JPH1183941A - Connecting apparatus, semiconductor element-inspecting apparatus and semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connecting apparatus which can connect many points with high density without damaging an electrode material of an inspected object and, an inspecting apparatus using the same. SOLUTION: A connecting apparatus storing an inspected semiconductor element 1 and connecting the semiconductor element electrically to an inspecting apparatus has a socket 3 for storing the semiconductor element 1 therein, and means (8, 9, 10) for pressing the semiconductor element 1 to a bottom face of the socket when the semiconductor element 1 is stored in the socket 3. The socket 3 is provided with a plurality of connecting terminals 4 arranged inside the bottom face to be electrically connected to the semiconductor element, and a lead-out wiring 7 drawn out from each connecting terminal 4. The connecting terminal 4 has a projecting streak with a knife edge at a face opposite to the semiconductor element 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting device for transmitting an electric signal to an electrode through a contact terminal in contact with the electrode to determine whether the semiconductor device is good or bad, and an inspection device using the same. And a semiconductor element formed by inspection by this inspection apparatus.

[0002]

2. Description of the Related Art Inspection apparatuses are used for industrially producing a large number of semiconductor elements and inspecting their electrical performance. This inspection device includes a probe unit and a tester unit.

In addition, as the density of semiconductor elements has increased, chip-shaped semiconductor elements having solder bumps on their electrodes for solder connection have been developed. As an inspection for such a semiconductor element, there is a method in which the semiconductor element is opposed to an electrode on the surface of a wiring board and connected via the solder bump. Since this method is suitable for high-density mounting and collective connection with high yield, its application is expanding.

Further, as disclosed in Japanese Patent Application Laid-Open No. 8-306749, there is a method in which unevenness is formed on a flat metal surface by plating, and the unevenness is transferred to form bumps. However, plating is effective only for metal, and when transferred to a bump or the like, the tip of the bump is not sharp, but the concave portion of the bump is sharp,
The tip of the bump is not sharp. Therefore, a large force is required to break the oxide film, and there is a problem that the semiconductor element may be damaged.

[0005]

In recent years, with the increase in the density of semiconductor elements, the number of pins of an inspection probe has become narrower and the number of pins has increased in the inspection process at the time of semiconductor manufacturing. It is desired to develop a method of manufacturing a semiconductor device using a connection device that can prevent damage to electrodes of the semiconductor device in a process of transmitting and inspecting a high-speed electric signal.
Therefore, from such a viewpoint, the above-described conventional technology will be examined.

In the method using a bump formed by plating a part of a copper wiring as a probe, the tip of the bump becomes flat or semicircular, so that an oxide is generated on the surface of a material such as an aluminum electrode or a solder electrode. For contact materials, the contact resistance becomes unstable and the load at contact is several hundred mN.
It is necessary to do above. However, there is a problem in making the load at the time of contact too large. In other words, the integration of semiconductor elements has been advanced, and high-density multi-pin, narrow-pitch electrodes have been formed on the surface of the semiconductor elements. Therefore, since a large number of active elements or fine wirings are formed immediately below the electrodes, if the contact pressure of the probe with the electrodes during the inspection of the semiconductor element is too large, the electrodes and the active elements and the wirings immediately below the electrodes may be damaged. There is a risk.

[0007] Furthermore, since it is expected that the shape of the bumps and the like will vary, a large contact pressure is required as a whole to completely contact the insufficiently contacting projections, and an excessively large contact pressure is required. There is a problem that it becomes a contact pressure.

Conventionally, a contact terminal is rubbed against an electrode (scribing operation) to scrape oxide on the surface of the electrode material and contact the metal conductor material on the lower surface of the electrode material to ensure good contact. ing. As a result, scribing of the electrode material by the scribe of the electrode with the contact terminal often occurs, and the electrode is often damaged by damaging the electrode. After the conventional probe inspection, the above-mentioned electrode material is scratched, so that a cleaning step is indispensable in order to prevent short-circuiting between electrode pads and between components and wiring during assembly and contamination by foreign matter.

Further, as disclosed in Japanese Patent Application Laid-Open No. Hei 8-306749, in a method of forming unevenness on a flat metal surface by plating and transferring the unevenness to create unevenness on a bump, plating is performed on a metal. When transferred to a bump or the like, the tip of the bump is not sharp, but the concave portion of the bump is sharp and the tip of the bump is not sharp. This is also apparent from the indentation when the bump is pressed against the electrode, as shown in FIG. 6 of the publication. That is, since the tip is not very sharp, traces are scattered at a plurality of places. Therefore, the force required to provide such an indentation increases in proportion to the area of the indentation, and it is considered that a large force is required. When the force is large, the force is locally applied to the semiconductor element via the electrode, and there is a possibility that the element is distorted, which is not preferable.

[0010] Further, there is a case where a person who has purchased a semiconductor device wants to know whether or not the purchased semiconductor device itself has been inspected. However, regarding the semiconductor element inspected by the above-described conventional inspection apparatus, no consideration is given to knowing from the external appearance whether the inspection has been performed. For example, JP-A-8-3057
FIG. 6 of Japanese Patent Publication No. 49 shows an indentation when the bump is pressed against the electrode. However, if the bump has a random scratch, it is difficult to distinguish it from the random scratch.

[0011] On the other hand, it is conceivable to attach an inspected mark to the inspected semiconductor element. However, in addition to the problem of whether or not there is a portion where a mark to be inspected is to be attached to a minute semiconductor element, there is a problem that an apparatus for that is required and a process for that is required.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a connection device capable of making contact at multiple points and high density without damaging an electrode material to be inspected, and an inspection device using the same.

Another object of the present invention is to provide a semiconductor device having a structure in which it can be visually recognized that inspection has been performed without a special inspection mark.

[0014]

According to a first aspect of the present invention, there is provided a connecting device for accommodating a semiconductor element for inspection and electrically connecting to a testing device. A socket for accommodating a semiconductor element, and means for pressing the semiconductor element to the bottom side of the socket when the semiconductor element is accommodated in the socket, wherein the socket is disposed inside the bottom surface, A plurality of contact terminals for making electrical contact with the semiconductor element, and a wiring for leading out from each contact terminal, wherein the contact terminal has a ridge having a knife edge on a surface facing the semiconductor element. A connection device is provided that is formed.

[0015] The means for pressing includes: a lid for holding the semiconductor element when the semiconductor element is accommodated in the socket; and a presser located between the lid and the semiconductor element and in contact with the semiconductor element. A configuration may be provided that includes a plate and an elastic member that imparts elasticity to the pressing plate. The contact terminal may be formed of a metal, and a protrusion having a knife edge may be formed by pressing a mold having a V-shaped groove on the surface facing the semiconductor element.

Further, according to the second aspect of the present invention, in the inspection apparatus for performing an inspection by contacting each electrode of the inspection object on which a large number of electrodes are arranged and transmitting and receiving an electric signal, the inspection object is An inspection target holding connection unit that performs the holding connection and performs an electrical connection, and a tester that is connected to the connection device and performs an inspection on the held inspection target. The connection device accommodates the inspection target object. A socket to be inspected, and means for pressing the inspection object toward the bottom surface of the socket when the inspection object is accommodated in the socket. A plurality of contact terminals for making electrical contact with each other, and lead-out wiring drawn out from each contact terminal, wherein the contact terminal has a ridge having a knife edge formed on a surface facing the inspection object. Sa Inspection apparatus characterized by that there is provided.

According to a third aspect of the present invention, there is provided a semiconductor device having a plurality of electrodes for external connection arranged on one surface, wherein A semiconductor element having a linear mark on the surface of the semiconductor element.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an example of the connection device of the present invention which can be used in a semiconductor device inspection device.

In this example, the inspection apparatus includes a socket 3 for housing the semiconductor element 1 and making an electrical connection for a test, a lid 8 covering the socket 3, and a socket 3 and a lid 8. It includes a ratchet 11 to be connected, a pressing plate 9 for holding the semiconductor element 1 in the socket 3, and an elastic body 10.

The socket 3 has pads 4 as contact terminals for connection with the electrodes 2 of the semiconductor element 1 disposed on the inner surface of the bottom 3a together with the wiring board 5, and external connection pins on the outer surface of the bottom 3a. 7 are arranged, and on the bottom 3a,
In order to connect each pad 4 to an external connection pin 7, a wiring 6 penetrating the bottom 3 a of the socket 3 is provided. The external connection pins 7 and the wiring 6 constitute a drawing wiring.

The wiring board 5 is formed of, for example, an insulating film. The pad 4 is provided so as to protrude from one surface of the wiring board 5. The wiring 13 is provided on the other surface of the wiring board 5. The pad 4 and the wiring 13 are connected via a via (not shown). The wiring 13 is connected to the wiring 6. The wiring 13 is formed by, for example, plating. Therefore, the connection with the pad 4 can also be made at the time of this plating.

As shown in FIG. 3, at least three protruding ridges 4a whose leading edges form a knife edge are formed on the surface of the pad 4, that is, the surface facing the semiconductor element. Even when the size of the electrode 2 varies due to the provision of the ridges 4a, and when the electrode 2 and the pad 4 are displaced, the contact can be reliably obtained.

FIG. 2 and FIG. 3 are cross-sectional views at the time of transfer and a mold member for providing the ridge 4a on the pad 4 shown in FIG. 2 is made of a metal harder than the pad 4 (usually, the pad is usually Al), for example, SUS304.
The V-shaped groove 12a is processed in parallel by a slicer. The V-shaped grooves 12a are machined at intervals of 1/3 or less of the size of the pad 4. This molding 2
As shown in FIGS. 3A, 3B and 3C, by pressing the pad 4 from above the insulating film 5 where the pad 4 is located,
At least three ridges 4 a are formed on the pad 4.

The surface of the pad 4 may be provided with square pyramid-shaped irregularities instead of the ridges 4a using a square pyramid mold shown in FIG. In this case, at least nine irregularities are formed on the pad 4. Thereby, even when the size of the electrode 2 varies and when the electrode 2 and the pad 4 are displaced, the contact can be reliably obtained.

A holding plate 9 and a spring 1 are provided inside the lid 8.
There is 0. The lid 8, the holding plate 9, and the spring 10 constitute a unit for pressing the semiconductor element. The holding plate 9 fixes the semiconductor element 1 in the socket 3,
The springs 10 are provided for the purpose of controlling the load such that the electrode 2 comes into contact with the pad 4 with an appropriate load. Lid 8
Is connected to the lower part of the socket by a ratchet 11.
Thus, the semiconductor element 1 can be inspected as one module.

FIG. 5 is an explanatory view showing a main part of an inspection device as an example in which the connection device of the present invention is connected to a tester.

In this embodiment, the inspection apparatus comprises an inspection object holding connection section 400 for holding an inspection object and electrically connecting the inspection object to a tester, and a tester section 450.

The inspection object holding / connecting section 400 includes the above-described connecting apparatus 401 and a supporting section 402 for supporting the connecting apparatus. Note that a plurality of connection devices 40 are
1 can be arranged. Since the structure of connection device 401 has been described with reference to FIG. 1 and has already been described, description thereof will not be repeated here.

The support section 402 has the connecting device 40
A connector 403 for attaching and connecting one external connection pin 7 and a wiring section 404 for connecting the connector 403 to a tester section 450 described later are provided.

The tester section 450 includes a tester 451 and a cable 452. The cable 452 is connected to the wiring unit 404 described above. Although only one cable is shown here, all the wiring units 404 are actually connected to the cable 452. The connection may be switched to perform the connection.

According to the present invention, for a semiconductor device having a plurality of electrodes arranged on the back surface of a chip, a 100% inspection of the chip, a sampling inspection of the chip, and the like are performed in the manufacturing process. In this case, it is good for a chip that has been 100% tested and passed, but if a sampling test is performed, it is assumed that a certain chip is itself inspected and is a good product, or it is not itself tested, and it is estimated that a chip is good by a sampling test. It is not easy to know from the chip itself whether it is done. However, in some cases, it is necessary to know from the appearance whether or not the semiconductor chip has been inspected.

Therefore, according to the present invention, in the inspection process, a mark indicating that the inspection has been performed is attached simultaneously with the inspection. That is, in the present invention, since the pad 4 is formed of the ridge 4a having the knife edge as described above, when the ridge 4a of the pad 4 is pressed against the electrode 2 of the semiconductor element during the inspection, the electrode 2 Pressing traces (linear traces) of the ridges 4a are formed on the surface of. This linear mark can be observed with a magnifying glass, a microscope, or, in some cases, with the naked eye.
In addition, since they are linear marks, they have regularity and can be clearly distinguished from random irregularities on the surface of the electrode 2. Therefore, whether or not the semiconductor element has been inspected,
It can be known by observing the surface of the electrode 2.

As a result, according to the present invention, it is possible to form a semiconductor device which is clearly subjected to the inspection.

In the above example, the case where the semiconductor element 1 is mounted on the connection device 401 as the inspection object has been described. The inspection object in the present invention is not limited to this. For example, the present invention can be applied to a case where a package housing the semiconductor element 1 is housed in the connection device 401 and inspection is performed.

Next, another embodiment of the present invention will be described.
This will be described with reference to FIG.

The inspection apparatus shown in FIG. 7 is an example using a wafer probe using a thin film probe as a contact terminal.

The inspection apparatus shown in FIG. 7 is configured as a wafer prober in manufacturing a semiconductor device. The inspection apparatus includes a sample support system 140 that supports an object to be inspected, and a probe system 25 that contacts an object to be inspected and transmits and receives an electric signal.
0 and a drive control system 1 for controlling the operation of the sample support system 140
50 and a tester 170 for performing measurement. In addition, as the inspection object, the individual semiconductor elements 303 of the semiconductor wafer 304 are targeted. A plurality of electrodes 303a as external electrodes are formed on the surface of the chip 103.

A contact terminal 253 and a wiring board 257 are provided in a posture facing the sample table 142 in parallel. The contact terminal 253 is formed on the thin film sheet 251, and the wiring board electrode 26
0a is connected by soldering. Thin film sheet 25
On the back surface of 1, a holding plate 259 is adhered by a buffer layer 258 such as silicone rubber, and the holding plate 259 is fixed to a wiring board 257. Each contact terminal 253 is
Through the thin film electrode for extraction 252 and the internal wiring 257a in the wiring board 257, it is connected to the connection terminal 257b provided on the wiring board. This connection terminal 257b
Is connected to a tester 170 via a cable 171 connected to the semiconductor device 303, and exchanges operating power, an operation test signal, and the like between the semiconductor element 303 of the semiconductor wafer 304 and the tester 170, and determines the operating characteristics of the semiconductor element. It is determined whether or not it is possible. This is performed for each of the steps 303, and whether or not the operation characteristics are possible is determined.

The sample support system 140 includes a semiconductor wafer 304
A mounting table 141 provided with the mounting plate 141 detachably mounted thereon, a substantially horizontally provided sample stage 142, a vertically arranged elevating shaft 144 supporting the sample stage 142,
An elevating drive unit 145 that drives the elevating shaft 144 up and down;
An XY stage 147 supporting the elevation drive unit 145
It is composed of The XY stage 147 includes a housing 146
Fixed to The elevation drive unit 145 includes, for example, a stepping motor. By combining the moving operation of the XY stage 147 in the horizontal plane and the vertical movement by the elevation driving unit 145, the positioning operation of the sample table 142 in the horizontal and vertical directions is performed. Further, the sample table 142 is provided with a rotation mechanism (not shown) so that the sample table 142 can be rotationally displaced in a horizontal plane.

Above the sample table 142, the probe system 25
0 is placed. That is, the contact terminals 253 and the wiring board 257 are provided in a posture facing the sample table 142 in parallel. Each contact terminal is connected to a connection terminal 257b provided on the wiring board 257 through an internal wiring 257a.
It is connected to the. The tester 170 is connected via a cable 171 connected to the connection terminal 257b.
The contact terminal 252 of the connection device used here uses a probe formed by processing a tungsten wire (a cantilever probe), but is not limited to this.

The drive control system 150 is connected to the tester 170 via a cable 172. Further, the drive control system 150 sends a control signal to an actuator of each drive unit of the sample support system 140 to control the operation. That is, the drive control system 150 includes a computer inside,
The operation of the sample support system 140 is controlled in accordance with the progress information of the test operation of the tester 170 transmitted via the cable 172. The drive control system 150 includes an operation unit 151.
And accepts input of various instructions related to drive control, for example, accepts an instruction of a manual operation.

Hereinafter, the operation of the inspection apparatus of this embodiment will be described. A mounting plate 141 of a semiconductor substrate to which a semiconductor wafer 304 is adhered is fixed on a sample stage 142, and the semiconductor wafer 304 is diced and separated using a XY stage 147 and a rotating mechanism. The formed electrode 303a is positioned immediately below the contact terminal 253 of the probe system 100. Then, the drive control system 1
By operating the elevation drive unit 145 of 50 and elevating the sample table 142 to a predetermined height, the tips of the plurality of contact terminals 253 are applied to the plurality of electrodes 303a of the target semiconductor device at a predetermined pressure. Make contact. In this state, the cable 171, the connection terminal 257b, the internal wiring 25
7a and the semiconductor wafer 3 via the contact terminals 253.
Operation power, an operation test signal, and the like are exchanged between the semiconductor element 303 and the tester 170 to determine whether or not the semiconductor element has the operation characteristics. The series of operations described above determines the diced semiconductor wafer 304.

[0044]

According to the present invention, a reliable contact between a product and a circuit board can be realized at the time of inspection of a semiconductor element, and inspection defects in this step can be suppressed.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a connection device of the present invention.

FIG. 2 is a perspective view showing an example of a mold for forming a ridge on a pad used in the connection device of the present invention.

FIG. 3 is a schematic cross-sectional view showing a state in which a ridge of a mold material is transferred to a pad used in the connection device of the present invention.

FIG. 4 is a cross-sectional view showing another example of a mold having another pattern that can be used in the connection device of the present invention.

FIG. 5 is an explanatory diagram showing an example of an inspection device using the connection device of the present invention.

FIG. 6 is a schematic sectional view showing another example of the inspection apparatus of the present invention.

[Explanation of symbols]

1 ... semiconductor element, 2 ... electrode, 3 ... socket, 4 ... pad, 5 ... wiring board, 6 ... wiring, 7 ... external connection pin, 8 ... lid, 9 ... holding plate, 10 ... spring, 11 ... ratchet, 12… Shape, 13… Wiring, 103…
Tip, 140: sample support system, 142: sample stage, 144: elevating shaft, 145
… Elevating drive unit, 146 housing, 147 XY stage, 150 drive control system, 151 operating unit, 170 tester, 171 cable, 172
Cable, 250… probe system, 251… thin film sheet, 253… contact terminal, 253a, 253b, 253c, 253d, 253e, 253f… probe, 257…
Wiring board, 257a Internal wiring, 257b Connection terminal, 258 Electrode holding plate, 259 Buffer layer, 260a Thin film sheet electrode, 260b Wiring board electrode, 304 Semiconductor wafer, 400 Socket part, 401
Package, 402… Bump, 403… Electrode, 404… Wiring board, 405
… Pressing plate, 406… Spring, 407… Base, 408… Lid, 450… Tester part, 451… Tester, 452… Cable.

Claims (5)

[Claims] 1. A connection device for accommodating a semiconductor element for inspection and electrically connecting to a test device, comprising: a socket for accommodating a semiconductor element; and a semiconductor device accommodated in the socket. Means for pressing the semiconductor element toward the bottom surface of the socket, wherein the socket has a plurality of contact terminals disposed inside the bottom surface for electrically contacting the semiconductor element; and And a lead-out wiring to be drawn out, wherein the contact terminal has a ridge having a knife edge formed on a surface facing the semiconductor element. 2. The connection device according to claim 1, wherein the means for pressing includes: a lid for holding the semiconductor element when the semiconductor element is accommodated in the socket; and the lid and the semiconductor element. And a press plate that is located between the press plate and the semiconductor element, and an elastic member that imparts elasticity to the press plate. 3. The connection device according to claim 1, wherein the contact terminal is formed of a metal, and a mold having a V-shaped groove on a surface thereof is pressed against a surface facing the semiconductor element, so that a knife edge is formed. A connection device characterized by forming a ridge having the following. 4. An inspection apparatus for performing an inspection by contacting each electrode of an inspection target on which a large number of electrodes are arranged and transmitting and receiving an electric signal, wherein the inspection device holds and connects the inspection target and performs an electrical connection. An object holding connection unit, a tester that is connected to the connection device and performs an inspection on the held inspection object, wherein the connection device includes: a socket that accommodates the inspection object; and an inspection object in the socket. Means for pressing the test object toward the bottom surface of the socket when the test object is accommodated, wherein the socket has a plurality of Inspection characterized by comprising a contact terminal, and a lead-out wiring drawn out from each contact terminal, wherein the contact terminal has a ridge having a knife edge formed on a surface facing an object to be inspected. apparatus. 5. A semiconductor device having a plurality of electrodes for external connection arranged on one surface, wherein the surface of the electrode has a linear mark.