP Nickel plating NiSO ₄ 260 to 300 g / , NICl ₂ : 60 to 210 sec, Ph: 4.4 to 4.8, chromium plating conditions are 210 to 270 g / l of CrO ₃ , 40 to 50 g / l of H ₃ BO _3, 45 to 55 g / _{H 2 SO 4: 0.4 ~ 1,4} g / l, temperature: 30 ~ 40 ℃, time: is carried out under the condition of 150 ~ 240 Sec copper thickness 20 ~ 30㎛, chrome plating thickness 20 ~ 30㎛, nickel plating thickness A plating method capable of realizing a multicolor pattern satisfying 10 to 15 占 퐉. delete delete The color display device according to claim 1, wherein the color is determined by a color of a predetermined color table by a combination of any one selected from a laser power, a frequency of use, and a marking speed, which is measured when the laser is irradiated onto an electroplating layer positioned at a predetermined focal length. Wherein the plating layer is formed on the substrate. 2. The color display device according to claim 1, wherein the color is formed such that the depth of the decor layer is differently set so that the relative focal distance of the laser irradiated at the same distance is changed,
And a configuration in which the focal length of the laser is changed by changing the focal length of the laser on a decor layer formed on the same plane. The plating method according to claim 1, wherein the step of forming a surface coating layer is further performed on the upper side of the color after the laser is irradiated. delete

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