JP3104555B2 - Partial plating method for resin products - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for partial plating of a resin product in which a plating layer is formed only on a portion of the surface of a resin base material which requires plating.

[0002]

2. Description of the Related Art Conventionally, as this kind of technology, for example, those disclosed in Japanese Patent Publication No. 45-37843 (first prior art) and Japanese Patent Publication No. 48-16987 (second prior art) are disclosed. Are known.

As a plating method to which the first prior art is applied, for example, as shown in FIG. 31, a base material in which a groove (notch) 81 having a substantially V-shaped cross section is formed in an annular shape by die molding. The main body 82 is formed, and the base body 82 is subjected to electroless plating. At this time, plating is difficult to be performed on the bottom portion 81a of the groove 81 because the gap is narrow, and the electroless plating layer 83 is formed on all parts except these. Next, the base body 8 on which the electroless plating layer 83 is formed
2 is subjected to electroplating. The electroplating step includes a multi-step process such as a strike plating step, a copper plating step, a nickel plating step, and a chromium plating step.
Then, as shown in FIG. 32, in these series of electroplating steps, the electroless plating layer 83 formed in a portion not requiring plating is gradually dissolved by the electroplating solution in each step (FIG. 32). To the right). On the other hand, in a portion requiring plating, an electroplating layer 84 made of various metal plating layers is sequentially formed on the surface of the electroless plating layer 83 by energization (left side in the figure). In this way,
A plating layer 85 including an electroless plating layer 83 and an electroplating layer 84 is partially formed on the surface of the base body 82.

On the other hand, as a plating method to which the second prior art is applied, for example, as shown in FIG. 33, first, a base material body 91 is formed by molding. A resist paint composed of a polymer compound solution whose surface is unlikely to be roughened is applied onto the base material body 91. By this coating, a resist coating layer 92 is formed in a ring shape on a portion of the base material body 91 that does not require plating. Next, the base body 91 is subjected to electroless plating. At this time, since the surface of the resist coating layer 92 is hardly roughened, plating is hardly performed, and the electroless plating layer 93 is formed on all parts except the resist coating layer 92. Next, as shown in FIG.
Electroplating is performed in the same manner as above, and the electroplating layer 94 is formed.
Is formed (left side in the figure). In addition, the electroless plating layer 93 formed in a portion that does not require plating is gradually dissolved by the electroplating solution in each step (right side in the figure). Also in this way, a resin product in which a plating layer 95 composed of an electroless plating layer 93 and an electroplating layer 94 is partially obtained is obtained. Further, in this technique, since the resist coating layer 92 is not formed on the entire surface where plating is not required, workability and cost can be reduced accordingly.

[0005]

By the way, in each of the above-mentioned prior arts, during a series of electroplating steps, the electroless plating layer 83,
93 should be gradually dissolved by the acidic electroplating solution in each step. However, in the electroplating solution, a phenomenon called “bipolar phenomenon” occurs. This is because the electroless plating layers 83 and 93 having conductivity formed in portions where plating is not required.
And an electroplating solution, and a potential difference is generated. The length of the electroless plating layers 83 and 93 formed in the portions that do not require plating (generally, the conduction distance of the portions of the base materials 82 and 91 that do not require plating as shown in FIG. 35) is large. This phenomenon becomes stronger as the potential difference becomes larger as the potential increases. This "bipolar phenomenon" means that the electroless plating layers 83 and 93 do not melt at the place where the potential with respect to the cathode is higher than the electroless plating layer potential. Metal ions are deposited.

For this reason, when the substrate bodies 82 and 93 are large, the area of a portion that does not require plating tends to be large. In such a case, as shown in FIG. 36, even if the electroless plating layers 83 and 93 are insulated by the groove 81 or the resist coating layer 92 as shown in FIG.
There was a risk that plating would be formed on portions that did not require plating. In other words, due to the “bipolar phenomenon”, metal ions in the electroplating solution are deposited on the portions where the electroless plating layers 83 and 93 elute (the portions close to the grooves 81 and the like) and on the electroless plating layers 83 and 93. Part (slot 81
The center part of the part that does not need plating, away from etc.)
And occur together. Therefore, after the electroplating process is completed, the central portion of the portion that does not require plating is
In some cases, a strong acid of each electroplating solution formed a film thickness that could not be completely dissolved, and the plating remained. Further, as shown in FIG. 38, it has been derived from the experimental results that the thickness of the plating added at this time increases with an increase in the conduction distance of a portion not requiring plating. As a result, there was a possibility that a desired partially plated product could not be obtained. Further, even if it is attempted to apply a coating thereon, the coating did not adhere well, and the appearance quality was poor, and even if the coating adhered, there was a problem in durability.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to prevent plating from being applied to a portion not requiring plating, thereby improving the appearance quality. Another object of the present invention is to provide a method of partially plating a resin product which can improve the durability of a coating film when the coating is applied.

[0008]

In order to achieve the above object, according to the first aspect of the present invention, a portion of the surface of a resin substrate that requires plating and a portion that does not require plating are provided. A first electroless plating avoiding means forming an annular shape, a first electroless plating avoiding means for preventing the formation of an electroless plating layer, An electroless plating step of forming an electroless plating layer on at least a portion other than the first electroless plating avoidance means, and plating among the electroless plating layers formed on the base material after the electroless plating step. A required portion of the electroless plating layer, an electroplating step of forming an electroplating layer on the required portion of the electroless plating layer, a method for partial plating of a resin product, Electroless plating In the previous stage, by forming a second electroless plating avoiding means at least on a part not requiring plating surrounded by the first electroless plating avoiding means, a part not requiring the plating can be formed. The first electroless plating is divided into at least two parts;
To be surrounded by the avoiding means and the second electroless plating avoiding means
The area of the parts that do not require
Requires plating surrounded by the first means for avoiding electroless plating
The gist of the invention is to make the area smaller than the area or the longest conduction distance of the portion not to be used.

[0009]

Further, according to the invention described in claim 2 , in the invention described in claim 1, the second electroless plating avoiding means is at least any two points of the first electroless plating avoiding means. The gist of the invention is that it is formed to connect

[0011] In addition, in the invention according to claim 3, in the invention described in claim 2, wherein the second electroless plating avoidance means is in its gist in that it has a crossing itself .

[0012] In addition, in the invention according to claim 4, in the invention described in claim 1, wherein the second electroless plating avoidance means is made form the annular within the portion not requiring plating The main point is that

Further, in the invention according to claim 5 , the invention according to any one of claims 1 to 4 ,
The electroplating process is electrically conductive wherein the first stage electroplating process for forming a strike plated layer on necessary portions of the plating on the electroless plating layer, the strike plating layer formed on the front Kimoto material by being composed of a second-stage electroplating process for forming a common electroplating layer comprising a plurality of metal plating to the strike plating layer Rutotomoni, before
Between the first stage electroplating process and the second stage electroplating process
Requires immersion of the substrate in a given solution and plating
And dissolve the electroless plating layer in the part
The gist of the present invention is that it further includes a deplating and melting step .

[0014]

According to the first aspect of the present invention, in the first electroless plating avoiding means forming step, a portion of the surface of the resin base material which requires plating and a portion which does not require plating. The first electroless plating avoiding means for preventing the formation of the electroless plating layer is formed at a boundary portion between the ring and the ring so as to form a ring or a part of the ring. In the electroless plating step, an electroless plating layer is formed on the surface of the base material other than the first electroless plating avoiding means. Further, after the electroless plating step, in the electroplating step, of the electroless plating layer formed on the base material, a necessary portion of the electroless plating layer is electrically conducted, and the plating on the electroless plating layer is performed. An electroplating layer is formed in a necessary part. At this time, the electroless plating layer which has been basically formed in a portion that does not require plating is gradually dissolved by the solution for electroplating. Therefore, finally, a resin product is obtained in which only the portions requiring plating are partially plated.

In the electroplating step, a so-called "bipolar phenomenon" occurs in portions where plating is not required. The degree of this "bipolar phenomenon" is
The larger the area of the portion surrounded by the electroless plating avoidance means and which does not require plating or the longer the maximum conduction distance, the larger. In other words, in the above configuration only, if the area of the portion not requiring plating surrounded by the first electroless plating avoidance means or the longest conductive distance is large, the portion not requiring plating is plated due to the "bipolar phenomenon". May easily remain.

However, in the present invention, prior to the electroless plating step, the second electroless plating avoiding means is formed at least in a portion surrounded by the first electroless plating avoiding means and which does not require plating. Is done. Then, by the second electroless plating avoiding means, a portion surrounded by the first electroless plating avoiding means and not requiring plating is divided into at least two parts. For this reason, the area or the longest conduction distance of the portion not requiring plating surrounded by the first and second electroless plating avoidance means is reduced by the portion not requiring plating surrounded by the first electroless plating avoidance means. Will be smaller than that of For this reason, the potential difference between the electroless plating layer having electroconductivity and the electroplating solution formed in portions that do not require plating is relatively small, and the "bipolar phenomenon" is unlikely to occur. .

[0017]

Further, according to the invention described in claim 2 ,
In addition to the effects of the invention described in claim 1, the second electroless plating avoidance means is formed to at least connecting any two points of the first electroless plating avoiding means. For this reason,
The first and second electroless plating avoidance means correspond to the distance from the point farthest from the first electroless plating avoidance means to the first electroless plating avoidance means among the portions not requiring plating. The distance from the point furthest from the first to the first and second means for avoiding electroless plating surely decreases.

According to the third aspect of the present invention,
In addition to the function described in claim 2 , the second electroless plating avoiding means has its own intersection. Therefore, the first
Further, the distance from the point farthest from the second electroless plating avoiding means to the first and second electroless plating avoiding means is further reduced. Therefore, the "bipolar phenomenon"
Is even less likely to occur.

In addition, according to the fourth aspect of the present invention,
In addition to the effects of the invention described in claim 1, the second electroless plating avoidance means is made form the annular within the portion not requiring plating. Therefore, the same operation as the operation described in claim 2 is achieved.

According to the fifth aspect of the present invention, in addition to the functions of the first to fourth aspects of the present invention, in the first stage electroplating step in the electroplating step, the electroless plating layer A strike plating layer is formed in a portion requiring plating. At this time, as described above, since the “bipolar phenomenon” is unlikely to occur, it is possible to suppress the deposition of metal ions in the strike plating solution on portions that do not require plating.

In the electroless plating melting step, the first
The base material having undergone the step electroplating step is immersed in a predetermined solution to dissolve the electroless plating layer in a portion not requiring plating. At this time, the strike plating layer is not dissolved, or even if dissolved, the portion of the strike plating layer is thicker than the other portion, so the plating on the surface of the substrate requires plating. The electroless plating layer formed only on the critical portion and the strike plating layer formed thereon remain. In addition, since precipitation of metal ions in the strike plating solution is suppressed on the electroless plating layer formed in other portions, in the dissolving step, the electroless plating layer in a portion that does not require plating is used. Is reliably dissolved.
Therefore, no plating other than the strike plating layer is exposed on the base material.

Subsequently, in the second stage electroplating step,
The strike plating layer formed on the substrate having undergone the electroless plating melting step is electrically conducted, and a general electroplating layer made of a plurality of metal platings is formed on the strike plating layer. At this time, the portions of the electroless plating layer that do not require plating have already been dissolved and do not exist at these times. Therefore, in the second-stage electroplating step, the electroless plating layer is not dissolved in each plating solution.

Further, since the electroless plating layer is not exposed in a portion not requiring plating, a general electroplating layer or the like is not formed in a portion not requiring plating.

[0025]

【Example】

(First Embodiment) FIGS. 1 to 10 show a first embodiment in which the present invention is embodied in a vehicle back panel 1 as a resin product.
It will be described based on.

A back panel 1 as shown in FIG. 1 is attached to the rear portion of the vehicle where a license plate is attached. This back panel 1 is formed in a substantially box shape. The back panel 1 includes a back panel main body 2 (see FIGS. 5 and 6) as a base material made of an ABS resin, and a plating layer formed in a substantially rectangular shape on a part of the design surface (the end of the peripheral portion). 3 (the portion with the mesh pattern in FIG. 1);
Coating layer 4 applied and formed on inner and outer surfaces (portions indicated by dotted lines in FIG. 1) other than plating layer 3 excluding the non-designed surface
And In addition, on the upper part of the back panel main body 2, a red transparent decoration member 5 extending in the lateral direction (see FIG. 3).
Is attached.

As shown in FIGS. 5 to 7, in the back panel main body 2, at the boundary between the plating layer 3 and the coating layer 4 on the inner and outer peripheral sides, an inner peripheral side step portion for coating parting is provided. 6 and the outer peripheral step portion 7 are formed in an annular shape. The two stepped portions 6 and 7 are formed with annular grooves (closed curve shape) having substantially V-shaped cross sections. Further, as shown in FIG. 3, the portion covered with the decorative member 5 includes:
A through hole 10 is formed. Further, an electrode projection 11 projecting toward the non-design surface side, that is, toward the front of the vehicle, is formed on the back side of the portion covered with the decorative member 5. In addition, a groove 12 is formed in an annular shape on the back side of the portion covered with the decorative member 5 so as to surround the through hole 10 and the electrode projection 11. The groove 12 blocks the entire formation of the plating on the rear surface side. In this embodiment, the grooves 8, 9,
12 constitutes first electroless plating avoidance means.

In addition, as shown in FIG. 5, the plating layer 3 has an electroless plating layer 13 and an electroplating layer 14 formed thereon. In this embodiment, the electroless plating layer 13 is made of copper and has a thickness of “0.3 to 0.4 μm”.
It is formed to the extent. The electroplating layer 14 is formed to have a total thickness of about 20 to 50 μm and includes a strike plating layer 14A made of nickel and a general electroplating layer 14B made of various metals. More specifically, the general electroplating layer 14B is formed by various metal platings in the order of a copper plating layer, a semi-bright nickel plating layer, a bright nickel plating layer, and a chromium plating layer (all not shown) from the lower layer. Have been.

As for the size of each of the grooves 8, 9 and 12, the width W is formed to be "0.5 mm" and the depth D is formed to be "0.7 mm". However, the width W is not particularly limited, but is limited to “0.3
mm "or more, and preferably 1.0 mm or less from the viewpoint of improving the design. Also, the depth D is not particularly limited, but is preferably equal to or more than “0.3 mm” from the same processing limitation. Further, in the present embodiment, the ratio (D / W) of the depth D to the width W is formed to be larger than “1.0”, and the ratio (D / W) W)> 6.7 * r1 + 1.0 (1) It is desirable that the ratio (D / W)> 180 * r1-15.7 (2) is satisfied. The upper limit of the ratio (D / W) is not particularly limited. However, if the thickness of the back panel body 2 or the like is present as in the present embodiment, the ratio (D / W) may be reduced in terms of processing. "5.0" or less is desirable. More preferably, it is "4.0" or less, and if it is "3.0" or less, processing becomes extremely easy.

Further, various plating solutions for forming each metal plating constituting the electroless plating layer 13 and the electroplating layer 14 will be described. First, the plating solution for forming the electroless plating layer 13 is copper sulfate pentahydrate 5 g /
L, 5 g / L sodium hydroxide, 10 mL / L formalin (37% by volume), and 25 g / L Rossell salt. The plating solution used to form strike plating layer 14A, which is the lowermost layer of electroplating layer 14, is composed of nickel sulfate 250 g / L, nickel chloride 30 g / L and boric acid 3 g / L.
It contains 0 g / L.

The plating solution for forming the copper plating layer in the general electroplating layer 14B is 200 g of copper sulfate.
/ L, sulfuric acid 50 g / L, hydrochloric acid 0.01 g / L and a trace amount of brightener. Further, the plating solution for forming the semi-bright nickel plating layer is 280 g of nickel sulfate.
/ L, nickel chloride 45 g / L, boric acid 40 g / L and a trace amount of brightener. At the same time, the plating solution for forming the bright nickel plating layer is nickel sulfate 240
g / L, nickel chloride 45 g / L, boric acid 30 g / L and trace amounts of brighteners and additives. In addition, the plating solution for forming the chromium plating layer contains 250 g / L of chromic anhydride, 10 g / L of sodium silicofluoride, and 1 g / L of sulfuric acid.

In the present embodiment, two types of predetermined solutions for dissolving the electroless plating layer 13 in portions where plating is not necessary are prepared after the formation of the strike plating layer 14A. This solution was prepared by adding an aqueous solution of 30 g / L ammonium peroxodisulfate or an acid such as nitric acid,
0% ammonia aqueous solution, and the liquid temperature is 40 ° C.
And 50 ° C.

In this embodiment, as shown in FIGS. 1 to 4, the inner surface of the back panel main body 2 (portion not requiring plating) is divided into the inner surface and the inner surface. Four grooves 15, 16, 17, 18 each having a substantially V-shaped cross section are formed to connect between two points of the groove 8. For this reason, the inner surface is substantially equally divided into eight by these grooves 15 to 18.
18 constitute a second means for avoiding electroless plating.

Next, the operation and effects of manufacturing the above-described back panel 1 will be described. First, as shown in FIGS. 2 to 4, the back panel body 2 having the grooves 8, 9, 12, 15 to 18 is formed by a known molding method.
Get.

Subsequently, the back panel body 2 is immersed in an electroless plating solution to perform electroless plating. That is, the back panel body 2 is first immersed in the electroless plating solution. Here, as shown in FIG.
At the bottoms 8a of 9, 12, 15 to 18, the plating solution does not reach because the gaps are narrow. However, FIG.
In FIG. 10, for convenience of explanation, only the inner circumferential groove 8 is described, but the outer circumferential and back side grooves 9, 12 and the inner circumferential surface are formed so as to divide the inner circumferential surface.
The same can be said for. Therefore, these bottom portions 8
a is not plated. In other words, an electroless plating layer 13 made of copper is formed on all portions of the surface of the back panel main body 2 except for the bottom portions 8a.

Next, in a strike plating step, which is a first-stage electroplating step, the back panel main body 2 on which the electroless plating layer 13 is formed is placed in the plating solution for forming the strike plating layer 14A for a predetermined time. At the same time as immersion, a portion requiring plating is electrically connected. Then, as shown in FIGS. 8 (a) and 8 (b), the portions that do not require plating are the grooves 8, 9, 12, 15 to
Because it is electrically interrupted by 18, basically no plating is formed thereon. On the other hand, in a portion requiring plating, the surface of the electroless plating layer 13
Strike plating layer 13A is formed relatively thin.

At this time, if the area of the portion that does not require plating is relatively large, a so-called “bipolar phenomenon” occurs. The degree of the “bipolar phenomenon” depends on the grooves 8, 9, 12, 15 among the portions not requiring plating.
From the furthest point from ~ 18,
The larger the distance from 12, 15 to 18, the stronger. In other words, if only the grooves 8, 9, 12 are used, and if the distance from the point furthest from these grooves to the grooves 8, 9, 12 is large, the central portion of the inner surface of the back panel main body 2 is caused by the "bipolar phenomenon". In this case, plating tends to remain.

However, in this embodiment, before the electroless plating step, the grooves 15 to 18 are formed so as to divide the inner surface. By these grooves 15 to 18, portions which do not require plating surrounded by the grooves 8 are 8.
Divided into two. That is, of the portions that do not require plating, the distance from the point farthest from the groove 8 (the central part of the inner side surface) to the groove 8 increases
The distance from the point farthest from 9, 12, 15 to 18 to the groove 8, 9, 12, 15 to 18 becomes smaller. For this reason, the potential difference between the electroless plating layer 13 having electroconductivity and the electroless plating layer 13 having conductivity formed in a portion not requiring plating becomes relatively small, and the "bipolar phenomenon" hardly occurs. Become. For this reason, it is possible to suppress the deposition of metal ions in the strike plating solution at portions that do not require plating, particularly at the central portion of the inner surface. Therefore, the electroless plating layer 13 formed on the portion that does not require plating is completely dissolved by the strike plating solution as shown in FIG.
Or, as shown in FIG. 8 (b), it is gradually dissolved and becomes thin.

Next, in the step of dissolving the electroless plating layer,
The film of the electroless plating layer 13 which does not require plating is dissolved. First, it is immersed in an aqueous solution of ammonium peroxodisulfate for 2 minutes to dissolve the nickel layer deposited on the electroless plating layer 13 by the "bipolar phenomenon".
At this time, since the “bipolar phenomenon” is hardly caused by the grooves 15 to 18, the thickness of the strike plating layer 14 </ b> A is sufficiently larger than the thickness of the deposited nickel layer. For this reason, the deposited nickel layer and the strike plating layer 14A are both made of nickel, and both are dissolved in a predetermined solution. The layer 14A remains with a sufficient thickness. As a result, the electroless plating layer 13 and the strike plating layer 14A formed only in the portion requiring plating remain on the surface of the back panel main body 2.

Subsequently, the back panel body 2 that has been subjected to the above processing is immersed in an aqueous ammonia solution for 5 minutes. At this time, since the portion where the strike plating layer 14A is formed is made of nickel, it is not dissolved in an alkaline aqueous ammonia solution. On the other hand, as shown in FIG. 8B, the electroless plating layer 13 slightly remaining in the unnecessary portion of the plating is made of copper, and is dissolved in an alkaline aqueous ammonia solution. Therefore, in such a dissolving step, the electroless plating layer 13 in a portion not requiring plating is completely dissolved. As a result, even if the electroless plating layer 13 is not completely dissolved by the strike plating solution, it is completely dissolved in the dissolving step as shown in FIG.

Then, on the surface of the back panel body 2,
Electroless plating layer 1 formed only on the part requiring plating
3 and the strike plating layer 14A formed thereon remain, and the electroless plating layer 13 does not exist in other portions, and plating on the back panel body 2 other than the strike plating layer 14A does not occur at all. Not exposed.

Subsequently, in the copper plating step, the semi-bright nickel plating step, the bright nickel plating step, and the chromium plating step, which are the second-stage electroplating steps, substantially the same operations as those in the first-stage electroplating step are performed. At this time, the portion of the electroless plating layer 13 that does not require plating has already been dissolved in the predetermined solution, and does not exist at these times. Therefore, in the second-stage electroplating process after the copper plating process, the electroless plating layer 13 is not dissolved in each plating solution. As a result, each plating solution can be prevented from being contaminated.

Further, since the electroless plating layer 13 is not exposed in the unnecessary portion of the plating, the general electroplating layer 14B and the like are formed on the electroless plating layer 13 in the portion which does not require the plating. It will not be done. for that reason,
It is possible to prevent the plating layer 3 from being formed on a portion that does not require plating and the short circuit between the grooves 8, 9, and 12 from occurring.

Then, as shown in FIG. 9, a general electroplating layer 14B having a multilayer structure is formed on the strike plating layer 14A through a second-stage electroplating process including the above-described various processes. In this manner, the plating layer 3 including the electroless plating layer 13 and the electroplating layer 14 including the strike plating layer 14A and the general electroplating layer 14B is formed only in a portion requiring plating.

Thereafter, as shown in FIG.
Is formed with an electroformed mask 19.
That is, the electroformed mask 19 is a metal plate having a thickness of “several mm” and has a shape conforming to the shape of the back panel 1. Further, the electroformed mask 19 is appropriately formed with an opening which is opened only at a portion necessary for forming the coating layer 4. By the coating of the electroformed mask 19, a portion necessary for forming the coating layer 4 is exposed from the opening. Then, spray coating is performed on the exposed portion. By this coating, a coating film layer 4 is formed at a necessary portion of the coating film. On the other hand, in the portion covered by the electroformed mask 19,
The coating layer 4 is not formed.

Then, after the coating layer 4 is formed, FIG.
As shown in FIG. 6, the back panel 1 is obtained by releasing the coating of the electroformed mask 19. As described above, according to the present embodiment, the above electroless plating layer 1
When forming 3, the electroless plating layer 13 is not formed on the bottom 8a of the grooves 8, 9, 12, 15 to 18. Then, when the electroplating layer 14 is formed, only portions that require plating are electrically conducted. Therefore, in a portion requiring plating, the electroplating layer 14 including the strike plating layer 14A and the general electroplating layer 14B can be formed on the surface of the electroless plating layer 13.

According to the present embodiment, as described above, since the grooves 15 to 18 are separately formed, the point (inside) located at the position farthest from the groove 8 among the portions that do not require plating. With respect to the distance from the center portion of the side surface) to the groove 8, the point farthest from all the grooves 8, 9, 12, 15 to 18 starts at the point farthest from the groove 8, 9, 12, 15 to 18. The distance becomes smaller. For this reason, the electroless plating layer 13 having conductivity formed in a portion not requiring plating
And the potential difference between the solution and the solution for electroplating is relatively small, and the "bipolar phenomenon" is less likely to occur. Therefore, the deposition of metal ions in the strike plating solution is suppressed in portions not requiring plating, particularly in the central portion of the inner surface, and the formation of plating in portions not requiring plating is suppressed. it can. Therefore, in the next electroless plating dissolving step, it is possible to surely dissolve all the electroless plating layer 13 in a portion that does not require plating, and to eventually form the plating layer 3 in the portion. Can be prevented. As a result, the appearance quality of the finally obtained back panel 1 can be significantly improved, and the durability of the coating film layer 4 formed by application can be improved.

In this embodiment, the grooves 18 intersecting the grooves 15 to 17 extending in the vertical direction are formed so as to extend in the horizontal direction. For this reason, the portion that does not require plating is divided into more portions, and the above-described effects can be further ensured.

Further, in the present embodiment, immediately after the strike plating step, which is the first-stage electroplating step, all the electroless plating layers 13 that do not require plating dissolve. Therefore, the electroless plating layer 13 is not dissolved in the plating solution in the subsequent electroplating process. Further, in the subsequent general electroplating step, the electroless plating layer 13 is not exposed in a portion not requiring plating, so that the general electroplating is performed on the electroless plating layer 13 in a portion not requiring plating. There is no formation of the layer 14B or the like. Therefore, according to the present embodiment, the electroless plating layer 13 is not dissolved in the plating solution in the various steps of the general electroplating layer process. Therefore, each plating solution can be prevented from being contaminated. As a result, there is no need to replace each plating solution due to contamination, thereby reducing costs.

Further, the plating layer 3 may be formed in portions where plating is not required, or the grooves 8, 9, 12, 15 may be formed.
18 can be prevented from short-circuiting.

In addition, in this embodiment, the grooves 8, 9,
Reference numeral 12 indicates a boundary between the coating layer 4 and the plating layer 3. For this reason, the parting part of the boundary part is formed not in a zigzag shape but sharply. As a result, the parting line can be made clear and clear, and the appearance quality can be further improved.

(Second Embodiment) Next, FIGS. 11 to 18 show a second embodiment in which the present invention is embodied in an outer cover 31 (hereinafter simply referred to as "outer cover") for a vehicle door mirror bracket as a resin product. It will be described based on the following. However, in the present embodiment, the description of portions substantially similar to those of the above-described first embodiment will be omitted, and mainly the differences will be mainly described.

In recent years, a door mirror is generally attached to a door mirror bracket at a front portion of a door of a vehicle such as an automobile. However, some users mount a conventional so-called fender mirror instead of the door mirror. In this case, an outer cover 31 as shown in FIG. 11 is attached to the door mirror bracket for the purpose of covering the bracket mounting portion and the like.

As shown in FIGS. 11 and 12, the outer cover 31 is formed in a substantially triangular planar shape. The outer cover 31 includes an outer cover main body 32 (see FIG. 12) as a base material made of ABS resin, and has a part of the design surface (including a part of the non-design surface) (with a mesh pattern shown in FIG. 11). 11), and a coating layer 34 applied to portions other than the plating layer 33 (excluding the non-designed surface; portions indicated by dotted lines in FIG. 11). I have.

On the design surface side of the outer cover main body 32, a boundary between the plating layer 33 and the coating layer 34 is
A concave portion 35 for parting the paint is formed. A simple groove 36 having a substantially U-shaped cross section is formed in the outer cover main body 32 including the concave portion 35 in an annular shape (closed curve shape) across the design surface and the non-design surface. Along the simple groove 36, a resist coating layer 41 as a first means for avoiding electroless plating is applied and formed. The resist coating layer 41 is made of a predetermined resist paint that is not easily roughened during plating, and specifically, a vinyl chloride-vinyl acetate copolymer or a styrene-methyl methacrylic acid copolymer is used. Further, on the non-design surface side of the outer cover main body 32, an electrode protrusion 37 is formed so as to protrude toward the non-design surface side (inside the vehicle). The electrode projection 37 may be removed at the time of use.

At the same time, as shown in FIG.
3 has an electroless plating layer 38 and an electroplating layer 39 formed thereon as in the first embodiment. The electroplating layer 39 has a strike plating layer 39A and a general electroplating layer 39B.

As shown in FIGS. 13 and 15, in the portion which does not require plating in the present embodiment, the portion is divided into two parts so that the simple groove 4 is parallel to the simple groove 36.
2 is formed in an annular shape (closed curve shape) over the design surface and the non-design surface. A resist coating layer 43 (see FIG. 15) as a second means for avoiding electroless plating is applied and formed along the simple groove. The resist coating layer 43 is also made of the same material as the resist coating layer 41.

Next, the operation and effects of manufacturing the outer cover 31 will be described. First,
The outer cover main body 31 in which the simple grooves 36 and 42 are formed at predetermined positions in an annular shape is formed. Next, as shown in FIGS. 14 and 15, a resist paint is applied along the simple grooves 36 and 42 or inside the simple grooves 42 to form a resist coating layer 4.
1, 43 are formed.

Then, the outer cover main body 31 on which the resist coating layers 41 and 43 are formed is immersed in an electroless plating solution to perform electroless plating. At this time, since the resist coating layers 41 and 43 are hard to be roughened, the portions are not plated. In other words, as shown in FIG. 16, the electroless plating layer 38 is formed on all parts except the resist coating layer 41 (43). Next, the electroless plating layer 38
The outer cover main body 32 formed with is formed for electroplating. That is, first, in a strike plating step as a first-stage electroplating step, the outer cover main body 32 on which the electroless plating layer 38 is formed is attached to the strike plating layer 39.
While immersing in the plating solution for forming A for a predetermined time, a portion requiring plating is electrically connected. Then, as shown in FIGS. 17A and 17B, the portions that do not require plating are electrically cut off by the resist coating layer 41 of the simple groove 36. No plating is formed. On the other hand, in portions requiring plating, strike plating layer 39A is formed relatively thin on the surface of electroless plating layer 13.

At this time, if the area of the portion that does not require plating is relatively large, a “bipolar phenomenon” may occur. The larger the distance from the point farthest from 43 to the resist coating layers 41 and 43 becomes, the larger the distance becomes. That is, with the resist coating layer 41 alone, if the distance from the point farthest from the resist coating layer 41 to the resist coating layer 41 is large, the tip of the outer cover main body 32 (the upper vertex in FIG. ) May easily cause plating to remain.

However, in this embodiment, the simple groove 42 and the resist coating layer 43 are formed in a ring shape in a portion that does not require plating in advance. Due to the resist coating layer 43, all portions of the resist coating layer 41 that do not require plating correspond to the distance from the point farthest from the resist coating layer 41 (the tip portion) to the resist coating layer 41. The distance from the point farthest from the film layers 41, 43 to the resist coating layers 41, 43 becomes smaller. Therefore, the potential difference between the electroless plating layer 38 having electroconductivity and the electroless plating layer 38, which is formed in a portion not requiring plating, is relatively small, and the "bipolar phenomenon" is unlikely to occur. Become. For this reason, it is possible to suppress the deposition of metal ions in the strike plating solution at portions that do not require plating, particularly at the central portion of the inner surface.
Therefore, the electroless plating layer 38 formed in the portion that does not require plating is changed by the strike plating solution.
It is completely dissolved as shown in FIG. 17A, or is gradually dissolved and becomes thin as shown in FIG.

Subsequently, in the electroless plating melting step,
The outer cover body 32 on which the strike plating layer 39A is formed is immersed in a predetermined solution as in the first embodiment. At this time, the nickel layer deposited by the “bipolar phenomenon” is dissolved, and the electroless plating layer 3 remaining in the unnecessary portion of the plating as shown in FIG.
8 is dissolved. Here, since the precipitation of metal ions in the strike plating solution (bipolar phenomenon) is suppressed on the electroless plating layer 38, the nickel layer does not become thick, and in these dissolving steps, Nickel layer and electroless plating layer 3 in portions not requiring plating
All 8 are reliably dissolved. As a result, even if the electroless plating layer 38 is not completely dissolved by the strike plating solution, it is completely dissolved in the dissolving step as shown in FIG.

Then, on the surface of the outer cover body 32,
Electroless plating layer 3 formed only on the portion required for plating
8 and the strike plating layer 39A formed thereon remain, and the electroless plating layer 38 does not exist in other portions, and the plating other than the strike plating layer 39A is completely exposed on the outer cover body 32. do not do.

Subsequently, in the copper plating step, the semi-bright nickel plating step, the bright nickel plating step, and the chromium plating step, which are the second-stage electroplating steps, the same operations as in the first embodiment are performed. At this time, the portion of the electroless plating layer 38 that does not require plating is already dissolved in the above-mentioned predetermined solution and does not exist at these times. The electroless plating layer 38 is not dissolved in the solution. As a result, each plating solution can be prevented from being contaminated. Then, as shown in FIG. 18, a general electroplating layer 39B having a multilayer structure is formed on the strike plating layer 39A through a second-stage electroplating process including the above various processes. In this manner, the plating layer 33 including the electroless plating layer 38 and the electroplating layer 39 including the strike plating layer 39A and the general electroplating layer 39B is formed only in a portion requiring plating.

Thereafter, a coating is applied to a portion where the plating layer 33 is not formed, so that a coating film layer 34 is formed at a necessary portion of the coating film. In this way, FIGS.
The outer cover 31 shown in FIG.

As described above, according to this embodiment,
When forming the electroless plating layer 38, the electroless plating layer 38 is not formed on the resist coating layers 41 and 43. Then, when the electroplating layer 39 is formed, only portions that require plating are electrically conducted. Therefore, in a portion requiring plating, the electroplating layer 39 including the strike plating layer 39A and the general electroplating layer 39B can be formed on the surface of the electroless plating layer 38.

According to the present embodiment, as described above, since the resist coating layer 43 is separately formed, the point farthest from the resist coating layer 41 among the portions that do not require plating is used. With respect to the distance from the (tip portion) to the resist coating layer 41, all the resist coating layers 41,
The distance from the point furthest from 43 to the resist coating layers 41 and 43 becomes smaller. Therefore, the potential difference between the electroless plating layer 38 having electroconductivity and the electroless plating layer 38, which is formed in a portion not requiring plating, is relatively small, and the "bipolar phenomenon" is unlikely to occur. Become. Therefore, the deposition of metal ions in the strike plating solution at portions not requiring plating, particularly at the tip portion, is suppressed, and formation of plating at portions not requiring plating can be suppressed. As a result, an effect similar to that of the first embodiment is obtained.

(Third Embodiment) A third embodiment in which the present invention is embodied in a vehicle front grille 51 as a resin product will be described below with reference to FIGS. However, also in the present embodiment, description of portions substantially similar to those in the above-described first and second embodiments will be omitted, and mainly the differences will be mainly described.

A front grill 51 as shown in FIG. 19 is mounted on the front of the vehicle. FIG.
As shown in FIGS.
Has a front grille body (hereinafter, referred to as a grille body) 52 as a base material made of ABS resin, and has a plating layer 53 (FIG. 20) formed on a part of its design surface, that is, a part of the front surface. (The part shown in a mesh pattern)
And a coating layer 54 applied to a portion other than the plating layer 53 (excluding a part of the back side). More specifically, the front grille 51 has a substantially rectangular frame 5 on the front side.
5, a plurality of sub-partition plates 56 extending in the frame 55 in the horizontal direction, a plurality of connection plates 57 extending in the frame 55 in the vertical direction, a mounting plate 58 for mounting a mark plate (not shown) in the center, and A main partition plate 59 extends from the frame 55 toward the mounting plate 58. The plating layer 53 is formed mainly on the front side of the frame 55 and on the front side of the main partition plate 59. The sub-partition plate 56 and the mounting plate 5
The coating layer 54 is formed mainly on the front side of the connecting plate 8 and the connecting plate 57.

FIG. 21 is an enlarged front view showing a part of the main partition plate 59, and FIG. 22 is a sectional view taken along line DD of FIG. As shown in these figures and FIG. 23, in the front side portion of the grill main body 52, the front surface projecting vertically from the frame 55 and the main partition plate 59 is provided at the boundary between the plating layer 53 and the coating layer 54. The side step part 60 is formed in an annular shape. The front side step portion 60 has a cross section substantially V
A groove 61 as a first U-shaped electroless plating avoiding means is formed in an annular shape (closed curve shape) (see also FIG. 20). FIG. 24 is a back view showing a part of the back side of the frame 55 in an enlarged manner. As shown in FIG.
In the back surface side portion 2, a groove 63 as a first electroless plating avoidance means having a substantially V-shaped cross section is provided at a boundary between the plating layer 53 and a portion where the plating layer 53 is not formed.
Are formed in an annular shape (see also FIG. 20). Further, an electrode projection 64 is formed on the rear surface side portion of the grill main body 52 so as to protrude toward the rear surface (toward the rear of the vehicle).

As shown in FIG. 23, the plating layer 53 includes an electroless plating layer 65 and an electroplating layer 66. This embodiment is different from the first and second embodiments in that the electroless plating layer 65 is formed of nickel. Further, the electroplated layer 66 is different from the strike plated layer 66A constituting the first-stage electroplated layer with the second electroplated layer.
The strike plating layer 66A is made of nickel, as in the first and second embodiments. That is, in the third embodiment, the electroless plating layer 65
The strike plating layer 66A is made of nickel.

Next, the composition of the plating solution when forming the electroless plating layer 65 and when forming the strike plating layer 66A will be described. First, a plating solution for forming the electroless plating layer 65 is nickel sulfate 20 g.
/ L, 30 g / L of sodium citrate, 30 g / L of ammonium chloride and 15 g / L of sodium hypophosphite. The temperature of the solution was 40 ° C., and the hydrogen ion concentration (pH) was 9. Next, the plating solution for forming the strike plating layer 16A contains 250 g / L of nickel sulfate, 30 g / L of nickel chloride, and 30 g / L of boric acid as in the first and second embodiments. Further, the same composition as in the first and second embodiments is employed for the plating solution for forming each plating layer of the general electroplating layer 16B.

Also in this embodiment, before the formation of the strike plating layer 66A, a predetermined solution for dissolving the electroless plating layer 65 in a portion not requiring plating is prepared. As the solution, an aqueous solution of 30 g / L ammonium peroxodisulfate or an acid such as nitric acid is suitably used. The water temperature of the solution is 40 ° C.

In this embodiment, as shown in FIG. 25, a belt-like resist coating layer 67 as a second means for avoiding electroless plating is formed on the mounting plate 58 in an annular shape. The resist coating layer 67 uses the same paint as that of the second embodiment.

Next, the operation and effect of this embodiment will be described. First, a grill main body 52 in which strip grooves 61 and 63 are respectively formed at predetermined positions in a ring shape is obtained. Subsequently, as shown in FIGS.
Then, a resist paint is applied to form a resist coating layer 67 in an annular shape.

Next, the grill main body 52 on which the resist coating layer 67 is formed is immersed in an electroless plating solution to perform electroless plating. Then, as shown in FIGS. 27 and 28, an electroless plating layer 65 made of nickel is formed on all portions except the bottom 61a of the grooves 61 and 63 on the surface of the grill main body 52 and the resist coating layer 67. .

Next, in a strike plating step as a first-stage electroplating step, the grill main body 52 on which the electroless plating layer 65 is formed is immersed for a predetermined time in the plating solution for forming the strike plating layer 66A. At the same time, the portions requiring plating are electrically conducted. Then, as shown in FIGS. 29A and 29B, portions not requiring plating are electrically interrupted by the grooves 61 and 63, and no plating is formed thereon. On the other hand, where plating is required,
A strike plating layer 66 is formed on the surface of the electroless plating layer 65.
A is formed relatively thin. However, the thickness (for example, 0.5 to 5 μm) of the strike plating layer 66A is formed sufficiently larger than the thickness (for example, 0.3 to 0.4 μm) of the electroless plating layer 65.

At this time, if the area of the portion that does not require plating is relatively large, a “bipolar phenomenon” may occur. The larger the distance from the furthest point to the groove 61, 63, the larger. That is, if the distance from the point furthest from these grooves 61 and 63 to the grooves 61 and 63 is large, plating tends to remain in the central portion of the mounting plate 58 due to the "bipolar phenomenon". There is a risk of becoming something.

However, in this embodiment, the resist coating layer 67 is formed in an annular shape on the mounting plate 58 in a portion not requiring plating in advance. This resist coating layer 67
Of the portions that do not require plating,
With respect to the distance from the point furthest from 63 (mounting plate 58) to the grooves 61, 63, from the point furthest from the grooves 61, 63 and the resist coating layer 67, the grooves 61, 63 In addition, the distance to the resist coating layer 67 is reduced. Therefore, the potential difference between the electroless plating layer 65 having electroconductivity and the electroless plating layer 65 formed in portions not requiring plating is relatively small, and the "bipolar phenomenon" is unlikely to occur. Become. For this reason, the deposition of metal ions in the strike plating solution at portions that do not require plating, particularly at the center of the mounting plate 58, can be suppressed. Therefore, the electroless plating layer 65 formed in a portion that does not require plating is completely dissolved by the strike plating solution as shown in FIG. 29A, or as shown in FIG. 29B. And gradually become thinner.

Subsequently, in the electroless plating melting step,
Grill main body 52 with strike plating layer 66A formed
Is immersed in the predetermined solution for about 2 minutes. here,
In the immersion time of about 2 minutes, the electroless plating layer 65
It is clear from experimental results that the strike plating layer 16A dissolves at a dissolution rate of 0.05 μm / min at a dissolution rate of 0.2 μm / min.
Further, as described above, the thickness of strike plating layer 66A is sufficiently larger than the thickness of electroless plating layer 65 (note: this is not shown for convenience in the drawings). Therefore, the electroless plating layer 65 and the strike plating layer 66
A is composed of nickel, and both are dissolved in a predetermined solution. However, even after the electroless plating layer 65 is completely dissolved, the strike plating layer 66A has a sufficient thickness. Remain in a state. As a result, FIG.
As shown in (a), on the surface of the grill main body 52, the electroless plating layer 65 formed only on the portion requiring plating and the strike plating layer 66A formed thereon remain. Then, the electroless plating layer 65 does not exist in other portions, and no plating other than the strike plating layer 66A is exposed on the grill main body 52.

Subsequently, in the copper plating step, the semi-bright nickel plating step, the bright nickel plating step, and the chromium plating step, which are the second-stage electroplating steps, the same operations as in the first and second embodiments are performed. At this time, the portion of the electroless plating layer 65 that does not require plating is already dissolved in the above-mentioned predetermined solution and does not exist at these times. The electroless plating layer 65 is not dissolved in the solution. As a result, each plating solution can be prevented from being contaminated. Then, as shown in FIG. 30, a general electroplating layer 66B having a multilayer structure is formed on the strike plating layer 66A through a second-stage electroplating process including the above various processes. In this way, the plating layer 53 including the electroless plating layer 65 and the electroplating layer 66 including the strike plating layer 66A and the general electroplating layer 66B is formed only in a portion requiring plating.

Thereafter, a coating is applied to a portion where the plating layer 53 is not formed, so that a coating film layer 64 is formed where a coating film is required. Thus, FIGS.
The front grill 51 shown in FIG.

As described above, also in the present embodiment, the "bipolar phenomenon" can be suppressed. Therefore, the deposition of metal ions in the strike plating solution at portions not requiring plating, particularly at the center of the mounting plate 58, is suppressed, and the formation of plating at portions not requiring plating is suppressed. Can be. As a result, the same effects as in the first and second embodiments are obtained.

According to the present embodiment, both the electroless plating layer 65 and the strike plating layer 66A are formed of nickel. Therefore, the electroless plating layers 13, 3
Compared with the first and second embodiments in which 8 is formed of copper, plating can be performed at relatively low cost.

Further, in the predetermined solution for dissolving the electroless plating layer 65, only the nickel constituting the electroless plating layer 65 and the strike plating layer 66A is dissolved. In other words, in the waste liquid of the predetermined solution, only nickel ions mainly remain. Therefore, the treatment of the waste liquid can be performed relatively easily.

The present invention is not limited to the above-described embodiments, but may be implemented as follows by appropriately changing a part of the configuration without departing from the spirit of the invention. (1) In the first and second embodiments, the electroless plating layer 1
By forming the strike plating layers 14A and 39A from nickel while making the layers 3, 38 from copper, and treating the aqueous ammonium peroxodisulfate solution and the alkaline aqueous solution in the two-stage electroless plating melting step, Only the plating layers 13 and 38 were dissolved. Conversely, the electroless plating layers 13 and 38 are made of nickel, and the strike plating layers 14A and 39A are made of copper. In the electroless plating dissolving step, an alkaline aqueous solution and an aqueous solution of ammonium peroxodisulfate are used. (Acid solution)
, The electroless plating layers 13 and 38
Only one may be dissolved. In this case, the same operation and effect as those of the first and second embodiments can be obtained.

In the third embodiment, the electroless plating layer 65 and the strike plating layer 66A are both made of nickel. A configuration may be adopted in which unnecessary portions of plating are dissolved in a predetermined solution.

(2) In each of the above embodiments, the second-stage electroplating step is composed of four steps including a copper plating step, and the general electroplating layer 14 composed of a plurality of metal platings is used.
B, 39B, and 66B are formed. However, if the electroplating step includes a plurality of steps, the order,
The number of steps, the type of plating, and the like are not particularly limited. Therefore, for example, one step can be omitted, the order of the plating steps can be changed, or another plating step can be introduced.

(3) In each of the above embodiments, the present invention is embodied in the back panel 1 for a vehicle, the outer cover 31 for a door mirror bracket for a vehicle, and the front grille 51. ,
It may be embodied as a quarter vent, a mark plate or the like. Further, the present invention is not limited to the above resin products, and the present invention may be embodied in other resin products partially having a plating layer.

(4) In each of the above embodiments, the resin material constituting the base material is made of ABS resin. However, other than that, various resins such as polypropylene, polyphenylene oxide, polyamide, polysulfone, polyester, etc. A material may be used.

(5) In each of the above embodiments, the grooves 8, 9, 12, 15 to 18 and the simple grooves 36, 42 and the like are formed by using a mold. It may be formed by post-processing using a sonic cutter or the like.

(6) The composition of each plating solution described in the above embodiments is not limited to the above. (7) The configuration may be such that the electroless plating dissolving step in each of the above embodiments is omitted.

[0093]

As described above in detail, according to the method for partially plating resin products of the present invention, it is possible to suppress the plating that does not need to be performed on the parts that do not require plating, thereby improving the appearance quality. An excellent effect that remarkable improvement can be achieved is achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a back panel according to a first embodiment.

FIG. 2 is a front view showing a back panel main body in the first embodiment.

FIG. 3 is a cross-sectional view showing a back panel main body according to the first embodiment.

FIG. 4 is a sectional perspective view showing a back panel main body in the first embodiment.

FIG. 5 is an enlarged sectional view of a main part of the back panel in the first embodiment.

FIG. 6 is a partial cross-sectional view of the back panel in the first embodiment.

FIG. 7 is a cross-sectional view showing a state where electroless plating is performed.

8 (a) and 8 (b) are cross-sectional views when strike plating is applied. In particular, FIG. 8 (a) is a cross-sectional view showing a state where an electroless plating layer is completely dissolved.

FIG. 9 is a cross-sectional view showing a state where an electroplating layer is formed.

FIG. 10 is a cross-sectional view showing a state when a coating layer is formed.

FIG. 11 is a front view showing an outer cover according to a second embodiment.

FIG. 12 is a sectional view taken along line BB of FIG. 11, which is a main part of the outer cover.

FIG. 13 is a cross-sectional view illustrating an outer cover body according to a second embodiment.

FIG. 14 is a cross-sectional view showing a state where a resist coating layer is formed in a simple groove of a concave portion.

FIG. 15 is a sectional view showing a state in which a resist coating layer is formed in another simple groove.

FIG. 16 is a cross-sectional view showing a state where electroless plating is performed.

FIGS. 17 (a) and 17 (b) are cross-sectional views when strike plating is performed. In particular, (a) is a cross-sectional view showing a state in which an electroless plating layer is completely dissolved.

FIG. 18 is a cross-sectional view showing a state where an electroplating layer is formed.

FIG. 19 is a front view showing a front grill in the third embodiment.

FIG. 20 is a schematic diagram showing a front grill developed on the front side and the back side.

FIG. 21 is an enlarged front view of a main partition plate.

22 is a sectional view taken along line DD of FIG. 21.

FIG. 23 is an enlarged sectional view showing a main part of a front grill of the third embodiment.

FIG. 24 is an enlarged back view showing a part of the back side of the front grill.

FIG. 25 is a front view schematically showing a mounting plate.

FIG. 26 is a sectional view taken along line EE of FIG. 25;

FIG. 27 is a cross-sectional view showing a state where electroless plating has been performed.

FIG. 28 is a sectional view of a mounting plate showing a state where electroless plating is performed.

FIGS. 29 (a) and (b) are cross-sectional views when strike plating is performed. In particular, (a) is a cross-sectional view showing a state in which an electroless plating layer is completely dissolved.

FIG. 30 is a cross-sectional view showing a state where an electroplating layer is formed.

FIG. 31 is a cross-sectional view showing a state where electroless plating is performed in a conventional technique.

FIG. 32 is a cross-sectional view showing a state where electroplating is performed in a conventional technique.

FIG. 33 is a cross-sectional view showing a state where electroless plating is performed in a conventional technique.

FIG. 34 is a cross-sectional view showing a state where electroplating is performed in a conventional technique.

FIG. 35 is a diagram schematically illustrating a bipolar phenomenon, and is a graph showing a relationship between a conduction distance and a potential difference.

FIG. 36 is a cross-sectional view schematically illustrating a bipolar phenomenon.

FIG. 37 is a cross-sectional view schematically illustrating a bipolar phenomenon.

FIG. 38 is a graph showing the relationship between the conduction distance and the anode-side increased film thickness.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Back panel as a resin product, 2 ... Back panel body as a base material, 8, 9, 12, 61, 63 ... Grooves constituting first electroless plating avoidance means, 13, 38, 6
5: electroless plating layer, 14, 39, 66: electroplating layer, 14A, 39A, 66A: strike plating layer, 1
4B, 39B, 66B: General electroplated layer, 15, 1
6, 17, 18 ... groove forming second electroless plating avoidance means, 31 ... outer cover as resin product, 32 ...
Outer cover body as a base material, 41... Resist coating layers constituting first electroless plating avoidance means, 43, 67.
A resist coating layer constituting the second means for avoiding electroless plating, 51... A front grill as a resin product, 52.

Continuation of the front page (56) References Patent No. 2985623 (JP, B2) Patent No. 2985651 (JP, B2) Patent 2940349 (JP, B2) Patent 2947016 (JP, B2) Patent 2985646 (JP, B2) Patent 2947024 (JP, B2) U.S. Pat. No. 5,548,516 (US, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C25D 5/56 C23C 28/00 C23C 18/16

Claims (5)

(57) [Claims] An electroless plating layer (13, 3) is provided on a boundary between a portion requiring plating and a portion not requiring plating on the surface of a resin base material (2, 32, 52).
First electroless plating avoiding means forming step of forming first electroless plating avoiding means (8, 9, 12, 41, 61, 63) for preventing formation of (8, 65) into an annular shape. At least the first surface of the substrate (2, 32, 52) surface;
Means for avoiding electroless plating (8, 9, 12, 41, 61,
63) Electroless plating layer (13, 38, 6)
5) forming an electroless plating step; and the base material (2, 32, 5) having passed through the electroless plating step.
2) The electroless plating layer (13, 38, 6) formed on
Of 5), the portions requiring plating are electrically conducted to form electroplating layers (14, 39, 66) on the portions requiring plating on the electroless plating layers (13, 38, 65). A partial plating method for a resin product, comprising: performing an electroplating step, wherein at least a first electroless plating avoidance means (8, 9, 12, 41, 41,
61, 63), a second electroless plating avoidance means (15, 16, 1)
By forming the 7,18,43,67), dividing the portion which does not require the plating on at least two, before
The first means for avoiding electroless plating (8, 9, 12, 41,
61, 63) and the second means for avoiding electroless plating (15, 63).
16, 17, 18, 43, 67)
The area of the unnecessary portion or the longest conduction distance is
Electroless plating avoidance means (8, 9, 12, 41, 61, 6)
3) The area or minimum area of the part that does not require plating surrounded by
A partial plating method for a resin product, wherein the method is smaller than a long conduction distance . 2. The second electroless plating avoiding means (1).
5,16,17,18) is a resin product according to claim 1, characterized in that it is formed so as to couple at least any two points of the first electroless plating avoidance means (8) Partial plating method. 3. The second electroless plating avoiding means (1).
5. The method according to claim 2 , wherein ( 5 , 16, 17, 18) has its own intersection. Wherein said second electroless plating avoiding means (4
3,67) are partial plating method of the resin product according to claim 1, characterized in that it is made form the annular within the portion not requiring plating. Wherein said electroplating step, the electroless plating layer (13,38,65) strike plating layer on necessary portions of the plating on (14A, 39A, 66A) a first stage electroplating process for forming a If, before the strike plating layer formed on Kimotozai (2,32,52) (14A, 39A, 66A) are electrically connected to thereby, and the strike plating layer (14A, 39A, 66
Comprising a plurality of metal plated on A) General electroplating layer (14B, 39B, is composed of a second-stage electroplating process for forming a 66B) Rutotomoni, the first stage electroplating process and the second stage electroplating With the process
In the meantime, the base material (2, 32, 52) is immersed in a predetermined solution.
Immersed in the part that does not need plating
Electroless plating solution to dissolve the plating layer (13, 38, 65)
Partial plating method of a resin product according to claim 1-4, characterized in further comprising a solution process.