JPH08148770A - Circuit board - Google Patents

Abstract

PURPOSE: To eliminate insulation breakdown or the like due to static electricity generated during manufacturing process and to reduce time and cost required for manufacture of liquid crystal cell. CONSTITUTION: In a master substrate 12, a short ring 7 crosses a dividing line 6 and is alternately connected to gate electrode wirings 2... and source electrode wirings 3... between adjacent active matrix substrates 5 on an insulating substrate 1. A liquid crystal cell comprising the active matrix substrate 5 can be obtained by dividing the master substrate 12 with the dividing line 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board provided with a plurality of electrode wiring parts on a substrate, and an active matrix substrate as a circuit wiring substrate can be individually obtained by dividing adjacent electrode wiring parts. is there.

[0002]

2. Description of the Related Art Conventionally, a liquid crystal display panel is manufactured, for example, by arranging an active matrix substrate and a counter substrate so as to face each other, dividing each substrate into a predetermined size, and then enclosing a liquid crystal between both substrates. Has been done. The active matrix substrate is formed by forming gate electrode wirings, source electrode wirings, switching elements such as non-linear elements or active elements, picture element electrodes and alignment films on a transparent insulating substrate as circuit wirings.

Further, in general, in a wiring board in which an electrode wiring having a structure in which an insulating material, a dielectric material or a semiconductor is interposed between electrodes made of a conductive material, the electrodes are rubbed or the like during the manufacturing process of the wiring board. Static electricity may accumulate between them. For this reason, when the potential difference of the static electricity accumulated between the electrodes exceeds the withstand voltage of the insulator, discharge occurs, which causes dielectric breakdown of the insulator and heat generation of the semiconductor. As a result, the reliability of the wiring board is improved. It is deteriorating.

Therefore, by short-circuiting the electrode wirings in common, even if static electricity is generated during the manufacture of the wiring board, a potential difference does not occur between the electrodes, and as a result, a discharge causing a dielectric breakdown or the like occurs. A method of manufacturing a wiring board that is prevented from occurring is disclosed in, for example, Japanese Patent Application Laid-Open No. 2-193112.

In the above publication, when manufacturing a liquid crystal cell, as shown in FIG. 4, it is connected to the electrode wirings 102 of the active matrix substrate 101 along the peripheral edge of the active matrix substrate 101 as a wiring substrate. A short-circuit portion (short ring) 103 for electrically connecting the derived terminals in common is formed, and a counter substrate 104 is attached. Then, as shown in FIG. 5A, the peripheral portion 101a of the active matrix substrate 101 including the short ring 103 is cut by a diamond cutter or the like, and liquid crystal is sealed to obtain a liquid crystal cell 105. In addition, FIG.
As shown in (a), the active matrix substrate 101
The short ring 103 is removed by chamfering the peripheral edge portion 101b of the above, and the liquid crystal is sealed to obtain the liquid crystal cell 105 ′.

Further, as a method of manufacturing the above active matrix substrate 101, for example, as shown in FIG.
There is a method of using a master substrate 107 in which a plurality of electrode wiring parts for an active matrix substrate are formed by intersecting a plurality of electrode wirings 102 arranged on a substrate 106. In this case, the dividing line 10 at the substantially center between the adjacent active matrix substrates 101 on the master substrate 107.
The active matrix substrate 101 is individually obtained by dividing the substrate at 8. The short ring 103 is arranged on the dividing line 108 in order to release static electricity generated when the substrate is divided.

[0007]

However, in the above publication, the short ring 103 is provided on the peripheral portion of the active matrix substrate 101 so that static electricity is not accumulated between the electrodes.
The short ring 103 must be removed in order to obtain the liquid crystal cell 105 to which a driver circuit for driving the liquid crystal is connected. Therefore, in the manufacturing process of the liquid crystal cell, a short ring removing process is required, and as a result, the manufacturing process becomes complicated, resulting in an increase in manufacturing time and manufacturing cost.

Further, the above active matrix substrate 1
In 01, in order to remove the short ring 103, as shown in FIG. 5B, the peripheral region 101 a of the active matrix substrate 101 including the short ring 103 and having a width X is divided, and the short ring 103 is removed. 6B, chamfering is performed by the width Y of the peripheral edge portion 101b of the active matrix substrate 101 in order to remove the above.

Therefore, the active matrix substrate 10
Since it is necessary to previously secure a region for removing the short ring 103 on the substrate 1, the substrate itself becomes large. In addition, as shown in FIG. 7, even when the active matrix substrate 101 is formed using the master substrate 107, the region where the short ring 103 is formed must be formed. Therefore, between the electrode wiring portions of the active matrix substrate 101. Becomes large, and as a result, the master substrate 107 itself becomes large.
Therefore, the number of active matrix substrates 101 formed on the master substrate 107 per unit is reduced, resulting in an increase in manufacturing cost.

Further, since the distance between the electrode wiring portions of the active matrix substrate 101 becomes large, there arises a problem that the screen size of the active matrix substrate 101 becomes small.

[0011]

A wiring board according to claim 1 is
An active matrix substrate is individually provided by providing an electrode wiring portion provided in each active matrix substrate unit by a plurality of electrode wirings formed on the surface and dividing the electrode wiring portion at a substantially central dividing portion between adjacent electrode wiring portions. In the wiring board, a conductor that short-circuits the above electrode wirings in common,
It is characterized in that they are alternately connected to the respective electrode wirings between the adjacent electrode wiring portions via the divided portions.

[0012]

According to the first aspect of the present invention, by providing the conductor for commonly short-circuiting each electrode wiring of the electrode wiring board, during the manufacturing process of the wiring board, for example, in the case of manufacturing a liquid crystal cell, a rubbing treatment is performed. It is possible to uniformly dissipate static electricity caused by friction of the substrate and the like between the electrode wirings. As a result, the potential difference of static electricity accumulated between the electrode wirings of the wiring board can be made uniform, and dielectric breakdown and heat generation due to the accumulation of static electricity can be prevented.

Further, the conductors are alternately connected to the respective electrode wirings between the adjacent electrode wiring portions through the substantially central dividing portion between the electrode wiring portions, so that the wiring board is divided. The conductors can be divided at the same time. Thereby, when the active matrix substrate is obtained from the wiring substrate, the step of removing the conductor in the active matrix substrate after the division can be eliminated. Further, since it is not necessary to previously form a region for removing the electrostatic breakdown preventing conductor on the periphery of the active matrix substrate, it is possible to reduce the interval between the electrode wiring portions on the wiring substrate. As a result, the number of active matrix substrates manufactured from the wiring substrate per unit can be increased, and the screen size of the active matrix substrate can be increased. Therefore, it is possible to reduce the time and cost for manufacturing the active matrix substrate.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following will describe one embodiment of the present invention with reference to FIGS. In this example, a liquid crystal cell provided with an active matrix substrate used in an active matrix driving type liquid crystal display panel obtained by dividing a wiring substrate will be described.

As shown in FIG. 2, in the liquid crystal cell 8 obtained by applying the present invention, the counter substrate 4 is arranged opposite to the active matrix substrate 5, and liquid crystal (not shown) is sealed between these substrates. Is configured.

On the surface of the active matrix substrate 5, a plurality of gate electrode wirings 2 ... And source electrode wirings 3 ... Which are formed of ITO (Indium Tin Oxide) or the like and output a signal from a driving driver circuit (not shown) are provided. Along with being formed, it is provided at the intersection of these electrode wirings and selectively applies a voltage to the electrode wirings. A switching element (not shown) is formed.

The surface of the counter substrate 4, that is, the surface of the active matrix substrate 5 facing the electrode wiring portions provided with the respective electrode wirings and the switching elements, faces the electrode wiring portion. A counter electrode (not shown) is formed.

The liquid crystal cell 8 is obtained by dividing the master substrate (wiring substrate) 12 shown in FIG. 1 into units of the active matrix substrate 5.

As shown in FIG. 1, the master substrate 12 has gate electrode wirings 2 ... And source electrode wirings 3 formed on an insulating substrate 1 and is arranged so as to face electrode wiring portions where these electrode wirings intersect. The counter substrate 4 is provided. The electrode wiring section is formed in units of the active matrix substrate 5.

On the peripheral portion of the counter substrate 4 on the insulating substrate 1, a dividing line 6 is formed as a mark for individually dividing the active matrix substrate 5 facing the counter substrate 4.

In the vicinity of the dividing line 6 of the insulating substrate 1, I
A short ring (conductor) 7 which is made of TO and which intersects the dividing line 6 and which short-circuits by commonly connecting the gate electrode wirings 2 and the source electrode wirings 3 of adjacent active matrix substrates 5 is formed. There is. The short ring may use not only ITO but other conductors (metals) or semiconductors (Si, etc.).

Now, a method of manufacturing the master substrate 12 will be described below with reference to FIG.

First, after forming an ITO film which is a transparent electrode on the insulating substrate 1 by sputtering or the like, patterning is performed to form the gate electrode wirings 2 ... And the source electrode wirings 3.

Next, on the insulating substrate 1, the gate electrode wirings 2 ... And the source electrode wirings 3 are commonly short-circuited I
The short ring 7 made of TO intersects the dividing line 6 formed for dividing the active matrix substrate 5 on the insulating substrate 1, and the gate electrode wiring 2 ... Or the source electrode between the adjacent active matrix substrates 5 Wiring 3 ...
To be connected alternately.

The short ring 7 is preferably formed on the insulating substrate 1 immediately after the gate electrode wirings 2 ... And the source electrode wirings 3 are formed. this is,
By uniformly applying the static electricity generated during the manufacturing process of the master substrate 12 to each of the gate electrode wirings 2, ... And the source electrode wirings 3 ,. This is because it is possible to eliminate the electrostatic damage and the like due to discharge. However, short ring 7
May be formed simultaneously with other electrode wiring.

Then, after the insulating substrate 1 and the counter substrate 4 are oriented by rubbing treatment or the like, a switching element such as a TFT is formed at a portion opposed to the position where the counter substrate 4 is arranged. The master substrate 12 is obtained by being opposed to each other with a sealing member or the like interposed therebetween.

Finally, the master substrate 12 is cut along the dividing line 6 by a cutting device such as a diamond cutter to divide the active matrix substrate 5 into units, and liquid crystal is sealed between the substrates to form a substrate. The liquid crystal cell 8 shown in FIG.

Since the short ring 7 is formed in the vicinity of the dividing line 6 when the master substrate 12 is divided, the static electricity generated during the dividing is applied to each electrode wiring, that is, the gate electrode wiring 2 and the source electrode wiring. You can escape to 3 ... Thereby, the potential difference of the static electricity accumulated between the electrode wirings of the master substrate 12 can be made uniform, and the dielectric breakdown of the master substrate 12 can be prevented.

Further, the short ring 7 is composed of the dividing line 6
Since they are formed so as to intersect with the gate electrode wirings 2 ... Or the source electrode wirings 3 ... of the adjacent active matrix substrate 5, the short ring 7 is also divided at the same time when the master substrate 12 is divided. This can eliminate the step of removing the short ring 7 on the master substrate 12 in the liquid crystal cell 8 after the division.

Further, since it is not necessary to previously form a region for removing the short ring 7 on the peripheral edge of the master substrate 12, the interval between the active matrix substrates 5 on the master substrate 12 can be reduced. As a result, the number of liquid crystal cells 8 manufactured from the master substrate 12 per unit can be increased.

Further, the liquid crystal cell 8 from the master substrate 12
If the number of formed units per unit is the same as the conventional one, it is not necessary to previously form a region for removing the short ring 7 on the periphery of the master substrate 12, so that the image size of the active matrix substrate 5, that is, display is possible. The area can be increased, and as a result, the master substrate 1 of the same size can be obtained.
From 2, it is possible to manufacture the liquid crystal cell 8 having a larger image size than the conventional one.

From the above, by using the master substrate 12 as the wiring substrate having the above-mentioned structure, the dielectric breakdown due to static electricity generated during the manufacturing process can be eliminated and the time and cost for manufacturing the liquid crystal cell 8 can be reduced. Is possible.

The short ring 7 in this embodiment is used.
1 has a rectangular shape with the dividing line 6 as a central axis as shown in FIG. 1, but the shape is not limited to this, and for example, FIG.
As shown in (a), a saw-shaped short ring 9 having the dividing line 6 as a central axis may be used.
As shown in (b), a corrugated short ring 10 having the dividing line 6 as a central axis may be used, and further, FIG.
As shown in FIG. 5, a rectangular short ring 11 which is not a repetitive figure having the dividing line 6 as the central axis may be used.

Further, the present application is a COG (Chip on Gl) in which a driver for driving is directly mounted on an active matrix substrate.
The present invention can be applied even when a short ring is formed only on one side, two sides, or three sides of a peripheral portion of an active matrix substrate, such as a liquid crystal display panel having an ass structure. Further, the present invention can be applied not only in the case where the four sides which are the peripheral portions of the active matrix substrate are divided from the wiring board, but also in the case where only one side, two sides or three sides are cut.

[0035]

As described above, the wiring board according to the first aspect of the present invention includes the electrode wiring portion provided in each active matrix substrate unit by the plurality of electrode wirings formed on the surface,
In a wiring substrate in which active matrix substrates are individually obtained by dividing at a substantially central dividing portion between adjacent electrode wiring portions, a conductor that short-circuits each electrode wiring in common, through the dividing portion, In this structure, the electrode wirings between the adjacent electrode wiring portions are alternately connected.

As a result, it is possible to eliminate the dielectric breakdown due to static electricity generated during the manufacturing process and to reduce the time and cost for manufacturing the liquid crystal cell having the active matrix substrate.

[Brief description of drawings]

FIG. 1 is a plan view showing a master substrate according to an embodiment of the present invention, in which a counter substrate is arranged.

FIG. 2 is a perspective view of a liquid crystal cell obtained by dividing the wiring board shown in FIG. 1 along a dividing line.

3A and 3B show another example of the shape of the short ring formed on the wiring board shown in FIG. 1, in which FIG. 3A is a schematic view of a saw-shaped short ring, and FIG. 3B is a corrugated short. FIG. 3C is a schematic diagram of a ring, and FIG. 6C is a schematic diagram of a rectangular short ring that is not a figure with a dividing line as a central axis.

FIG. 4 is a perspective view of a liquid crystal cell before removing a short ring from a conventional active matrix substrate.

5 is a perspective view showing a state in which a short ring forming portion is separated from the active matrix substrate shown in FIG.

6 is a perspective view showing a state in which a short ring forming portion is chamfered from the active matrix substrate shown in FIG.

FIG. 7 is a plan view showing a master substrate provided with a plurality of active matrix substrates shown in FIG.

[Explanation of symbols]

 1 Insulating Substrate 2 Gate Electrode Wiring 3 Source Electrode Wiring 5 Active Matrix Substrate 6 Dividing Line 7 Short Ring (Conductor) 12 Master Substrate (Wiring Substrate)

Claims (1)

[Claims] 1. An electrode wiring portion provided in an active matrix substrate unit, in which a plurality of gate electrode wirings and a plurality of source electrode wirings formed on the surface intersect each other,
In a wiring substrate in which active matrix substrates are individually obtained by dividing the electrode wiring portions between adjacent electrode wiring portions, a conductor that commonly short-circuits each of the electrode wirings, through the dividing portion, A wiring board, which is alternately connected to each electrode wiring between adjacent electrode wiring portions.