JP3456146B2 - Bonding apparatus and bonding method for electronic component with bump - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus and a bonding method for a bumped electronic component for bonding a bumped electronic component to a substrate.

[0002]

2. Description of the Related Art As a method of mounting electronic parts on a board,
A method is known in which bumps, which are protruding electrodes for external connection, are formed on an electronic component, and the bumps are bonded to electrodes on a substrate. In this method, the bumps are bonded to the electrodes by soldering or a conductive resin adhesive. In this bonding process, the electronic component is heated while being pressed against the substrate with a predetermined pressure load. The crimping load value required at this time varies depending on the size of the bumps and the number of bumps, but since it is generally impossible to support this crimping load only by the rigidity of the substrate itself on which the electronic component is mounted, At the time of bonding, a lower receiving member is arranged on the back surface of the substrate to support a load acting on the substrate from above.

[0003]

By the way, depending on the type of the circuit board on which the electronic component is mounted, the electronic component may be mounted on both front and back surfaces of the substrate. In such a case, if it is attempted to bond the aforementioned electronic component with bumps to the surface opposite to the surface on which the electronic component is already mounted, the crimping load at the time of bonding is the electronic component already mounted on the opposite side of the bonding surface. Will be supported through. However, the types of electronic components mounted on the opposite surface are not necessarily the same, and the heights of the electronic components are different, and even the electronic components of the same type have different heights after mounting. Therefore, when these electronic components are received by the lower receiving member to support the crimping load, the load is concentrated only on the electronic components which are in contact with the lower receiving member, and the electronic components are damaged. was there.

In addition, after the electronic components are mounted, the circuit board is subjected to a functional inspection in an inspection process, where it is inspected whether or not each electronic component functions normally. Considering the measures taken at the time of failure, it is desirable to perform these functional tests in the state of each electronic component unit before being mounted on the board. However,
For the inspection, it is necessary to electrically connect the electronic component to a circuit for the inspection to make it conductive, and for this reason, conventionally, the electronic component was mounted on the substrate and made conductive, and then the inspection was performed. And, in most cases, the substrate judged to be defective as a result of the inspection was discarded together with the substrate.

However, such an inspection method and a treatment method result in the generation of defective products which are difficult to recycle and increase the amount of waste. This makes it difficult to reduce production costs and goes against the demand for effective use of resources. Therefore, there is a demand for a bonding apparatus that can perform these inspections when bonding electronic components to a substrate.

Therefore, according to the present invention, the bumped electronic component can be pressed onto the substrate without damaging the electronic component already mounted on the back surface, and the functional inspection of the bumped electronic component can be performed in this state. An object is to provide a bonding apparatus and a bonding method for electronic components.

[0007]

According to another aspect of the present invention, there is provided a bonding apparatus for a bumped electronic component, wherein a bumping electronic component is pressed and bonded by a bonding head onto an upper surface of a substrate having a lower surface on which the electronic component is mounted. An electronic component bonding apparatus, comprising: a bonding head that contacts an electronic component with bumps to press the bumps of the electronic component with bumps onto a substrate; and a lower receiving portion that supports the substrate from below. The portion has a substrate support that directly supports the lower surface of the substrate, and an elastic body that elastically supports the electronic component already mounted on the surface opposite to the surface on which the bumped electronic component is bonded. The crimping load is dispersed and supported by the substrate support and the elastic body ,
Also, with the bumps that are electrically connected to the substrate
An inspection unit that inspects the functions of electronic components and this inspection unit
A conductive means electrically connected to the electric circuit of the substrate;
It was

[0008]

According to a second aspect of the present invention, there is provided a method of bonding an electronic component with bumps, wherein the electronic component with bumps is pressed by a bonding head onto the upper surface of a substrate having the electronic component mounted on the lower surface for bonding. And an elastic body for elastically contacting the pressure load during bonding with the substrate support that directly supports the lower surface of the substrate and the electronic component already mounted on the surface opposite to the surface on which the electronic component with bumps is bonded. When the electronic components with bumps are pressed against the substrate when dispersed and supported by
Electronic components already mounted on the bottom surface of the plate push the surface of the elastic body.
The bottom surface of the substrate contacts the upper end of the substrate support.
The substrate was allowed to descend .

According to a third aspect of the present invention, there is provided a method of bonding an electronic component with bumps according to the third aspect, wherein the electronic component with bumps is pressed against the substrate so as to be electrically conductive. In this state, the inspection unit is electrically connected to the electric circuit of the substrate to perform the function inspection of the bumped electronic component. If the inspection result is normal, the bumped electronic component is continuously fixed to the substrate.

According to a fourth aspect of the present invention, there is provided a method for bonding an electronic component with bumps, wherein the bump of the electronic component with bumps is pressed against the upper surface of the inspection board having the electronic component mounted on the lower surface, and the electronic component with bumps is bonded to the substrate. By a step of electrically connecting to an electric circuit, a substrate support body that abuts the pressing load on the lower surface of the substrate, and an elastic body that elastically contacts an electronic component mounted on a surface opposite to the bonding surface of the electronic component with bumps. A step of supporting, and a step of conducting a functional test of the bumped electronic component by electrically connecting an inspection section to an electric circuit of the substrate,
And a step of bonding the bumped electronic component determined to be normal by this inspection to the actual substrate.

According to a fifth aspect of the present invention, there is provided a bumping electronic component bonding method according to the fifth aspect, wherein an actual substrate is used as the inspection substrate.

According to the first or second aspect of the present invention, the substrate support body for directly supporting the lower surface of the substrate on the lower receiving portion for supporting the substrate from below during bonding, and the electronic component already mounted on the opposite surface of the substrate. By providing the elastic body that elastically supports the electronic component with bumps, the electronic component with bumps can be bonded to the substrate without damaging the already mounted electronic component.

According to the invention of claim 3, 4, 5 or 6, the function test of the bumped electronic component is performed while the bumped electronic component is pressed against the substrate and is electrically connected to the electric circuit of the substrate. Only normal ones can be mounted on the substrate, and the number of substrates discarded due to defects can be reduced.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a bonding apparatus for a bumped electronic component according to an embodiment of the present invention, FIG. 2 is a sectional view of a lower receiving portion of a bonding apparatus for a bumped electronic component, and FIG. It is a flowchart of the bonding by a bonding device.

First, the structure of a bonding apparatus for electronic components with bumps will be described with reference to FIG. In FIG. 1, a substrate 2 is placed on the transport path formed by the transport rails 1a and 1b. The substrate 1 is transported in the horizontal direction (vertical direction with respect to the paper surface of FIG. 1) on the transport path by a transport unit (not shown). Electrodes 3 for mounting electronic components and electrodes 4 for inspecting the substrate 2 are formed on the upper surface of the substrate 2. On the lower surface of the substrate 2, a plurality of electronic components 5A and 5B having different types and heights are already mounted in the previous process.

A bonding head 7 having a heater 8 is arranged above the transport path. The bonding head 7 is horizontally moved and vertically moved by the head drive mechanism 9 controlled by the controller 17, picks up the bumped electronic component 6 from the supply unit 10 and moves it onto the substrate 2. Then, the bumps 6a of the electronic component with bumps 6 are pressed against the electrodes 3 of the substrate 2 by performing an up-and-down operation, and the heater 8 is driven to heat the bumps 6a to the electrodes 3 by soldering or thermocompression bonding. Bond.

Below the substrate 2, a lower receiving portion 11 of the substrate 2 is arranged corresponding to the bonding position of the electronic component 6 with bumps. The lower receiving portion 11 is movable up and down by a cylinder 14, and the upper end of the lower receiving portion 11 contacts the lower surface of the substrate 2 in a state where the rod of the cylinder 14 is projected.

A probe 15, which is a conducting means, is disposed above the transport rails 1a and 1b so as to be movable up and down by an elevating means (not shown). When the probe 15 is lowered, the tip of the probe 15 is attached to the substrate 2. Contact the electrode 4. As a result, the electric circuit of the substrate 2 is electrically connected to the inspection unit 16 via the probe 15. The bumping electronic component 6 is driven by driving the inspection unit 16 while the bonding head 7 presses the bumping electronic component 6 against the substrate 2.
Is electrically connected to the inspection unit 16 via the substrate 2, and the functional inspection of the bumped electronic component 6 is performed. And the inspection result is the control unit 1
7 is transmitted.

Next, the lower receiving portion 11 will be described with reference to FIG. The lower receiving portion 11 is configured by mounting an elastic body 12 such as rubber or sponge inside a box-shaped member having two side plates 13 which are vertically passed through in the transporting direction of the substrate 2 (direction perpendicular to the plane of FIG. 2). As shown in FIG. 2, when the bumped electronic component 6 is pressed against the substrate 2 with the rod of the cylinder 14 protruding, the electronic component 5 already mounted on the lower surface of the substrate 2 is pressed.
A and 5B push the surface of the elastic body 12, and the substrate 2 descends until the lower surface of the substrate 2 contacts the upper end of the side plate 13.
That is, the side plate 13 serves as a substrate support that directly supports the lower surface of the substrate 2.

In this state, the crimping load F is equal to the two side plates 1.
3. The electronic components 5A and 5B are dispersed and supported at four places, and the load is not concentrated on any of the electronic components 5A and 5B on the lower surface. Moreover, the elastic body 12 is the electronic component 5A,
Since the load is applied in contact with the entire surface of 5B, these electronic components 5A and 5B receive the load evenly,
No damage due to partial load concentration.

If an elastic body having an excellent heat insulating effect is selected as the elastic body to be used, the heat transmitted from the heater 8 to the bumped electronic component 6 at the time of bonding is received by the lower electronic components 5A and 5B. It has an effect of preventing radiation to the portion 11, and can improve heating efficiency during bonding.

The bonding apparatus for the electronic component with bumps is configured as described above, and the bonding method will be described below with reference to the flow of FIG. First, in FIG. 3, the substrate 2 is transported to the bonding position on the transport path (ST1). Next, the bumped electronic component 6 is picked up from the supply unit 10 by the bonding head 7 and moved to above the substrate 2 (ST2). After that, the lower receiving portion 11 rises (ST3) to receive the substrate 2 from below, then the bonding head 7 is lowered (ST4), and the bump 6a of the bumped electronic component 6 is pressed against the electrode 3 (ST).
5), the bump 6a and the electrode 3 are electrically connected.

Next, the probe 5 is lowered and brought into contact with the electrode 4 (ST6), and the inspection section 16 is electrically connected to the electric circuit of the substrate 2. In this state, the inspection unit 16 performs the function inspection of the circuit (ST7). If the inspection result determines that the bumped electronic component 6 is NG (ST8),
The defective part is disposed in a waste box (not shown), and ST2 is again used.
Return to and pick up the new electronic component 6 with bumps,
Then, the same steps are performed.

If it is determined in ST8 that the electronic component with bumps is a good product, heating is started by the heater 8 (ST10), and the bump 6a is soldered to the electrode 3 by maintaining pressing and heating for a predetermined time. After attachment or thermocompression bonding, the bonding head 7 is lifted to complete the bonding (ST11). After this, the lower receiving member 11 descends (ST
12) Then, the substrate 2 is unloaded (ST13), and the bonding operation to the substrate 2 is completed.

As described above, by forming the lower receiving portion for supporting the crimping load at the time of bonding as described above, even if the electronic component is already mounted on the lower surface of the substrate, the electronic component is damaged. Without doing so, it is possible to press the electronic component with bumps with a load necessary to bring it into electrical connection with the electric circuit of the substrate. For this reason, it is possible to perform a functional test that can be performed at the time of bonding, which has been conventionally performed only after the soldering or the bonding with the conductive resin is completed. Therefore, even if the electronic component with bumps is determined to be defective in the inspection, it is not necessary to discard the substrate itself, and it can be effectively used in combination with a new non-defective product.

Further, in the above-described embodiment, an example is shown in which after performing the function inspection, the process directly shifts to the mounting operation, but only the function inspection may be performed in advance. That is, first, the bumped electronic component 6 is pressed against the substrate 2 to perform a function test, and if it is a non-defective product, the operation of returning it to the tray for storing the inspected component or the original tray of the supply unit 10 is repeated, and only a defective product Remove and discard. Then, the tray in which only the good products are selected is set in the supply unit 10, and the above-mentioned ST5
Bonding is performed according to the flow without ST8.

In this case, the substrate 2 to be inspected by pressing the bumped electronic component 6 is used as a so-called inspection substrate, but the substrate used here is prepared for the inspection purpose. The dedicated inspection board may be used, or an actual board used as an actual product may be used. By performing an inspection with the apparatus including the lower receiving portion shown in the present embodiment, even an actual board having electronic components mounted on both front and back surfaces of the board can be used as an inspection board. As a result, it is possible to save the labor and cost of preparing a dedicated inspection board.

[0029]

According to the present invention, a substrate support for directly supporting the lower surface of a substrate on a lower receiving portion for supporting the substrate from below during bonding, and an elasticity for elastically supporting an electronic component mounted on the opposite surface of the substrate. By providing the body, the bumped electronic component can be bonded to the substrate without damaging the already mounted electronic component. Also, by using a bonding device equipped with such a lower receiving portion, it becomes possible to perform a functional test of the bumped electronic component in a state where the bumped electronic component is pressed against the substrate and is electrically connected to the electric circuit of the substrate. As a result, only normal products can be mounted on the substrate, and the number of substrates discarded due to defective electronic components with bumps can be reduced.

[Brief description of drawings]

FIG. 1 is a front view of a bonding apparatus for electronic components with bumps according to an embodiment of the present invention.

FIG. 2 is a sectional view of a lower receiving portion of a bonding apparatus for a bumped electronic component according to an embodiment of the present invention.

FIG. 3 is a flow chart of bonding by an apparatus for bonding electronic components with bumps according to an embodiment of the present invention.

[Explanation of symbols]

2 substrates 3 electrodes 5A, 5B Electronic parts 6 Electronic components with bumps 6a bump 7 Bonding head 11 Lower part 12 Elastic body 15 probes 16 Inspection Department

Continuation of front page (56) Reference JP-A-5-129799 (JP, A) JP-A-6-90099 (JP, A) JP-A-8-274498 (JP, A) JP-A-1-158800 (JP , A) JP 8-46397 (JP, A) JP 4-1511861 (JP, A) JP 9-162352 (JP, A) JP 11-284021 (JP, A) JP 10-12666 (JP, A) JP-A-10-92878 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 25/00 H05K 13/04

Claims (5)

(57) [Claims] 1. A bonding apparatus for a bumped electronic component, which presses and bonds a bumped electronic component by a bonding head onto an upper surface of a substrate having a lower surface on which electronic components are mounted. A bonding head for pressing the bumps of the electronic component with bumps onto the substrate; and a lower receiving portion for supporting the substrate from below, the lower receiving portion directly supporting the lower surface of the substrate, and the bump. The attached electronic component has an elastic body elastically supporting the already mounted electronic component on the surface opposite to the surface to be bonded, and the pressure bonding load at the time of bonding is dispersed and supported by the substrate support and the elastic body. And also the substrate
Of the electronic component with bumps in the state of being electrically connected to
And the inspection unit that inspects the
A bonding device for an electronic component with bumps, comprising: a conducting means electrically conducting to the path . 2. A bonding method for an electronic component with bumps, wherein an electronic component with bumps is pressed and bonded by a bonding head onto an upper surface of a substrate having electronic components mounted on its lower surface, wherein the pressure applied during bonding is the substrate. In order to dispersively support the lower surface of the substrate directly by the substrate support and the elastic body elastically contacting the electronic component already mounted on the surface opposite to the surface on which the electronic component with the bump is bonded, When a component is pressed against the board, the board
Electronic parts already mounted on the underside of the elastic body push the surface of the elastic body.
The bottom surface of the substrate abuts the upper end of the substrate support.
A method for bonding electronic components with bumps, characterized in that the substrate is lowered by . 3. The electronic component with bumps is electrically connected to the substrate by pressing the electronic component with bumps, and an inspection unit is electrically connected to an electric circuit of the substrate to perform a functional test of the electronic component with bumps and perform inspection. 4. The bonding method for bumped electronic components according to claim 3, wherein if the result is normal, the bumped electronic components are continuously fixed to the substrate. 4. A step of pressing a bump of an electronic component with bumps onto the upper surface of an inspection board having an electronic component mounted on the lower surface thereof to electrically connect the electronic component with bumps to an electric circuit of the substrate.
A step of supporting the pressing load by a substrate support that abuts the lower surface of the substrate and an elastic body that elastically contacts the electronic component mounted on the opposite surface of the bonding surface of the electronic component with bumps; A bump comprising: a step of conducting a function test of the electronic component with bumps by bringing it into electrical connection with an electric circuit of the substrate; and a step of bonding an electronic component with bumps determined to be normal by this inspection to an actual substrate. Bonding method for electronic components. 5. The method for bonding electronic components with bumps according to claim 5, wherein an actual substrate is used as the inspection substrate.