JPH0812053B2 - Appearance inspection method and apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rectangular plate type chip fixed resistor, a chip type capacitor or the like sample during transportation during taping work, reel winding work after taping or appearance inspection work. The present invention relates to a visual inspection method and apparatus for inspecting the external contour and external appearance of a surface state.

[0002]

2. Description of the Related Art A chip-shaped electronic component such as a rectangular plate chip fixed resistor is mounted on a printed circuit board or the like by an automatic mounting machine, and the chip-shaped electronic component can be easily supplied to this automatic mounting machine. To make it possible, we are taping the chip-shaped electronic components. BACKGROUND ART Conventionally, as taping tapes used for taping chip-shaped electronic components, there are a type in which a recessed portion for accommodating a chip-shaped electronic component is formed by punching and a type formed by drawing.

27 (a) and 27 (b) show the former type of taping tape, FIG. 27 (a) is a partial plan view, and FIG. 27 (b).
Is a vertical sectional view. As shown in FIGS. 27A and 27B , the taping tape 1 is composed of a storage tape 2 and a cover tape 3, and the storage tape 2 is a tape body 4.
And a bottom tape 5. Tape body 4
Is made of paper or transparent plastic, and a hole 6 for accommodating the chip-shaped electronic component R and a feed hole 7 are formed in a row along the longitudinal direction by punching, and the back surface of the tape body 4 is optically transparent. The bottom tape 5 made of thin paper having the above is adhered, the hole 6 is closed, and the recessed portion 8 is formed. The cover tape 3 is made of a transparent plastic film, and an adhesive layer that can be adhered to both sides of the recessed portion 8 on the surface of the storage tape 2 is formed along both longitudinal edges to close the recessed portion 8. You can do it. Then, the chip-shaped electronic component R is sequentially supplied to the recessed portion 8 of the storage tape 2, the cover tape 3 is superposed on the surface of the storage tape 2, and the two are bonded to each other, whereby the chip-shaped electronic component R can be enclosed. it can.

FIG. 28 is a longitudinal sectional view showing the latter type of tape for taping. As shown in FIG. 28 , the taping tape 1 is composed of a storage tape 2 and a cover tape 3. The storage tape 2 has a recessed portion 8 for storing the chip-shaped electronic component R formed in a tape made of a transparent plastic film by drawing along the longitudinal direction, and a feed hole (not shown) in the longitudinal direction. They are lined up by stamping. Cover tape 3 is a figure
27 It is formed similarly to the case of the taping tape 1 shown in FIGS. Then, the chip-shaped electronic component R is sequentially supplied to the recessed portion 8 of the storage tape 2, the cover tape 3 is superposed on the surface of the storage tape 2, and the two are bonded to each other, whereby the chip-shaped electronic component R can be enclosed. it can.

Not only the chip-shaped electronic component R itself is normal, but also if the tape-shaped electronic component R is not stored in a normal posture in the taping tape 1, problems will occur when it is mounted on a printed circuit board by an automatic mounting machine. In order to prevent such troubles, the appearance of the chip-shaped electronic component R, that is,
It is necessary to inspect the outer contour and the surface condition. Conventionally,
In order to inspect the appearance of the chip-shaped electronic component R, as described above, the chip-shaped electronic component R is enclosed in the taping tape 1 and wound on a reel, the taping tape 1 is rewound on another reel, and then again. When the tape is wound on a reel, it is visually judged from the top of the cover tape 3 of the taping tape 1 that is running whether the appearance is good or bad.

Further, conventionally, in order to automatically inspect the external appearance of a sample, a structure is known in which the sample is illuminated by a light source and the external appearance of the illuminated sample is grasped by an image processing technique. ing.

[0007]

By the way, in recent years, electronic parts are becoming more and more miniaturized, and, for example, a rectangular plate type chip fixed resistor is becoming about several mm square to 1 mm square. The naked eye inspection method as described above cannot cope with miniaturization of electronic components. Also,
Recently, a high inspection speed of about 1000 pieces per minute has been demanded, but such inspection speed cannot be achieved by the naked eye inspection method. In addition, the naked eye inspection method may cause an inspection error due to fatigue, increase the inspection cost, and increase the cost of the chip-shaped electronic component. Furthermore, since the visual inspection speed is much slower than the taping speed of the chip-shaped electronic component, it is necessary to perform the visual inspection while rewinding the taping tape 1 once wound up with the naked eye. Therefore, it is necessary to provide an inspection process independently from the taping work process.

On the other hand, in the image processing method of the above-mentioned conventional example, the sample is illuminated from either the front side or the back side thereof.
For example, when illuminated from the surface side, the surface state of the sample can be grasped, but the outer contour cannot be grasped because a shadow corresponding to the thickness thereof is generated on the periphery of the sample. On the contrary, when illuminated from the back side, the outer contour of the sample can be seen and grasped, but the obtained image is a silhouette image, so it is necessary to obtain a detailed image of the surface state of the sample. I can't. Therefore, according to the conventional image processing method, in order to grasp both the outer contour and the surface state of the sample, the illumination light source is changed and the images are taken twice, or the imaging device is provided on each of the front side and the back side of the sample. It was necessary to arrange the above and separately capture the external contour and the surface condition of the sample, and then combine them.

In recent years, an apparatus for inspecting an electronic component in a taping state using an optical sensor or a capacitance sensor has been put into practical use, but this apparatus can only perform a simple inspection for the presence or absence of an electronic component. Can not.

The present invention solves the above-mentioned conventional problems, and it is possible to simultaneously obtain an image of the outer contour and the surface state of a specimen such as a chip-shaped electronic component by using an image pickup device. (EN) Provided are a visual inspection method and an apparatus thereof capable of coping with miniaturization of a specimen and speeding up of the inspection speed and simplifying the structure, and thus reducing the inspection cost. That is the purpose.

[0011]

According to the appearance inspection method of the present invention for achieving the above object, the first illuminating means illuminates the specimen so that an image of the outer contour of the conveyed specimen can be obtained. In addition, the sample is illuminated by the second illuminating means from the side opposite to the first illuminating means so that an image of the surface state of the sample can be obtained.
And the outer contour and surface state of the sample illuminated by the second illumination means are simultaneously imaged by the imaging device.

Further, the appearance inspection apparatus of the present invention for achieving the above object, comprises a first illuminating means for illuminating the sample so that an image of the outer contour of the sample to be conveyed can be obtained, and the sample. A second illuminating means for illuminating the specimen from the side opposite to the first illuminating means so that an image of the surface state of the specimen can be obtained, and the specimen illuminated by the first and second illuminating means. An image pickup device for simultaneously picking up an image of the outer contour and the surface state is provided.

A light source and an optical fiber for guiding the light emitted from the light source to illuminate the sample can be provided as the first and second illuminating means in the appearance inspection apparatus, and the image pickup apparatus can be provided. As a single imaging camera, the outer contour and the surface state of the specimen are simultaneously imaged, or the first contour imaging first imaging camera and the surface state second imaging camera are used. Optical means for guiding light to the two imaging cameras at the same time is provided, and the outer contour and the surface state of the sample can be simultaneously imaged by the first and second imaging cameras. Further, in each of the appearance inspection devices described above, the first illuminating unit may illuminate the sample from one location, and the second illuminating unit may illuminate the sample from both sides of the imaging device.

In any of the above appearance inspection methods and appearance inspection devices, the specimens are stored in a recessed portion having a light-transmitting property, at least the bottom of which is arranged in a row in the storage tape of the taping tape. The storage tape can be transported while being prevented from being separated by the guide having light transparency by traveling, and the sample can be illuminated from the bottom side of the recess and the guide side, or the sample can be used for taping. A tape storage tape is arranged in a row, at least the bottom is stored in a light-transmissive recess, and the specimen is sealed by the light-transmissive plastic cover tape in the recess for the taping. The sample can be conveyed by running the tape and the sample can be illuminated from the bottom side of the recess and the cover tape side, or the sample can be centered on the vertical axis. Housed in a number formed receiving groove on the outer periphery of the gage wheel that can rotate, conveys the specimen while preventing detachment by rotation of the gage wheel,
The specimen can be illuminated from the light-transmissive substrate side and the light-transmissive cover guide side. As the above-mentioned storage tape, holes are provided in a row in the tape body, and a bottom tape made of a light-transmitting thin paper is adhered to the tape body to form a concave portion, or it is made of transparent plastic. It is possible to use the one in which the recessed portion is formed by drawing. Also, when using black taping tape, change to visible light, infrared rays,
The sample can be illuminated using ultraviolet rays, X-rays, or the like.
In addition, the sample can be continuously or intermittently transported.

Examples of the specimen include electronic parts such as a rectangular plate type fixed chip resistor and a chip type capacitor, and solid substances such as tablets.

[0016]

Therefore, according to the present invention, by illuminating the transported sample with the first illuminating means, the outer contour of the sample can be highlighted, and the surface of the sample is illuminated with the second illuminating means. By doing so, it is possible to make it clear. Then, the external contour and the surface state of the sample can be simultaneously imaged by the imaging device, and the two can be related and grasped.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show an appearance inspection apparatus according to a first embodiment of the present invention, FIG. 1 being a front view and FIG.
Is a side view, and FIG. 3 is an overall schematic configuration diagram of the applied taping device the appearance inspection apparatus of the present invention, FIG. 4 is taping process illustration, FIGS. 5 (a) and (b) a tape taping for taping process described 6 is a plan view and a sectional view of FIG. 6 , FIG. 6 is a sectional view showing the inspection wheel portion for supplying the rectangular plate chip fixed resistor to the recessed portion of the storage tape, and FIG. 7 is an external view of the rectangular plate chip fixed resistor. Inspection operation explanatory diagram, FIG. 8 (a),
(B) is a plan view of an example of an image captured by the appearance inspection device,
Figure 9 is an explanatory view of images obtained by the visual inspection device, FIG. 1
0 is a plan view showing a state where the square plate chip fixed resistor is normally stored in the taping tape, and FIG. 11 is a plan view showing a state where the square plate chip fixed resistor is not stored in the taping tape. 12 to 22 are plan views showing defective examples of the rectangular plate type chip fixed resistor housed in the taping tape.

As shown in FIG. 19 , a rectangular plate-shaped chip fixed resistor (hereinafter, simply referred to as a chip resistor) R which is a sample.
Is a coating layer made of glass or the like, in which a carbon coating R2 serving as a resistor is formed on the outer surface of a substrate R1 made of ceramic or the like, desired grooves are formed in the carbon coating R2 to adjust the resistance value, and the carbon coating R2 is made of glass or the like. Protected by R3, electrodes R4 are formed on both ends by plating, etc.
A resistance value display R5 is provided on the surface 3 by printing or the like.

Next, the taping process of the chip resistor R will be described. As shown in FIGS. 3 to 5 , the tape main body 4 wound on the reel 11 is unrolled, and the bottom tape 5 wound on the reel 12 made of light-transmissive thin paper is unrolled. Crimping device 1
The bottom tape 5 is adhered to the back surface of the tape body 4 by 3 to form the recessed portion 8. The storage tape 2 is intermittently run by the feeding device 14 using the feeding hole 7. During the intermittent running of the storage tape 2, the chip resistors R are sequentially supplied to the recesses 8 by the supply device 15. After the supply, the appearance of the chip resistor R conveyed by intermittent running of the storage tape 2 is inspected by the appearance inspection device 16 of the present invention. After the inspection, the cover tape 3 wound on the reel 17 is overlaid on the surface of the storage tape 2 and the pressure bonding device 18 bonds the both. Then, the taping tape 1 containing the chip resistor R is wound on the winding reel 19.

In the present embodiment, the supply device 15 detects the front and back of the chip resistor R, measures the resistance value, and then supplies it to the recessed portion 8 of the storage tape 2.
In particular, as apparent from FIGS. 4 and 6 , a vertical rotation shaft 21 is rotatably supported by a base 20 via a bearing 22, and a measurement wheel 23 is fixed to the rotation shaft 21. A large number of storage grooves 24 are formed on the outer periphery of the inspection wheel 23 at evenly divided positions. The rotary shaft 21 and the inspection wheel 23 are intermittently rotated by a driving device (not shown) so that the storage grooves 24 are sequentially aligned with the recesses 8 of the storage tape 2 which intermittently travels as described above. It has become. On the outer peripheral portion of the inspection wheel 23, the separation / supply unit 25 and the front / back detection unit 2 are arranged from the upstream side to the downstream side in the rotation direction.
6, first inspection unit 27, second inspection unit 28 and insertion unit 29
Are arranged in sequence. The separation supply unit 25 is configured so that the chip resistor R discharged from the parts feeder 30 can be sequentially supplied to each storage groove 24 of the inspection wheel 23 that is intermittently rotated. A guide 31 and a cover plate 32 are sequentially mounted on the base 20 at the outer peripheral portion of the inspection wheel 23. In the base 20, the chip resistor R supplied to the storage groove 24 of the inspection wheel 23 by the separate supply unit 25 is rotated with intermittent rotation of the inspection wheel 23.
The guide 31 and the cover plate 32 are set so that they can be sequentially conveyed to the front / back detection unit 26, the first inspection unit 27, the second inspection unit 28, and the insertion unit 29.
The chip resistor R is set so as to prevent the chip resistor R from coming off the storage groove 24. The front and back detection unit 26 can detect the front and back of the conveyed chip resistor R, the first and second inspection units 27 and 28 can each measure the resistance value of the chip resistor R, and the insertion unit. Reference numeral 29 is configured so that the chip resistor R after measurement can be inserted into the recessed portion 8 of the storage tape 2.

In this embodiment, the visual inspection device 16 is arranged at the position shown by the solid line in FIG. 4 , that is, at the position before the chip resistor R housed in the recess 8 of the housing tape 2 is sealed by the cover tape 3. , As is clear from FIG . 1 and FIG.
The first illuminating unit 35, the second illuminating unit 36, and the imaging device 37 are included. The first illuminating means 35 comprises a light source (not shown) such as a halogen lamp and an optical fiber 38 for guiding the light emitted from this light source. And
The chip resistance is provided in the hole 41 of the rail 40 so that the emitting portion 39 of the optical fiber 38 can obtain an image of the outer contour of the chip resistor R in the recessed portion 8 of the storage tape 2 running along the rail 40. It is arranged to illuminate the vessel R from below (see FIG. 7 ). Second lighting means 3
Reference numeral 6 includes a light source (not shown) such as a halogen lamp, and an optical fiber 42 that guides the light emitted from the light source. The emitting portion 43 of the optical fiber 42 is provided with a reflection mirror 44 for varying the illumination angle. There is. The second illuminating means 36 has glass, acrylic resin, etc. in the guide 45 for preventing separation so that the emitting portion 43 can obtain an image of the surface state of the chip resistor R in the recessed portion 8 of the housing tape 2. Are arranged so as to illuminate the chip resistor R from above, and at intervals along the traveling direction of the storage tape 2, that is, the conveying direction of the chip resistor R. Are arranged in pairs. The image pickup device 37 is arranged above the storage tape 2, that is, above the chip resistor R, between the emitting portions 43 of the pair of optical fibers 42. The image pickup device 37 is placed in a case 47.
A single image pickup camera (CCD camera) 48 is provided, and this single image pickup camera 48 can simultaneously pick up an image of the outer contour and surface state of the chip resistor R. Since the image pickup device 37 images the outer contour and surface state of the chip resistor R, the image pickup device 37 is arranged immediately above the conveyed chip resistor R, so that the illumination of the surface of the chip resistor R by the second illumination means 36 is oblique. Direction. In this case, if the chip resistor R is illuminated from one direction, it may not be possible to illuminate the entire surface of the chip resistor R with uniform brightness. By illuminating, the entire surface of the chip resistor R can be illuminated with uniform brightness. Therefore, the emission portion 43 of each as the second illumination means 36 the light emitted from the optical fiber 42 by the reflecting mirror 44 as shown in FIG. 7, so that can be collected below the imaging device 37 Is configured. The imaging camera 48 of the imaging device 37 has a field of view capable of imaging the entire shape of at least one chip resistor R, and has a resolution sufficient to grasp the surface state of the chip resistor R to be inspected. Any one can be adopted as long as it has As the imaging device 37 shown in FIG. 8 (a), may be captured two chip resistor R in one field, or as shown in FIG. 8 (b), 1 piece in one field of view The chip resistors R may be imaged, or three or more chip resistors R may be imaged in one visual field. Until the cover tape 3 is adhered to the storage tape 2 in which the chip resistor R is stored, the chip resistor R is prevented from being separated from the recessed portion 8 by the guide 45 while the storage tape 2 is running. Has been done.

In FIG. 3 , reference numeral 52 is an installation table,
Reference numeral 53 is an image processing apparatus connected to the image capturing camera 48 of the image capturing apparatus 37, 54 is a teaching box for setting the inspection standard, setting the outer shape of the chip resistor R, and the like, and 55 is a television for monitoring the image. is there.

Next, the appearance inspection method of the present invention is described above.
The operation of the appearance inspection device will be described. FigureThreeOr figure5To
As shown, when the tape body 4 is unwound from the reel 11.
Together, the bottom tape 5 is unwound from the reel 12 and crimped.
The bottom tape 5 is attached to the back surface of the tape body 4 by the device 13.
It adheres and the recessed part 8 is formed. Send this storage tape 2
The traveling device 14 causes the vehicle to travel intermittently. On the other hand, parts
Separating and supplying the chip resistor R discharged from the feeder 30
Each of the inspection wheels 23 that are intermittently rotated by 25
It is sequentially supplied to the storage groove 24. The supplied chip resistor R is
As described above, with the intermittent rotation of the inspection wheel 23,
During this time, the front and back are detected by the front and back detection unit 26 during this time.
Then, the resistance value is measured by the first and second inspection units 27 and 28.
Is inserted into the recessed portion 8 of the storage tape 2 by the insertion portion 29.
It is stored with the surface facing upward. The front and back are opposite
Chip resistor R is detected and the
When the resistor R is measured, the discharge means (not shown)
Is automatically discharged, and the storage groove 24 after this discharge is stored
Of the storage tape 2 so that it can pass with respect to the storage tape 2.
Driving is stopped. After storage, the chip resistor R is a storage
It is conveyed intermittently as the group 2 travels intermittently. This
During the transportation of, Fig. 2And figure7As shown in
The external appearance and the table of the chip resistor R are displayed by the visual inspection device 16.
Detect the surface condition. That is, the lower first illuminating means 3
5, the chip resistor R is connected to the light-transmissive
Illuminating from behind the mutape 5 side, the periphery of the chip resistor R
Outline of the chip resistor R by preventing the generation of shadow in
Can clearly stand out, and a pair of top
Of the chip resistor R by the emitting portion 43 of the second illumination means 36.
Illuminate the entire surface uniformly and brightly from the transparent guide 46 side.
Can be Then, the light of the first illumination means 35 and the first
The reflected light by the chip resistor R of the illumination means 36 of No. 2 is imaged
Guide to camera 489As shown in, the chip resistor R
The outer contour F and the surface state S of the
You. An example of a method of detecting the chip resistor R is an image pickup device.
Image processing of the image obtained with
Register product data and tolerances from this data in memory
Then, the captured image of the chip resistor R is stored in the memory.
Compare. In addition, the straight line of the outline of the chip resistor R
It is also possible to employ a detection method such as determining sex.
In addition, as described above, a plurality of images are captured in one field of view of the imaging device 37.
The appearance of the chip resistor R can be inspected (Fig.8
(Refer to (a)), and one chip resistor R
Appearance can be inspected (Figure8(See (b)), in particular,
Inspecting the appearance of multiple chip resistors R in one view
To speed up the running of the storage tape 2 by
Can be

As shown in FIG. 10 , when the chip resistor R has a normal outline and surface condition, and the chip resistor R is normally stored in the recess 8 of the storage tape 2. Since the visual inspection result is normal, the storage tape 2 is intermittently run by the feeding device 14 and the supply operation to the recessed portion 8 of the chip resistor R is continued as described above. 11 to 22 show examples of defects that can be detected by the present invention as described below. FIG. 11 shows a state in which the chip resistor R is not housed in the recess 8 of the housing tape 2. FIG. 12 shows a state in which the chip resistor R is reversed and stored in the recessed portion 8 of the storage tape 2. FIG. 13 shows a state in which the chip resistor R is housed in the recessed portion 8 of the housing tape 2 and a part of the chip resistor R is inserted between the tape body 4 and the bottom tape 5. Figure 1
4 is a state in which the chip resistor R is inserted in the recessed portion 8 of the storage tape 2 in an upright state. FIG. 15 shows a state in which the outer edge of the chip resistor R is missing. FIG. 16 shows a state where the chip resistor R is broken. FIG. 17 shows a defective plating state of the electrode R4 of the resistor R of the chip resistor R. FIG. 18 shows a defective state in which the plating of the electrode R4 of the chip resistor R is deviated. FIG. 19 shows a defective state in which the coat layer R3 of the chip resistor R is missing. FIG. 20 shows a defective state in which the plating of the electrode R4 of the chip resistor R protrudes. FIG. 21 shows a defective state of the display value R5 of the resistance value of the chip resistor R. FIG. 22 shows the resistance value R of the chip resistor R
5 is a defective state. In addition, there are cases where chip resistors R having different resistance values are mixed, and when such various defects are detected, the storage tape 2 is stopped from running, and the chip resistors which are normal on the spot are stopped. Store R, store it again, or replace it. When the storage tape 2 containing the normal chip resistor R runs intermittently in this way, as shown in FIGS. 3 and 4 , the cover tape 3 fed from the reel 17 is overlaid on the surface of the storage tape 2 and crimped. The device 18 can bond the both, and the tape for tape 1 after the completion of storage can be wound on the winding reel 19.

The image pickup device 37 thus arranged at one place
By simultaneously imaging both the outer contour and the surface state of the chip resistor R, the image of the surface state can always be grasped integrally with the outer contour. As a result, it becomes possible to grasp the surface condition of the chip resistor R such as improper marking of the resistance value in relation to the outer contour, and the chip resistor R is housed in the recessed portion 8 of the housing tape 2 in a random state. Even if it is, the quality of the surface condition can be judged at high speed. Therefore, it is possible to maintain the conventional processing speed without reducing the traveling speed of the storage tape 2. Moreover, by increasing the optical magnification, it is possible to cope with the miniaturization of the chip resistor R. Further, since only one imaging device 37 needs to be used, the configuration is simplified,
The inspection cost can be reduced. Moreover, since the structure is simplified, it can be easily attached to an existing taping device. Further, in this embodiment, the appearance inspection is performed after the chip resistor R is housed in the recessed portion 8 of the housing tape 2 and before the cover tape 3 is adhered and sealed. When found, the normal chip resistor R can be stored, re-stored and replaced on the spot. Therefore, the chip resistor R after taping can be handled as an inspected product, and it is not necessary to rewind the chip resistor for inspection as in the conventional case, and the taping process and the inspection process can be significantly rationalized. .

Next, a second embodiment of the present invention will be described with reference to the drawings. Figure 23 is a second shows the appearance inspection apparatus in the embodiment, the same visual inspection operation explanatory view and FIG. 7 of the present invention. In this embodiment, the appearance inspection device 16 is located at the position shown by the alternate long and short dash line in FIG. 4 , that is, at the position after the cover tape 3 is adhered to the storage tape 2 and the chip resistor R is sealed in the taping tape 1. It is arranged. The visual inspection of the chip resistor R is preferably performed immediately after the chip resistor R is housed in the recessed portion 8 of the housing tape 2 as described above, but the chip resistor R is used for taping as in this embodiment. The first illuminating means 3 from the side of the bottom tape 5 having optical transparency in the state of being enclosed in the tape 1.
5 and illuminates with the second illuminating means 36 from the side of the transparent cover tape 3 having a light-transmitting property so that the external contour and the surface state of the chip resistor R are simultaneously imaged by the single image pickup device 37. May be. Other configurations are the same as those in the first embodiment.

When performing a visual inspection of the chip resistor R after taping as in the present embodiment, when a visual defect is detected, for example, the bottom tape 5 at the defective position is broken and a normal chip resistor R is stored. Or the bottom tape 5 is repaired. When the appearance inspection of the chip resistor R after taping is performed, the appearance inspection of the chip resistor R is not limited to after the cover tape 3 is adhered as described above, but also in the process of rewinding the taping tape 1 as in the related art. It is also possible to do In this case, it is obvious that the visual inspection is carried out while the chip resistor R is continuously conveyed.

Next, a third embodiment of the present invention will be described with reference to the drawings. Figure 24 is a third shows the appearance inspection apparatus in the embodiment, the same visual inspection operation explanatory view and FIG. 7 of the present invention. In the present embodiment, the appearance inspection device 16 is operated by the second inspection unit 28 while the chip resistor R is being conveyed by the inspection wheel 23 at the position indicated by the chain double-dashed line in FIGS. 4 and 6 . It is located at the position after the value was measured. At the position of the visual inspection device 16, holes 20a and 32a are formed in the substrate 20 and the cover plate 32, respectively.
A transparent substrate 20b and a transparent cover guide 32b are formed inside a. Then, the chip resistor R is housed on the base 20 in the housing groove 24 of the inspection wheel 23, and is separated by the outer peripheral guide 31 (see FIG. 6 ) and the upper cover plate 32 by intermittent rotation of the inspection wheel 23. The transparent substrate 20 is transported intermittently while being prevented from
The first illuminating means 35 illuminates from the b side, the second illuminating means 36 illuminates from the transparent cover guide 32b side, and the outer contour and the surface state of the chip resistor R are simultaneously imaged by one imaging device 37. To do. The other structure is similar to that of the first embodiment.

According to the present embodiment, since the appearance inspection is performed before the chip resistor R is stored in the recessed portion 8 of the storage tape 2, the chip resistor R itself is excluded except for the storage failure of the storage tape 2. You can inspect for defects. Therefore, as in the first embodiment, the chip resistor R after taping can be handled as an inspected product, and there is no need to rewind the inspection for inspection as in the conventional case. It will be possible to greatly streamline the process.

Next, a fourth embodiment of the present invention will be described with reference to the drawings. 25 and 26 show an appearance inspection apparatus in a fourth embodiment of the present invention, FIG. 25 is a front view and FIG. 26 is a side view. In the present embodiment, FIG. 2
As shown in FIG. 5 and FIG. 26 , the image pickup device 37 includes a first image pickup camera (CCD camera) 48 for outer contour in a case 47.
a and a second image pickup camera (CCD camera) 4 for surface condition
8b is supported. The first imaging camera 48a and the second
The half mirrors 5 are provided in front of the image pickup cameras 48b.
0 and the reflection mirror 51 are supported, a part of the light is transmitted by the half mirror 50 and guided to the first imaging camera 48a, the remaining part is reflected, and further reflected by the reflection mirror 51 to be the second imaging camera. It is possible to lead to 48b. Other configurations are similar to those of the first to third embodiments. According to the present embodiment, the chip resistor R is provided by the first and second separate imaging cameras 48a and 48b.
Since the outer contour and the surface state of the chip resistor R are simultaneously imaged, the outer contour and the surface state can be reliably imaged at the same time even if the surface contrast of the chip resistor R is poor.

In each of the above embodiments,27
When using the taping tape 1 shown in (a) and (b),
I explained about the case, but the figure28Taping tape shown in
This can be applied to the case of using
In addition, if the sample can be seen through from the outside,
The tape for taping may be of the type described below. Also, the inspection
If the inspection surface of the body is the lower surface, the first illumination means 3
5 and the arrangement of the second illumination means 36 and the image pickup device 37
You can change it. Also, the first lighting means 35 and the second lighting means
The shape, arrangement form, and the number of arrangement of the light means 36 are as described above.
It is not limited to an example, but in addition to this, 4 directions, all directions
It can be appropriately selected according to each purpose, such as
You. In addition, the first and second imaging cameras 48a and 48b are not
Example without using the half mirror 50 and the reflection mirror 51
For example, arrange it diagonally to show the external contour and surface condition of the sample.
You may make it image. Also, the other side or side of the specimen
When it is necessary to inspect a surface (end surface), the imaging device 3
7 The number of imaging cameras can be increased, or
Illumination means is provided at a location different from the appearance inspection device 16 of each embodiment.
An imaging device can also be arranged. Also a chip resistor
After taping R with a taping device, take up
Appearance inspection of the chip resistor R during winding on the reel of the device
You can also conduct an inspection. Also, samples are transported intermittently
Not only in the case but also in the case of continuous conveyance, the appearance inspection
Can be inspected. Also, electronic parts such as chip resistor R
Not limited to products, tablets and capsules can also be inspected
it can. Also, when using black taping tape
Infrared rays, ultraviolet rays, X-rays, etc. are used instead of visible light
be able to. In addition, the present invention is based on its basic technical concept.
Various design changes can be made without departing from the concept.

[0032]

As described above, according to the present invention, by illuminating the transported sample with the first illumination means,
It is possible to make the outer contour of the sample stand out, and it is possible to make it clear by illuminating the surface of the sample by the second illumination means. Then, the external contour and the surface state of the sample can be simultaneously imaged by the imaging device, and the two can be related and grasped. Since the image of the outer contour and the surface state of the sample can be obtained at the same time by using the imaging device, it is possible to cope with the miniaturization of the sample and the increase in the inspection speed, and also to simplify the configuration. Therefore, the inspection cost can be reduced.

Further, as an image pickup apparatus, if one image pickup camera simultaneously picks up an image of the outer contour and the surface state of the sample, the structure can be simplified and the cost can be reduced. Of the first image pickup camera, the second image pickup camera for the surface state, and the optical means for guiding light to the first and second image pickup cameras at the same time. If the outer contour and the surface state of the sample are imaged at the same time, the outer contour and the surface state of the sample can be reliably imaged even if the contrast of the surface of the sample is poor. Further, the first illuminating means illuminates the sample from one place, and the second illuminating means illuminates the sample from both sides of the image pickup device, so that an image of the outer contour and surface state of the sample can be obtained with a simple configuration. Can be surely obtained. Further, the specimen is arranged in a row in the tape for storing the taping tape, and at least the bottom portion is stored in the recessed portion having the light transmitting property, and the sample is detached by the guide having the light transmitting property by the running of the storage tape. Transported in a prevented state, illuminating the specimen from the bottom side of the recess and the guide side,
By visual inspection, the sample after taping can be handled as an inspected product, and the taping process and the inspection process can be rationalized. In addition, the sample
The taping tape is arranged in a row in the storage tape, at least the bottom is stored in a light-transmissive recess, and the sample is sealed in the recess by a light-transmissive plastic cover tape. By transporting the working tape and illuminating the sample from the bottom side of the recess and the cover tape side, it is possible to perform a visual inspection of the sample without using a special sample separation preventing means. Further, the sample is stored in a plurality of storage grooves formed on the outer periphery of the inspection wheel that can rotate about a vertical axis, and this sample is transported while being prevented from being separated by the rotation of the inspection wheel. By illuminating from the substrate side having light transmissivity and the cover guide side having light transmissivity and inspecting the appearance, the specimen after taping can be handled as an inspected product, streamlining the taping process and the inspection process. be able to.

[Brief description of drawings]

FIG. 1 is a front view showing an appearance inspection apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view showing the appearance inspection device.

FIG. 3 is an overall schematic configuration diagram of a taping device to which the appearance inspection device is applied.

FIG. 4 is an explanatory view of a taping process of the taping device.

FIG. 5A is a plan view of a taping tape for explaining the taping process of the taping device, and FIG. 5B is a cross-sectional view of the taping tape for explaining the taping process of the taping device.

FIG. 6 is a cross-sectional view showing an inspection wheel unit for supplying the rectangular plate-shaped chip fixing resistor in the taping device to the recessed portion of the storage tape.

FIG. 7 is an explanatory diagram showing the appearance inspection operation of the rectangular plate chip fixed resistor by the appearance inspection device.

8 (a) is a plan view plan view showing an example of imaging by the inspection system (b) is showing another example of imaging by the visual inspection device

FIG. 9 is an explanatory diagram of an image obtained by the appearance inspection device.

FIG. 10 is a plan view showing a state where the square plate chip fixed resistor is normally stored in the taping tape.

FIG. 11 is a plan view showing a state in which the rectangular plate chip fixed resistor is not housed in the taping tape.

Figure 12 is a plan view showing a defective example of square plate shape Chip Resistors paid to a Te Doping tape

FIG. 13 is a rectangular plate-shaped chip stored in a tape for taping .
Plan view showing an example of defective fixed resistor

FIG. 14: Square plate-shaped chip accommodated in taping tape
Plan view showing an example of defective fixed resistor

FIG. 15 is a rectangular plate-shaped chip stored in a tape for taping .
Plan view showing an example of defective fixed resistor

FIG. 16 is a rectangular plate-shaped chip stored in a tape for taping .
Plan view showing an example of defective fixed resistor

FIG. 17: Square plate-shaped chip stored in tape for taping
Plan view showing an example of defective fixed resistor

FIG. 18 is a rectangular plate-shaped chip stored in a tape for taping .
Plan view showing an example of defective fixed resistor

FIG. 19 is a rectangular plate-shaped chip stored in a tape for taping .
Plan view showing an example of defective fixed resistor

FIG. 20 is a rectangular plate-shaped chip stored in a tape for taping .
Plan view showing an example of defective fixed resistor

FIG. 21 is a rectangular plate-shaped chip stored in a tape for taping .
Plan view showing an example of defective fixed resistor

FIG. 22 is a rectangular plate-shaped chip stored in a tape for taping .
Plan view showing an example of defective fixed resistor

FIG. 23 is an explanatory diagram of an appearance inspection operation similar to FIG. 7 , showing an appearance inspection device according to a second embodiment of the present invention.

FIG. 24 is an explanatory view of the appearance inspection operation similar to FIG. 7 , showing the appearance inspection apparatus in the third embodiment of the present invention.

FIG. 25 is a front view showing an appearance inspection device according to a fourth embodiment of the present invention.

FIG. 26 is a side view showing the appearance inspection apparatus.

FIG. 27 (a) is a partial plan view showing an example of taping tape, and FIG. 27 (b) is a longitudinal sectional view showing the taping tape.

FIG. 28 is a vertical cross-sectional view showing another example of taping tape.

[Explanation of symbols]

 1 Tape for taping 2 Tape for storing 3 Cover tape 4 Tape body 5 Bottom tape 8 Recessed part 14 Feeding device 15 Supply device 16 Visual inspection device 20b Board 23 Inspection wheel 24 Storage groove 29 Insertion part 32b Cover guide 35 First illumination Means 36 Second Illumination Means 37 Imaging Device 38 Optical Fiber 42 Optical Fiber 48 Imaging Camera 48a First Imaging Camera 48b Second Imaging Camera R Square Plate Chip Fixed Resistor (Sample)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical location H01G 13/00 361 Z 7924-5E H01L 21/66 J 7514-4M H04N 7/18 B (72) Inventor Tomoyuki Kojima 3-26, Tanimotomura-cho, Shinjuku-ku, Tokyo Within Masawa Industrial Co., Ltd. (72) Inventor Hiroshige Miyazato 1-5 Otoyanagicho, Kaminoba, Minami-ku, Kyoto-shi, Kyoto (Duck Engineering Co., Ltd. 72) Inventor Gen'ichi Kaneshiro 1-5, Kamitoba Oyanagicho, Minami-ku, Kyoto Prefecture, Kyoto Duck Engineering Co., Ltd. (72) Inventor Yoshitaka Hikami 1-5, 5th duck, Kamitoba Oyanagi-cho, Minami-ku, Kyoto City, Kyoto Prefecture Engineering Co., Ltd. (56) Reference JP 63-132108 (JP, A) JP 62-277538 (JP, A) JP 56-155802 (JP, A)

Claims (11)

[Claims] 1. The sample is illuminated by the first illuminating means so that an image of the outer contour of the transported sample can be obtained, and the sample of the surface state of the sample can be obtained. Is illuminated by the second illuminating means from the side opposite to the first illuminating means, and the external contour and the surface condition of the sample illuminated by the first and second illuminating means are simultaneously imaged by the image pickup device. Appearance inspection method. 2. A specimen is arranged in a line in a tape for storing a tape for taping, and at least a bottom portion is stored in a recess having a light transmitting property, and the sample is removed by a guide having a light transmitting property when the storage tape runs. Transported in a prevented state,
The visual inspection method according to claim 1, wherein the sample is illuminated from the bottom side of the recess and the guide side. 3. A sample is arranged in a row in a tape for storing a taping tape, at least the bottom is stored in a light-transmissive recess, and is sealed in the recess by a light-transmissive plastic cover tape. The appearance inspection method according to claim 1, wherein the taping tape is transported in this state while being conveyed, and the sample is illuminated from the bottom side of the recess and the cover tape side. 4. The sample is stored in a plurality of storage grooves formed on the outer periphery of the inspection wheel that can rotate about a vertical axis, and is transported while being prevented from being separated by the rotation of the inspection wheel. The sample is illuminated from the light-transmissive substrate side and the light-transmissive cover guide side.
Appearance inspection method described. 5. A first illuminating means for illuminating the sample so as to obtain an image of the outer contour of the transported sample, and the sample for obtaining the image of the surface condition of the sample. A second illuminating unit that illuminates from the side opposite to the first illuminating unit, and an imaging device that simultaneously captures the outer contour and the surface state of the sample illuminated by the first and second illuminating units are provided. Appearance inspection device. 6. The appearance inspection apparatus according to claim 5, wherein the image pickup device simultaneously picks up an image of the outer contour and the surface state of the sample by one image pickup camera. 7. An image pickup device comprises a first image pickup camera for an outer contour, a second image pickup camera for a surface state, and an optical means for guiding light to the first and second image pickup cameras at the same time. The appearance inspection apparatus according to claim 5. 8. The visual inspection apparatus according to claim 5, wherein the first illuminating unit illuminates the sample from one location, and the second illuminating unit illuminates the sample from both sides of the imaging device. 9. A sample is arranged in a row in a tape for storing a tape for taping, and at least a bottom portion is stored in a recess having a light transmitting property, and the sample is removed by a guide having a light transmitting property while the storage tape is running. Transported in a prevented state,
9. The appearance inspection apparatus according to claim 5, wherein the first and second illumination means illuminate the sample from the bottom side of the recess and the guide side. 10. A sample is arranged in a row in a tape for storing a tape for taping, and at least the bottom is stored in a recess having a light transmitting property, and is enclosed in the recess by a cover tape made of a light transmitting plastic. In this state, the tape for tape is conveyed by the traveling of the tape for tape, and the first and second tapes are conveyed.
9. The appearance inspection apparatus according to claim 5, wherein the illumination means illuminates the sample from the bottom side of the recess and the cover tape side. 11. The sample is stored in a plurality of storage grooves formed on the outer circumference of the inspection wheel that can rotate about a vertical axis, and is transported while being prevented from being separated by the rotation of the inspection wheel. 9. The visual inspection apparatus according to claim 5, wherein the first and second illuminating means illuminate the sample from the light-transmissive substrate side and the light-transmissive cover guide side.