CN111693778B - Patch resistor abnormality detection method, device, system, equipment and storage medium - Google Patents
Patch resistor abnormality detection method, device, system, equipment and storage medium Download PDFInfo
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- CN111693778B CN111693778B CN202010449266.XA CN202010449266A CN111693778B CN 111693778 B CN111693778 B CN 111693778B CN 202010449266 A CN202010449266 A CN 202010449266A CN 111693778 B CN111693778 B CN 111693778B
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Abstract
The application relates to a chip resistor abnormity detection method, device, system, equipment and storage medium. The method comprises the following steps: acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors; obtaining standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information; performing area division on the image according to the standard position information to obtain a target area containing each chip resistor; and extracting the color characteristics of each target area, and determining the state of each patch resistor according to the color characteristics. By identifying the color characteristics of each target area on the circuit board and determining whether the chip resistor is abnormal in surface mounting according to the color characteristics, the chip resistor does not need to be manually checked, and the detection efficiency and accuracy are improved.
Description
Technical Field
The present disclosure relates to the field of computer technologies, and in particular, to a method, an apparatus, a system, a device, and a storage medium for detecting an abnormality of a chip resistor.
Background
The chip resistor is also called a chip type fixed resistor, is one of metal glass glaze resistors, has the characteristics of small volume, light weight, high mechanical strength, superior high-frequency characteristic and the like, and is widely used on circuit boards of products such as computers, mobile phones, televisions, air conditioners and the like.
The chip resistor is generally mounted on the PCB by a chip mounter, and when a mounting fault occurs in the chip mounter or the PCB deforms seriously, an abnormal condition that the chip resistor overturns may be caused, namely that the chip resistor is being mounted on a corresponding pad of the PCB, but the reverse side faces upwards and the front side faces downwards. At present, the overturning quality detection of the chip resistor mainly depends on manual direct visual detection or auxiliary visual detection by means of a microscope. The method has low detection efficiency, and particularly has long detection time when a single PCB has a plurality of chip resistors, thereby seriously influencing the production progress. Meanwhile, the eyes of the detection personnel who see the small object for a long time are easy to be tired, and both the detection efficiency and the accuracy rate can be reduced.
Disclosure of Invention
In order to solve the technical problems of long time consumption and low efficiency of artificially detecting the surface mounting abnormity of the chip resistor, the application provides a method, a device, a system, equipment and a storage medium for detecting the abnormity of the chip resistor.
In a first aspect, the present application provides a method for detecting an abnormality of a chip resistor, including:
acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors;
obtaining standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information;
performing area division on the image according to the standard position information to obtain a target area containing each chip resistor;
and extracting the color characteristics of each target area, and determining the state of each patch resistor according to the color characteristics.
Optionally, the status includes abnormal and normal, and the method further comprises:
when the state of at least one chip resistor in the image is abnormal, generating a recovery instruction for recovering the circuit board, and executing the recovery instruction;
and when the states of all the chip resistors in the image are normal, generating a transmission instruction for transmitting the circuit board, and executing the transmission instruction.
Optionally, the status comprises an exception, the method further comprising:
and when the state of at least one patch resistor in the image is abnormal, generating an alarm instruction for starting an alarm device.
Optionally, the extracting the color feature of each target region, and determining the state of each patch resistor according to the color feature includes:
extracting color features in each target region;
calculating a first pixel proportion of each target area, wherein the first pixel proportion is the proportion of pixel points of which the color characteristics of each target area accord with preset color characteristics;
judging whether the first pixel ratio of each target area is smaller than a preset ratio or not;
when the first pixel proportion of the current target area is smaller than the preset proportion, judging that the state of the chip resistor of the current target area is abnormal;
and when the first pixel proportion of the current target area is greater than or equal to the preset proportion, judging that the state of the patch resistor of the current target area is normal.
Optionally, the method further comprises:
modifying the pixel value of a pixel point meeting a first preset condition in the color characteristics of each target area into a preset pixel value;
the calculating the first pixel fraction in each of the target regions includes: and calculating the ratio of the number of pixel points of the preset pixel value in each target region to the number of total pixel points of the corresponding target region to obtain the first pixel proportion of each target region.
Optionally, the method further comprises:
and when the state of the patch resistor of the current target area is abnormal, marking the current target area.
In a second aspect, the present application provides a chip resistor abnormality detection apparatus, including:
the image acquisition module is used for acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors;
the standard information acquisition module is used for acquiring standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information;
the area dividing module is used for carrying out area division on the image according to the standard position information to obtain a target area containing each chip resistor;
and the state determining module is used for extracting the color characteristics of each target area and determining the state of each patch resistor according to the color characteristics.
A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the following steps when executing the computer program:
acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors;
obtaining standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information;
performing area division on the image according to the standard position information to obtain a target area containing each chip resistor;
and extracting the color characteristics of each target area, and determining the state of each patch resistor according to the color characteristics.
A computer-readable storage medium, on which a computer program is stored which, when executed by a processor, carries out the steps of:
acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors;
obtaining standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information;
performing area division on the image according to the standard position information to obtain a target area containing each chip resistor;
and extracting the color characteristics of each target area, and determining the state of each patch resistor according to the color characteristics.
The chip resistor abnormity detection method, device, system, equipment and storage medium comprise the following steps: acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors; obtaining standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information; performing area division on the image according to the standard position information to obtain a target area containing each chip resistor; and extracting the color characteristics of each target area, and determining the state of each patch resistor according to the color characteristics. By identifying the color characteristics of each target area on the circuit board and determining whether the chip resistor is abnormal in surface mounting according to the color characteristics, the chip resistor does not need to be manually checked, and the detection efficiency and accuracy are improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a diagram of an exemplary embodiment of a method for detecting anomalies in a chip resistor;
FIG. 2 is a schematic diagram of an embodiment of an image capture module;
FIG. 3 is a schematic flow chart of a method for detecting an anomaly in a chip resistor in one embodiment;
FIG. 4 is a block diagram showing the structure of a device for detecting abnormality of a chip resistor according to an embodiment;
FIG. 5 is a diagram illustrating an internal structure of a computer device according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a diagram of an application system of the method for detecting an abnormality of a chip resistor in one embodiment. Referring to fig. 1, the chip resistor abnormality detection method is applied to a chip resistor abnormality detection system. The chip resistor abnormality detection system comprises an image acquisition module 110, a mobile carrier 120, a position detection module 130, a limiting module 140, an offline module 150, a chip resistor abnormality detection device 160 and an industrial control device 170. The chip resistor abnormality detection device 160 is connected to and controlled by the industrial control device 170, the image acquisition module 110, the mobile carrier 120, the position detection module 130, the limit module 140, and the offline module 150.
In an embodiment, fig. 2 is a schematic structural diagram of an image capturing module in an embodiment, and referring to fig. 2, the image capturing module 110 includes an industrial camera 111, a camera moving platform 112, an industrial light source 113, and an industrial lens 114, and is configured to capture an image of a circuit board and upload the image to the industrial control device 170. The camera motion platform 112 is a two-dimensional platform, the industrial camera 111 is fixed on the camera motion platform 112, and the industrial camera 111 is moved to a designated position according to an operation instruction.
In one embodiment, referring to fig. 2, the camera moving platform 112 includes two servo motors and lead screw modules corresponding to the servo motors, and the industrial camera 111 is moved to a designated position on a two-dimensional plane by the camera moving platform, so as to acquire patch resistance images of different position areas on the circuit board.
The mobile carrier 120 is used for carrying a circuit board to move to a designated position on the transmission track, and the circuit board is a universal PCB board.
In one embodiment, two adjacent edges of the mobile carrier 120 are respectively provided with a positioning baffle for limiting one corner of circuit boards with different sizes to the same position on the mobile carrier 120.
The position detection module 130 is used for identifying the position of the mobile carrier 120 on the transfer track.
In one embodiment, the position detection module 130 includes an infrared sensor, and when the mobile carrier 120 triggers the infrared sensor, the position detection module 130 sends a trigger message to the industrial control device 170.
The position limiting module 140 is used for limiting the mobile carrier 120 at a set position.
In one embodiment, the limiting module includes an air cylinder and an infrared sensor, a baffle is disposed on the top of a piston rod of the air cylinder, when the industrial control device 170 receives the triggering information transmitted by the position detecting module 130, the industrial control device 170 sends an action command for controlling the movement of the air cylinder, so that the piston rod of the air cylinder extends out to limit the mobile carrier 120 at the set position through the baffle, when the mobile carrier 120 reaches the set position, the infrared sensor is triggered, and the limiting module 140 sends the in-place information of the mobile carrier 120 to the industrial control device 170.
The offline module 150 is used for moving the circuit board which is detected to be unqualified from the automatic detection line to a defective product area.
In one embodiment, the offline module 150 includes a pick-up rack, by which the non-defective circuit board is picked up and transferred to a defective area.
In one embodiment, referring to fig. 1, when the mobile carrier 120 carries a circuit board and moves to the position detection module 130, the position detection module 130 sends trigger information to the industrial control device 170, the industrial control device 170 controls the position limiting module 140 to limit the mobile carrier 120 under the image acquisition module 110, and controls the image acquisition module 110 to acquire images of the circuit board, the acquired images are uploaded to the chip resistor abnormality detection device 160 for state detection, if it is determined that at least one chip resistor in an abnormal state exists on the circuit board, a recovery instruction is generated, the circuit board is moved to under the offline module 150, the mobile carrier is identified to move in place by the position detection module 130, the position detection module 130 sends the trigger information to the industrial control device 170, the industrial control device 170 controls the position limiting module 140 to limit the mobile carrier 120 under the offline module 150, the offline module 150 grabs the circuit board with abnormal state away from the automatic detection line and transfers the circuit board to a defective product area.
In an embodiment, fig. 3 is a schematic flow chart of a chip resistor abnormality detection method in an embodiment, and referring to fig. 3, a chip resistor abnormality detection method is provided. The embodiment is mainly exemplified by applying the method to the chip resistor abnormality detection device 160 in fig. 1, and the method specifically includes the following steps:
step S210, an image including a wiring board is acquired.
In this embodiment, the circuit board includes identification information and a plurality of chip resistors, and the circuit board is the PCB board, includes a plurality of chip resistors and other components and parts on the circuit board, and has identification information on the circuit board, and identification information corresponds the model of this circuit board, and chip resistor's positive protective material is black, and the ceramic substrate of reverse side is white.
And step S220, acquiring standard information of each chip resistor according to the identification information of the circuit board.
In this embodiment, corresponding parameter information is screened in a database according to identification information of a circuit board, the parameter information includes standard information of each chip resistor on the identification information circuit board, the standard information includes standard position information, a preset ratio, a first preset condition and the like of the chip resistor, the standard position information is used for indicating the position of the chip resistor on the circuit board, and the first preset condition and the preset ratio are used as reference standards for judging whether a color feature corresponding to the chip resistor is a front surface.
And step S230, performing area division on the image according to the standard position information to obtain a target area containing each chip resistor.
In this embodiment, according to the standard position information of each patch resistor, a plurality of target regions including the patch resistor are determined on the image, where the target regions are specifically ROI regions (regions of interest), and the target regions include the complete patch resistor and a small amount of background around the patch resistor.
Step S240, extracting color features of each target region, and determining the state of each chip resistor according to the color features.
In this embodiment, the color features in the target areas are extracted, since the front protective material of the chip resistor is black and the ceramic substrate on the back is white, the mounting state of the chip resistor in each target area is determined according to the identified color features, the state includes abnormal and normal, the abnormal state corresponds to the chip resistor with the back facing upward, that is, the color features in the extracted target areas are mainly white; the front of the normal corresponding chip resistor faces upwards, namely, the color feature in the extraction target area is mainly black.
In one embodiment, when the state of at least one chip resistor in the image is abnormal, a recovery instruction for recovering the circuit board is generated, and the recovery instruction is executed; when the states of all the chip resistors in the image are normal, a transmission instruction for transmitting the circuit board is generated, and the transmission instruction is executed.
Specifically, the state of the chip resistor in each target area is determined according to the color characteristics in the target area, when at least one chip state in the image is abnormal, a transmission instruction for transmitting the circuit board to the defective area is generated, the transmission instruction is executed, the industrial control device 170 controls the offline module 150 according to the transmission instruction, the circuit board is grabbed from the automatic detection line and is transferred to the defective area, and the circuit board with the abnormal chip state is prohibited from entering the subsequent process. And uniformly re-mounting the chip resistors with the abnormality on the circuit board in the defective product area, and performing abnormality detection on the re-mounted circuit board again.
In one embodiment, an alarm instruction for activating the alarm device is generated when the state of at least one of the chip resistors present in the image is abnormal.
Specifically, when the abnormal chip resistor is determined to exist on the circuit board, an alarm instruction for starting the alarm device is generated to remind a worker of the existence of the circuit board which needs to be re-mounted.
In one embodiment, color features in each target region are extracted; calculating a first pixel proportion of each target area, wherein the first pixel proportion is the proportion of pixel points of which the color characteristics of each target area accord with preset color characteristics; judging whether the first pixel ratio of each target area is smaller than a preset ratio or not; when the first pixel proportion of the current target area is smaller than the preset proportion, judging that the state of the chip resistor of the current target area is abnormal; and when the first pixel proportion of the current target area is larger than or equal to the preset proportion, judging that the state of the patch resistor of the current target area is normal.
Specifically, the first pixel proportion is the proportion of pixel points with the color of the front side of the chip resistor in the target area, whether the chip resistor in the target area is turned over or not is judged according to the proportion of the pixel points with the color of the front side of the chip resistor, when the first pixel proportion is larger than or equal to a preset proportion, namely the proportion of the pixel points with the color of the front side of the chip resistor is larger, the state of the chip resistor in the current target area is judged to be normal, namely the situation that the back side of the chip resistor is upward does not exist; when the first pixel proportion is smaller than the preset proportion, namely the proportion of the pixel points of the front color of the chip resistor is smaller, the state of the chip resistor in the current target area is judged to be abnormal, namely the reverse side is upward.
In one embodiment, the first pixel ratio is a ratio of the number of pixels of the front color of the chip resistor to the total number of pixels in the target area. Counting the number of pixel points of the front color of the chip resistor in the target area to obtain the number of target pixel points, wherein the product of the number of the target pixel points and a calibration value is the actual area of the target pixel points in the target area, and the calibration value is the area of one pixel point. The parameter information corresponding to the circuit board further comprises a set area, the set area is the area of the front side or the back side of the chip resistor, the difference value between the actual area and the set area is calculated, whether the absolute value of the difference value is larger than a preset precision value or not is judged, if the absolute value of the difference value is larger than the preset precision value, the corresponding actual area is smaller, the corresponding first pixel occupation ratio is smaller than the preset occupation ratio, the state of the chip resistor in the current target area is judged to be abnormal, and the situation that the back side faces upwards exists. If the absolute value of the difference is smaller than or equal to the preset precision value, the corresponding actual area is larger, the corresponding first pixel ratio is larger than or equal to the preset ratio, and the state of the chip resistor in the current target area is judged to be normal, namely, the situation that the reverse side faces upwards does not exist.
In one embodiment, the pixel value of a pixel point meeting a first preset condition in the color characteristics of each target area is modified into a preset pixel value; and calculating the ratio of the number of pixel points of the preset pixel value in each target region to the number of total pixel points of the corresponding target region to obtain the first pixel proportion of each target region.
Specifically, the first preset condition is that the RGB color threshold requirement is met, the RGB color threshold includes three channel thresholds, the preset pixel value is a white RGB color value (255 ), and in each target region, the pixel values of the pixel points which are simultaneously smaller than three channel thresholds in the RGB color threshold are modified into the white RGB color value; and modifying the pixel value of the pixel point which does not accord with the RGB color threshold value into a black RGB color value, namely (0,0, 0). According to the RGB color threshold, converting the color of the pixel points which represent the front face of the chip resistor in the image into white, converting other pixel points in the image into black, and calculating the number of white pixel points in each target area, namely calculating the ratio of the number of the pixel points on the front face of the chip resistor in the target area to the total number of the pixel points of the corresponding target area to obtain the first pixel ratio of each target area.
In one embodiment, the current target area is marked when the state of the patch resistance of the current target area is abnormal.
Specifically, when the state of the chip resistor in the current target area is abnormal, the current target area is marked in the image, for example, by using a graphic mark and/or a color mark, so that a worker can conveniently locate the position of the abnormal chip resistor on the circuit board.
Fig. 3 is a schematic flow chart of a method for detecting an abnormality in a chip resistor according to an embodiment. It should be understood that, although the steps in the flowchart of fig. 3 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 3 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
In an embodiment, fig. 4 is a block diagram illustrating a structure of a chip resistor abnormality detecting apparatus according to an embodiment, and as shown in fig. 4, there is provided a chip resistor abnormality detecting apparatus 160 including:
the image acquisition module is used for acquiring an image comprising a circuit board, and the circuit board comprises identification information and a plurality of chip resistors;
the standard information acquisition module is used for acquiring standard information of each chip resistor according to the identification information of the circuit board, and the standard information comprises standard position information;
the area division module is used for carrying out area division on the image according to the standard position information to obtain a target area containing each chip resistor;
and the state determining module is used for extracting the color characteristics of each target area and determining the state of each patch resistor according to the color characteristics.
In one embodiment, the status includes abnormal and normal, the apparatus further comprising:
the recovery module is used for generating a recovery instruction for recovering the circuit board and executing the recovery instruction when the state of at least one chip resistor in the image is abnormal;
and the transmission module is used for generating a transmission instruction for transmitting the circuit board and executing the transmission instruction when the states of all the chip resistors in the image are normal.
In one embodiment, the status comprises an exception, the apparatus further comprising:
and the alarm module is used for generating an alarm instruction for starting the alarm device when the state of at least one chip resistor in the image is abnormal.
In one embodiment, the state determination module comprises:
a feature extraction unit configured to extract color features in each target region;
the first pixel proportion calculation unit is used for calculating the first pixel proportion of each target area, and the first pixel proportion is the proportion of pixel points of which the color characteristics of each target area accord with the preset color characteristics;
the ratio judging unit is used for judging whether the first pixel ratio of each target area is smaller than a preset ratio or not;
the abnormity determining unit is used for judging that the state of the chip resistor of the current target area is abnormal when the first pixel occupation ratio of the current target area is smaller than the preset occupation ratio;
and the normal determining unit is used for judging that the state of the patch resistor of the current target area is normal when the first pixel occupation ratio of the current target area is greater than or equal to a preset occupation ratio.
In one embodiment, the apparatus further comprises:
the pixel value modification module is used for modifying the pixel values of the pixel points meeting the first preset condition in the color characteristics of each target area into preset pixel values;
the proportion calculation unit includes:
and the ratio generating unit is used for calculating the ratio of the number of pixel points of the preset pixel value in each target area to the number of total pixel points of the corresponding target area to obtain the first pixel ratio of each target area.
In one embodiment, the apparatus further comprises:
and the marking module is used for marking the current target area when the state of the patch resistor of the current target area is abnormal.
FIG. 5 is a diagram illustrating an internal structure of a computer device in one embodiment. The computer device may specifically be the chip resistor abnormality detection apparatus 160 in fig. 1. As shown in fig. 5, the computer apparatus includes a processor, a memory, a network interface, an input device, and a display screen connected through a system bus. Wherein the memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system and may also store a computer program, which, when executed by the processor, causes the processor to implement the chip resistance abnormality detection method. The internal memory may also have a computer program stored therein, which when executed by the processor, causes the processor to perform a method of detecting an anomaly in the patch resistance. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 5 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, the patch resistance abnormality detection apparatus 160 provided herein may be implemented in the form of a computer program that is executable on a computer device such as the one shown in fig. 5. The memory of the computer device may store various program modules constituting the chip resistance abnormality detection apparatus 160, such as an image acquisition module, a standard information acquisition module, an area division module, and a state determination module shown in fig. 4. The respective program modules constitute computer programs that cause the processor to execute the steps in the patch resistance abnormality detection method of the respective embodiments of the present application described in the present specification.
The computer device shown in fig. 5 may perform acquiring an image including a wiring board including identification information and a plurality of chip resistors by an image acquisition module in the chip resistor abnormality detection apparatus 160 shown in fig. 4. The computer equipment can execute the standard information acquisition of each chip resistor according to the identification information of the circuit board through the standard information acquisition module, and the standard information comprises standard position information. The computer equipment can execute area division on the image according to the standard position information through the area division module to obtain a target area containing each chip resistor. The computer equipment can extract the color characteristics of each target area through the state determination module, and determine the state of each patch resistor according to the color characteristics.
In one embodiment, a computer device is provided, comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing the following steps when executing the computer program: acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors; obtaining standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information; dividing the image into areas according to the standard position information to obtain target areas containing all the chip resistors; and extracting the color characteristics of each target area, and determining the state of each patch resistor according to the color characteristics.
In one embodiment, the processor, when executing the computer program, further performs the steps of: when the state of at least one chip resistor in the image is abnormal, generating a recovery instruction for recovering the circuit board, and executing the recovery instruction; when the states of all the chip resistors in the image are normal, a transmission instruction for transmitting the circuit board is generated, and the transmission instruction is executed.
In one embodiment, the processor, when executing the computer program, further performs the steps of: and when the state of at least one patch resistor in the image is abnormal, generating an alarm instruction for starting an alarm device.
In one embodiment, the processor, when executing the computer program, further performs the steps of: extracting color features in each target region; calculating a first pixel proportion of each target area, wherein the first pixel proportion is the proportion of pixel points of which the color characteristics of each target area accord with preset color characteristics; judging whether the first pixel ratio of each target area is smaller than a preset ratio or not; when the first pixel proportion of the current target area is smaller than the preset proportion, judging that the state of the chip resistor of the current target area is abnormal; and when the first pixel proportion of the current target area is larger than or equal to the preset proportion, judging that the state of the patch resistor of the current target area is normal.
In one embodiment, the processor, when executing the computer program, further performs the steps of: modifying the pixel value of a pixel point meeting a first preset condition in the color characteristics of each target area into a preset pixel value; and calculating the ratio of the number of pixel points of the preset pixel value in each target region to the number of total pixel points of the corresponding target region to obtain the first pixel proportion of each target region.
In one embodiment, the processor, when executing the computer program, further performs the steps of: and marking the current target area when the state of the patch resistor of the current target area is abnormal.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of: acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors; obtaining standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information; dividing the image into areas according to the standard position information to obtain target areas containing all the chip resistors; and extracting the color characteristics of each target area, and determining the state of each patch resistor according to the color characteristics.
In one embodiment, the computer program when executed by the processor further performs the steps of: when the state of at least one chip resistor in the image is abnormal, generating a recovery instruction for recovering the circuit board, and executing the recovery instruction; when the states of all the chip resistors in the image are normal, a transmission instruction for transmitting the circuit board is generated, and the transmission instruction is executed.
In one embodiment, the computer program when executed by the processor further performs the steps of: and when the state of at least one patch resistor in the image is abnormal, generating an alarm instruction for starting an alarm device.
In one embodiment, the computer program when executed by the processor further performs the steps of: extracting color features in each target region; calculating a first pixel proportion of each target area, wherein the first pixel proportion is the proportion of pixel points of which the color characteristics of each target area accord with preset color characteristics; judging whether the first pixel ratio of each target area is smaller than a preset ratio or not; when the first pixel proportion of the current target area is smaller than the preset proportion, judging that the state of the chip resistor of the current target area is abnormal; and when the first pixel proportion of the current target area is larger than or equal to the preset proportion, judging that the state of the patch resistor of the current target area is normal.
In one embodiment, the computer program when executed by the processor further performs the steps of: modifying the pixel value of a pixel point meeting a first preset condition in the color characteristics of each target area into a preset pixel value; and calculating the ratio of the number of pixel points of the preset pixel value in each target region to the number of total pixel points of the corresponding target region to obtain the first pixel proportion of each target region.
In one embodiment, the computer program when executed by the processor further performs the steps of: and marking the current target area when the state of the patch resistor of the current target area is abnormal.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware related to instructions of a computer program, and the program can be stored in a non-volatile computer readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A chip resistor abnormality detection method is characterized by comprising the following steps:
acquiring an image comprising a circuit board, wherein the circuit board comprises identification information and a plurality of chip resistors;
obtaining standard information of each chip resistor according to the identification information of the circuit board, wherein the standard information comprises standard position information;
performing area division on the image according to the standard position information to obtain a target area containing each chip resistor;
extracting color features of each target area, and determining the state of each patch resistor according to the color features;
wherein the determining the state of each of the patch resistances according to the color characteristics comprises:
calculating a first pixel proportion of each target area, wherein the first pixel proportion is the proportion of pixel points of which the color characteristics of each target area accord with preset color characteristics;
judging whether the first pixel ratio of each target area is smaller than a preset ratio or not;
when the first pixel proportion of the current target area is smaller than the preset proportion, judging that the state of the chip resistor of the current target area is abnormal;
and when the first pixel proportion of the current target area is larger than or equal to the preset proportion, judging that the state of the patch resistor of the current target area is normal.
2. The method of claim 1, wherein the states include abnormal and normal, the method further comprising:
when the state of at least one chip resistor in the image is abnormal, generating a recovery instruction for recovering the circuit board, and executing the recovery instruction;
and when the states of all the chip resistors in the image are normal, generating a transmission instruction for transmitting the circuit board, and executing the transmission instruction.
3. The method of claim 1, wherein the status comprises an exception, the method further comprising:
and when the state of at least one patch resistor in the image is abnormal, generating an alarm instruction for starting an alarm device.
4. The method of claim 1, further comprising:
modifying the pixel value of a pixel point meeting a first preset condition in the color characteristics of each target area into a preset pixel value;
the calculating the first pixel fraction in each of the target regions includes: and calculating the ratio of the number of pixel points of the preset pixel value in each target region to the number of total pixel points of the corresponding target region to obtain the first pixel proportion of each target region.
5. The method of claim 1, further comprising:
and when the state of the patch resistor of the current target area is abnormal, marking the current target area.
6. A system for detecting abnormality of chip resistance, characterized in that the method of any one of claims 1 to 5 is applied to the system.
7. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the steps of the method of any of claims 1 to 5 are implemented when the computer program is executed by the processor.
8. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 5.
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| CN114089213A (en) * | 2021-12-03 | 2022-02-25 | 中科国微科技(深圳)有限公司 | All-digital control type high-power direct-current stabilized power supply detection method and system |
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