JPH08127894A - Method for partially plating resin product - Google Patents

Abstract

PURPOSE: To improve the adhesion of plating to a substrate and the appearance quality at the time of partially plating the surface of the resin product difficult to plate. CONSTITUTION: A grill main body 2 is formed, and a conductive coating material is applied on the face to be plated to form a conductive coating film layer 16. The surface side of the layer 16 is then ground by sanding, hence the area of the exposed nickel powder on the surface side is increased, the ruggednesses ar made uniform, and the surface is smoothed. Various electroplatings are then applied thereon. At this time, the area of the exposed nickel powder is increased and specified conductivity is secured, and an electroplating layer 3 is easily and surely formed and firmly attached to the surface layer. Further, since the surface layer side of the layer 16 is made uniform and smoothed, the electroplating layer 3 formed thereon is also made uniform and smoothed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portion of a resin product which is made of a resin which is difficult to plate and which is plated only on a portion of the surface of a substrate which is molded into a predetermined shape and which requires plating. The present invention relates to a plating method.

[0002]

2. Description of the Related Art Conventionally, resin products of this type include exterior decorations such as front grilles and back panels for vehicles. For example, in a front grill, a plating layer is formed on a predetermined portion of its front surface (design surface), and a coating layer is formed on other portions. Alternatively, when a pre-colored substrate is used, the formation of the coating layer may be omitted and the non-plated portion may be exposed. As described above, various techniques have been conventionally proposed as a technique for partially plating. In such a technique, as the base material, for example, ABS
(Acrylonitrile-butadiene-styrene) resin,
When a material such as PPO (polyphenylene oxide) which is relatively easy to plate is adopted, the plating is directly applied to the required portion of the base material.

However, for example, when a base material made of an AES (acrylonitrile-ethylene-styrene) resin or a difficult-to-plate resin such as PE (polyethylene), PP (polypropylene) or polyamide is adopted, direct plating is performed. It is practically difficult to apply.

Therefore, as techniques for solving such a problem, those disclosed in, for example, Japanese Patent Laid-Open Nos. 1-301882 and 60-162792 are known. In these techniques, a conductive coating layer is formed by applying a conductive coating material mixed with metal powder or the like onto a resin base material that is difficult to plate. Then, electroplating is performed to form an electroplating layer on the conductive coating film layer. By applying such a technique to partial plating, it becomes possible to perform partial plating on a resin base material that is difficult to plate.

[0005]

However, in the above-mentioned prior art, even though the conductive coating layer contains the metal powder, the metal powder is almost always covered with the coating matrix. However, the metal powder on the surface layer side was sometimes covered with the coating film matrix (see FIG. 7). Therefore, it has been extremely difficult to secure sufficient conductivity in the subsequent electroplating. as a result,
The formed electroplating layer easily causes interfacial peeling with respect to the conductive coating layer, and the so-called adhesion strength of the plating layer is extremely low.

Further, due to the presence of the metal powder in the conductive coating film layer, the surface layer of the coating film layer has a large number of fine irregularities, and when an electroplating layer is formed thereon, the electroplating is performed. There was a risk that the surface of the layer would also have irregularities. In such a case, the appearance quality of the resin product is significantly deteriorated.

The present invention has been made to solve the above problems, and an object thereof is to provide a resin product for applying plating to a portion of the surface of a resin base material that is difficult to plate, where plating is required. Another object of the present invention is to provide a partial plating method for a resin product, which can improve the adhesion of the plating to the base material and improve the appearance quality.

[0008]

In order to achieve the above-mentioned object, in the invention described in claim 1, the plating on the surface of a base material made of a resin which is difficult to plate and which is molded into a predetermined shape. A conductive coating film layer forming step of forming a conductive coating film layer by applying a conductive coating material containing a conductive powder in the coating material to a necessary portion, and at least the conductive coating film layer. A surface treatment step of performing a surface treatment by removing the coating matrix on the surface layer side, and an electroplating for forming an electroplating layer by performing electroplating on the surface-treated conductive coating layer The gist is a partial plating method for a resin product including steps.

According to the second aspect of the invention,
Made of a difficult-to-plate resin, and, where necessary for plating on the surface of the base material molded into a predetermined shape, by applying a conductive coating material containing a conductive powder in the coating material, A conductive coating layer forming step of forming a conductive coating layer, an electroless plating step of forming an electroless plating layer by performing electroless plating on the conductive coating layer, and the electroless plating The gist is a partial plating method for a resin product including an electroplating step of forming an electroplated layer by performing electroplating on the layer.

Further, in the invention described in claim 3, in the coating material, a conductive powder is added to a portion of the surface of the base material made of a resin having a poor plating property and molded into a predetermined shape, where plating is required. A conductive coating layer forming step of forming a conductive coating layer by applying a conductive coating material containing a body, and removing at least the coating matrix on the surface layer side of the conductive coating layer. A surface treatment step of applying a surface treatment with, an electroless plating step of forming an electroless plating layer by applying electroless plating on the surface-treated conductive coating layer, and the electroless plating layer The gist is a partial plating method for a resin product including an electroplating step of forming an electroplating layer by performing electroplating on the resin product.

[0011]

According to the invention described in claim 1, first, in the step of forming the conductive coating film layer, the plating on the surface of the base material made of a resin having poor plating property and formed into a predetermined shape is performed. A conductive paint containing a conductive powder in the paint is applied to a required portion. By this coating, a conductive coating film layer is formed. Further, in the surface treatment step, the surface treatment is performed by removing at least the paint matrix on the surface layer side of the conductive coating film layer. Then, in the electroplating step, electroplating is performed on the surface-treated conductive coating layer to form the electroplating layer.

As described above, according to the present invention, the surface area of the electroconductive coating layer is exposed by increasing the exposed area of the electroconductive powder by performing the surface treatment process after forming the electroconductive coating layer. Sometimes conductivity is imparted. Therefore, the electroplating layer is easily and surely formed, and the electroplating layer firmly adheres to the conductive powder.

Further, the surface treatment makes the surface side of the conductive coating film uniform and smooth, so that the electroplating layer formed thereon is also uniform and smooth. Further, according to the invention of claim 2, in the electroless plating step, electroless plating is performed on the conductive coating layer formed in the conductive coating layer forming step of the invention of claim 1. The electroless plating layer is formed by applying. Moreover, an electroplating layer is formed by performing electroplating on the electroless plating layer.

As described above, according to the present invention, the electroless plating layer is formed with the conductive powder on the surface side of the conductive coating film layer as the nucleus. Therefore, the electroless plating layer imparts conductivity during electroplating, and the electroplating layer is easily and reliably formed. Then, finally, the electroplating layer firmly adheres to the electroconductive coating layer via the electroless plating layer.

Further, the formation of the electroless plating layer makes the outermost surface side uniform and smooth, so that the electroplating layer formed thereon is also uniform and smooth. Furthermore, according to the invention described in claim 3, both the effects described in claims 1 and 2 are achieved.

[0016]

【Example】

(First Embodiment) A first embodiment in which the present invention is embodied in a vehicle front grill 1 as a resin product will be described with reference to FIGS.
It will be described based on.

A front grill 1 as shown in FIG. 2 is mounted on the front surface of the vehicle. As shown in FIGS. 1 and 3, the front grill 1 includes a front grill main body (hereinafter, referred to as “AES (acrylonitrile-ethylene-styrene) resin base material mixed with a predetermined pigment).
It is equipped with 2). In addition, this AES
The resin is a resin that is difficult to directly plate. An electroplating layer 3 is formed on a part of the design surface of the grill body 2, that is, a part of the front surface (see FIG. 3).
Then the part shown in a mesh). Therefore, the portion other than the electroplated layer 3 is in a state where the pigmented AES resin is exposed.

More specifically, as shown in FIGS. 2 and 3, the front grill 1 includes a frame 5 having a substantially rectangular front shape, a plurality of sub-partition plates 6 extending laterally in the frame 5, and a frame 5.
It has a plurality of connecting plates 7 extending in the longitudinal direction, a mounting plate 8 for mounting a mark plate (not shown) in the central portion, and a main partition plate 9 extending from the frame 5 toward the mounting plate 8. . The electroplating layer 3 is formed mainly on the front side portion of the frame 5 and on the front side portion of the main partition plate 9.

FIG. 4 is an enlarged front view showing a part of the main partition plate 9 (α portion in FIG. 3), and FIG. 5 is an AA line in FIG.
It is a line sectional view. As shown in these figures and FIG. 1, the electroplating layer 3 is formed on the front side of the grill body 2.
The front side step portion 10 protruding in the vertical direction from the frame 5 and the main partition plate 9 is provided at the peripheral edge portion of the base plate, that is, the boundary portion between the portion where the electroplating layer 3 is formed and the portion where the electroplating layer 3 is not formed.
Is formed in a ring shape. And this front side step portion 1
At 0, a simple groove 11 having a substantially U-shaped cross section for a parting is formed in an annular shape (closed curve shape). Furthermore, the grill body 2
An electrode projection 12 is formed on the rear surface side of the vehicle so as to project in the rear surface direction (vehicle rear direction).

As shown in FIG. 1, a conductive coating layer 16 is formed between the grill body 2 and the electroplating layer 3 in this embodiment. The conductive coating film layer 16 is formed by drying and solidifying the conductive coating material in which nickel powder is mixed in the one-pack type thermoplastic acrylic coating material. That is, as shown in FIG. 8 or FIG. 9, the conductive coating film layer 16 is composed of a paint matrix 17 and a nickel powder 18 as a metal powder dispersed in the matrix 17, and has a thickness of “50 μm”. It is formed to a degree.

Further, in this embodiment, the surface of the conductive coating layer 16 on the surface layer side is polished by sanding. By this surface treatment, the paint matrix 17 on the surface layer side of the conductive coating film layer 16 is removed by polishing, and the area occupied by the nickel powder 18 on the surface layer surface of the conductive coating film layer 16 becomes relatively large. There is.

The electroplating layer 3 has a thickness of "20".
˜50 μm ”and is composed of a strike plating layer made of nickel and a general electroplating layer.
More specifically, the general electroplating layer is formed by various metal platings in the order of a copper plating layer, a semi-bright nickel plating layer, a bright nickel plating layer, and a chrome plating layer (all not shown) from the lower layer. ing.

Further, various plating solutions for forming each metal plating forming the plating layer 3 will be described. First, the plating solution for forming the strike plating layer which is the lowermost layer of the electroplating layer 3 is nickel sulfate 25
0 g / L, nickel chloride 30 g / L and boric acid 30 g / L
It contains. In addition, the plating solution for forming the copper plating layer of the general electroplating layer is copper sulfate 200 g /
L, sulfuric acid 50 g / L, hydrochloric acid 0.01 g / L and a slight amount of brightener. Furthermore, the plating solution for forming the semi-bright nickel plating layer is 280 g of nickel sulfate /
L, nickel chloride 45 g / L, boric acid 40 g / L and a slight amount of brightener. In addition, the plating solution for forming the bright nickel plating layer is 240 g of nickel sulfate.
/ L, 45 g / L of nickel chloride, 30 g / L of boric acid, and a slight amount of brightener and additives. In addition, the plating solution for forming the chromium plating layer contains chromic anhydride 250 g / L, sodium silicofluoride 10 g / L, and sulfuric acid 1 g / L.

Next, the operation and effect of manufacturing the front grill 1 will be described. First,
The grill main body 2 is molded by a known mold molding method.

Subsequently, as shown in FIG. 6, the grill body 2
The portion that does not require plating is covered with the electroforming mask 19, and the conductive paint is applied to the surface that requires plating, that is, the portion surrounded by the simple groove 11. At this time,
The simple groove 11 serves as a parting portion of the coating material. Then, after the application, the conductive coating film layer 16 is formed by heating and drying at 80 ° C. for 30 minutes.

Here, as shown in FIG. 7, fine irregularities are formed on the surface side of the conductive coating layer 16 due to the presence of the nickel powder 18, and the nickel powder 18 on the surface side is coated. It is often covered by the film of the film matrix 17. Therefore, in the present embodiment, the conductive coating film layer 16 in such a state is sanded (coarseness: # 15).
00 or # 2000). Then
As shown in FIG. 8 or FIG. 9, the exposed area of the nickel powder 18 on the surface side of the conductive coating film layer 16 is increased, and the unevenness is made uniform and smooth as compared with the case where no surface treatment is performed. .

Next, after performing an acid activation treatment (a treatment of immersing it in an acidic solution to remove oxides on the surface), it is subjected to a strike plating step. In the strike plating step, the conductive coating layer 16 is formed, and the grill body 2 which has been surface-treated and acid-activated is dipped in the plating solution for forming the strike plating layer for a predetermined time. At the same time, the portion requiring plating is electrically connected. Then, since the AES resin is exposed at the portion that does not require plating and electrical conduction is cut off, no plating is formed on it. On the other hand, in the portion requiring plating, the strike plating layer is formed relatively thin on the surface of the conductive coating film layer 16. At this time, since the exposed area of the nickel powder 18 on the surface side of the conductive coating film layer 16 is increased, a predetermined conductivity is secured. Therefore, the strike plating layer is easily and surely formed, and the strike plating layer firmly adheres to the nickel powder 18.

Further, by the surface treatment, the conductive coating layer 16
Since the surface layer side of is uniformized and smoothed, the strike plating layer formed thereon can also be uniform and smooth.

Then, in the copper plating step, the semi-bright nickel plating step, the bright nickel plating step and the chrome plating step, operations similar to those in the strike plating step are performed. Then, a general electroplating layer having a multilayer structure is formed on the strike plating layer. In this way, the electroplating layer 3 including the strike plating layer and the general electroplating layer is formed only in the portion requiring plating.

As described above, according to this embodiment,
By performing the surface treatment after forming the conductive coating film layer 16, the exposed area of the nickel powder 18 on the surface layer side of the conductive coating film layer 16 is increased, and conductivity is imparted to the surface layer side during electroplating. be able to. Therefore, the electroplating layer 3 including the strike plating layer can be easily and
It can be reliably formed. Moreover, electroplating layer 3
To the nickel powder 18 or the conductive coating layer 1
6. As a result, the grill body 2 can be firmly attached.

Incidentally, as a result of actually performing the peeling test of the electroplating layer 3, in the prior art, interfacial peeling occurred, whereas in the present example, cohesive failure occurred and the adhesion strength was significantly improved. It was confirmed that it was done.

By the surface treatment by sanding, the surface side of the conductive coating film layer 16 is made uniform and smooth. Therefore, the electroplating layer 3 formed thereon can also be made uniform and smooth, and the formation of irregularities can be suppressed. As a result, the appearance quality can be significantly improved.

Further, in this embodiment, the electroplated layer 3
The other parts have a structure in which the base material is exposed, but in this embodiment, electroless plating is not performed. Therefore, etching or the like at the time of electroless plating is not performed, and fine unevenness due to etching or the like is not formed on the non-plated portion. As a result, even if there is a portion where the base material is exposed as in the present embodiment, the exposed portion does not whiten and exhibits a good appearance.

In addition, in this embodiment, the simple groove 11 on the front side serves as the boundary between the electroplated layer 3 and the exposed portion. For this reason, the parting portion of the boundary portion is clearly formed instead of the zigzag shape. As a result, the parting line can be made clear and clear, and further, the appearance quality can be further improved.

(Second Embodiment) Next, a second embodiment in which the present invention is embodied in a vehicle grill guard 21 as a resin product will be described with reference to FIGS.

A front inverted U-shaped grille guard 21 as shown in FIG. 11 is mounted on the upper part of the bumper on the front surface of the vehicle. This grill guard 21
A grill guard body (hereinafter referred to as a guard body) 22 as a base material is provided. The guard body 22 has a pipe shape and is made of nylon-12. In addition,
This nylon-12 is also a resin that is difficult to plate directly, like the AES resin in the first embodiment.

A plating layer 23 is formed in the central portion of the guard body 22. Furthermore, the plating layer 2
A coating layer 24 is formed on both sides of the guard body 22 except for 3. It should be noted that the mounting portions 2 for protruding further downward and attached to the vehicle body are provided at the lower portions of both side portions.
5 are integrally formed.

As shown in FIG. 10, between the plating layer 23 and the coating layer 24, a simple groove 2 having a substantially U-shaped cross-section for parting.
6 is formed. That is, the plating layer 23 and the coating layer 24 are formed with the simple groove 26 as a boundary. In this embodiment, the plating layer 23 is the electroless plating layer 27.
And an electroplating layer 28. A conductive coating layer 29 is formed between the guard body 22 and the electroless plating layer 27. The conductive coating film layer 29 is formed by drying and solidifying the conductive coating material in which nickel powder is mixed in the two-component polyurethane coating material. That is, the conductive coating film layer 29 is composed of a paint matrix and nickel powder as a metal powder dispersed in the same as in the first embodiment.

Also in this embodiment, the surface of the electroconductive coating layer 29 on the surface layer side is polished by sanding. By this surface treatment, the paint matrix on the surface layer side of the conductive coating film layer 29 is removed by polishing, and the area occupied by the nickel powder on the surface layer surface of the conductive coating film layer 29 becomes relatively large.

The electroplating layer 28 is composed of a strike plating layer made of nickel and a general electroplating layer, as in the first embodiment. Further, the electroless plating layer 27 is made of nickel. The plating solution for forming the electroless plating layer 27 contains, for example, 7 g / L of nickel sulfate (metal nickel conversion), 16 g / L of sodium hypophosphite, and 120 g / L of sodium phosphite.

On the other hand, the coating layer 24 is formed by applying a two-component polyurethane paint (Origin Electric Co., Ltd., trade name: Origin Plate Z). Next, the operation and effect of manufacturing the grill guard 21 will be described.

First, the guard main body 22 is molded by a known mold molding method. Then, as shown in FIG. 12, the portion of the guard body 22 that does not require plating is electrocast mask 3
The surface is covered with 0, and the conductive paint is applied to the surface requiring plating, that is, the portion surrounded by the simple groove 26. At this time, the simple groove 26 just serves as a parting portion of the paint. Then, after the application, the conductive coating film layer 29 is formed by heating and drying at 80 ° C. for 30 minutes.

Here, as in the case of the first embodiment, the conductive coating layer 29 is sanded (coarseness: # 1500 or # 1500).
2000). Then, the exposed area of the nickel powder on the surface side of the conductive coating film layer 16 is increased, and the unevenness is made uniform and smooth.

Next, after the same acid activation treatment as in the first embodiment, it is subjected to an electroless plating process. That is, in the electroless plating step, the conductive coating layer 29 is formed, the surface of the guard body 22 is further subjected to the acid activation treatment, and the guard body 22 is plated to form the electroless plating layer. Immerse in the solution for a predetermined time. Then, as shown in FIG. 13, electroless plating grows with the nickel powder as a nucleus, and the electroless plating layer 27 is formed only on the surface where the conductive coating film layer 29 is formed. At this time, since the exposed area of the nickel powder on the surface side of the conductive coating film layer 29 is increased, a predetermined conductivity is secured.
Therefore, the electroless plating layer 27 is easily and reliably formed, and the electroless plating layer 27 is firmly adhered to the nickel powder.

Further, by the surface treatment, the conductive coating layer 16
Since the surface layer side thereof is made uniform and smooth, the electroless plating layer 27 formed thereon can also be made uniform and smooth. Further, by forming the electroless plating layer 27 itself, the outermost surface side is made uniform and smooth. That is, the unevenness on the outermost surface side due to the presence of the nickel powder,
This is offset by the electroless plating layer 27 that has been grown and formed.

Subsequently, a strike plating step, a copper plating step, a semi-bright nickel plating step, a bright nickel plating step and a chrome plating step are performed, whereby a multi-layer is formed on the electroless plating layer 27 as shown in FIG. The structural electroplating layer 28 is formed. In this way, the plating layer 23 including the electroless plating layer 27 and the electroplating layer 28 is formed only in the portion requiring plating.

When the legs (protrusions) for plating cannot be formed due to the design surface as in this embodiment, the needle electrode for electroplating is attached to the guard body 22 in the electroplating step. It is possible to employ a measure such as keeping in contact with the conductive coating film layer 29 (or the electroless plating layer 27) formed on the plated portion.

Then, as shown in FIG. 15, the plating layer 23 is covered with an electroforming mask 31 and the non-plated surface is coated. After drying, the coating layer 2 is formed on the non-plated surface.
4 is formed and the above-mentioned coating is released to obtain the grill guard 21.

As described above, according to this embodiment,
The electroless plating layer 27 was formed on the conductive coating layer 28. Therefore, in addition to the function and effect described in the first embodiment, the formation of the electroless plating layer 27 itself makes the outermost layer side more uniform and smooth. That is, the unevenness on the outermost layer side due to the presence of the nickel powder is offset by the electroless plated layer 27 that has been grown and formed. Therefore, the electroplating layer 28 formed on the electroless plating layer 27 can be made more uniform and smooth. As a result, it is possible to further improve the appearance quality.

The present invention is not limited to the above embodiments,
For example, the configuration may be as follows. (1) In each of the above-described examples, the surface treatment is performed by polishing the conductive coating layers 16 and 29 by sanding. However, other than that, the coating film of the paint matrix 17 on the surface may be dissolved and removed by, for example, immersing in an acidic solution. Even if such a method is adopted, the exposed area of the nickel powder on the surface side of the conductive coating layers 16 and 29 can be increased, and the plated surface can be made uniform and smooth.

(2) The non-plated surface may or may not be painted. (3) In each of the above-described embodiments, the simple grooves 11 and 26 are formed on the base material. However, this is only formed to improve the appearance of the parting off, and the grooves are separately omitted. Good.

(4) In each of the above embodiments, ABS resin or nylon-12 was adopted as the resin material constituting the base material. Any material such as polyethylene or polyethylene may be used.

(5) In each of the above embodiments, the nickel powder 18 was used as the conductive powder, but other metal powder may be used, or a granular material slightly larger than the powder. It may be.

(6) In the first embodiment, the present invention is embodied in a front grill for a vehicle, and in the second embodiment, it is embodied in a grill guard 21 for a vehicle. , Vehicle back panel, vehicle louver, vehicle pillar garnish,
It may also be embodied in a vehicle quarter vent, a vehicle mark plate, and the like. Further, the present invention is not limited to the above resin products for automobiles, and the present invention can be embodied in other resin products partially having a plating layer.

(7) The composition of each plating layer in each of the above embodiments is not limited. Also,
The composition of the plating solution for forming the plating is not limited at all.

The technical idea which is not described in each claim of the claims and which can be understood from the above-mentioned embodiment will be described below together with its effect. (A) In the partial plating method for a resin product according to claim 2 or 3, the surface treatment step is characterized in that the paint matrix on the surface side of the conductive coating film layer is removed by polishing or dissolution. . According to such a method, the effects of the present invention can be achieved easily and reliably.

[0057]

As described above in detail, according to the method for partially plating a resin product according to the present invention, when plating is applied to a portion of the surface of a resin base material which is difficult to plate, the base material is required to be plated. It has an excellent effect that it is possible to improve the adhesiveness of the plating with respect to and to improve the appearance quality.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a main partition plate of a grill according to a first embodiment.

FIG. 2 is a front view showing a front grill in the first embodiment.

FIG. 3 is a diagram showing a plated portion of the front grille in the first embodiment, and is a schematic diagram in which the front grille is developed on the front surface and the back surface.

FIG. 4 is an enlarged front view showing a main partition plate of the front grill.

FIG. 5 is a sectional view taken along line AA of FIG. 4 in the first embodiment.

FIG. 6 is a partial cross-sectional view showing a conductive coating film layer forming state of the first embodiment.

FIG. 7 is an enlarged cross-sectional view showing a conductive coating film layer of the first embodiment.

FIG. 8 is an enlarged cross-sectional view schematically showing one aspect of the surface treatment of the conductive coating film layer in the first example.

9 is an enlarged cross-sectional view schematically showing an aspect different from FIG.

FIG. 10 is an enlarged sectional view of a grill guard according to a second embodiment.

FIG. 11 is a perspective view of a grill guard according to a second embodiment.

FIG. 12 is a partial cross-sectional view showing a state in which a conductive coating film layer is formed on the guard body of the second embodiment.

FIG. 13 is a cross-sectional view showing a state of forming an electroless plating layer according to a second embodiment.

FIG. 14 is a cross-sectional view showing a state of forming an electroplating layer according to a second embodiment.

FIG. 15 is a cross-sectional view showing a state in which a coating layer of the second embodiment has been formed.

[Explanation of symbols]

1 ... Front grill as a resin product, 2 ... Grill main body as a base material, 3, 28 ... Electroplating layer, 16, 29 ...
Conductive coating layer, 17 ... Paint matrix, 18 ... Nickel powder as conductive powder, 21 ... Grill guard as resin product, 22 ... Guard body as base material, 27 ... Electroless plating layer.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location B05D 7/02 7415-4F 7/14 L

Claims (3)

[Claims] 1. A conductive powder (18) is added to a coating material on a surface of a base material (2, 22) which is made of a hard-to-plate resin and has a predetermined shape, where plating is required. A conductive coating film layer forming step of forming a conductive coating film layer (16, 29) by applying a conductive coating material containing, and at least a surface layer side of the conductive coating film layer (16, 29) A surface treatment step of removing the paint matrix (17) in (1), and electroplating on the surface-treated conductive coating layer (16, 29). (3,2
8) An electroplating step of forming 8), which is a partial plating method for a resin product. 2. A conductive powder (18) is added to a coating material on a surface of a base material (2, 22) made of a resin having a poor plating property and molded into a predetermined shape, where plating is required. A conductive coating film layer forming step of forming a conductive coating film layer (16, 29) by applying a conductive coating material containing the same; and an electroless coating on the conductive coating film layer (16, 29). An electroless plating step of forming an electroless plating layer (27) by plating, and an electroplating layer (3, 28) is formed by performing electroplating on the electroless plating layer (27). A method for partially plating a resin product, which comprises an electroplating step. 3. A conductive powder (18) is added to a coating material on a surface of a base material (2, 22) made of a resin having a poor plating property and molded into a predetermined shape, where plating is required. A conductive coating film layer forming step of forming a conductive coating film layer (16, 29) by applying a conductive coating material containing, and at least a surface layer side of the conductive coating film layer (16, 29) A surface treatment step of performing a surface treatment by removing the paint matrix (17) in (1), and an electroless plating by performing electroless plating on the surface-treated conductive coating layer (16, 29). Plating layer (2
A resin characterized by comprising an electroless plating step of forming 7) and an electroplating step of forming an electroplating layer (28) by performing electroplating on the electroless plating layer (27). Partial plating method for products.