JPH08160094A - Method and device for inspecting printed wiring board - Google Patents

Abstract

PURPOSE: To secure stable electrical contact between points to be inspected and a printed wiring board inspecting device by preventing the points to be inspected from being damaged and, at the same time, to make the device to cope with a printed wiring board on which wiring is printed at a high density. CONSTITUTION: The rugged inspection terminals 141 and 151 of position converting substrates 14 and 15 are brought into contact with points 10a and 10b to be inspected on the front and rear surface of a printed wiring board 10 and, after the board 10 is finely vibrated in the direction of its surface, electrical inspections are performed on a conductor pattern on the board 10. The insulating material coating the contacting surfaces of the points 10a and 10b is removed without scratching the surfaces of the metals constituting the points 10a and 10b by utilizing the friction between the points 10a and 10b and terminals 141 and 141.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting a printed wiring board and an apparatus therefor, and particularly for inspecting a high-density conductor pattern for electrical opens and shorts (bare board test).
However, the present invention relates to a method and an apparatus for inspecting a printed wiring board, which is suitable for determining the quality of a product.

[0002]

2. Description of the Related Art An inspection apparatus using a contact probe is known as the most typical conventional printed wiring board inspection apparatus of this kind. In this inspection device, a large number of contact probes are arranged on an insulating substrate according to the arrangement pattern of the inspection points of the printed wiring board, and the printed wiring board to be inspected is superposed and pressed onto the insulating substrate. Contact the pads and through holes, which are the inspection points of the printed wiring board for inspection, and supply the voltage from the pattern inspection section through the contact probe between the pads or through holes corresponding to the inspection points to open the conductor pattern. It is for inspecting (breaking wire), short circuit (insulation failure) and the like.

As a conventional printed wiring board inspecting apparatus, as shown in FIG. 10, a pad on one surface of an insulating substrate 1a is aligned with the through hole (or pad) 3 of the inspected printed wiring board 2. 4 are formed, on the other surface of the insulating substrate 1a, the same number of through holes (or pads) 5 as the pads 4 formed on one surface are formed in a matrix at a predetermined pitch, and are formed on one surface. Pad 4
And through hole (or pad) 5 formed on the other surface
The position conversion board 1 is electrically connected in a one-to-one relationship with the surface of the position conversion board 1 on the side of the pad 4 and the printed wiring board 2 to be inspected. By applying pressure through the anisotropic conductive rubber 6 having the electric conductivity, an electrical connection is made between the through hole 3 of the inspected printed wiring board 2 and the pad 4 of the position conversion substrate 1 which are opposed to each other by the anisotropic conductive rubber 6. Are electrically connected to each other, and contact probes 7 arranged in a matrix are press-fitted into the through holes 5 of the position conversion substrate 1, and a voltage is supplied from a pattern inspection unit (not shown) through the contact probes 7 to form conductors. This is for inspecting the pattern for open (break), short (insulation failure), etc.

[0004]

However, in the individual jig method using the above-mentioned conventional contact probe, the contact probes arranged in a matrix on the insulating substrate interfere with each other both electrically and mechanically. The arrangement pitch is 2 due to the fact that the arrangement structure must not be
The limit is 00 μm. Therefore, the pitch of the inspection points of the printed wiring board that can be inspected by this individual jig is 20.
ICs for printed wiring boards and chip-on-boards for multi-chip modules that can only handle up to about 0 μm
It cannot be used for inspection of a printed wiring board having inspection points with a pitch of 200 μm or less such as a pad for connecting a chip or the like. Further, since this type of contact probe is directly pressed into contact with a pad or the like, which is an inspection point of a printed wiring board for inspection, the tip shape of the contact probe,
Depending on the contact method and the speed at the time of contact, the pad, etc. may be damaged, and depending on the load applied from the contact probe to the pad side, in the case of a printed wiring board whose insulating layer is made of only resin that does not contain glass cloth, etc. This may cause cracks in the insulating layer.

Further, in the conventional individual jig using the contact probe, the inspection points of the printed wiring board are generally not evenly distributed over the entire area of the printed wiring board. When the contact probe is pressed into contact with the printed wiring board, an unbalanced load is generated on the printed wiring board, which may cause the printed wiring board to bend, resulting in poor contact between the contact probe and the pad. However, there are problems such as peeling of the conductor pattern and cracks in the insulating layer in the case of a printed wiring board in which the insulating layer is made of only resin that does not contain glass cloth or the like.

Further, as shown in FIG. 10, in the individual jig method using the position conversion substrate 1 and the anisotropic conductive rubber 6, the pads or the like of the printed wiring board are damaged by the contact probe or the insulating layer is cracked. There is no fear of causing. However, since there is a limit to the resolution for making each inspection point of the anisotropic conductive rubber 6 conductive only in the thickness direction, it can be applied only to a printed wiring board having an inspection point pitch of up to about 200 μm. .
In addition, since anisotropic conductive rubber has low durability, running cost is high, and since conductive resistance is higher than that of contact probe, it is vulnerable to dust, dust, dirt, etc., and there is a problem that poor contact easily occurs. .

On the other hand, the surface of the inspected pad or the like of the inspected printed wiring board and the surface of the inspecting terminal on the inspecting side in contact with these pads or the like are more or less covered with an insulating material such as an oxide film or a minute foreign substance. It is normal to have

Conventionally, as a method of removing such an insulating material to ensure reliable contact between the pad to be inspected and the like and the inspection terminal, a high voltage is applied at the time of pattern inspection, or the inspection terminal is a contact probe. In Case of,
The tip of the tip is made sharp to pierce the surface of the pad to be inspected to destroy the insulating material, or a high load is applied to destroy the insulating material and simultaneously increase the contact area with the pad. It was

However, in the method of applying a high voltage, the insulating layer may be destroyed. In that case, there arises a problem such as a decrease in insulation. In addition, when the contact probe is pierced on the surface of a pad or the like or is pressed with a high load, scratches are generated on the surface of the pad or the like, and the metal surface of the pad or the like exposed by the scratch is oxidized and components such as wire bonding are attached. There are problems such as a result that adversely affects the implementation. Furthermore, if a crack is generated in the insulating layer of the printed wiring board by pressing the contact probe against the pad with a high load, depending on the environment, moisture may accumulate in the crack part and the insulation may deteriorate, Due to the heat generated by the generated components, the water accumulated in the cracks may expand and destroy the module.

The present invention has been made in view of the above circumstances, and an object of the present invention is to ensure stable electrical contact without damaging a point to be inspected, thereby providing a printed wiring of high density wiring. The inspection of the board can be performed with high reliability. An object of the present invention is to provide a method for inspecting a printed wiring board and an apparatus therefor.

[0011]

In order to achieve the above object, the invention of claim 1 is characterized in that an inspection terminal corresponding to an inspected point of an inspected printed wiring board is provided on one surface of the insulative substrate, On the other side, a position conversion board having a terminal electrically connected to the inspection terminal and arranged at a predetermined position on the other side, the inspection terminal comes into contact with an inspected point of the inspected printed wiring board. A method for inspecting a printed wiring board, wherein the printed wiring board is superposed on the inspected printed wiring board in this way, and an electrical inspection of the inspected printed wiring board is performed by an inspection unit connected to the terminals arranged at the predetermined positions. The inspection terminal of the position conversion board is brought into contact with the inspection point of the inspection printed wiring board, and the inspection wiring board and the position conversion board are inspected. And performing electrical inspection after giving the minute vibration in the plane direction of the objective printed circuit board in at least one.

Here, the "predetermined position" means a position where the inspection unit can be connected, for example, 100 m.
il (= 2.54mm), 50mil, 25mil,
Even at grid-like positions at intervals of 20 mil, 12.5 mil, or the like, they may be provided at the ends of the position conversion substrate in the form of terminals.

The invention of claim 2 is characterized in that, in the invention of claim 1, the surface of the inspection terminal which comes into contact with the inspected point has irregularities. Claim 3
In the invention of claim 1 or 2, when the inspection terminal of the position conversion board contacts the inspection point, the position conversion board is elastic according to the height level of the inspection point. It is characterized by being deformed.

According to a fourth aspect of the present invention, an inspection terminal corresponding to a point to be inspected of the printed wiring board to be inspected is provided on one surface of the insulating substrate, and the other side is electrically connected to the inspection terminal. The position conversion board having the terminals arranged at the positions is superposed on the inspected printed wiring board so that the inspection terminals are in contact with the inspected points, and the terminals are arranged at the predetermined positions. A method of inspecting a printed wiring board for electrically inspecting the inspected printed wiring board by an inspection unit connected to a method, comprising: a position conversion having a pair of rigidity for contacting both sides of the inspected printed wiring board. The inspection terminal of the position conversion board is brought into contact with an inspected point of the inspected printed wiring board between the boards, and the inspected print is performed. The wire board is housed so that it can be finely moved, and the position conversion board and the printed wiring board to be inspected are subjected to microvibration in the plane direction of the inspected board, and then connected to the inspecting section for electrical inspection. It is characterized by performing. The invention of claim 5 is characterized in that the surface of the inspection terminal that comes into contact with the inspected point has irregularities.

According to a sixth aspect of the present invention, an inspection terminal corresponding to a point to be inspected of the printed wiring board to be inspected is provided on one surface of the insulating substrate, and the other side is electrically connected to the inspection terminal and predetermined. And a means for superposing the position conversion board having terminals arranged at the positions on the inspected printed wiring board so that the inspection terminals come into contact with the inspected points, and arranged at the predetermined positions. Connected to the terminal, the inspection means for electrically inspecting the inspected printed wiring board, and the inspected terminal of the position conversion board in contact with the inspected point of the inspected printed wiring board. A vibrating means for slightly vibrating at least one of the printed wiring board and the position conversion board in the plane direction of the printed wiring board to be inspected. Is shall.

The invention of claim 7 is characterized in that, in the invention of claim 6, unevenness is formed on the surface of the inspection terminal which comes into contact with the inspected point. According to an eighth aspect of the present invention, in the sixth or seventh aspect of the present invention, the insulating substrate of the position conversion substrate is made of a flexible electrically insulating material, and the position conversion substrate is opposite to the inspection terminal formation surface. It is characterized in that a cushion layer is provided on the surface side. According to a ninth aspect of the present invention, in the fifth and eighth aspects of the present invention, the insulating substrate of the position conversion substrate is formed of a cushion layer and a flexible electric insulating layer laminated and adhered on both front and back surfaces of the cushion layer. It is characterized by

[0017]

In the method of the present invention, after the inspection terminal of the position conversion board is brought into contact with the inspection point of the inspection printed wiring board, at least one of the inspection printed wiring board and the position conversion board is inspected and printed. By slightly vibrating the wiring board in the plane direction, the insulating material that covers the contact surface of the inspected point and the inspection terminal can be removed without damaging the metal surface, thus eliminating damage to the inspected point. In addition to ensuring stable electrical contact, it can be applied to printed wiring boards with high-density wiring without using anisotropic conductive rubber. Further, in the method of the present invention, since the surface of the inspection terminal that comes into contact with the inspected point has irregularities, the insulating material covering the contact surface of the inspected point and the inspection terminal is removed in the concave portions of the irregularities. Since it can be removed by inserting it, more stable electrical contact can be secured. Further, in the method of the present invention, when the inspection terminal of the position conversion board comes into contact with the inspection point, the position conversion board is elastically deformed according to the height level of the inspection point, so that Even if there are variations in height, this can be followed, and electrical contact between the inspection terminal and the inspected point is ensured. Further, in the method of the present invention, the inspected printed wiring board is housed between a pair of rigid position conversion boards that contact both front and back surfaces thereof, and at least one of the position conversion board and the inspected printed wiring board. After applying a slight vibration in the plane direction of the printed circuit board to be inspected, by connecting to the inspection unit and performing an electrical inspection, a slight vibration is applied before connecting to the inspection machine, and then connected to the inspection machine. It becomes possible to use the inspection machine having the conventional contact probe as it is, and further improve the operation efficiency of the inspection machine.

Further, in the apparatus of the present invention, at least one of the printed wiring board to be inspected and the position conversion board is slightly vibrated in the plane direction of the printed wiring board to be inspected by vibrating means so that the point to be inspected and the inspection Since the insulating material that covers the contact surface of the terminal can be removed without causing scratches on the metal surface, damage to the inspected point is prevented, stable electrical contact is secured, and anisotropic conductive rubber is used. It can also be used for printed wiring boards with high-density wiring. Further, in the present invention, since the surface of the inspection terminal that comes into contact with the inspected point has unevenness, the insulating material that covers the contact surface of the inspected point and the inspected terminal is taken into the concave portion of the uneven portion. Since it can be removed, more stable electrical contact can be secured. Further, in the present invention, the insulating substrate of the position conversion substrate is made of a flexible electrically insulating material, and a cushion layer is provided on the side of the position conversion substrate opposite to the inspection terminal forming surface, so that the inspection target Even if the height of the inspected point of the printed wiring board for automobiles varies, it is possible to follow this and ensure electrical contact between the inspecting terminal and the inspected point. Further, in the device of the present invention, the insulating substrate of the position conversion substrate is formed of the cushion layer and the flexible electric insulating layer laminated and adhered on both the front and back surfaces of the cushion layer, so that the printed wiring board for inspection can be covered. Even if there is variation in the height of the inspection point, it can be followed, and the electrical contact between the inspection terminal and the inspected point can be ensured.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration diagram showing a first embodiment of a printed wiring board inspection apparatus to which the method of the present invention is applied. FIG.
In the figure, reference numeral 10 denotes a printed wiring board for inspection (hereinafter, simply referred to as a printed wiring board). On the front surface and the back surface of the printed wiring board 10, inspection points (corresponding to pads or through holes on the inspection side) are provided. ) 10a and 10
b are formed respectively. The printed wiring board 10 is supported by a holder 11 that moves up and down.

In FIG. 1, reference numeral 12 denotes a lower support member which is installed on the back surface of the printed wiring board 10 so as to face each other in parallel. Reference numeral 13 denotes a lower support member which faces the front surface side of the printed wiring board 10 in parallel and vertically. It is an upper support member that is movably arranged, a position conversion board 14 for the back surface of the printed wiring board 10 is fixed on the lower support member 12, and a position for the front surface of the printed wiring board 10 is on the lower surface of the upper support member 13. The conversion board 15 is fixed. The printed wiring board 10 is provided on the surface of the position converting board 14 for the back surface that faces the back surface of the printed wiring board 10.
The inspection terminals 141 that are in surface contact with each of the inspected points 10b are formed, and the terminals 142 that are electrically connected to the inspection terminals 141 are provided on the back surface of the wiring on the position conversion board 14. It is provided at the plate end of the position conversion substrate 14. The terminals 142 are connected to the inspection unit 1 via unillustrated lead wires or the like.
6 is connected.

In this example, the terminals 142 are provided at the plate ends of the position conversion substrate, but the terminals 142 may be provided in a grid pattern and connected to an inspection section provided with lead wires, probes, etc. in a grid pattern. Further, as shown in FIG. 2, the surface of the inspection terminal 141 has irregularities 14 of about 20 μm or less.
1a is formed. The unevenness 141a is formed by, for example, press working or plating treatment with increased current density.

The printed wiring board 1 is provided on the surface of the surface position conversion board 15 facing the surface of the printed wiring board 10.
The inspection terminals 151 that are in surface contact with the inspection points 10a of 0 are formed, and the terminals 152 electrically connected to the inspection terminals 151 are formed on the rear surface of the inspection terminals 151 on the position conversion board 14. It is provided at the plate end of the position conversion substrate 14 via the, but this is arranged in a predetermined lattice shape. This each terminal 1
Reference numeral 52 is connected to the inspection unit 16 via a lead wire (not shown). Further, as shown in FIG. 2, the surface of the inspection terminal 151 has irregularities 151 of about 20 μm or less.
a is formed. The unevenness 151a is formed by, for example, press working or plating treatment with increased current density. In addition, the holder 11 of the printed wiring board 10
An oscillating device 17 for vibrating the printed wiring board 10 in the plane direction with an amplitude of about 10 to 20 μm is connected.

When the printed wiring board is to be electrically inspected by the inspection apparatus constructed as described above, the printed wiring board 10 supported by the holder 11 is placed on the lower support member 1.
2 is set on the back surface position conversion substrate 14, the upper support member 13 is lowered, the front surface position conversion substrate 15 is lightly pressed against the printed wiring board 10, and the vibration device 17 is activated to mount the printed wiring board 10. Slightly vibrates for a predetermined time in the plane direction. As a result, the contact surfaces of the inspection points 10a and 10b and the inspection terminals 141 and 151 having irregularities are rubbed against each other to remove the insulating substances covering the contact surfaces without causing scratches on the metal surface. To do. Also, the insulating material is taken into the recess. As a result, the inspection points 10a and 10b and the inspection terminal 14
A good electrical contact state is established between 1 and 151. afterwards,
The vibration device 17 is stopped, the inspection unit 16 is operated, and a test voltage is supplied from the inspection unit 16 to inspect the conductor pattern for open (breakage), short-circuit (insulation failure), and the like.

In this embodiment as described above, the inspected points 10a and 10b on the front and back surfaces of the printed wiring board 10 are tested.
Inspection terminal 1 with unevenness of position conversion boards 14 and 15
41 and 151 are brought into contact with each other, the vibration device 17 is activated for a predetermined time, and the printer wiring board 10 is slightly vibrated in the planar direction.
Since the conductor pattern is electrically inspected, the inspected points 10a and 10b and the inspection terminal 141,
Due to the friction between the contact surfaces with 151, the insulating substances covering the contact surfaces can be removed without damaging the metal surface, and it is necessary to positively apply a load to the printed wiring board. Since there is no damage to the inspected point, even if the insulating layer is a printed wiring board made only of resin that does not contain glass cloth, cracks do not occur in the insulating layer of the printed wiring board, and stable electrical While ensuring contact, it can be applied to a printed wiring board with high-density wiring without using anisotropic conductive rubber.

Further, since the position conversion board can be manufactured by the same material and the same process as the printed wiring board,
The displacement between the inspection terminal and the point to be inspected due to thermal deformation can be minimized, and the position conversion board can be manufactured with the same accuracy as the printed wiring board, so it can be used for any printed wiring board with high-density wiring. It can be handled easily. Furthermore, it can be used for existing 100 mil universal wiring inspection machines, and since the inspection terminal is surface contact, it does not damage the inspected point.

Next, a second embodiment of the present invention will be described with reference to FIG. In FIG. 3, the same parts as those in FIG. 1 are designated by the same reference numerals, and the description of the structure will be omitted. As is clear from FIG. 3, the insulating substrate 211 of the rear surface position conversion substrate 21 installed on the lower support member 12 is formed from a flexible material such as a polyimide film material, and the surface of the insulating substrate 211 is formed. Is formed with uneven inspection terminals 212 that are in surface contact with each of the inspected points 10b of the printed wiring board 10, and are electrically connected to the respective inspection terminals 212 on the back surface thereof. Terminal 2
13 is provided in a peripheral portion of the insulating substrate 211 via a wiring provided on the insulating substrate 211. Further, a holder 214 for attaching the position conversion substrate 21 to the lower support member 12 is fixed to the peripheral portion of the insulating substrate 211, and the back surface of the insulating substrate 211 surrounded by the holder 214 and the upper support member 13 are surrounded. A cushion material 215 made of silicon rubber or the like is interposed between the upper surfaces.

Further, the insulating substrate 221 of the surface position conversion substrate 22 installed on the upper support member 13 is formed of a flexible material such as a polyimide film material, and the printed wiring is formed on the surface of the insulating substrate 221. Corresponding to each inspected point 10a of the plate 10, an inspection terminal 222 having an uneven surface contact is formed, and a terminal 223 electrically connected to each inspection terminal 222 is formed on the back surface thereof. It is provided in the peripheral portion of the insulating substrate 221 via the wiring provided on the insulating substrate 221. Further, a holder 224 for attaching the position conversion substrate 22 to the lower support member 13 is fixed to the peripheral portion of the insulating substrate 221, and the back surface of the insulating substrate 221 surrounded by the holder 224 and the upper support member 13 are surrounded. A cushion material 225 made of silicon rubber or the like is interposed between the lower surfaces. Then, while the printed wiring board 10 is sandwiched by the position conversion boards 21 and 22 from both sides, a slight vibration is applied to the printed wiring board in a width of 10 μm to 20 μm, and then a test voltage is supplied from an inspection unit (not shown). Thus, it is possible to inspect the conductor pattern for open (disconnection), short circuit (insulation failure), and the like.

In the second embodiment as described above, the same effects as those of the first embodiment can be obtained, and even if the height of the inspected point of the inspected printed wiring board varies, This has the effect of being able to follow this and ensuring the contact of the inspection terminal with the inspected point.

Next, a third embodiment of the present invention will be described with reference to FIG. 4, the same parts as those in FIG. 1 are designated by the same reference numerals, the description of the structure will be omitted, and the parts different from FIG. 1 will be mainly described. As is clear from FIGS. 4A and 4B, the inspected point 10b of the printed wiring board 10
The inspection terminal 311 is provided on the front surface facing the substrate, the terminal 312 is electrically connected to the inspection terminal 311 on the back surface, and positioning holes 313 are provided at four corners of the back surface position conversion substrate 31 having rigidity. Positioning pins 121 that are formed and engage with the positioning holes 313 are provided at the four corners of the upper surface of the lower support member 12. Further, on the front surface side of the four corners of the back surface position conversion substrate 31, coupling pins 315 also serving as positionings are provided via a printed wiring board supporting block 314 which also serves as a spacer.

Similarly, an inspection terminal 32 is formed on the surface of the printed wiring board 10 facing the inspected point 10a.
1, the terminal 322 electrically connected to the inspection terminal 321 is provided on the back surface, and the coupling pins 315 are provided at the four corners of the front surface position conversion board 32 having rigidity.
A coupling hole 323 which is also used for positioning is formed so as to engage with.

In the back surface position conversion board 31 and the front surface position conversion board 32 configured as described above, the printed wiring board 10 is set inside the supporting block 314 of the back surface position conversion board 31, and then, from the upper surface thereof. The surface position conversion board 32 is covered, and the connecting hole 323 is inserted into the connecting pin 31.
As shown in FIG. 4 (B), the box-type position conversion board having the printed wiring board 10 accommodated therein is assembled by engaging with 5. Here, there is a gap of about 10 to 20 μm between the printed wiring board 10 and the supporting block 314, and friction is generated between the inspected point and the inspection terminal when slightly vibrated. After that, the box-type position conversion substrate is slightly vibrated in the plane direction for a predetermined time by a vibrating device (not shown), and the contact surfaces of the inspected point and the inspection terminal are rubbed to remove the insulating material. In this state, the positioning hole 313 of the box-type position conversion board is inserted into the positioning pin 1 of the lower support member 12.
By engaging with 21, the box-type position conversion board is set on the lower support member 12. In this state, the contact probe 122 provided on the lower support member 12 on a predetermined grid electrically contacts the corresponding terminal 312. On the other hand, by lowering the upper support member 13, the contact probe 1 provided on the predetermined lattice
32 is electrically connected to the corresponding terminal 322. Then, by supplying a test voltage from an inspection unit (not shown), it is possible to inspect the conductor pattern for open (breakage), short-circuit (insulation failure), and the like.

In the third embodiment as described above, the same operation and effect as those of the first embodiment can be obtained, and a slight vibration can be given before connecting to the inspection machine and then connected to the inspection machine. This makes it possible to use the conventional inspection machine having the contact probe as it is, and further improve the operating efficiency of the inspection machine.

Next, a fourth embodiment of the present invention will be described with reference to FIG. In FIG. 5, the same parts as those in FIG. 1 are designated by the same reference numerals, the description of the configuration will be omitted, and the parts different from FIG. 1 will be mainly described. As is clear from FIG. 5, the insulating substrate 411 of the back side position conversion substrate 41 facing the inspected point 10b of the printed wiring board 10 is provided with a cushion layer 412 of an elastic material such as silicon rubber and having a desired thickness. From a flexible electric insulating layer 413 made of a polyimide film or the like laminated and adhered to the surface of the cushion layer 412, and a non-flexible electric insulating layer 414 such as glass epoxy laminated and adhered to the back surface of the cushion layer 412. Molded,
The printed wiring board 1 is formed on the electric insulating layer 413 on the front surface side.
The inspection terminals 415 having surface irregularities are formed corresponding to the inspection points 10b of 0, and the electrically insulating layer 414 on the back surface thereof is electrically connected to the inspection terminals 415 separately. The terminals 416 are arranged on a predetermined grid.

Similarly, the surface position conversion substrate 4 facing the inspected point 10a of the printed wiring board 10 is also provided.
The second insulating substrate 421 is a cushion layer 422 made of an elastic material such as silicon rubber and having a desired thickness.
22, a flexible electrical insulating layer 423 made of a polyimide film or the like laminated and adhered to the surface of the cushion layer 22, and a cushion layer 422.
Is formed from a non-flexible electric insulating layer 424 such as glass epoxy laminated and adhered to the back surface of the printed wiring board 10. The electric insulating layer 423 on the front surface side corresponds to each inspected point 10a of the printed wiring board 10. The inspection terminals 425 with unevenness are formed so as to be in surface contact with each other, and each of the inspection terminals 425 is formed on the back surface of the electrical insulating layer 424.
A terminal 426, which is electrically connected separately to the above, is arranged on a predetermined grid.

As shown in FIG. 5, the position converting board 41 for the back surface has guide posts 43 on the upper surface of the lower support member 12.
Is supported by a coil spring 44 toward the printed wiring board 10 side, and a contact probe 122 provided on a predetermined lattice on the lower support member 12 is electrically connected to a corresponding terminal 416. Is in contact with. The surface position conversion board 42 is supported on the upper surface of the upper support member 13 via a guide post 45 so as to be movable up and down, and a coil spring 46 allows the printed wiring board 1 to move.
The contact probe 132 provided on the predetermined lattice on the upper support member 13 is electrically contacted with the corresponding terminal 426 while being biased to the 0 side. The back surface position conversion substrate 41 and the front surface position conversion substrate 42 thus supported sandwich the printed wiring board 10 from both front and back surfaces, and then the printed wiring board 10 is slightly vibrated in the planar direction for a predetermined time. After stopping the slight vibration, by supplying a test voltage from an inspection unit (not shown), it is possible to inspect the conductor pattern for open (breakage), short (insulation failure), and the like.

In the fourth embodiment as described above, the same operation and effect as in the first embodiment can be obtained, and even if the height of the inspected point of the inspected printed wiring board varies, There is an effect that the inspection terminal can be surely electrically contacted with the inspected point and can be used in an existing inspection machine having a contact probe.

Next, a concrete example of the vibration device will be described. FIG. 6 shows a first embodiment of the vibrating device 17, in which a vibrating member 52 is supported on a supporting member 51 by a pair of guide rods 53 so as to be capable of expanding and contracting, and the vibrating member 52 is attached in a retracted direction by a spring 54. A cam 55 is disposed inside the vibrating member 52 while being urged, and the cam 55 is rotated to vibrate the printed wiring board 10 in contact with the outer surface of the vibrating member 52 in the arrow direction. .

FIG. 7 shows a second embodiment of the vibrating device 17, in which one end of a swing member 61 is swingably supported by a pin 62, and the other end of the swing member 61 is supported. Member 6
By stretching the spring 64 between the three and rotating the cam 65 that is pressed against the other end of the swing member 61, the printed wiring board 10 that contacts one end of the swing member 61 is vibrated in the arrow direction. It was done.

FIG. 8 shows a third embodiment of the vibrating device 17, in which one end of a swinging member 71 is swingably supported by a pin 72 and is supported by the intermediate portion of the swinging member 71. A spring 74 is stretched between the members 73 and an eccentric disc 75 that is pressed against the other end of the swinging member 71 is rotated to vibrate the printed wiring board 10 that contacts one end of the swinging member 71 in the arrow direction. It was made to let.

FIG. 9 shows a fourth embodiment of the vibrating device 17, in which a vibrator is constituted by an ultrasonic vibrating body 81, and the ultrasonic vibrating body 81 is driven to be connected thereto. The printed wiring board 10 is made to vibrate in the arrow direction.

The present invention is not limited to the configuration shown in the above embodiment, and various modifications and changes can be made without departing from the scope of the claims.

[0042]

As described above, according to the present invention, after the inspection terminal of the position conversion board is brought into contact with the inspected point of the inspected printed wiring board, the inspected printed wiring board and the position conversion board are By slightly vibrating at least one of them in the plane direction of the printed wiring board to be inspected, the insulating material covering the contact surface of the inspection point and the inspection terminal can be removed without damaging the metal surface. It is possible to secure stable electrical contact without damaging the points, and to inspect a printed wiring board with high-density wiring with high reliability without using anisotropic conductive rubber.

Further, according to the present invention, when the inspection terminal of the position conversion board electrically contacts the inspected point, the position conversion board is elastically deformed according to the height level of the inspected point. Even if there are variations in the height of the point to be inspected, it is possible to follow this, and it is possible to ensure electrical contact between the inspection terminal and the point to be inspected. It can be done reliably.

Further, according to the present invention, the inspected printed wiring board is housed between a pair of rigid position conversion boards that come into contact with both front and back surfaces thereof, and at least one of the position conversion board and the inspected printed wiring board. After applying a slight vibration in the plane direction of the printed circuit board to be inspected, by connecting to the inspection unit and performing an electrical inspection, give a slight vibration before connecting to the inspection machine and then connect with the inspection machine. Therefore, the conventional inspection machine having the contact probe can be used as it is, and the operation efficiency of the inspection machine can be improved.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a first embodiment of a printed wiring board inspection apparatus to which the method of the present invention is applied.

FIG. 2 is an enlarged view of an inspection terminal in this embodiment.

FIG. 3 is a configuration diagram showing a second embodiment of the printed wiring board inspection device according to the present invention.

FIG. 4 is a configuration diagram showing a third embodiment of the printed wiring board inspection apparatus according to the present invention.

FIG. 5 is a configuration diagram showing a fourth embodiment of a printed wiring board inspection device according to the present invention.

FIG. 6 is a configuration diagram showing a first embodiment of a vibrating device according to the present invention.

FIG. 7 is a configuration diagram showing a second embodiment of the vibration device according to the present invention.

FIG. 8 is a configuration diagram showing a third embodiment of the vibration device according to the present invention.

FIG. 9 is a configuration diagram showing a fourth embodiment of the vibration device according to the present invention.

FIG. 10 is a schematic configuration diagram showing a conventional printed wiring board inspection device.

[Explanation of symbols]

 10 Printed Wiring Boards 10a, 10b Inspected Point 12 Lower Support Member 13 Upper Support Member 14 Back Position Conversion Board 15 Front Surface Position Conversion Board 141, 151 Inspection Terminals 141a, 151a Unevenness 142. 152 Terminal 16 Inspection Section 17 Vibration Device 21 Position conversion board for back surface 22 Position conversion board for front surface 211, 221 Insulation board 214, 224 Holder 215, 225 Cushion layer 31, 32 Position conversion board 314 Plate support block 315 Coupling pin 323 Coupling hole 41, 42 Position conversion board 412 422 Cushion layer 413 423 Electrical insulation layer

Claims (9)

[Claims] 1. An inspection terminal corresponding to a point to be inspected of a printed wiring board to be inspected is provided on one surface of an insulating substrate, and is electrically connected to the inspection terminal on the other surface and arranged at a predetermined position. A position conversion board provided with a terminal is placed on the printed wiring board to be inspected so that the inspection terminal is in contact with the inspection point, and the inspection is connected to the terminals arranged at the predetermined positions. A method of inspecting a printed wiring board for electrically inspecting the inspected printed wiring board by a section, wherein an inspection terminal of the position conversion board is brought into contact with an inspected point of the inspected printed wiring board, Electrical inspection after applying a slight vibration in the plane direction of the printed wiring board to be inspected to at least one of the printed wiring board and the position conversion board. A method for inspecting a printed wiring board, which comprises: 2. The method for inspecting a printed wiring board according to claim 1, wherein the surface of the inspection terminal that comes into contact with the inspected point has irregularities. 3. The position conversion board is elastically deformed according to the height level of the inspected point when the inspection terminal of the position conversion board contacts the inspected point. Alternatively, the method for inspecting a printed wiring board according to claim 2. 4. An insulative substrate is provided with an inspection terminal corresponding to an inspected point of a printed wiring board on one surface, and is electrically connected to the inspected terminal on the other surface and arranged at a predetermined position. A position conversion board provided with a terminal is placed on the printed wiring board to be inspected so that the inspection terminal is in contact with the inspection point, and the inspection is connected to the terminals arranged at the predetermined positions. A method of inspecting a printed wiring board for electrically inspecting the inspected printed wiring board by a section, wherein the inspected printed wiring board is provided between a pair of rigid position conversion boards that contact both sides of the printed wiring board. The inspection terminal of the position conversion board is brought into contact with the inspected point of the inspected printed wiring board, and the inspected printed wiring board can be moved slightly. And applying a slight vibration in the plane direction of the printed circuit board to be inspected to at least one of the position conversion board and the printed circuit board to be inspected, and then connecting to the inspection section to perform an electrical inspection. A method for inspecting a printed wiring board, characterized by: 5. The method for inspecting a printed wiring board according to claim 4, wherein the surface of the inspection terminal that comes into contact with the inspected point has irregularities. 6. An inspection terminal corresponding to a point to be inspected of a printed wiring board to be inspected is provided on one surface of the insulating substrate, and is electrically connected to the inspection terminal on the other surface and arranged at a predetermined position. Connected to the terminal arranged at the predetermined position, and a means for superposing the position conversion board having the terminal on the printed wiring board to be inspected so that the inspection terminal is in contact with the inspection point. An inspection means for electrically inspecting the inspected printed wiring board; and an inspected printed wiring board and the inspected printed wiring board in a state where an inspection terminal of the position conversion board is in contact with an inspected point of the inspected printed wiring board. A vibrating means for slightly vibrating at least one of the position conversion boards in the plane direction of the inspected printed wiring board. Inspection device for wire plate. 7. The printed wiring board inspection apparatus according to claim 6, wherein irregularities are formed on a surface of the inspection terminal that comes into contact with the inspection point. 8. An insulating substrate of the position conversion substrate is made of a flexible electrically insulating material, and a cushion layer is provided on the side of the position conversion substrate opposite to the inspection terminal formation surface. An inspection device for a printed wiring board according to claim 6 or 7. 9. The insulating substrate of the position conversion substrate is formed of a cushion layer and a flexible electrical insulating layer laminated and adhered on both front and back surfaces of the cushion layer. 8. A printed wiring board inspection device according to item 8.